TSL2671 [AMSCO]
DIGITAL PROXIMITY DETECTOR; 数字接近检测
| 型号： | TSL2671 |
| 厂家： | 
AMS(艾迈斯) |
| 描述： | DIGITAL PROXIMITY DETECTOR |
| 文件： | 总27页 (文件大小：725K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TAOS Inc.
is now
ams AG
The technical content of this TAOS datasheet is still valid.
Contact information:
Headquarters:
ams AG
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8141 Unterpremstaetten, Austria
Tel: +43 (0) 3136 500 0
e-Mail: ams_sales@ams.com
Please visit our website at www.ams.com
TSL2671
DIGITAL PROXIMITY DETECTOR
r
r
TAOS118 − JANUARY 2011
PACKAGE FN
DUAL FLAT NO-LEAD
(TOP VIEW)
Features
D Proximity Detection with an Integrated LED
Driver in a Single Device
6 SDA
5 INT
VDD
1
D Proximity Detection
− Programmable Number of IR Pulses
− Programmable Current Sink for the IR
LED — No Limiting Resistor Needed
− Programmable Interrupt Function with
Upper and Lower Threshold
SCL 2
GND 3
4 LDR
Package Image Not Actual Size
− Covers a 2000:1 Dynamic Range
D Programmable Wait Timer
− Programmable from 2.72 ms
to > 8 Seconds
Applications
D Cell Phone Touch Screen Disable
D Notebook/Monitor Security
D Automatic SpeakerphonEnble
D Automatic Menu Popu
− Wait State — 65 mA Typical Current
2
D I C Interface Compatible
2
− Up to 400 kHz (I C Fast Mode)
− Dedicated Interrupt Pin
D Small 2 mm ꢀ 2 mm ODFN Package
D Sleep Mode — 2.5 mA Typical Current
Description
The TSL2671 family of devices provides a complete proximity detctiosystem and digital interface logic in a
single 6-pin package. The device includea diital proximity sensor with integrated LED driver for the required
external IR LED. The proximity function offers a wide range oerformance, with four programmable LED drive
currents and a pulse repetition rane of 1 to 32 pulseThe proximity detection circuitry compensates for
ambient light, allowing it to operte in environments ranging from bright sunlight to dark rooms. This wide
dynamic range also allows opeation in short-distane detection applications behind dark glass, such as cell
phones. An internal state mace provides the abilitto put the device into a low-power mode for very low
average power consumption.
The proximity function specifically targetnear-field proximity applications. In cell phones, for example, the
proximity detection function can detect whn the user positions the phone close to their ear. The device is fast
enough to provide proximity informaion at the high repetition rate needed when answering a phone call. This
provides both improved green power sving capability and the added security to lock the screen when the user
may accidently deploy a touch.
2
Communication with the dvice is accomplished through a simple two-wire I C interface with data rates up to
400 kHz. An interrupt output pin is provided for connection to the host processor. This interrupt pin can be used
to eliminate the need to poll the device on a repetitive basis. There is also a digital filter that compares the
proximity ADC reslts to programmed values so that an interrupt is generated only upon a proximity event.
The TSL261 is upplied in a very small form factor 2-mm × 2-mm, 6-pin optical package, requiring very little
PCB area. Alo, the package height is only 0.65 mm high, which makes the TSL2671 suitable for very thin
mechanical applications.
Copyright E 2011, TAOS Inc.
The LUMENOLOGY r Company
Texas Advarnced Optoelectronic Solutions Inc.
1001 Klein Road S Suite 300 S Plano, TX 75074 S (972) 673-0759
www.taosinc.com
1
TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
Functional Block Diagram
Interrupt
INT
IR LED Constant
Current Sink
LDR
Prox Control
SCL
Upper Limit
Lower Limit
V
DD
Prox
Prox
ADC
Prox
Data
Integration
SDA
Wait Control
CH0
GND
CH1
Detailed Description
The TSL2671 light-to-digital device provides on-chip photodiodes, integrating amplifiers, ADC, accumulators,
2
clocks, buffers, comparators, a state machine, and an I C interface. Each device combnes a Channel 0
photodiode (CH0), which is responsive to both visible and infrared light, and a channel photodiode (CH1),
which is responsive primarily to infrared light. Proximity detction can occur using eithr or both photodiodes.
Two integrating ADCs simultaneously convert the amplifiephotoode currents into a digital value providing
up to 16 bits of resolution. Upon completion of the conversion cycle, the conversion reult is transferred to the
data registers.
Proximity detection requires only a single external IR LED. An internal LED drier can be configured to provide
a constant current sink of 12.5 mA, 25 mA, 50 mA, or 100 mA of currnt. No external current limiting resistor
is required. The number of proximity LED pulses cn be programmed frm 1 to 255 pulses. Each pulse has a
16-μs period. This LED current, coupled with the programme number of pulses, provides a 2000:1
contiguous dynamic range.
