TSL26711 [AMSCO]
Digital Proximity Detector;
| 型号： | TSL26711 |
| 厂家： | 
AMS(艾迈斯) |
| 描述： | Digital Proximity Detector |
| 文件： | 总44页 (文件大小：691K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TSL2671
Digital Proximity Detector
The TSL2671 family of devices provides a complete proximity
detection system and digital interface logic in a single 6-pin
package. The device includes a digital proximity sensor with
integrated LED driver for the required external IR LED. The
proximity function offers a wide range of performance, with
four programmable LED drive currents and a pulse repetition
range of 1 to 32 pulses. The proximity detection circuitry
compensates for ambient light, allowing it to operate in
environments ranging from bright sunlight to dark rooms. This
wide dynamic range also allows operation in short-distance
detection applications behind dark glass, such as cell phones.
An internal state machine provides the ability to put the device
into a low-power mode for very low average power
consumption.
General Description
The proximity function specifically targets near-field proximity
applications. In cell phones, for example, the proximity
detection function can detect when the user positions the
phone close to their ear. The device is fast enough to provide
proximity information at the high repetition rate needed when
answering a phone call. This provides both improved green
power saving capability and the added security to lock the
screen when the user may accidently deploy a touch.
Communication with the device is accomplished through a
simple two-wire I²C interface with data rates up to 400 kHz. An
interrupt output pin is provided for connection to the host
processor. This interrupt pin can be used to eliminate the need
to poll the device on a repetitive basis. There is also a digital
filter that compares the proximity ADC results to programmed
values so that an interrupt is generated only upon a proximity
event.
The TSL2671 is supplied in a very small form factor
2 mm × 2 mm, 6-pin optical package, requiring very little PCB
area. Also, the package height is only 0.65 mm high, which
makes the TSL2671 suitable for very thin mechanical
applications.
Ordering Information and Content Guide appear at end of
datasheet.
ams Datasheet
Page 1
[v1-00] 2016-Jul-12
Document Feedback
TSL2671 − General Description
Key Benefits & Features
The benefits and features of TSL2671, Digital Proximity Detector
are listed below:
Figure 1:
Added Value Of Using TSL2671
Benefits
Features
• Enables Operation in IR Light Environments
• Enables Operation in High Lux Sunlight and
Accurate Sensing Behind Spectrally Distorting
Materials
• Patented Dual-Diode Architecture
• 2000:1 Dynamic Range
• Allows Multiple Power-Level Selection without
External Passives
• Programmable LED Drive Current
• Programmable Interrupt Function
• Reduces Micro-Processor Interrupt Overhead
• Reduces Board Space Requirements while
Simplifying Designs
• Area Efficient 2mm x 2mm Dual Flat No-Lead (FN)
Package
• Proximity Detection with an Integrated LED Driver in a
Single Device
• Proximity Detection
• Programmable Number of IR Pulses
• Programmable Current Sink for the IR LED — No
Limiting Resistor Needed
• Programmable Interrupt Function with Upper and
Lower Threshold
• Covers a 2000:1 Dynamic Range
• Programmable Wait Timer
• Programmable from 2.72 ms to > 8 Seconds
• Wait State — 65μA Typical Current
• I²C Interface Compatible
• Up to 400 kHz (I²C Fast Mode)
• Dedicated Interrupt Pin
• Small 2 mm × 2 mm ODFN Package
• Sleep Mode — 2.5 μA Typical Current
Applications
TSL2671, Digital Proximity Detector is ideal for:
• Cell Phone Touch Screen Disable
• Notebook/Monitor Security
• Automatic Speakerphone Enable
• Automatic Menu Popup
Page 2
Document Feedback
ams Datasheet
[v1-00] 2016-Jul-12
TSL2671 − General Description
Functional Block Diagram
The functional blocks of this device are shown below:
Figure 2:
TSL2671 Block Diagram
Interrupt
INT
IR LED Constant
Current Sink
LDR
Prox Control
SCL
Upper Limit
Lower Limit
V
DD
Prox
Prox
ADC
Prox
Data
Integration
SDA
Wait Control
CH0
GND
CH1
ams Datasheet
[v1-00] 2016-Jul-12
Page 3
Document Feedback
TSL2671 − Detailed Description
The TSL2671 light-to-digital device provides on-chip
Detailed Description
photodiodes, integrating amplifiers, ADCs, accumulators,
clocks, buffers, comparators, a state machine, and an I²C
interface. Each device combines a Channel 0 photodiode (CH0),
which is responsive to both visible and infrared light, and a
channel 1 photodiode (CH1), which is responsive primarily to
infrared light. Proximity detection can occur using either or
both photodiodes. Two integrating ADCs simultaneously
convert the amplified photodiode currents into a digital value
providing up to 16 bits of resolution. Upon completion of the
conversion cycle, the conversion result is transferred to the data
registers.
Proximity detection requires only a single external IR LED. An
internal LED driver can be configured to provide a constant
current sink of 12.5 mA, 25 mA, 50 mA, or 100 mA of current. No
external current limiting resistor is required. The number of
proximity LED pulses can be programmed from 1 to 255 pulses.
Each pulse has a 16-μs period. This LED current, coupled with
the programmable number of pulses, provides a 2000:1
contiguous dynamic range.
Communication to the device is accomplished through a fast
(up to 400 kHz), two-wire I²C serial bus for easy connection to
a microcontroller or embedded controller. The digital output of
the device is inherently more immune to noise when compared
to an analog interface.
The device provides a separate pin for level-style interrupts.
When interrupts are enabled and a pre-set value is exceeded,
the interrupt pin is asserted and remains asserted until cleared
by the controlling firmware. The interrupt feature simplifies and
improves system efficiency by eliminating the need to poll a
sensor for a proximity value. An interrupt is generated when the
value of a proximity conversion exceeds either an upper or
lower threshold. In addition, a programmable interrupt
persistence feature allows the user to determine how many
consecutive exceeded thresholds are necessary to trigger an
interrupt.
