RFP-100-9AE [ANAREN]
Fixed Attenuator, 0MHz Min, 1000MHz Max;
| 型号： | RFP-100-9AE |
| 厂家： | 
ANAREN MICROWAVE |
| 描述： | Fixed Attenuator, 0MHz Min, 1000MHz Max 衰减器 射频 微波 |
| 文件： | 总2页 (文件大小：471K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Model RFP-100-XXAE
Flanged Attenuators
100 Watts
General Specifications
Resistive Element:
Thick film
Substrate:
Cover:
Beryllium oxide ceramic
Alumina ceramic
Mounting Flange:
Copper nickel plated per
QQ-N-290
Lead(s):
99.99% pure silver (.005” thk)
Features
• DC - 2.5 GHz
Electrical Specifications
Attenuation Value:
1, 2, 3, 4, 5, 6, 9, 10, 20 or
30 dB
• 100 Watts
Frequency Range:
Power:
DC - 2.5 GHz
100 Watts
• BeO Ceramic
• Welded Silver Leads
Notes: Tolerance is .010, unless otherwise specified. Operating
temperature is -55°C to +150°C (see chart). Designed to meet or
exceed applicable portions of MIL-E-5400. All dimensions are in
inches. Lead length 0.15” minimum.
• Non-Nichrome Resistive
Element
• Low VSWR
Specifications subject to change without notice.
• 100% Tested
Outline Drawing
.800
.400
.130 DIA. THRU.
(2 PLACES)
RFP
.225
100-XX
AE
.112
.050
.350
.560
.120
.130
.062
Note: XX denotes attenuation value.
VER. 12/5/01
1
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
Model RFP-100-XXAE
Specifications
45PART NUMBER ATTENUATION (dB)
TOL. (+/-dB)
0.40
POWER (WATTS)
VSWR
1.45:1
1.40:1
1.35:1
1.30:1
1.25:1
1.20:1
1.20:1
1.25:1
1.20:1
1.30:1
FREQ. (GHz)
RFP-100-1AE
RFP-100-2AE
RFP-100-3AE
RFP-100-4AE
RFP-100-5AE
RFP-100-6AE
RFP-100-9AE
RFP-100-10AE
RFP-100-20AE
RFP-100-30AE
1
2
100
100
100
100
100
100
100
100
100
100
1.0
1.0
1.0
1.0
1.0
1.0
1.0
2.0
2.5
2.0
0.40
3
0.40
4
0.30
5
0.30
6
0.30
9
0.30
10
20
30
0.75
0.50
2.00
Suggested Mounting Procedures
Power Derating
.025 MIN.
(2 PLACES)
100
75
BOARD LOWER
THAN LEAD.
BOARD HIGHER
THAN LEAD.
BOARD LOWER
THAN LEAD.
BOARD EVEN
WITH LEAD.
NOT RECOMMENDED APPLICATION
SCALE:
SUGGESTED STRESS RELIEF METHODS
SCALE:
50
1. Make sure that the devices are mounted on flat surfaces
(.001” under the device) to optimize the heat transfer.
25
0
2. Drill & tap the heatsink for the appropriate thread size to be
used.
3. Coat heatsink with a minimum amount of high quality
silicone grease (.001” max. thickness).
25
50
75
100
125
150
CASE TEMPERATURE — °C
4. Position device on mounting surface and secure using
socket head screws, flat & split washers. Torque screws to
the appropriate value. Make sure that the device is flat
against the heatsink. (Care should be taken to avoid
upward pressure of the leads towards the lid).
5. Solder leads in place using an SN63 type solder with a
controlled temperature iron (210°C).
2
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369
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