2
Communication to the device is accomplished through a fast (up to 400 kHz), two-wire I C serial bus for easy
connection to a microcontroller r bedded controller. The digital output of the device is inherently more
immune to noise when compared tn analog inter
The device provides a separate pin for level-style interrupts. When interrupts are enabled and a pre-set value
is exceeded, the interrupt pin is asserted and emans asserted until cleared by the controlling firmware. The
interrupt feature simplifies and improves system efficiency by eliminating the need to poll a sensor for a proximity
value. An interrupt is generated when the value of a proximity conversion exceeds either an upper or lower
threshold. In addition, a programmable nterrupt persistence feature allows the user to determine how many
consecutive exceeded thresholds are cessary to trigger an interrupt.
Copyright E 2011, TAOS Inc.
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TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
Terminal Functions
TERMINAL
TYPE
DESCRIPTION
NAME
GND
INT
NO.
3
Power supply ground. All voltages are referenced to GND.
Interrupt — open drain.
5
O
O
LDR
SCL
SDA
4
LED driver for proximity emitter — up to 100 mA, open drain.
2
2
2
I
I C serial clock input terminal — clock signal for I C serial data.
2
2
6
I/O
I C serial data I/O terminal — serial data I/O for I C .
Supply voltage.
V
1
DD
Available Options
DEVICE
TSL26711
TSL26713
TSL26715
TSL26717
ADDRESS
PACKAGE − LEADS
INTERFACE DESCRIPTION
ORDERING NUMBER
TSL26711FN
2
0x39
0x39
0x29
0x29
FN−6
FN−6
FN−6
FN−6
I C Vbus = V Interface
DD
2
I C Vbus = 1.8 V Interface
TSL26713FN
C Vbus = V Interface
TSL26715FN
DD
2
I C b= 1.8 V Interface
TSL26717FN
Absolute Maximum Ratings over operating freair temperature range (unless otherwise noted)†
Supply voltage, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.8 V
DD
Digital output voltage range, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 3.8 V
O
Digital output current, I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −1 mA to 20 mA
O
Storage temperature range, T
ESD tolerance, human body mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2000 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
stg
†
Stresses beyond those listed under “absoluaximum ratings” mcauspermanent damage to the device. These are stress ratings only, and
functional operation of the device at these any other conditiond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for exed periods may affect device reliability.
NOTE 1: All voltages are with respect to GND.
Recommended Operating Conitns
MIN NOM
MAX
3.6
3
UNIT
V
Supply voltage, V
2.6
−3
3
DD
Supply voltage accuracy, V total eor including transients
%
DD
Operating free-air temperatu, T
−30
70
°C
A
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TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
Operating Characteristics, VDD = 3 V, TA = 25ꢁ C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Active — LDR pulse off
MIN
TYP
175
65
MAX
UNIT
250
Wait mode
I
Supply current
μA
DD
Sleep mode
2.5
4
0.4
0.6
5
3 mA sink current
6 mA sink current
0
0
V
I
INT, SDA output low voltage
V
OL
Leakage current, SDA, SCL, INT pins
Leakage current, LDR pin
−5
μA
μA
LEAK
LEAK
I
10
TSL26711, TSL26715
TSL26713, TSL26717
TSL26711, TSL26715
TSL26713, TSL26717
0.7 V
DD
V
V
SCL, SDA input high voltage
SCL, SDA input low voltage
V
V
IH
IL
1.25
0.3 V
DD
054
Proximity Characteristics, VDD = 3 V, TA = 25ꢁ C, PEN = 1 (unless otherwise noted)
PARAMETER
Supply current
TEST CONDITIONS
LDR pulse on
CONDITION
MIN
TY
3
MAX
UNIT
mA
I
DD
ADC conversion time step size
ADC number of integration steps
ADC counts per step
PTIME = 0xFF
28
2.72
2.9
ms
1
0
0
256
steps
PTIME = 0xFF
1023 counts
IR LED pulse count
255 pulses
Pulse period
16.3
7.2
100
50
μs
Pulse — LED on time
μs
PDRIVE=0
PDRIVE=1
PDRIVE=2
PDRIVE=3
75
125
I
sink current @ 600 mV,
SINK
LED Drive
mA
LDpin
25
12.5
18
Operating distance (See note 1)
inches
NOTE 1: Proximity Operating Distance is dependent upon emitr proerties and the reflective properties of the proximity surface. The nominal
value shown uses an IR emitter with a peak wavelengtof 50 nm and a 20° half angle. The proximity surface used is 90% reflective
(white surface) 16 × 20-inch Kodak Gray Car60 mw/SR, 100 mA, 64 pulses, open view (no glass). Note: Greater distances are
achievable with appropriate system consideratios.