Page 4
ams Datasheet
Document Feedback
[v1-00] 2016-Jul-12
TSL2671 − Pin Assignments
The TSL2671 pin assignments are described below:
Pin Assignments
Figure 3:
Package FN Dual Flat No-Lead (Top View)
6 SDA
5 INT
VDD
1
SCL 2
GND 3
4 LDR
Package Image Not Actual Size
Figure 4:
Terminal Functions
Terminal
Type
Description
Name
No
V
1
2
3
4
5
6
Supply voltage.
DD
SCL
GND
LDR
INT
I
I²C serial clock input terminal — clock signal for I²C serial data.
Power supply ground. All voltages are referenced to GND.
LED driver for proximity emitter — up to 100 mA, open drain.
Interrupt — open drain
O
O
SDA
I/O
I²C serial data I/O terminal — serial data I/O for I²C.
ams Datasheet
[v1-00] 2016-Jul-12
Page 5
Document Feedback
TSL2671 − Absolute Maximum Ratings
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or
any other conditions beyond those indicated under
Recommended Operating Conditions is not implied. Exposure
to absolute-maximum-rated conditions for extended periods
may affect device reliability.
Absolute Maximum Ratings
Figure 5:
Absolute Maximum Ratings Over Operating Free-Air Temperature Range (unless otherwise noted)
Symbol
Parameter
Min
Max
Units
(1)
Supply voltage
3.8
3.8
+20
85
V
V
V
DD
V
Digital output voltage range
Digital output current
-0.5
-1
O
I
mA
°C
V
O
T
Storage temperature range
ESD tolerance, human body model
-40
STRG
ESD
2000
HBM
Note(s):
1. All voltages are with respect to GND.
Figure 6:
Recommended Operating Conditions
Parameter
Min
2.6
-3
Nom
Max
Units
Supply voltage, V
3
3.6
3
V
DD
Supply voltage accuracy, V total error including transients
%
°C
DD
Operating free-air temperature, T
-30
70
A
Page 6
ams Datasheet
Document Feedback
[v1-00] 2016-Jul-12
TSL2671 − Absolute Maximum Ratings
Operating Characteristics
V
= 3 V, T = 25°C (unless otherwise noted)
A
DD
Figure 7:
Operating Characteristics
Symbol
Parameter
Test Conditions
Min
Typ
175
65
Max
Unit
Active — LDR pulse off
Wait mode
250
I
Supply current
μA
DD
Sleep mode
2.5
4
3 mA sink current
0
0
0.4
0.6
V
INT, SDA output low voltage
V
OL
6 mA sink current
Leakage current, SDA, SCL,
INT pins
I
−5
5
μA
μA
LEAK
I
Leakage current, LDR pin
10
LEAK
0.7 V
TSL26711, TSL26715
DD
V
SCL, SDA input high voltage
V
V
IH
1.25
TSL26713, TSL26717
TSL26711, TSL26715
0.3V
DD
V
SCL, SDA input low voltage
IL
0.54
TSL26713, TSL26717
ams Datasheet
Page 7
[v1-00] 2016-Jul-12
Document Feedback
TSL2671 − Absolute Maximum Ratings
Proximity Characteristics
V
= 3 V, T = 25°C, PEN = 1 (unless otherwise noted)
A
DD
Figure 8:
Proximity Characteristics
Test
Conditions
Parameter
Condition
Min Typ Max
Unit
I
Supply current
LDR pulse on
PTIME = 0xFF
3
mA
ms
DD
ADC conversion time step
size
2.58
1
2.72
2.9
ADC number of integration
steps
256
steps
ADC counts per step
IR LED pulse count
Pulse period
PTIME = 0xFF
0
0
1023
255
counts
pulses
μs
16.3
7.2
Pulse — LED on time
μs
PDRIVE=0
PDRIVE=1
PDRIVE=2
PDRIVE=3
75
100
50
125
I
sink current
SINK
LED Drive
mA
@ 600 mV, LDR pin
25
12.5
(1)
18
inches
Operating distance
Note(s):
1. Proximity Operating Distance is dependent upon emitter properties and the reflective properties of the proximity surface. The
nominal value shown uses an IR emitter with a peak wavelength of 850 nm and a 20° half angle. The proximity surface used is 90%
reflective (white surface) 16 × 20-inch Kodak Gray Card. 60 mw/SR, 100 mA, 64 pulses, open view (no glass). Greater distances are
achievable with appropriate system considerations.
Wait Characteristics
V
= 3 V, T = 25°C, WEN = 1 (unless otherwise noted)
A
DD
Figure 9:
Wait Characteristics
Test
Conditions
Parameter
Channel
Min
Typ Max
Unit
Wait step size
WTIME = 0xFF
2.58
1
2.72
2.9
ms
Wait number of integration steps
256
steps
Page 8
ams Datasheet
Document Feedback
[v1-00] 2016-Jul-12
TSL2671 − Absolute Maximum Ratings
AC Electrical Characteristics
V
= 3 V, T = 25°C, (unless otherwise noted)
DD
A
Figure 10:
AC Electrical Characteristics
Test
Conditions
Parameter (1)
Symbol
Min
Typ Max Unit
f
Clock frequency (I²C only)
0
400
kHz
(SCL)
Bus free time between start and stop
condition
t
1.3
μs
(BUF)
Hold time after (repeated) start
condition. After this period, the first
clock is generated.
t
0.6
μs
(HDSTA)
t
t
Repeated start condition setup time
Stop condition setup time
Data hold time
0.6
0.6
0
μs
μs
μs
ns
μs
μs
ns
ns
pF
(SUSTA)
(SUSTO)
(HDDAT)
t
t
Data setup time
100
1.3
0.6
(SUDAT)
t
SCL clock low period
SCL clock high period
Clock/data fall time
(LOW)
t
(HIGH)
t
300
300
10
F
t
Clock/data rise time
Input pin capacitance
R
C
i
Note(s):
