AON3816 [AOS]

Common-Drain Dual N-Channel Enhancement Mode Field Effect Transistor; 常见的漏双N沟道增强型场效应晶体管
AON3816
型号: AON3816
厂家: ALPHA & OMEGA SEMICONDUCTORS    ALPHA & OMEGA SEMICONDUCTORS
描述:

Common-Drain Dual N-Channel Enhancement Mode Field Effect Transistor
常见的漏双N沟道增强型场效应晶体管

晶体 晶体管 场效应晶体管
文件: 总4页 (文件大小:118K)
中文:  中文翻译
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AON3816  
Common-Drain Dual N-Channel Enhancement Mode Field  
Effect Transistor  
General Description  
Features  
The AON3816/L uses advanced trench technology to  
provide excellent RDS(ON), low gate charge. It is ESD  
protected. This device is suitable for use as a uni-  
directional or bi-directional load switch, facilitated by  
its common-drain configuration. AON3816 and  
AO3816L are electrically identical.  
VDS (V) = 20V  
ID = 4A (VGS = 4.5V)  
RDS(ON) < 22m(VGS = 4.5V)  
R
R
DS(ON) < 23m(VGS = 4V)  
DS(ON) < 28m(VGS = 2.5V)  
ESD Protected  
-RoHS Compliant  
-AO3816L is Halogen Free  
D2  
D1  
DFN 3x3  
Top View  
Bottom View  
G1  
G2  
D2  
S2  
G2  
S1  
D2  
D1  
D1  
G1  
S2  
S1  
Absolute Maximum Ratings TA=25°C unless otherwise noted  
Parameter  
Symbol  
VDS  
10 Sec  
Steady State  
20  
Units  
Drain-Source Voltage  
Gate-Source Voltage  
Continuous Drain  
Current A F  
V
V
VGS  
±12  
TA=25°C  
TA=70°C  
4
4
4
4
A
ID  
Pulsed Drain Current B  
IDM  
20  
TA=25°C  
TA=70°C  
2.4  
1.5  
1.4  
0.9  
PD  
W
Power Dissipation A  
TJ, TSTG  
Junction and Storage Temperature Range  
-55 to 150  
°C  
Thermal Characteristics  
Parameter  
Maximum Junction-to-Ambient  
Symbol  
Typ  
43  
80  
Max  
52  
90  
Units  
°C/W  
°C/W  
°C/W  
A
t 10s  
RθJA  
A
Steady State  
Maximum Junction-to-Ambient  
C
Steady State  
RθJL  
Maximum Junction-to-Lead  
33  
50  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AON3816  
Electrical Characteristics (TJ=25°C unless otherwise noted)  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Units  
STATIC PARAMETERS  
BVDSS  
Drain-Source Breakdown Voltage  
ID=250µA, VGS=0V  
20  
V
V
DS=20V, VGS=0V  
1
5
IDSS  
Zero Gate Voltage Drain Current  
µA  
µA  
TJ=55°C  
IGSS  
Gate-Body leakage current  
Gate-Source Breakdown Voltage  
Gate Threshold Voltage  
VDS=0V, VGS=±10V  
10  
BVGSO  
VGS(th)  
ID(ON)  
VDS=0V, IG=±250µA  
±12  
0.4  
20  
V
V
A
VDS=VGS ID=250µA  
GS=4.5V, VDS=5V  
0.75  
1.1  
On state drain current  
V
VGS=4.5V, ID=4A  
14  
18  
23  
22  
29  
23  
28  
mΩ  
TJ=125°C  
18  
RDS(ON)  
Static Drain-Source On-Resistance  
mΩ  
mΩ  
VGS=4V, ID=4A  
VGS=2.5V, ID=4A  
VDS=5V, ID=4A  
IS=1A,VGS=0V  
15  
19  
17  
22.5  
21  
gFS  
VSD  
IS  
Forward Transconductance  
Diode Forward Voltage  
S
V
A
0.75  
1
3
Maximum Body-Diode Continuous Current  
DYNAMIC PARAMETERS  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
1315  
219  
183  
2.1  
pF  
pF  
V
GS=0V, VDS=10V, f=1MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Gate resistance  
pF  
kΩ  
VGS=0V, VDS=0V, f=1MHz  
VGS=4.5V, VDS=10V, ID=4A  
SWITCHING PARAMETERS  
Qg  
Total Gate Charge  
Gate Source Charge  
Gate Drain Charge  
Turn-On DelayTime  
Turn-On Rise Time  
Turn-Off DelayTime  
Turn-Off Fall Time  
15  
6.7  
4.6  