Wait Characteristics, VDD = 3 VTA = 25ꢁ C, WEN = 1 (unless otherwise noted)
PARAMETER
Wait step size
Wait number of integration seps
TEST CONDITIONS
WTIME = 0xFF
CHANNEL
MIN
2.58
1
TYP
MAX
2.9
UNIT
ms
2.72
256
steps
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TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
AC Electrical Characteristics, VDD = 3 V, TA = 25ꢁ C (unless otherwise noted)
†
PARAMETER
TEST CONDITIONS
MIN
0
TYP
MAX
UNIT
kHz
μs
2
f
t
Clock frequency (I C only)
400
(SCL)
(BUF)
Bus free time between start and stop condition
1.3
Hold time after (repeated) start condition. After
this period, the first clock is generated.
t
0.6
μs
(HDSTA)
t
t
t
t
t
t
t
t
Repeated start condition setup time
Stop condition setup time
Data hold time
0.6
0.6
0
μs
μs
μs
n
s
μs
ns
ns
pF
(SUSTA)
(SUSTO)
(HDDAT)
(SUDAT)
(LOW)
(HIGH)
F
Data setup time
100
1.3
0.6
SCL clock low period
SCL clock high period
Clock/data fall time
300
10
Clock/data rise time
Input pin capacitance
R
C
i
†
Specified by design and characterization; not production tested.
PARAMETER MEASUREMENT INFORMATION
t
t
(R
t
(F)
(LOW)
V
IH
SCL
SDA
V
IL
t
t
(HDSTA
(SUSTA)
t
t
t
(SUSTO)
t
(BUF)
(HDDAT)
(SUDAT)
V
V
IH
IL
P
S
S
P
Stop
Condition
Start
Condition
rt
Stop
t
(LOWSEXT)
SCL
SCL
ACK
ACK
t
t
t
(LOWMEXT)
(LOWMEXT)
(LOWMEXT)
SCL
SDA
Figure 1. Timing Diagrams
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DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
TYPICAL CHARACTERISTICS
LDR OUTPUT COMPLIANCE
SPECTRAL RESPONSIVITY
1
0.8
0.6
0.4
0.2
112.5
100
87.5
75
100 mA
Ch 0
62.5
50 mA
50
37.5
25
Ch 1
25 m
12.5 A
1.5
0
0
0
0.3
0.6
0.9
1.2
300 400 500 600 700 800 900 1000 1100
V
− utput Low Voltage − V
OL
λ − Wavelength − nm
Figure 2
Figure 3
NORMALIZED IDD
vs.
VDD and TEMPERATUE
110%
108%
106%
104%
102%
75ꢁC
50ꢁC
25ꢁ
100%
98%
96%
94%
92%
C
2.7
8
2.9
3
3.1
3.2
3.3
V
— V
DD
Figure 4
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TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
PRINCIPLES OF OPERATION
System State Machine
The device provides control of proximity detection and power management functionality through an internal
state machine. After a power-on-reset, the device is in the sleep mode. As soon as the PON bit is set, the device
will move to the start state. It will then cycle through the Proximity and Wait states. If these states are enabled,
the device will execute each function. If the PON bit is set to a 0, the state machine will continue until the current
conversion is complete and then go into a low-power sleep mode.
Sleep
PON = 1
(r0x00:b0)
PON = 0
(r0x00:b0)
Start
Prox
Wait
Figure 5. Simplified State Diagram
NOTE: In this document, the nomenclature uses the bit field name in italics followed by the register number and
bit number to allow the user to easily identify the ter and bit thacontrols the function. For example, the
power on (PON) is in register 0x00, bit 0. This is rresented as PON (rx00:b0).
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DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
Proximity Detection
Proximity sensing uses an external light source (generally an infrared emitter) to emit light, which is then viewed
by the integrated light detector to measure the amount of reflected light when an object is in the light path
(Figure 6). The amount of light detected from a reflected surface can then be used to determine an object’s
proximity to the sensor.
Surface Reflectivity (SR)
Glass Attenuation (GA)
IR LED
Distance (D)
2771
Background Energy (BGE)
Optical Crosstalk (OC)
Figure 6. Proximity Dtectio
The device has controls for the number of IR pulses (PCOUNT), the integration time (PTIME), the LED drive
current (PDRIVE), and the photodiode configuration (ODE) (Figure 7)he photodiode configuration can
be set to CH1 diode (recommended), CH0 diode, or a cmbination of both dioes. At the end of the integration
cycle, the results are latched into the proximity data (PDATAx) registers.
V
DD
IR
LED
PDRIVE(r0x0F, b7:6)
PTME(r0x02)
IR LED Constant
Current S
Prox ontrol
Pr
Integration ADC
Prox
Prox
Data
PDATAH(r0x19), PDATAL(r0x18)
PPCOUNT(r0x0E)
CH0
CH1
Figure 7. Proximity Detection Operation
The LED drive current is controlled by a regulated current sink on the LDR pin. This feature eliminates the need
to use a current liiting resistor to control LED current. The LED drive current can be configured for 12.5 mA,
25 mA, 50 mA, or 10 mA. For higher LED drive requirements, an external P type transistor can be used to
control the LD crrent.
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TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
The number of LED pulses can be programmed to any value between 1 and 255 pulses as needed. Increasing
the number of LED pulses at a given current will increase the sensor sensitivity. Sensitivity grows by the square
root of the number of pulses. Each pulse has a 16-μs period.