1. Specified by design and characterization; not production tested.
ams Datasheet
Page 9
[v1-00] 2016-Jul-12
Document Feedback
TSL2671 − Parameter Measurement Information
Parameter Measurement
Information
Figure 11:
Timing Diagrams
t
t
(R)
t
(F)
(LOW)
V
IH
SCL
SDA
V
IL
t
t
t
(HDSTA)
(HIGH)
(SUSTA)
t
t
t
t
(BUF)
(HDDAT)
(SUSTO)
(SUDAT)
V
V
IH
IL
P
S
S
P
Stop
Condition
Start
Condition
Start
Stop
t
(LOWSEXT)
SCL
SCL
ACK
ACK
t
t
t
(LOWMEXT)
(LOWMEXT)
(LOWMEXT)
SCL
SDA
Page 10
ams Datasheet
Document Feedback
[v1-00] 2016-Jul-12
TSL2671 − Typical Characteristics
Typical Characteristics
Figure 12:
Spectral Responsivity
1
Ch 0
0.8
0.6
0.4
0.2
0
Ch 1
300 400 500 600 700 800 900 1000 1100
λ − Wavelength − nm
Figure 13:
LDR Output Compliance
112.5
100
87.5
75
100 mA
62.5
50 mA
50
37.5
25
25 mA
12.5 mA
12.5
0
0
0.3
0.6
0.9
1.2
V
− Output Low Voltage − V
OL
ams Datasheet
[v1-00] 2016-Jul-12
Page 11
Document Feedback
TSL2671 − Typical Characteristics
Figure 14:
Normalized I vs.V and Temperature
DD
DD
DD
110%
108%
106%
75ꢀC
104%
102%
50ꢀC
25ꢀC
100%
98%
96%
94%
92%
0ꢀC
2.7
2.8
2.9
3
3.1
3.2
3.3
V
— V
DD
Page 12
Document Feedback
ams Datasheet
[v1-00] 2016-Jul-12
TSL2671 − Principles of Operation
Principles of Operation
System State Machine
The device provides control of proximity detection and power
management functionality through an internal state machine.
After a power-on-reset, the device is in the sleep mode. As soon
as the PON bit is set, the device will move to the start state. It
will then cycle through the Proximity and Wait states. If these
states are enabled, the device will execute each function. If the
PON bit is set to a 0, the state machine will continue until the
current conversion is complete and then go into a low-power
sleep mode.
Figure 15:
Simplified State Diagram
Sleep
PON = 1
(r0x00:b0)
PON = 0
(r0x00:b0)
Start
Prox
Wait
Note(s):
1. In this document, the nomenclature uses the bit field name in italics followed by the register number and bit number to allow the
user to easily identify the register and bit that controls the function. For example, the power on (PON) is in register 0x00, bit 0. This
is represented as PON (r0x00:b0).
ams Datasheet
Page 13
[v1-00] 2016-Jul-12
Document Feedback
TSL2671 − Principles of Operation
Proximity Detection
Proximity sensing uses an external light source (generally an
infrared emitter) to emit light, which is then viewed by the
integrated light detector to measure the amount of reflected
light when an object is in the light path (Figure 16). The amount
of light detected from a reflected surface can then be used to
determine an object’s proximity to the sensor.
Figure 16:
Proximity Detection
Surface Reflectivity (SR)
Glass Attenuation (GA)
Distance (D)
IR LED
2771
Background Energy (BGE)
Optical Crosstalk (OC)
The device has controls for the number of IR pulses (PPCOUNT),
the integration time (PTIME), the LED drive current (PDRIVE),
and the photodiode configuration (PDIODE) (Figure 17). The
photodiode configuration can be set to CH1 diode
(recommended), CH0 diode, or a combination of both diodes.
At the end of the integration cycle, the results are latched into
the proximity data (PDATAx) registers.
Figure 17:
Proximity Detection Operation
V
DD
IR
LED
PDRIVE(r0x0F, b7:6)
PTIME(r0x02)
IR LED Constant
Current Sink
Prox Control
Prox
Prox
Prox
Data
PDATAH(r0x19), PDATAL(r0x18)
Integration ADC
PPCOUNT(r0x0E)
CH0
CH1
Page 14
Document Feedback
ams Datasheet
[v1-00] 2016-Jul-12
TSL2671 − Principles of Operation
The LED drive current is controlled by a regulated current sink
on the LDR pin. This feature eliminates the need to use a current
limiting resistor to control LED current. The LED drive current
can be configured for 12.5 mA, 25 mA, 50 mA, or 100 mA. For
higher LED drive requirements, an external P type transistor can
be used to control the LED current.
The number of LED pulses can be programmed to any value
between 1 and 255 pulses as needed. Increasing the number of
LED pulses at a given current will increase the sensor sensitivity.
Sensitivity grows by the square root of the number of pulses.
Each pulse has a 16-μs period.
Figure 18:
Proximity IR LED Waveform
Add IR + Subtract
Background Background
LED On
LED Off
16 ms
IR LED Pulses
The proximity integration time (PTIME) is the period of time that
the internal ADC converts the analog signal to a digital count.
It is recommend that this be set to a minimum of PTIME = 0xFF
or 2.72 ms.
The combination of LED power and number of pulses can be
used to control the distance at which the sensor can detect
proximity. Figure 19 shows an example of the distances covered
with settings such that each curve covers 2X the distance.
Counts up to 64 pulses provide a 16X range.
ams Datasheet
Page 15
[v1-00] 2016-Jul-12
Document Feedback
Figure 19:
Proximity ADC Count vs. Relative Distance
1000
25 mA,
1 Pulse
100 mA,
64 Pulses
800
100 mA,
16 Pulses
600
400
100 mA,
4 Pulses
100 mA,
1 Pulse
200
0
1ꢁ 2ꢁ 4ꢁ
8ꢁ
16ꢁ
Relative Distance
Page 16
Document Feedback
ams Datasheet
[v1-00] 2016-Jul-12
TSL2671 − Principles of Operation
Interrupts
The interrupt feature simplifies and improves system efficiency
by eliminating the need to poll the sensor for a proximity value.
The interrupt mode is determined by the state of the PIEN field
in the ENABLE register.
Two 16-bit-wide interrupt threshold registers allow the user to
define upper and lower threshold limits. An interrupt can be
generated when the proximity data (PDATA) exceeds the upper
threshold value (PIHTx) or falls below the lower threshold
(PILTx).
