AON4407 [AOS]
Plastic Encapsulated Device; 塑料封装的器件
| 型号： | AON4407 |
| 厂家： | 
ALPHA & OMEGA SEMICONDUCTORS |
| 描述： | Plastic Encapsulated Device |
| 文件： | 总3页 (文件大小：30K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
AOS Semiconductor
Product Reliability Report
AON4407, rev B
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
This AOS product reliability report summarizes the qualification result for AON4407.
Accelerated environmental tests are performed on a specific sample size, and then followed
by electrical test at end point. Review of final electrical test result confirms that AON4407
passes AOS quality and reliability requirements. The released product will be categorized by
the process family and be monitored on a quarterly basis for continuously improving the
product quality.
Table of Contents:
I.
Product Description
II.
III.
IV.
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
I. Product Description:
The AON4407 uses advanced trench technology to provide excellent RDS(ON), low gate charge
and operation with gate voltages as low as 1.8V. This device is suitable for use as a load
switch.
-RoHS Compliant
-Halogen Free
Detailed information refers to datasheet.
II. Die / Package Information:
AON4407
Process
Standard sub-micron
Low voltage P channel
DFN 3x2A
Copper
Silver epoxy
Package Type
Lead Frame
Die Attach
Bonding Wire
Mold Material
Au wire
Epoxy resin with silica filler
MSL (moisture sensitive level) Level 1 based on J-STD-020
Note * based on information provided by assembler and mold compound supplier
III. Result of Reliability Stress for AON4407
Test Item
Test Condition
Time
Point
Lot
Total
Number
of
Standard
Attribution Sample
size
Failures
0
168hr 85°c
/85%RH +3 cycle
reflow@260°c
-
11 lots
1815pcs
77pcs
JESD22-
A113
MSL
Precondition
168hrs
500 hrs
1000 hrs
0
0
JESD22-
A108
Temp = 150°c,
Vgs=100% of
Vgsmax
HTGB
HTRB
1 lot
(Note A*)
77pcs / lot
77pcs
168hrs
500 hrs
1000 hrs
JESD22-
A108
Temp = 150°c,
Vds=80% of
Vdsmax
1 lot
(Note A*)
11 lots
77pcs / lot
605pcs
100 hrs
0
0
0
JESD22-
A110
130 +/- 2°c,
HAST
85%RH, 33.3 psi,
Vgs = 100% of
Vgs max
121°c, 29.7psi,
RH=100%
(Note A*)
11 lots
55pcs / lot
605pcs
96 hrs
JESD22-
A102
Pressure Pot
(Note A*)
11 lots
55pcs / lot
605pcs
250 / 500
cycles
JESD22-
A104
-65°c to 150°c,
air to air
Temperature
Cycle
(Note A*)
55pcs / lot
Note A: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 46
MTTF = 2478 years
The presentation of FIT rate for the individual product reliability is restricted by the actual
burn-in sample size of the selected product (AON4407). Failure Rate Determination is based
on JEDEC Standard JESD 85. FIT means one failure per billion hours.
Failure Rate = Chi2 x 109
/ / [2x (2x77x500) x258] = 46
[2 (N) (H) (Af)] = 1.83 x 109
MTTF = 109 / FIT = 2.17 x 107hrs = 2478 years
Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
55 deg C
70 deg C
85 deg C
32
100 deg C
13
115 deg C
5.64
130 deg C
2.59
150 deg C
1
Af
258
87
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u = The use junction temperature in degree (Kelvin), K = C+273.16
K
=
Boltzmann’s constant, 8.617164 X 10-5eV / K
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