Add IR + Subtract
Background Background
LED On
LED Off
16 ms
IR LED Pulses
Figure 8. Proximity IR LED Waveform
The proximity integration time (PTIME) is the period of time that the internal ADC converts the aalog signal
to a digital count. It is recommend that this be set to a minimum of PTIME = 0xFF or 2.72 ms.
The combination of LED power and number of pulses can be used to control the distane at which the sensor
can detect proximity. Figure 9 shows an example of the distances covered with settings such that each curve
covers 2× the distance. Counts up to 64 pulses provide a 16× range.
PROXIMITY ADC COUNT
RELATIDISTANCE
1000
25 mA,
1 Pulse
00 m
6ulses
800
10 mA,
16 Pulses
600
400
100 A,
4 Pulse
mA,
Pulse
200
0
1ꢀ ꢀ
8ꢀ
16ꢀ
Relative Distance
Figure 9
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TSL2671
DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
Interrupts
The interrupt feature simplifies and improves system efficiency by eliminating the need to poll the sensor for
a proximity value. The interrupt mode is determined by the state of the PIEN field in the ENABLE register.
Two 16-bit-wide interrupt threshold registers allow the user to define upper and lower threshold limits. An
interrupt can be generated when the proximity data (PDATA) exceeds the upper threshold value (PIHTx) or falls
below the lower threshold (PILTx).
To further control when an interrupt occurs, the device provides an interrupt persistence feature. This feature
allows the user to specify a number of conversion cycles for which an event exceeding the proximity interrupt
threshold must persist (PPERS) before actually generating an interrupt. See the register descriptions for details
on the length of the persistence.
PIHTH(r0x0B), PIHTL(r0x0A)
PPERS(r0x0C, b7:4)
Upper Limit
Prox Persistence
Prox
Integration
Prox
ADC
Prox
Data
Lower Limit
CH0
CH1
PILTH(r0x09), PILTL(r008)
Figure 10. Programmable Interrupt
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DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
State Diagram
The following state diagram shows a more detailed flow for the state machine. The device starts in the sleep
mode. The PON bit is written to enable the device. A 2.72-ms Start Delay will occur before entering the start
state. If the PEN bit is set, the state machine will step through the proximity accumulate, then proximity ADC
conversion states. As soon as the conversion is complete, the state machine will move to the Wait Check state.
If the WEN bit is set, the state machine will then cycle through the wait state. If the WLONG bit is set, the wait
cycles are extended by 12× over normal operation. When the wait counter terminates, the state machine will
move to the 2.72-ms Wait Delay state before returning to the Start state.
PON = 1
Sleep
Start
Delay
PON = 0
2.72 ms
Start
5.44 ms
1 to 255 LED Pulses
Pulse Frequency: 62.5 kHz
Time: 16.3 ms − 4.2 ms
Prox
Check
Wait
Delay
PEN = 1
PEN = 0
WLONG = 0
1 to 256 steps
EN = 0
Step: 2.72 ms
Time: 2.72 ms − 696 ms
Prox
Accum
ai
Check
WEN = 1
WLONG = 1
1 to 256 steps
Step: 32.6 ms
1 to 256 steps
Prox
ADC
Wait
Step: 2.72 ms
Time: 2.72 ms − 696 ms
Recommended − 2.72 ms 1023 Counts
Time: 32.6 ms − 8.35 s
Figure 11. Expandd State Diagram
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DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
Power Management
Power consumption can be controlled through the use of the wait state timing because the wait state consumes
only 65 μA of power. Figure 14 shows an example of using the power management feature to achieve an
average power consumption of 138 μA current with four 100-mA pulses of proximity detection.
4 IR LED Pulses
Prox Accum
Prox ADC
65 ms (29 ms LED On Time)
2.72 ms
Example: ~49 ms Cycle TIme
State
Duration (m)
Current (mA)
Wait
43.52 ms
Prox Accum
LED On
Prox DC
Wait
0.065 (Note 1)
0.029 Note )
2.72
100.0
0.175
0.065
0.175
Wait
Delay
43.52
5.44 ms
Wait elay
544
Average Current = ((0.029 ꢀ 100) + 0.175) + (43.52 ꢀ 0.065) + (5.44 ꢀ 0.175)) / 52 = 138 mA
Note 1: Prox Accum = 16.3 ms per pule ꢀ 4 pulses = 65 s = 0.65 ms
Note 2: LED On = 7.2 ms per pulse ꢀ 4 pulses = 29 ms 0.029 ms
Figure 12. Powr Consumption Caulations
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I2C Protocol
2
Interface and control are accomplished through an I C serial compatible interface (standard or fast mode) to
a set of registers that provide access to device control functions and output data. The devices support the 7-bit
2
I C addressing protocol. Devices TSL26711 and TSL26713 are at slave address 0x39, while the TSL26715 and
TSL26717 devices are at slave address 0x29.
2
The I C standard provides for three types of bus transaction: read, write, and a combined protocol (Figure 13).