To further control when an interrupt occurs, the device provides
an interrupt persistence feature. This feature allows the user to
specify a number of conversion cycles for which an event
exceeding the proximity interrupt threshold must persist
(PPERS) before actually generating an interrupt. See the register
descriptions for details on the length of the persistence.
Figure 20:
Programmable Interrupt
PIHTH(r0x0B), PIHTL(r0x0A)
PPERS(r0x0C, b7:4)
Upper Limit
Prox Persistence
Prox
Integration
Prox
ADC
Prox
Data
Lower Limit
CH0
CH1
PILTH(r0x09), PILTL(r0x08)
ams Datasheet
[v1-00] 2016-Jul-12
Page 17
Document Feedback
TSL2671 − Principles of Operation
State Diagram
The following state diagram shows a more detailed flow for the
state machine. The device starts in the sleep mode. The PON bit
is written to enable the device. A 2.72-ms Start Delay will occur
before entering the start state. If the PEN bit is set, the state
machine will step through the proximity accumulate, then
proximity ADC conversion states. As soon as the conversion is
complete, the state machine will move to the Wait Check state.
If the WEN bit is set, the state machine will then cycle through
the wait state. If the WLONG bit is set, the wait cycles are
extended by 12X over normal operation. When the wait counter
terminates, the state machine will move to the 2.72-ms Wait
Delay state before returning to the Start state.
Figure 21:
Expanded State Diagram
PON = 1
Sleep
Start
Delay
PON = 0
2.72 ms
Start
5.44 ms
1 to 255 LED Pulses
Pulse Frequency: 62.5 kHz
Time: 16.3 ms − 4.2 ms
Prox
Check
Wait
Delay
PEN = 1
PEN = 0
WLONG = 0
1 to 256 steps
WEN = 0
Step: 2.72 ms
Time: 2.72 ms − 696 ms
Prox
Accum
Wait
Check
WEN = 1
WLONG = 1
1 to 256 steps
Step: 32.6 ms
1 to 256 steps
Prox
ADC
Wait
Step: 2.72 ms
Time: 2.72 ms − 696 ms
Recommended − 2.72 ms 1023 Counts
Time: 32.6 ms − 8.35 s
Page 18
Document Feedback
ams Datasheet
[v1-00] 2016-Jul-12
TSL2671 − Principles of Operation
Power Management
Power consumption can be controlled through the use of the
wait state timing because the wait state consumes only 65 μA
of power. Figure 37 shows an example of using the power
management feature to achieve an average power
consumption of 138 μA current with four 100-mA pulses of
proximity detection.
Figure 22:
Power Consumption Calculations
4 IR LED Pulses
Prox Accum
Prox ADC
65 ms (29 ms LED On Time)
2.72 ms
Example: ~49 ms Cycle TIme
State
Duration (ms)
Current (mA)
Wait
43.52 ms
Prox Accum
LED On
Prox ADC
Wait
Wait Delay
0.065 (Note 1)
0.029 (Note 2)
2.72
43.52
5.44
100.0
0.175
0.065
0.175
Wait
Delay
5.44 ms
Average Current = ((0.029 ꢁ 100) + (2.72 ꢁ 0.175) + (43.52 ꢁ 0.065) + (5.44 ꢁ 0.175)) / 52 = 138 mA
Note(s):
1. Prox Accum = 16.3 μs per pulse × 4 pulses = 65 μs = 0.065 ms
2. LED On = 7.2 μs per pulse × 4 pulses = 29 μs = 0.029 ms
ams Datasheet
Page 19
[v1-00] 2016-Jul-12
Document Feedback
TSL2671 − Principles of Operation
I²C Protocol
Interface and control are accomplished through an I²C serial
compatible interface (standard or fast mode) to a set of registers
that provide access to device control functions and output data.
The devices support the 7-bit I²C addressing protocol. Devices
TSL26711 and TSL26713 are at slave address 0x39, while the
TSL26715 and TSL26717 devices are at slave address 0x29.
The I²C standard provides for three types of bus transaction:
read, write, and a combined protocol (see Figure 23). During a
write operation, the first byte written is a command byte
followed by data. In a combined protocol, the first byte written
is the command byte followed by reading a series of bytes. If a
read command is issued, the register address from the previous
command will be used for data access. Likewise, if the MSB of
the command is not set, the device will write a series of bytes
at the address stored in the last valid command with a register
address. The command byte contains either control information
or a 5-bit register address. The control commands can also be
used to clear interrupts.
The I²C bus protocol was developed by Philips (now NXP). For
a complete description of the I²C protocol, please review the
NXP I²C design specification at
http://www.i2c-bus.org/references/.
Page 20
ams Datasheet
Document Feedback
[v1-00] 2016-Jul-12
TSL2671 − Principles of Operation
Figure 23:
I²C Protocols
1
7
1
1
8
1
8
1
1
...
...
S
Slave Address
W
A
Command Code
A
Data Byte
A
P
I2C Write Protocol
1
7
1
1
8
1
8
1
1
S
Slave Address
R
A
Data
A
Data
A
P
I2C Read Protocol
1
7
1
1
8
1
1
8
1
1
S
Slave Address
W
A
Command Code
A
S
Data
R
A
8
1
8
1
1
...
Data
A
Data
A
P
I2C Read Protocol — Combined Format
A
N
P
R
S
S
W
Acknowledge (0)
Not Acknowledged (1)
Stop Condition
Read (1)
Start Condition
Repeated Start Condition
Write (0)
... Continuation of protocol
Master-to-Slave
Slave-to-Master
ams Datasheet
[v1-00] 2016-Jul-12
Page 21
Document Feedback
TSL2671 − Register Description
Register Description
Register Set
The device is controlled and monitored by data registers and a
command register accessed through the serial interface. These
registers provide for a variety of control functions and can be
read to determine results of the ADC conversions. The register
set is summarized in Figure 24.
