AAT8543 [ANALOGICTECH]

20V P-Channel Power MOSFET; 20V P沟道功率MOSFET
AAT8543
型号: AAT8543
厂家: ADVANCED ANALOGIC TECHNOLOGIES    ADVANCED ANALOGIC TECHNOLOGIES
描述:

20V P-Channel Power MOSFET
20V P沟道功率MOSFET

文件: 总6页 (文件大小:111K)
中文:  中文翻译
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AAT8543  
20V P-Channel Power MOSFET  
General Description  
Features  
The AAT8543 is a low threshold P-channel MOSFET  
designed for the battery, cell phone, and PDA mar-  
kets. Using AnalogicTech's ultra-high-density MOS-  
FET process and space-saving, small-outline, J-lead  
package, performance superior to that normally  
found in a TSOP-6 footprint has been squeezed into  
the footprint of an SC70JW-8 package.  
Drain-Source Voltage (max): -20V  
Continuous Drain Current1 (max):  
-4.2A @ 25°C  
Low On-Resistance:  
— 57m@ VGS = -4.5V  
— 104m@ VGS = -2.5V  
SC70JW-8 Package  
Applications  
Top View  
Battery Packs  
Battery-Powered Portable Equipment  
Cellular and Cordless Telephones  
D
8
D
D
D
5
7
6
Absolute Maximum Ratings  
TA = 25°C, unless otherwise noted.  
1
2
3
4
S
S
S
G
Symbol  
Description  
Value  
Units  
VDS  
VGS  
Drain-Source Voltage  
Gate-Source Voltage  
-20  
±12  
V
TA = 25°C  
TA = 70°C  
±4.2  
ID  
Continuous Drain Current @ TJ = 150°C1  
±3.3  
A
IDM  
IS  
Pulsed Drain Current2  
±20  
Continuous Source Current (Source-Drain Diode)1  
Operating Junction Temperature Range  
Storage Temperature Range  
-1.2  
TJ  
-55 to 150  
-55 to 150  
°C  
°C  
TSTG  
Thermal Characteristics1  
Symbol  
Description  
Typ  
Max  
Units  
RθJA  
RθJA2  
RθJF  
Typical Junction-to-Ambient Steady State  
Maximum Junction-to-Ambient t<5 Seconds  
Typical Junction-to-Foot  
100  
62  
124  
76  
°C/W  
°C/W  
°C/W  
35  
42  
TA = 25°C  
Maximum Power Dissipation  
TA = 70°C  
1.6  
1.0  
PD  
W
1. Based on thermal dissipation from junction to ambient while mounted on a 1" x 1" PCB with optimized layout. A 5-second pulse on a  
1" x 1" PCB approximates testing a device mounted on a large multi-layer PCB as in most applications. RθJF + RθFA = RθJA where the  
foot thermal reference is defined as the normal solder mounting surface of the device's leads. RθJF is guaranteed by design; howev-  
er, RθCA is determined by the PCB design. Actual maximum continuous current is limited by the application's design.  
2. Pulse test: Pulse Width = 300µs.  
8543.2005.04.1.0  
1
AAT8543  
20V P-Channel Power MOSFET  
Electrical Characteristics  
TJ = 25°C, unless otherwise noted.  
Symbol Description  
DC Characteristics  
Conditions  
Min Typ Max Units  
BVDSS  
Drain-Source Breakdown  
Voltage  
VGS = 0V, ID = -250µA  
-20  
V
VGS = -4.5V, ID = -4.2A  
VGS = -2.5V, ID = -3.1A  
VGS = -4.5V, VDS = -5V (pulsed)  
VGS = VDS, ID = -250µA  
VGS = ±12V, VDS = 0V  
45  
80  
57  
RDS(ON) Drain-Source On-Resistance1  
m  
104  
ID(ON)  
VGS(th)  
IGSS  
On-State Drain Current1  
Gate Threshold Voltage  
Gate-Body Leakage Current  
-20  
A
V
-0.6  
±100  
-1  
nA  
V
GS = 0V, VDS = -20V  
IDSS  
Drain Source Leakage Current  
Forward Transconductance1  
µA  
S
VGS = 0V, VDS = -16V, TJ = 70°C2  
-5  
gfs  
VDS = -5V, ID = -4.2A  
7
Dynamic Characteristics2  
QG  
QGS  
QGD  
tD(ON)  
tR  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay  
VDS = -10V, RD = 2.4, VGS = -4.5V  
VDS = -10V, RD = 2.4, VGS = -4.5V  
VDS = -10V, RD = 2.4, VGS = -4.5V  
VDS = -10V, RD = 2.4, VGS = -4.5V, RG = 6Ω  
VDS = -10V, RD = 2.4, VGS = -4.5V, RG = 6Ω  
VDS = -10V, RD = 2.4, VGS = -4.5V, RG = 6Ω  
VDS = -10V, RD = 2.4, VGS = -4.5V, RG = 6Ω  
8.5  
1.5  
2.8  
10  
nC  
ns  
Turn-On Rise Time  
Turn-Off Delay  
32  
tD(OFF)  
tF  
61  
Turn-Off Fall Time  
38  
Source-Drain Diode Characteristics  
VSD  
Source-Drain Forward  
Voltage1  
Continuous Diode Current3  
VGS = 0, IS = -4.2A  
-1.3  
-1.2  
V
A