During a write operation, the first byte written is a command byte followed by data. In a combined protocol, the
first byte written is the command byte followed by reading a series of bytes. If a read command is issued, th
register address from the previous command will be used for data access. Likewise, if the MSB of the command
is not set, the device will write a series of bytes at the address stored in the last valid command with a register
address. The command byte contains either control information or a 5-bit register address. The conrol
commands can also be used to clear interrupts.
2
2
The I C bus protocol was developed by Philips (now NXP). For a complete description of the I C proocol, please
2
review the NXP I C design specification at http://www.i2c−bus.org/references/.
A
N
P
R
S
S
W
Acknowledge (0)
Not Acknowledged (1)
Stop Condition
Read (1)
Start Condition
Repeated Start Condition
Write (0)
... Continuation of protocol
Master-to-Slave
Slave-to-Master
1
7
1
1
8
8
1
1
...
...
S
Slave Address
W
Command Code
A
Data Byte
A
P
2
I C Wrie Protocol
1
7
1
1
8
1
8
1
1
S
Slave Address
R
A
Data
A
Data
A
P
2
I C Read Protocol
1
7
1
1
8
1
1
8
1
1
S
Slave Addres
W
A
Command Code
A
S
Data
R
A
8
1
8
1
1
...
Data
A
Data
A
P
2
I C Read Protocol — Combined Format
2
Figure 13. I C Protocols
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DIGITAL PROXIMITY DETECTOR
TAOS118 − JANUARY 2011
Register Set
The device is controlled and monitored by data registers and a command register accessed through the serial
interface. These registers provide for a variety of control functions and can be read to determine results of the
ADC conversions. The register set is summarized in Table 1.
Table 1. Register Address
ADDRESS
−−
RESISTER NAME
COMMAND
ENABLE
PTIME
R/W
W
REGISTER FUNCTION
Specifies register address
RESET VALUE
0x00
0x00
0x02
0x03
0x08
0x09
0x0A
0x0B
0x0C
0x0D
0x0E
0x0F
0x12
0x13
0x18
0x19
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R
Enables states and interrupts
Proximity ADC time
0x00
0xFF
0xFF
0x0
WTIME
Wait time
PILTL
Proximity interrupt low threshold low byte
Proximity interrupt low threshold high byte
Proximity interrupt high threshold low byte
Proximity interrupt high threshold high byte
Interrupt persistence filter
Configuration
PILTH
x0
PIHTL
0x00
PIHTH
0x00
PERS
0x00
CONFIG
PPCOUNT
CONTROL
ID
0x00
Proximity pulse count
0x00
Control register
0x00
Device ID
ID
STATUS
PDATAL
PDATAH
R
Device status
0x00
R
Proximity ADC low data register
Proximity Dhh data register
0x00
R
0x00
2
The mechanics of accessing a specific register depends on he specific protocol used. See the section on I C
protocols on the previous pagesIgeneral, the COMMAND register is written first to specify the specific
control/status register for following d/write opera.
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Command Register
The command registers specifies the address of the target register for future write and read operations.
Table 2. Command Register
7
6
5
4
3
2
ADD
1
0
COMMAND
− −
COMMAND
TYPE
FIELD
COMMAND
TYPE
BITS
7
DESCRIPTION
Select Command Register. Must write as 1 when addressing COMMAND register.
Selects type of transaction to follow in subsequent data transfers:
6:5
FIELD VALUE
DESCRIPTION
00
01
10
11
Repeated byte protocol transaction
Auto-increment protocol transaction
Reserved — Do not use
Special function — See description belw
Transaction type 00 will repeatedly read thsame register with each ta acess.
Transaction type 01 will provide an aut-increment function to read succssive register bytes.
ADD
4:0
Address register/special function regisr. Depding on the tranaction type, see above, this field either
specifies a special function command or elecs the specific contrtats-register for following write and
read transactions:
FIELD VALUE
00000
DESRIPTION
Nrml — no action
Proimity interrupt clear
00101
Proximity Interrupt Clear cleas any pending pity interrupt. This special function is self clearing.
Enable Register (0x00)
The ENABLE register is used ower the devion/off, enable functions, and interrupts.
Table 3. Enable Register
7
6
5
4
3
2
1
0
Address
0x00
Reserved
PEN
Reserved
WEN
PEN
PON
ENABLE
FIELD
Reserved
PIEN
BITS
7:6
5
DESCRIPTION
ReserveWite as 0.
Proximy interrupt mask. When asserted, permits proximity interrupts to be generated.
Reseved. Write as 0.
Reserved
4
Wait Enable. This bit activates the wait feature. Writing a 1 activates the wait timer. Writing a 0 disables the
wait timer.
WEN
PEN
3
2:1
0
Proximity enable. These bits activate the proximity function. Writing a 11b enables proximity. Writing a 00b
disables proximity. The Wait Time register should be configured before asserting proximity enable.
Power ON. This bit activates the internal oscillator to permit the timers and ADC channel to operate. Writing
a 1 activates the oscillator. Writing a 0 disables the oscillator.
1,
PON
NOTE: 1. See Power Management section for more information.
2. A minimum interval of 2.72 ms must pass after PON is asserted before proximity can be initiated. This required time is enforced
by the hardware in cases where the firmware does not provide it.