Figure 24:
Register Address
Address
−−
Register Name
R/W
Register Function
Reset Value
0x00
COMMAND
ENABLE
PTIME
W
Specifies register address
0x00
R/W Enables states and interrupts
R/W Proximity ADC time
R/W Wait time
0x00
0x02
0xFF
0x03
WTIME
0xFF
Proximity interrupt low threshold low
0x08
0x09
0x0A
0x0B
PILTL
PILTH
PIHTL
PIHTH
R/W
byte
0x00
0x00
0x00
0x00
Proximity interrupt low threshold high
R/W
byte
Proximity interrupt high threshold low
R/W
byte
Proximity interrupt high threshold
high byte
R/W
0x0C
0x0D
0x0E
0x0F
0x12
0x13
0x18
0x19
PERS
CONFIG
PPCOUNT
CONTROL
ID
R/W Interrupt persistence filters
R/W Configuration
0x00
0x00
0x00
0x00
ID
R/W Proximity pulse count
R/W Control register
R
R
R
R
Device ID
STATUS
PDATAL
PDATAH
Device status
0x00
0x00
0x00
Proximity ADC low data register
Proximity ADC high data register
The mechanics of accessing a specific register depends on the
specific protocol used. See the section on I²C protocols on the
previous pages. In general, the COMMAND register is written
first to specify the specific control/status register for following
read/write operations.
Page 22
Document Feedback
ams Datasheet
[v1-00] 2016-Jul-12
TSL2671 − Register Description
Command Register
The command registers specifies the address of the target
register for future write and read operations.
Figure 25:
Command Register
7
6
5
4
3
2
1
0
COMMAND
− −
COMMAND
TYPE
ADD
Field
Bits
Description
COMMAND
7
Select Command Register. Must write as 1 when addressing COMMAND register.
Selects type of transaction to follow in subsequent data transfers:
FIELD VALUE
DESCRIPTION
00
01
10
11
Repeated byte protocol transaction
Auto-increment protocol transaction
Reserved — Do not use
TYPE
6:5
Special function — See description below
Transaction type 00 will repeatedly read the same register with each data access.
Transaction type 01 will provide an auto-increment function to read successive
register bytes.
Address register/special function register. Depending on the transaction type, see
above, this field either specifies a special function command or selects the specific
control-status-register for following write and read transactions:
FIELD VALUE
00000
DESCRIPTION
ADD
4:0
Normal — No action
Proximity interrupt clear
00101
Proximity Interrupt Clear clears any pending proximity interrupt. This special function
is self clearing.
ams Datasheet
Page 23
[v1-00] 2016-Jul-12
Document Feedback
TSL2671 − Register Description
Enable Register (0x00)
The ENABLE register is used to power the device on/off, enable
functions, and interrupts.
Figure 26:
Enable Register
7
6
5
4
3
2
1
0
Address
0x00
Reserved
PIEN
Reserved
WEN
PEN
PON
ENABLE
Field
Reserved
PIEN
Bits
Description
7:6
5
Reserved. Write as 0.
Proximity interrupt mask. When asserted, permits proximity interrupts to be generated.
Reserved. Write as 0.
Reserved
4
Wait enable. This bit activates the wait feature. Writing a 1 activates the wait timer.
Writing a 0 disables the wait timer.
WEN
PEN
3
Proximity enable. These bits activate the proximity function. Writing a 11b enables
proximity. Writing a 00b disables proximity. The Wait Time register should be
configured before asserting proximity enable.
2:1
Power ON. This bit activates the internal oscillator to permit the timers and ADC
channel to operate. Writing a 1 activates the oscillator. Writing a 0 disables the
oscillator.
(1) (2)
0
PON
Note(s):
1. See Power Management section for more information.
2. A minimum interval of 2.72 ms must pass after PON is asserted before proximity can be initiated. This required time is enforced by
the hardware in cases where the firmware does not provide it.
Proximity Time Control Register (0x02)
The proximity timing register controls the integration time of
the proximity ADC in 2.72 ms increments. It is recommended
that this register be programmed to a value of 0xFF
(1 integration cycle).
Figure 27:
Proximity Time Control Register
Description
Field
Bits
Value
Integ_Cycles
Time
Max Count
PTIME
7:0
0xFF
1
2.72 ms
1023
Page 24
Document Feedback
ams Datasheet
[v1-00] 2016-Jul-12
TSL2671 − Register Description
Wait Time Register (0x03)
Wait time is set 2.72 ms increments unless the WLONG bit is
asserted in which case the wait times are 12X longer. WTIME is
programmed as a 2’s complement number.
Figure 28:
Wait Time Register
Description
Field
Bits
RegisterValue
Wait Time
Time (WLONG = 0) Time (WLONG = 1)
0xFF
0xB6
0x00
1
2.72 ms
201 ms
696 ms
0.032 s
2.4 s
WTIME
7:0
74
256
8.3 s
Note(s):
1. The Wait Time Register should be configured before PEN is asserted.
Proximity Interrupt Threshold Registers (0x08 - 0x0B)
The proximity interrupt threshold registers provide the values
to be used as the high and low trigger points for the comparison
function for interrupt generation. If the value generated by
proximity channel crosses below the lower threshold specified,
or above the higher threshold, an interrupt is signaled to the
host processor.
Figure 29:
Proximity Interrupt Threshold Registers
Register
PILTL
Address
0x08
Bits
7:0
Description
Proximity low threshold lower byte
Proximity low threshold upper byte
Proximity high threshold lower byte
Proximity high threshold upper byte
PILTH
0x09
7:0
PIHTL
0x0A
7:0
PIHTH
0x0B
7:0
ams Datasheet
Page 25
[v1-00] 2016-Jul-12
Document Feedback
TSL2671 − Register Description
Persistence Register (0x0C)
The persistence register controls the filtering interrupt
capabilities of the device. Configurable filtering is provided to
allow interrupts to be generated after each ADC integration
cycle or if the ADC integration has produced a result that is
outside of the values specified by threshold register for some
specified amount of time.
Figure 30:
Persistence Register
7
6
5
4
3
2
1
0
Address
0x0C
PERS
PPERS
Reserved
Field
PPERS
Bits
Description
Proximity interrupt persistence. Controls rate of proximity interrupt to the host
processor
Field Value
Meaning
Interrupt Persistence Function
Every proximity cycle generates an interrupt
1 proximity value out of range
0000
---
1
7:4
0001
0010
2
2 consecutive proximity values out of range
...
...
...