1
nC  
nC  
Qgs  
Qgd  
tD(on)  
tr  
nC  
µs  
µs  
µs  
µs  
2.8  
5.6  
5.9  
VGS=5V, VDS=10V, RL=2.5,  
R
GEN=3Ω  
tD(off)  
tf  
A: The value of RθJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C.  
The value in any given application depends on the user's specific board design.  
B: Repetitive rating, pulse width limited by junction temperature.  
C. The RθJA is the sum of the thermal impedence from junction to lead RθJL and lead to ambient.  
D. The static characteristics in Figures 1 to 6 are obtained using <300µs pulses, duty cycle 0.5% max.  
E. These tests are performed with the device mounted on 1 in2 FR-4 board with 2oz. Copper, in a still air environment with TA=25°C. The  
SOA curve provides a single pulse rating.  
F. The continuous current rating is limited by wire-bonding.  
Rev 2: Feb 15. 2008  
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL  
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING  
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,  
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AON3816  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
20  
30  
20  
10  
0
10V  
4V  
VDS=5V  
VGS =2V  
15  
10  
5
2.5V  
125°C  
25°C  
VGS =1.5V  
-40°C  
0
0
1
2
3
4
5
0.0  
0.5  
1.0  
GS(Volts)  
Figure 2: Transfer Characteristics  
1.5  
2.0  
2.5  
V
DS(Volts)  
V
Figure 1: On-Regions Characteristics  
35  
30  
25  
20  
15  
10  
1.6  
1.4  
1.2  
1.0  
0.8  
VGS=2.5V  
VGS=4V  
ID=4A  
VGS =2.5V  
VGS =4V  
VGS=4.5V  
VGS =4.5V  
0
5
10  
15  
20  
-50 -25  
0
25 50 75 100 125 150 175  
ID(A)  
Temperature (°C)  
Figure 3: On-Resistance vs. Drain Current and  
Gate Voltage  
Figure 4: On-Resistance vs. Junction  
Temperature  
30  
25  
20  
15  
10  
1E+01  
1E+00  
1E-01  
1E-02  
1E-03  
1E-04  
1E-05  
ID=4A  
125°C  
-40°C  
125°C  
25°C  
25°C  
0.0  
0.2  
0.4  
VSD(Volts)  
Figure 6: Body-Diode Characteristics  
0.6  
0.8  
1.0  
0
2
4
6
8
10  
VGS(Volts)  
Figure 5: On-Resistance vs. Gate-Source Voltage  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  
AON3816  
TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS  
2500  
5
VDS=10V  
ID=4A  
2000  
4
3
2
1
0
Coss  
1500  
1000  
500  
0
Ciss  
Crss  
0
5
10  
15  
20  
0
5
10  
15  
20  
VDS(Volts)  
Qg (nC)  
Figure 8: Capacitance Characteristics  
Figure 7: Gate-Charge Characteristics  
100.0  
10.0  
1.0  
40  
TJ(Max)=150°C  
TA=25°C  
10µs  
30  
20  
10  
0
RDS(ON)  
100µ  
1ms  
limited  
10ms  
DC  
0.1s  
1s  
0.1  
TJ(Max)=150°C  
TA=25°C  
10s  
0.0  
0.001  
0.01  
0.1  
1
10  
100  
1000  
0.01  
0.1  
1
10  
100  
V
DS (Volts)  
Pulse Width (s)  
Figure 9: Maximum Forward Biased Safe  
Operating Area (Note E)  
Figure 10: Single Pulse Power Rating Junction-to-  
Ambient (Note E)  
10  
1
D=Ton/T  
J,PK=TA+PDM.ZθJA.RθJA  
RθJA=90°C/W  
In descending order  
D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse  
T
P
D  
0.1  
0.01  
Ton  
T
single pulse  
0.001  
0.00001  
0.0001  
0.01  
0.1  
1
10  
100  
1000  
Pulse Width (s)  
Figure 11: Normalized Maximum Transient Thermal Impedance  
Alpha & Omega Semiconductor, Ltd.  
www.aosmd.com  

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