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Proximity Time Control Register (0x02)
The proximity timing register controls the integration time of the proximity ADC in 2.72 ms increments. It is
recommended that this register be programmed to a value of 0xFF (1 integration cycle).
Table 4. Proximity Time Control Register
FIELD
BITS
DESCRIPTION
INTEG_CYCLES
PTIME
7:0
VALUE
TIME
MAX COUNT
0xFF
1
2.72 ms
1023
Wait Time Register (0x03)
Wait time is set 2.72 ms increments unless the WLONG bit is asserted, in which case the wait times re ×
longer. WTIME is programmed as a 2’s complement number.
Table 5. Wait Time Register
FIELD
BITS
DESCRIPTION
TIME (WLONG = 0)
WTIME
7:0
REGISTER VALUE
WAIT TIME
TIME (WLONG = 1)
0.032 sec
0xFF
0xB6
0x00
1
2.72 ms
201 ms
6 ms
7
2.4 sec
256
8.3 sec
NOTE: The Wait Time register should be configured before PEN is asserted.
Proximity Interrupt Threshold Registers (0x08 − 0x0B)
The proximity interrupt threshold registrs provide the valueto be used as the high and low trigger points for
the comparison function for interrupt eneration. If the vale generated by proximity channel crosses below the
lower threshold specified, or above e higher thresh, an interrupt is signaled to the host processor.
Table 6. Proximity Interrupt Threshold Registers
REGISTER
PILTL
ADDRESS
0x08
BITS
7:0
DESCRIPTION
Proximity ow threshold lower byte
Proximlow threshold upper byte
Proxhigh threshold lower byte
Proimity high threshold upper byte
PILTH
0x09
7:0
PIHTL
0x0A
7:0
PIHTH
0x0B
7:0
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Persistence Register (0x0C)
The persistence register controls the filtering interrupt capabilities of the device. Configurable filtering is
provided to allow interrupts to be generated after each ADC integration cycle or if the ADC integration has
produced a result that is outside of the values specified by threshold register for some specified amount of time.
Table 7. Persistence Register
7
6
5
4
3
2
1
0
Address
0x0C
PERS
FIELD
PPERS
Reserved
BITS
DESCRIPTION
Proximity interrupt persistence. Controls rate of proximity interrupt to the host processor.
PPERS
7:4
FIELD VALUE
MEANING
INTERRUPT PERSISTENCE FUNCTION
Every proximity cycle generates an interrupt
0000
0001
0010
...
−−−
1
1 proximity value out of range
2 consecutive proximity values out of rnge
...
2
...
1111
15
15 cnsecue proximity values out of ange
Reserved
3:0
Default setting is 0x00.
Configuration Register (0x0D)
The configuration register sets the wait long time.
Table 8. Configuration egster
7
6
5
4
3
2
1
0
Address
0x0D
CONFIG
FIELD
WLONG
Reserved
Reserved
BITS
DESCRIPTION
Reserved
WLONG
Reserved
7:2
Reserved. Write as 0.
Wait Long. When sserted, the wait cycles are increased by a factor 12× from that programmed in the
1
0
WTIME register.
Reserved. Wite s 0.
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Proximity Pulse Count Register (0x0E)
The proximity pulse count register sets the number of proximity pulses that will be transmitted. PPULSE defines
the number of pulses to be transmitted at a 62.5-kHz rate.
While the value can be programmed up to 255 pulses, the practical limit of the device is 32 pulses. It is
recommended that 32 or fewer pulses be used to achieve maximum signal-to-noise ratio.
Table 9. Proximity Pulse Count Register
7
6
5
4
3
2
1
0
Address
0x0E
PPULSE
PPULSE
FIELD
PPULSE
BITS
DESCRIPTION
Proximity Pulse Count. Specifies the number of proximity pulses to be generated.
7:0
Control Register (0x0F)
The Control register provides four bits of control to the analog block. These bits contrthe iode drive current
and diode selection functions.
Table 10. Contl Register
7
6
5
4
3
2
1
0
Address
0x0F
CONTROL
PDRIVE
PDIODE
Rserved
DSCRTION
FIELD
BITS
PDRIVE
7:6
LED Drive Strength
FIELD VALU
LED STRENGTH
00
01
10
11
100 mA
50 mA
25 mA
12.5 mA
PDIODE
5:4
3:0
Proximity Diode Sele.
FIELD VALUE
DIODE SELECTION
00
01
10
11
erved
Proximity uses the Channel 0 diode
Proximity uses the Channel 1 diode
Proximity uses both diodes
Reserved
eservd. Write bits as 0.
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ID Register (0x12)
The ID Register provides the value for the part number. The ID register is a read-only register.
Table 11. ID Register
7
6
5
4
3
2
1
0
Address
0x12
ID
ID
FIELD
BITS
DESCRIPTION
0x00 = TSL26711 and TSL2615
0x09 = TSL26713 and TSL6717
ID
7:0
Part number identification
Status Register (0x13)
The Status Register provides the internal status of the device. This register is read only.