1111
15
15 consecutive proximity values out of range
Reserved
3:0
Default setting is 0x00.
Page 26
ams Datasheet
Document Feedback
[v1-00] 2016-Jul-12
TSL2671 − Register Description
Configuration Register (0x0D)
The configuration register sets the wait long time.
Figure 31:
Configuration Register
7
6
5
4
3
2
1
0
Address
0x0D
CONFIG
WLONG
Reserved
Reserved
Field
Bits
Description
Reserved
7:2
Reserved. Write as 0.
Wait Long. When asserted, the wait cycles are increased by a factor 12X from that
programmed in the WTIME register.
WLONG
1
0
Reserved
Reserved. Write as 0.
Proximity Pulse Count Register (0x0E)
The proximity pulse count register sets the number of proximity
pulses that will be transmitted. PPULSE defines the number of
pulses to be transmitted at a 62.5-kHz rate.
While the value can be programmed up to 255 pulses, the
practical limit of the device is 32 pulses. It is recommended that
32 or fewer pulses be used to achieve maximum signal-to-noise
ratio.
Figure 32:
Proximity Pulse Count Register
7
6
5
4
3
2
1
0
Address
0x0E
PPULSE
PPULSE
Field
Bits
Description
PPULSE
7:0
Proximity Pulse Count. Specifies the number of proximity pulses to be generated.
ams Datasheet
[v1-00] 2016-Jul-12
Page 27
Document Feedback
TSL2671 − Register Description
Control Register (0x0F)
The Control register provides four bits of control to the analog
block. These bits control the diode drive current and diode
selection functions.
Figure 33:
Control Register
7
6
5
4
3
2
1
0
Address
0x0F
CONTROL
PDRIVE
PDIODE
Reserved
Field
Bits
Description
LED Drive Strength.
Field Value
LED Strength
100 mA
00
PDRIVE
7:6
01
50 mA
10
25 mA
11
12.5 mA
Proximity Diode Select.
Field Value
Diode Selection
00
Reserved
PDIODE
5:4
3:0
01
Proximity uses the Channel 0 diode
Proximity uses the Channel 1 diode
Proximity uses both diodes
10
11
Reserved
Reserved. Write bits as 0.
Page 28
Document Feedback
ams Datasheet
[v1-00] 2016-Jul-12
TSL2671 − Register Description
ID Register (0x12)
The ID Register provides the value for the part number. The ID
register is a read-only register.
Figure 34:
ID Register
7
6
5
4
3
2
1
0
Address
0x12
ID
ID
Field
Bits
Description
0x00 = TSL26711 & TSL26715
0x09 = TSL26713 & TSL26717
ID
7:0
Part number identification
Status Register (0x13)
The Status Register provides the internal status of the device.
This register is read only.
Figure 35:
Status Register
7
6
5
4
3
2
1
0
Address
0x13
STATUS
Reserved
PINT
Reserved
Field
Bit
Description
Reserved
PINT
7:6
Reserved.
Proximity Interrupt. Indicates that the device is asserting a proximity
interrupt.
5
Reserved
4:0
Reserved.
ams Datasheet
[v1-00] 2016-Jul-12
Page 29
Document Feedback
TSL2671 − Register Description
Proximity Data Registers (0x18 - 0x19h)
Proximity data is stored as a 16-bit value. To ensure the data is
read correctly, a two-byte I²C read transaction should be
utilized with auto increment protocol bits set in the command
register. With this operation, when the lower byte register is
read, the upper eight bits are stored into a shadow register,
which is read by a subsequent read to the upper byte. The upper
register will read the correct value even if the next ADC cycle
ends between the reading of the lower and upper registers.
Figure 36:
Proximity Data Registers
Register
PDATAL
Address
Bits
7:0
Description
Proximity data low byte
0x18
0x19
PDATAH
7:0
Proximity data high byte
Page 30
Document Feedback
ams Datasheet
[v1-00] 2016-Jul-12
TSL2671 − Application Information: Hardware
Application Information:
Hardware
LED Driver Pin with Proximity Detection
The application hardware circuit with proximity detection
requires an LED connected as shown in Figure 37. V may be
bat
an independent power source. The 1-μF decoupling capacitors
should be of the low-ESR type and be placed as close as possible
to the load and V to reduce noise. To maximize system
DD
performance, the use of PCB power and ground planes are
recommended. If mounted on a flexible circuit, the power and
ground traces back to the PCB should be sufficiently wide
enough to have a low resistance, such as < 1Ω.
The I²C bus protocol was developed by Philips (now NXP). The
pull-up resistor value (R ) is a function of the I²C bus speed, the
P
supply voltage, and the capacitive bus loading. Users should
consult the NXP I²C design specification
(http://www.i2c.bus.org/references/) for assistance. With a
lightly loaded bus running at 400 kbps and V = 3 V, 1.5-kΩ.
DD
resistors have been found to be viable.
Figure 37:
Application Hardware Circuit for Proximity Sensing with Internal LED Driver
V
V
V
DD(digital)
BUS
DD(analog)
LED
1 mF
1 mF
TSL2671
R
P
R
P
R
PI
LDR
INT
SCL
SDA
The power supply connection — PCB routing and supply
decoupling — has a significant effect on proximity
performance. Contact ams or see the application notes
available at www.ams.com for power supply guidance.
ams Datasheet
[v1-00] 2016-Jul-12
Page 31
Document Feedback
TSL2671 − Application Information: Hardware
If the hardware application requires more than 100 mA of
current to drive the LED, then an external transistor should be
used. Note, R2 should be sized adequately to bias the gate
voltage given the LDR current mode setting. See Figure 38.
Figure 38:
Application Hardware Circuit for Proximity Sensing with External LED Driver Using P-FET Transistor
V
V
V
DD(digital)
BUS
DD(analog)
R2
1 mF
LED
1 mF
TSL2671
R
P
R
P
R
PI
R1
LDR
INT
SCL
SDA
Page 32
Document Feedback
ams Datasheet
[v1-00] 2016-Jul-12
TSL2671 − Application Information: Hardware
PCB Pad Layout
Suggested PCB pad layout guidelines for the Dual Flat No-Lead
(FN) surface mount package are shown in Figure 39.
