RFP-100-9AF [ANAREN]

Fixed Attenuator, 0MHz Min, 1000MHz Max;
RFP-100-9AF
型号: RFP-100-9AF
厂家: ANAREN MICROWAVE    ANAREN MICROWAVE
描述:

Fixed Attenuator, 0MHz Min, 1000MHz Max

衰减器 射频 微波
文件: 总2页 (文件大小:460K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Model RFP-100-XXAF  
Flangeless Attenuators  
100 Watts  
General Specifications  
Resistive Element:  
Substrate:  
Cover:  
Thick film  
Beryllium oxide ceramic  
Alumina ceramic  
Lead(s):  
99.99% pure silver (.005” thk)  
Electrical Specifications  
Features  
• DC - 2.5 GHz  
Attenuation Value:  
1, 2, 3, 4, 5, 6, 9, 10, 20 or  
30 dB  
Frequency Range:  
Power:  
DC - 2.5 GHz  
100 Watts  
• 100 Watts  
• BeO Ceramic  
• Welded Silver Leads  
Notes: Tolerance is .010, unless otherwise specified. Operating  
temperature is -55°C to +150°C (see chart). Designed to meet or  
exceed applicable portions of MIL-E-5400. All dimensions are in  
inches. Lead length 0.15” minimum.  
• Non-Nichrome Resistive  
Element  
Specifications subject to change without notice.  
• Low VSWR  
• 100% Tested  
Outline Drawing  
.350  
.175  
RFP  
100-XX  
AF  
.225  
.050 TYP.  
.042  
.070  
MAX.  
Note: XX denotes attenuation value.  
VER. 12/5/01  
1
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121  
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369  
Model RFP-100-XXAF  
Specifications  
PART NUMBER  
RFP-100-1AF  
RFP-100-2AF  
RFP-100-3AF  
RFP-100-4AF  
RFP-100-5AF  
RFP-100-6AF  
RFP-100-9AF  
RFP-100-10AF  
RFP-100-20AF  
RFP-100-30AF  
ATTENUATION (dB)  
TOL. (+/-dB)  
0.40  
POWER (WATTS)  
VSWR  
1.45:1  
1.40:1  
1.35:1  
1.30:1  
1.25:1  
1.20:1  
1.20:1  
1.25:1  
1.20:1  
1.30:1  
FREQ. (GHz)  
1
2
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
1.0  
2.0  
2.5  
2.0  
0.40  
3
0.40  
4
0.30  
5
0.30  
6
0.30  
9
0.30  
10  
20  
30  
0.75  
0.50  
2.00  
Suggested Mounting Procedures  
Power Derating  
.025 MIN.  
(2 PLACES)  
100  
75  
BOARD LOWER  
THAN LEAD.  
BOARD EVEN  
WITH LEAD.  
BOARD LOWER  
THAN LEAD.  
BOARD HIGHER  
THAN LEAD.  
SUGGESTED STRESS RELIEF METHODS  
SCALE:  
NOT RECOMMENDED APPLICATION  
SCALE:  
50  
25  
0
1. Make sure that the devices are mounted on flat surfaces  
(.001” under the device) to optimize the heat transfer.  
25  
50  
75  
100  
125  
150  
2. Position device on mounting surface and solder in place  
using an indalloy type or an SN63 type solder.  
CASE TEMPERATURE — °C  
3. Solder leads in place using an SN63 type solder with a  
controlled temperature iron (210°C).  
2
Sales Desk USA: Voice: (800) 544-2414 Fax: (315) 432-9121  
Sales Desk Europe: Voice: (+44) 23 92 232392 Fax: (+44) 23 92 251369  

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