Table 12. Status Register
7
6
5
4
3
2
1
0
Address
0x13
STATUS
FIELD
Reserved
PINT
Reserved
BIT
7:6
5
DESCRIPTIN
Reserved
PINT
Reserved.
Proximity Interrupt. Indicas tht the device is ang a proximity interrupt.
Reserved.
Reserved
4:0
Proximity Data Registers (0x1− 0x19h)
2
Proximity data is stored as a 16-bit value. To ethe data is read correctly, a two-byte I C read transaction
should be utilized with auto increment protocol bits set in the command register. With this operation, when the
lower byte register is read, the upper eight bits re stored into a shadow register, which is read by a subsequent
read to the upper byte. The upper rgister will read the correct value even if the next ADC cycle ends between
the reading of the lower and upper reisters.
Te 13. Proximity Data Registers
REGISTER
PDATAL
ADRESS
0x18
BITS
7:0
DESCRIPTION
Proximity data low byte
PATAH
0x19
7:0
Proximity data high byte
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APPLICATION INFORMATION: HARDWARE
LED Driver Pin with Proximity Detection
The application hardware circuit with proximity detection requires an LED connected as shown in Figure 14.
V
may be an independent power source. The 1-μF decoupling capacitors should be of the low-ESR type and
bat
be placed as close as possible to the load and V to reduce noise. To maximize system performance, the use
DD
of PCB power and ground planes are recommended. If mounted on a flexible circuit, the power and ground
traces back to the PCB should be sufficiently wide enough to have a low resistance, such as < 1Ω.
2
The I C bus protocol was developed by Philips (now NXP). The pull-up resistor value (R ) is a function of he
P
2
2
I C bus speed, the supply voltage, and the capacitive bus loading. Users should consult the NXP I C design
specification (http://www.i2c−bus.org/references/) for assistance. With a lightly loaded bus running at 400 ks
and V = 3 V, 1.5-kΩ resistors have been found to be viable.
DD
V
V
V
DD(digital)
BUS
DD(analog)
LD
1 mF
1 mF
TSL2671
R
P
R
P
R
PI
DR
INT
SCL
SDA
Figure 14. Application Hardware Circuit for Proxmiy Sensing with Internal LED Driver
The power supply connection — Prouting and ly decoupling — has a significant effect on proximity
performance. Contact TAOS or see the applicatios available at www.TAOSinc.com for power supply
guidance.
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APPLICATION INFORMATION: HARDWARE
If the hardware application requires more than 100 mA of current to drive the LED, then an external transistor
should be used. Note, R2 should be sized adequately to bias the gate voltage given the LDR current mode
setting. See Figure 15.
V
V
V
DD(digital)
BUS
DD(analog)
R2
1 mF
LED
1 mF
TSL2671
R
P
R
P
R
PI
R1
LDR
INT
SCL
SDA
Figure 15. Application Hardware Circuit for Proty Sensing with External LED Driver Using P-FET
Traistor
PCB Pad Layout
Suggested PCB pad layout guidelins for the Dual Flat o-Lead (FN) surface mount package are shown in
Figure 16.
0
Note: Pads can be
extended further if hand
soldering is needed.
1000
1000
400
650
650
1700
400
NOTES: A. All linear diensions are in micrometers.
B. Thdrang is subject to change without notice.
Figure 16. Suggested FN Package PCB Layout
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MECHANICAL DATA
PACKAGE FN
Dual Flat No-Lead
TOP VIEW
Pin 1 Marker
PIN OUT
TOP VIEW
PIN 1
VDD
1
6 SDA
5 INT
SCL 2
GND 3
2000 ꢂ 75
4 LDR
2000
ꢂ 75
Photo-Active Ara
END VIEW
SIDE VIEW
650 ꢂ 50
Seating Plane
203 ꢂ 8
650
300
ꢂ 50
BOTTOM VIEW
650
PIN 1
300 ꢂ 50
Pb
750 ꢂ 150
NOTES: A. All lineadimesions are in micrometers. Dimension tolerance is 20 μm unless otherwise noted.
Lead Free
B. The photoiode active area is 466 μm square and its center is 140 μm above and 20 μm to the right of the package center. The die
plent tolerance is 75 μm in any direction.
C. Paagtop surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
DContact finish is copper alloy A194 with pre-plated NiPdAu lead finish.
E. his package contains no lead (Pb).
F. This drawing is subject to change without notice.
Figure 17. Package FN — Dual Flat No-Lead Packaging Configuration
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MECHANICAL DATA
TOP VIEW
2.00 ꢂ 0.05
1.75
ꢃ 1.50
4.00
4.00
B
+ 0.30
8.00
− 0.10
3.50 ꢂ 0.05
ꢃ 1.00
ꢂ 0.25
B
A
A
DETAIL A
DETAIL B
5ꢁ Max
5ꢁ Max
0.254
2.18 ꢂ 0.05
2.18 ꢂ 0.05
ꢂ
0
.
0
2
0.83 ꢂ 0.05
B
o
A
o
K
o
NOTES: A. Alineadimensions are in millimeters. Dimension tolerance is 0.10 mm unless otherwise noted.