Figure 39:
Suggested FN Package PCB Layout
2500
1000
1000
400
650
650
1700
400
Pads can be extended further if hand soldering is needed.
Note(s):
1. All linear dimensions are in micrometers.
2. This drawing is subject to change without notice.
ams Datasheet
Page 33
[v1-00] 2016-Jul-12
Document Feedback
TSL2671 − Mechanical Data
Mechanical Data
Figure 40:
Package FN — Dual Flat No-Lead Packaging Configuration
PACKAGE FN
Dual Flat No-Lead
TOP VIEW
Pin 1 Marker
PIN OUT
TOP VIEW
PIN 1
V
1
6 SDA
5 INT
DD
SCL 2
GND 3
2000 ꢂ 75
4 LDR
2000
ꢂ 75
Photo-Active Area
END VIEW
SIDE VIEW
650 ꢂ 50
Seating Plane
203 ꢂ 8
650
300
ꢂ 50
BOTTOM VIEW
650
RoHS
PIN 1
300 ꢂ 50
Green
750 ꢂ 150
Note(s):
1. All linear dimensions are in micrometers. Dimension tolerance is 20 μm unless otherwise noted.
2. The photodiode active area is 466 μm square and its center is 140 μm above and 20 μm to the right of the package center. The die
placement tolerance is 75 μm in any direction.
3. Package top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
4. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish.
5. This package contains no lead (Pb).
6. This drawing is subject to change without notice.
Page 34
ams Datasheet
Document Feedback
[v1-00] 2016-Jul-12
TSL2671 − Mechanical Data
Mechanical Data
Figure 41:
Package FN Carrier Tape
TOP VIEW
2.00 ꢂ 0.05
1.75
ꢃ
1
.
5
0
4.00
4.00
B
+ 0.30
8.00
− 0.10
3.50 ꢂ 0.05
ꢃ 1.00
ꢂ 0.25
B
A
A
DETAIL A
DETAIL B
5ꢀ Max
5ꢀ Max
0.254
2.18 ꢂ 0.05
2.18 ꢂ 0.05
ꢂ 0.02
0.83 ꢂ 0.05
Bo
Ao
Ko
Note(s):
1. All linear dimensions are in millimeters. Dimension tolerance is 0.10 mm unless otherwise noted.
2. The dimensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
3. Symbols on drawing Ao, Bo, and Ko are defined in ANSI EIA Standard 481-B 2001.
4. Each reel is 178 millimeters in diameter and contains 3500 parts.
5. ams packaging tape and reel conform to the requirements of EIA Standard 481-B.
6. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape.
7. This drawing is subject to change without notice.
ams Datasheet
[v1-00] 2016-Jul-12
Page 35
Document Feedback
TSL2671 − Manufacturing Information
Manufacturing Information
Soldering Information
The FN package has been tested and has demonstrated an
ability to be reflow soldered to a PCB substrate. The process,
equipment, and materials used in these test are detailed below.
The solder reflow profile describes the expected maximum heat
exposure of components during the solder reflow process of
product on a PCB. Temperature is measured on top of
component. The components should be limited to a maximum
of three passes through this solder reflow profile.
Figure 42:
Solder Reflow Profile
Parameter
Average temperature gradient in preheating
Soak time
Reference
Device
2.5°C/s
t
2 to 3 minutes
Max 60 s
Max 50 s
Max 10 s
260°C
soak
Time above 217°C (T )
t
1
1
Time above 230°C (T )
t
2
2
Time above T
−10°C (T )
t
peak
3
3
T
Peak temperature in reflow
peak
Temperature gradient in cooling
Max −5°C/s
Figure 43:
Solder Reflow Profile Graph
Not to scale — for reference only
Tpeak
T3
T2
T1
Time (s)
t3
t2
t1
tsoak
Page 36
Document Feedback
ams Datasheet
[v1-00] 2016-Jul-12
TSL2671 − Manufacturing Information
Storage Information
Moisture Sensitivity
Optical characteristics of the device can be adversely affected
during the soldering process by the release and vaporization of
moisture that has been previously absorbed into the package.
To ensure the package contains the smallest amount of
absorbed moisture possible, each device is dry-baked prior to
being packed for shipping.
Devices are packed in a sealed aluminized envelope called a
moisture barrier bag with silica gel to protect them from
ambient moisture during shipping, handling, and storage
before use.
The Moisture Barrier Bags should be stored under the following
conditions:
• Temperature Range: < 40°C
• Relative Humidity: < 90%
• Total Time: No longer than 12 months from the date code on
the aluminized envelope if unopened.
Rebaking of the reel will be required if the devices have been
stored unopened for more than 12 months and the Humidity
Indicator Card shows the parts to be out of the allowable
moisture region.
Opened reels should be used within 168 hours if exposed to the
following conditions:
• Temperature Range: < 30°C
• Relative Humidity: < 60%
If rebaking is required, it should be done at 50°C for 12 hours.
The FN package has been assigned a moisture sensitivity level
of MSL 3.
ams Datasheet
Page 37
[v1-00] 2016-Jul-12
Document Feedback
TSL2671 − Ordering & Contact Information
Ordering & Contact Information
Figure 44:
Ordering Information
Package -
Leads
Ordering Code
Interface Description
Address
Device
I²C Vbus = V Interface
TSL26711FN
TSL26713FN
TSL26715FN
0x39
0x39
0x29
FN−6
TSL26711
TSL26713
DD
I²C Vbus = 1.8 V Interface
FN−6
(1)
I²C Vbus = V Interface
FN−6
TSL26715
TSL26717
DD
(1)
TSL26717FN
I²C Vbus = 1.8 V Interface
0x29
FN−6
Note(s):
1. Contact ams for availability.
Buy our products or get free samples online at:
www.ams.com/ICdirect
Technical Support is available at:
www.ams.com/Technical-Support
Provide feedback about this document at:
www.ams.com/Document-Feedback
For further information and requests, e-mail us at:
ams_sales@ams.com
For sales offices, distributors and representatives, please visit:
www.ams.com/contact
Headquarters
ams AG
Tobelbader Strasse 30
8141 Premstaetten
Austria, Europe
Tel: +43 (0) 3136 500 0
Website: www.ams.com
Page 38
ams Datasheet
Document Feedback
[v1-00] 2016-Jul-12
TSL2671 − RoHS Compliant & ams Green Statement
RoHS: The term RoHS compliant means that ams AG products
fully comply with current RoHS directives. Our semiconductor
products do not contain any chemicals for all 6 substance
categories, including the requirement that lead not exceed
0.1% by weight in homogeneous materials. Where designed to
be soldered at high temperatures, RoHS compliant products are
suitable for use in specified lead-free processes.
