TSL2672 [AMSCO]
DIGITAL PROXIMITY DETECTOR; 数字接近检测
| 型号： | TSL2672 |
| 厂家： | 
AMS(艾迈斯) |
| 描述： | DIGITAL PROXIMITY DETECTOR |
| 文件： | 总31页 (文件大小：749K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TAOS Inc.
is now
ams AG
The technical content of this TAOS datasheet is still valid.
Contact information:
Headquarters:
ams AG
Tobelbaderstrasse 30
8141 Unterpremstaetten, Austria
Tel: +43 (0) 3136 500 0
e-Mail: ams_sales@ams.com
Please visit our website at www.ams.com
TSL2672
DIGITAL PROXIMITY DETECTOR
r
r
TAOS133 − MAY 2012
PACKAGE FN
DUAL FLAT NO-LEAD
(TOP VIEW)
Features
D Proximity Detection with an Integrated LED
Driver in a Single Device
D Register Set- and Pin-Compatible with the
6 SDA
5 INT
VDD
1
TSL2x71 Series
SCL 2
GND 3
D Proximity Detection
4 LDR
− Reduced Proximity Count Variation
− Programmable Offset Control Register
− Saturation Indicator
Not Actual Size
− Programmable Analog Gain and
Integration Time
Applications
− Current Sink Driver for External IR LED
− 16,000:1 Dynamic Range
D Mobile Handset Touchscreen Control d
Automatic Speakerphone Enable
D Maskable Proximity Interrupt
− Programmable Upper and Lower
Thresholds with Persistence Filter
D Mechanical Switch Replacement
D Printer Paper Alignmen
D Power Management
− Low Power 2.2 mA Sleep State with User-
Selectable Sleep-After-Interrupt Mode
− 90 mA Wait State with Programmable Wait
Time from 2.7 ms to > 8 seconds
EnProducts and Market Segments
D Mobile Handsets, Tblets, Laptops, and
HDTVs
2
D White Goods
D I C Fast Mode Compatible Interface
− Data Rates up to 400 kbit/s
− Input Voltage Levels Compatible witV
or 1.8-V Bus
D Toys
D
D Dtal Signage
D Pnters
D Small 2 mm ꢀ 2 mm Dual Flat NoLead (FN)
Package
Description
The TSL2672 family of devices provides proximity detection when coupled with an external IR LED. The devices
incorporate a constant-current LED sink drier tpulse the external IR LED and achieve very low average power
consumption using the low-power ait state with programmable wait time between proximity measurements.
In addition, the devices are register-st and pin-compatible with the TSL2671 series and include a number of
new and improved features, suh improved signal-to-noise and measurement accuracy. A proximity offset
register allows compensation for ical system crosstalk between the IR LED and the sensor. To prevent false
measurements, a proximitsaturation bit indicates that the internal analog circuitry saturated. Interrupts have
been enhanced with the addition of a sleep-after-interrupt feature that also allows for single-cycle operation.
Copyright E 2012, TAOS Inc.
The LUMENOLOGY r Company
Texas Advarnced Optoelectronic Solutions Inc.
1001 Klein Road S Suite 300 S Plano, TX 75074 S (972) 673-0759
www.taosinc.com
1
TSL2672
DIGITAL PROXIMITY DETECTOR
TAOS133 − MAY 2012
Functional Block Diagram
Interrupt
INT
Prox LED
Current Driver
LDR
Prox Control
Upper Limit
Lower Limit
Prox
Integration
Prox
ADC
Prox
Data
V
DD
SCL
SDA
Wait Control
CH0
GND
CH1
Detailed Description
Proximity detection requires only a single external LED. This external LED is driven by an inrnal ED current driver,
which pulses the LED with current for approximately 7 microsecnds. Te number of pulses, fom 1 to 255, and the
current level, from 1.9 mA to 120 mA, can be programmed and ogeter provide a 1,00:1 contiguous dynamic
range. Because the driver is a constant current sink, no extecurrent limiting resistor is required to protect the LED.
In addition to the internal LED current driver, the TSL2672 promity detector provids on-chip photodiodes, oscillator,
2
integrating amplifier, ADC, state machine controller, programmable interrupt and I C interface to provide a complete
proximity detection solution.
Each device has two photodiodes; a channel 0 photodiode (CH0), whis responsive to both visible and infrared
light, and a channel 1 photodiode (CH1), which is primarily resposive o only infrared light. The user selects the
appropriate diode for their application.
The integrating amplifier and ADC convets the selected phodiode current into a digital value providing up to 16
bits of resolution. Upon completion of a ximity conversion ccle, the result is transferred to the proximity data
registers where it is available to be read.
2
Communication with the device is accomplished over a fast (up to 400 kHz), two-wire I C serial bus for easy
connection to a microcontroller or embedded cotrolr. The digital output of the device is inherently more
noise-immune when compared to an analog nterface.
The device provides a separate pin for level-stylinterrupts to simplify and improve system efficiency by eliminating
the need to poll for proximity data. When ntupts are enabled, an interrupt is generated when the proximity data
either exceeds an upper threshold or is less an a lower threshold. Once generated, the interrupt remains asserted
until cleared by the controlling firmwre. Iaddition, a programmable interrupt persistence filter allows the user to
determine the number of consecuve out-of-range measurements necessary to trigger an interrupt.
Copyright E 2012, TAOS Inc.
