RFP-100-50TW [ANAREN]
Flanged Terminations; 法兰连接端接
| 型号： | RFP-100-50TW |
| 厂家： | 
ANAREN MICROWAVE |
| 描述： | Flanged Terminations |
| 文件： | 总2页 (文件大小：86K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Mod e l RFP-100-50TW
Fla ng e d Te rm ina tions
100 Wa tts, 50 Ω
Ge ne ra l Sp e c ific a tions
Resistive Element:
Substrate:
Cover:
Thick film
Beryllium oxide ceramic
Alumina ceramic
Mounting Flange:
Copper, nickel plated per
QQ-N-290
Lead(s):
99.99% pure silver (.005” thk)
Fe a ture s
• DC - 6.0 GHz
Ele c tric a l Sp e c ific a tions
• 100 Watts
Resistance Value:
Frequency Range:
Power:
50 ohms, ±5%
DC - 6.0 GHz
100 Watts
1.20:1
• BeO Ceramic
• Welded Silver Leads
V.S.W.R.:
• Non-Nichrome Resistive
Element
Notes: Tolerance is ±.010, unless otherwise specified. Operating
temperature is -55°C to +150°C (see chart). Designed to meet or
exceed applicable portions of MIL-E-5400. All dimensions are in
inches. Lead length 0.15” minimum.
• Low VSWR
Specifications subject to change without notice.
• 100% Tested
Outline Dra wing
.062
.120
.160
.800
.400
.050
RFP
100-50
TW
.350
.225
.110
.130 DIA. THRU
(2 PLACES)
.120
.560
Sa le s De sk USA: Voic e : (800) 544-2414 Fa x: (315) 432-9121
Sa le s De sk Europe : Voic e : (+44) 23 92 232392 Fa x: (+44) 23 92 251369
4.5.45
Mod e l RFP-100-50TW
Typ ic a l Pe rform a nc e
Sug g e ste d Mounting Proc e d ure s
Powe r De ra ting
.025 MIN.
(2 PLACES)
BOARD LOWER
THAN LEAD.
BOARD EVEN
WITH LEAD.
BOARD LOWER
THAN LEAD.
BOARD HIGHER
THAN LEAD.
100
75
SUGGESTED STRESS RELIEF METHODS
SCALE:
NOT RECOMMENDED APPLICATION
SCALE:
50
1. Make sure that the devices are mounted on flat surfaces
(.001” under the device) to optimize the heat transfer.
25
0
2. Drill & tap the heatsink for the appropriate thread size to be
used.
25
50
75
100
125
150
3. Coat heatsink with a minimum amount of high quality
silicone grease (.001” max. thickness).
CASE TEMPERATURE — °C
4. Position device on mounting surface and secure using sock-
et head screws, flat & split washers. Torque screws to the
appropriate value. Make sure that the device is flat against
the heatsink. (Care should be taken to avoid upward pres-
sure of the leads towards the lid).
5. Solder leads in place using an SN63 type solder with a
controlled temperature iron (210°C).
Sa le s De sk USA: Voic e : (800) 544-2414 Fa x: (315) 432-9121
Sa le s De sk Europe : Voic e : (+44) 23 92 232392 Fa x: (+44) 23 92 251369
4.5.46
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