IS  
1. Pulse test: Pulse Width = 300µs.  
2. Guaranteed by design. Not subject to production testing.  
3. Based on thermal dissipation from junction to ambient while mounted on a 1" x 1" PCB with optimized layout. A 5-second pulse on a  
1" x 1" PCB approximates testing a device mounted on a large multi-layer PCB as in most applications. RθJF + RθFA = RθJA where the  
foot thermal reference is defined as the normal solder mounting surface of the device's leads. RθJF is guaranteed by design; however,  
RθCA is determined by the PCB design. Actual maximum continuous current is limited by the application's design.  
2
8543.2005.04.1.0  
AAT8543  
20V P-Channel Power MOSFET  
Typical Characteristics  
TJ = 25ºC, unless otherwise noted.  
Output Characteristics  
Transfer Characteristics  
20  
15  
10  
5
5V  
4.5V  
4V  
20  
3.5V  
VD = VG  
-55°C  
25°C  
3V  
15  
10  
5
125°C  
2.5V  
2V  
1.5V  
0
0
0
1
2
3
4
5
0
0.5  
1
1.5  
2
2.5  
3
VGS (V)  
VDS (V)  
On-Resistance vs. Drain Current  
On-Resistance vs. Gate-to-Source Voltage  
0.25  
0.4  
0.32  
0.24  
0.16  
0.08  
0
ID = 4.2A  
0.2  
0.15  
0.1  
VGS = 2.5V  
0.05  
0
VGS = 4.5V  
0
5
10  
15  
20  
0
1
2
3
4
5
ID (A)  
VGS (V)  
On-Resistance vs. Junction Temperature  
Threshold Voltage  
1.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
1.5  
1.4  
1.3  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
VGS = 4.5V  
ID = 4.2A  
ID = 250µA  
-0.1  
-0.2  
-0.3  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
-50  
-25  
0
25  
50  
75  
100  
125  
150  
TJ (°°C)  
TJ (ºC)  
8543.2005.04.1.0  
3
AAT8543  
20V P-Channel Power MOSFET  
Typical Characteristics  
TJ = 25ºC, unless otherwise noted.  
Source-Drain Diode Forward Voltage  
Gate Charge  
100  
5
VD = 10V  
ID = 4.2A  
4
10  
3
2
1
0
TJ = 150°C  
TJ = 25°C  
1
0.1  
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
0
2
4
6
8
10  
VSD (V)  
QG, Charge (nC)  
Capacitance  
Single Pulse Power, Junction to Ambient  
50  
45  
40  
35  
30  
25  
20  
15  
10  
5
1000  
800  
600  
400  
200  
0
Ciss  
Coss  
Crss  
0
0
5
10  
15  
20  
0.001  
0.01  
0.1  
1
10  
100  
1000  
VDS (V)  
Time (s)  
Transient Thermal Response, Junction to Ambient  
10  
1
.5  
.2  
0.1  
.1  
.05  
.02  
0.01  
Single Pulse  
0.001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
Time (s)  
4
8543.2005.04.1.0  
AAT8543  
20V P-Channel Power MOSFET  
Ordering Information  
Package  
Marking1  
Part Number (Tape and Reel)2  
AAT8543IJS-T1  
SC70JW-8  
JTXYY  
Package Information  
SC70JW-8  
0.50 BSC 0.50 BSC 0.50 BSC  
0.225 0.075  
2.00 0.20  
0.048REF  
0.100  
0.45 0.10  
4° 4°  
7° 3°  
2.10 0.30  
All dimensions in millimeters.  
1. XYY = assembly and date code.  
2. Sample stock is generally held on part numbers listed in BOLD.  
8543.2005.04.1.0  
5
AAT8543  
20V P-Channel Power MOSFET  
AnalogicTech cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in an AnalogicTech product. No circuit patent licenses, copyrights, mask work  
rights, or other intellectual property rights are implied.  
AnalogicTech reserves the right to make changes to their products or specifications or to discontinue any product or service without notice, and advise customers to obtain the latest  
version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale  
supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.  
AnalogicTech warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with AnalogicTech’s standard warranty. Testing and  
other quality control techniques are utilized to the extent AnalogicTech deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed.  
Advanced Analogic Technologies, Inc.  
830 E. Arques Avenue, Sunnyvale, CA 94085  
Phone (408) 737-4600  
Fax (408) 737-4611  
6
8543.2005.04.1.0  

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