B. The imensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
C. Symbs on drawing A , B , and K are defined in ANSI EIA Standard 481−B 2001.
o
o
o
DEah reel is 178 millimeters in diameter and contains 3500 parts.
E. TAOS packaging tape and reel conform to the requirements of EIA Standard 481−B.
F. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape.
G. This drawing is subject to change without notice.
Figure 18. Package FN Carrier Tape
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MANUFACTURING INFORMATION
The FN package has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate.
The process, equipment, and materials used in these test are detailed below.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The components should
be limited to a maximum of three passes through this solder reflow profile.
Table 14. Solder Reflow Profile
PARAMETER
Average temperature gradient in preheating
Soak time
REFERENCE
DEVICE
2.5°C/sec
t
2 to 3 minutes
Max 60 sec
Max 50 sec
Max 10 sec
260°C
soak
Time above 217°C (T1)
t
1
Time above 230°C (T2)
t
2
Time above T
−10°C (T3)
t
peak
3
Peak temperature in reflow
T
peak
Temperature gradient in cooling
Max −5°C/sec
Not to scale — for reference only
T
peak
T
3
T
T
2
1
Time (sec)
t
t
t
3
2
1
t
soak
Figure 19. Solder Reflow Profile Graph
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MANUFACTURING INFORMATION
Moisture Sensitivity
Optical characteristics of the device can be adversely affected during the soldering process by the release and
vaporization of moisture that has been previously absorbed into the package. To ensure the package contains
the smallest amount of absorbed moisture possible, each device is dry-baked prior to being packed for shipping.
Devices are packed in a sealed aluminized envelope called a moisture barrier bag with silica gel to protect them
from ambient moisture during shipping, handling, and storage before use.
The Moisture Barrier Bags should be stored under the following conditions:
Temperature Range
Relative Humidity
Total Time
< 40°C
< 90%
No longer than 12 months from the date code on the aluminized evele if
unopened.
Rebaking of the reel will be required if the devices have been stored unopened for mre tan 12 months and
the Humidity Indicator Card shows the parts to be out of the allowable moisture region.
Opened reels should be used within 168 hours if expoed to the following conditins:
Temperature Range
Relative Humidity
< 30°C
< 60%
If rebaking is required, it should be done at 50°C fo12 hours.
The FN package has been assigned a misture sensitivity level of MSL 3.
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PRODUCTION DATA — information in this document is current at publication date. Products conform to
specifications in accordance with the terms of Texas Advanced Optoelectronic Solutions, Inc. standard
warranty. Production processing does not necessarily include testing of all parameters.
LEAD-FREE (Pb-FREE) and GREEN STATEMENT
Pb-Free (RoHS) TAOS’ terms Lead-Free or Pb-Free mean semiconductor products that are compatible with the current
RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous
materials. Where designed to be soldered at high temperatures, TAOS Pb-Free products are suitable for use in specified
lead-free processes.
Green (RoHS & no Sb/Br) TAOS defines Green to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and
Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material).
Important Information and Disclaimer The information provided in this statement represents TAOS’ knowlege and
belief as of the date that it is provided. TAOS bases its knowledge and belief on information provided by third parties,
and makes no representation or warranty as to the accuracy of such information. Efforts are underway better integrate
information from third parties. TAOS has taken and continues to take reasonable steps to proide epresentative
and accurate information but may not have conducted destructive testing or chemical analysis on comng materials and
chemicals. TAOS and TAOS suppliers consider certain information to be proprietary, and thCAS numbers and other
limited information may not be available for release.
NOCE
Texas Advanced Optoelectronic Solutions, Inc. (TAOS) reservs the right to make chages to the products contained in this
document to improve performance or for any other purpose, or to discontinue tem without notice. Customers are advised
to contact TAOS to obtain the latest product information before placing orders r designing TAOS products into systems.
TAOS assumes no responsibility for the use f ay products or cicuits scibed in this document or customer product
design, conveys no license, either expressed oimplied, under any paent or other right, and makes no representation that
the circuits are free of patent infringement. TAOS further makes no aim as to the suitability of its products for any particular
purpose, nor does TAOS assume any liility arising out of the se of any product or circuit, and specifically disclaims any
and all liability, including without limitatconsequential oncidntal damages.
TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS, IC. PRODUCTS ARE NOT DESIGNED OR INTENDED FOR
USE IN CRITICAL APPLICATIONS IN WHICH TE FILURE OR MALFUNCTION OF THE TAOS PRODUCT MAY
RESULT IN PERSONAL INJURY OR DEATH. USE OF TAOS PRODUCTS IN LIFE SUPPORT SYSTEMS IS EXPRESSLY
UNAUTHORIZED AND ANY SUCH USE BY CUSTOMER IS COMPLETELY AT THE CUSTOMER’S RISK.
LUMENOLOGY, TAOS, the TAOS logo, and Ts Advanced Optoelectronic Solutions are registered trademarks of Texas Advanced
Optoelectronic Solutions Incorpoated
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