RoHS Compliant & ams Green
Statement
ams Green (RoHS compliant and no Sb/Br): ams Green
defines that in addition to RoHS compliance, our products are
free of Bromine (Br) and Antimony (Sb) based flame retardants
(Br or Sb do not exceed 0.1% by weight in homogeneous
material).
Important Information: The information provided in this
statement represents ams AG knowledge and belief as of the
date that it is provided. ams AG bases its knowledge and belief
on information provided by third parties, and makes no
representation or warranty as to the accuracy of such
information. Efforts are underway to better integrate
information from third parties. ams AG has taken and continues
to take reasonable steps to provide representative and accurate
information but may not have conducted destructive testing or
chemical analysis on incoming materials and chemicals. ams AG
and ams AG suppliers consider certain information to be
proprietary, and thus CAS numbers and other limited
information may not be available for release.
ams Datasheet
Page 39
[v1-00] 2016-Jul-12
Document Feedback
TSL2671 − Copyrights & Disclaimer
Copyright ams AG, Tobelbader Strasse 30, 8141 Premstaetten,
Austria-Europe. Trademarks Registered. All rights reserved. The
material herein may not be reproduced, adapted, merged,
translated, stored, or used without the prior written consent of
the copyright owner.
Copyrights & Disclaimer
Devices sold by ams AG are covered by the warranty and patent
indemnification provisions appearing in its General Terms of
Trade. ams AG makes no warranty, express, statutory, implied,
or by description regarding the information set forth herein.
ams AG reserves the right to change specifications and prices
at any time and without notice. Therefore, prior to designing
this product into a system, it is necessary to check with ams AG
for current information. This product is intended for use in
commercial applications. Applications requiring extended
temperature range, unusual environmental requirements, or
high reliability applications, such as military, medical
life-support or life-sustaining equipment are specifically not
recommended without additional processing by ams AG for
each application. This product is provided by ams AG “AS IS”
and any express or implied warranties, including, but not
limited to the implied warranties of merchantability and fitness
for a particular purpose are disclaimed.
ams AG shall not be liable to recipient or any third party for any
damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interruption of business or
indirect, special, incidental or consequential damages, of any
kind, in connection with or arising out of the furnishing,
performance or use of the technical data herein. No obligation
or liability to recipient or any third party shall arise or flow out
of ams AG rendering of technical or other services.
Page 40
ams Datasheet
Document Feedback
[v1-00] 2016-Jul-12
TSL2671 − Document Status
Document Status
Document Status
Product Status
Definition
Information in this datasheet is based on product ideas in
the planning phase of development. All specifications are
design goals without any warranty and are subject to
change without notice
Product Preview
Pre-Development
Information in this datasheet is based on products in the
design, validation or qualification phase of development.
The performance and parameters shown in this document
are preliminary without any warranty and are subject to
change without notice
Preliminary Datasheet
Datasheet
Pre-Production
Production
Information in this datasheet is based on products in
ramp-up to full production or full production which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade
Information in this datasheet is based on products which
conform to specifications in accordance with the terms of
ams AG standard warranty as given in the General Terms of
Trade, but these products have been superseded and
should not be used for new designs
Datasheet (discontinued)
Discontinued
ams Datasheet
Page 41
[v1-00] 2016-Jul-12
Document Feedback
TSL2671 − Revision Information
Revision Information
Changes from 118 (2011-Jan) to current revision 1-00 (2016-Jul-12)
Content of TAOS datasheet was updated to latest ams design
Updated Key Benefits & Features section
Page
2
Updated Figure 44
38
Note(s):
1. Page and figure numbers for the previous version may differ from page and figure numbers in the current revision.
2. Correction of typographical errors is not explicitly mentioned.
Page 42
ams Datasheet
Document Feedback
[v1-00] 2016-Jul-12
TSL2671 − Content Guide
1
2
2
3
General Description
Key Benefits & Features
Applications
Content Guide
Functional Block Diagram
4
5
Detailed Description
Pin Assignments
6
7
8
8
9
Absolute Maximum Ratings
Operating Characteristics
Proximity Characteristics
Wait Characteristics
AC Electrical Characteristics
10 Parameter Measurement Information
11 Typical Characteristics
13 Principles of Operation
13 System State Machine
14 Proximity Detection
17 Interrupts
18 State Diagram
19 Power Management
20 I²C Protocol
22 Register Description
22 Register Set
23 Command Register
24 Enable Register (0x00)
24 Proximity Time Control Register (0x02)
25 Wait Time Register (0x03)
25 Proximity Interrupt Threshold Registers (0x08 - 0x0B)
26 Persistence Register (0x0C)
27 Configuration Register (0x0D)
27 Proximity Pulse Count Register (0x0E)
28 Control Register (0x0F)
29 ID Register (0x12)
29 Status Register (0x13)
30 Proximity Data Registers (0x18 - 0x19h)
31 Application Information: Hardware
31 LED Driver Pin with Proximity Detection
33 PCB Pad Layout
34 Mechanical Data
35 Mechanical Data
36 Manufacturing Information
36 Soldering Information
37 Storage Information
37 Moisture Sensitivity
38 Ordering & Contact Information
39 RoHS Compliant & ams Green Statement
ams Datasheet
[v1-00] 2016-Jul-12
Page 43
Document Feedback
TSL2671 − Content Guide
40 Copyrights & Disclaimer
41 Document Status
42 Revision Information
Page 44
ams Datasheet
Document Feedback
[v1-00] 2016-Jul-12
相关型号：
©2020 ICPDF网 联系我们和版权申明