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r
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TSL2672
DIGITAL PROXIMITY DETECTOR
TAOS133 − MAY 2012
Terminal Functions
TERMINAL
TYPE
DESCRIPTION
Power supply ground. All voltages are referenced to GND.
NAME
GND
INT
NO.
3
5
O
O
Interrupt — open drain (active low).
LDR
SCL
SDA
4
LED driver for proximity emitter — open drain.
2
2
2
I
I C serial clock input terminal — clock signal for I C serial data.
2
2
6
I/O
I C serial data I/O terminal — serial data I/O for I C .
Supply voltage.
V
1
DD
Available Options
DEVICE
TSL26721
TSL26723
ADDRESS
PACKAGE − LEADS
INTERFACE DESCRIPTION
ORDERING NUMBER
TSL26721FN
2
0x39
0x39
0x29
0x29
FN−6
FN−6
FN−6
FN−6
I C Vbus = V Interface
DD
2
I C Vbus = 1.8 V Interface
TSL26723FN
†
TSL26725
C Vbus = V Interface
TSL26725FN
DD
†
2
TSL26727
I C b= 1.8 V Interface
TSL26727FN
†
Contact TAOS for availability.
Absolute Maximum Ratings over operating free-air temperaure range (unless otherwise noted)†
Supply voltage, V (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.8 V
DD
Input terminal voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 3.8 V
Output terminal voltage (except LDR. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 3.8 V
Output terminal voltage (LDR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 V
Output terminal current (excpt DR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −1 mA to 20 mA
Storage temperature range, T
ESD tolerance, human body model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2000 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 85°C
†
Stresses beyond those listed under “absolute maximum rings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other codiions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated coditions for extended periods may affect device reliability.
NOTE 1: All voltages are with respect to GND.
Recommended Operating Conditions
MIN NOM
MAX
3.6
3.6
3.6
4.8
70
UNIT
V
2
Supply voltage, V
Supply voltage, V
(TSL2621 & TSL26725) (I C V
= V )
DD
2.4
2.7
0
3
3
DD
bus
2
(SL2723 & TSL26727) (I C V
= 1.8 V)
V
DD
bus
LDR pulse on
LDR pulse off
LED driver voltae, V
V
LDR
0
Operating air temperature, T
−30
°C
A
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r
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TSL2672
DIGITAL PROXIMITY DETECTOR
TAOS133 − MAY 2012
Operating Characteristics, VDD = 3 V, TA = 25ꢁ C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
Active — LDR pulse off
Wait state
MIN
TYP
200
90
MAX
UNIT
250
I
Supply current
μA
DD
2
Sleep state — no I C activity
3 mA sink current
2.2
4
0.4
0.6
5
0
0
V
I
INT, SDA output low voltage
V
OL
6 mA sink current
Leakage current, SDA, SCL, INT pins
Leakage current, LDR pin
−5
−5
μA
μA
LEAK
LEAK
I
5
TSL26721, TSL26725
TSL26723, TSL26727
TSL26721, TSL26725
TSL26723, TSL26727
0.7 V
DD
V
V
SCL, SDA input high voltage
SCL, SDA input low voltage
V
V
IH
IL
1.25
0.3 V
DD
054
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r
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TSL2672
DIGITAL PROXIMITY DETECTOR
TAOS133 − MAY 2012
Proximity Characteristics, VDD = 3 V, TA = 25ꢁ C, PGAIN = 1ꢀ, PEN = 1 (unless otherwise noted)
PARAMETER
Supply current
TEST CONDITIONS
MIN
TYP
3
MAX
UNIT
mA
I
LDR pulse on
PTIME = 0xFF
DD
ADC conversion time step size
2.58
1
2.73
2.9
ms
ADC number of integration steps
(Note 1)
256
steps
ADC counts per step (Note 1)
PTIME = 0xFF
0
1500
900
1023 counts
2500
2
CH0 diode
CH1 diode
CH0 diode
CH1 diode
2000
1200
1.90
1.14
2
λ = 850 nm, E = 263.4 μW/cm ,
p
e
ADC count value
counts
PTIME = 0xFB, PPULSE = 4
1500
conts/
ADC output responsivity
λ = 850 nm, PTIME = 0xFB, PPULSE = 1
p
2
μW/c
PGAIN = 2×
PGAIN = 4×
PGAIN = 8×
Gain scaling, relative to 1× gain
4
8
×
setting
CH0 diode
CH1 diode
.5
0.5
E = 0, PTIME = 0xFB, PPULSE = 4
(Note 6)
e
Noise (Notes 1, 2, 3)
% FS
LED pulse count (Note 1)
LED pulse period
0
255 pulses
16.0
7.3
116
58
μs
LED pulse width — LED on time
μs
mA: PDRIVE = 0 & PDL = 0
0 mA: PDRIVE = 1 & PL = 0
0 mA: PDRIVE = 2 & PDL = 0
15 mA: PDRIVE = & PDL = 0
15 mA: PDE = 0 & PDL = 1
7.5 mPDRE = 1 & PDL = 1
3.8 A: PDIVE = 2 & PDL = 1
1mA: PDRIVE = 3 & PDL = 1
87
145
29
14.5
12.9
6.4
3.2
1.6
I
sink curnt
1.6 V, LDR pin
SINK
LED drive current
mA
PVE = 0 and PDL 16 mA), PPULSE = 64
Emitter: λ = 850 nmlf angle, and 60 mW/sr
p
Maximum operating distance
(Notes 1, 4, 5)
Object: 16 × 20-inch, 9% reflective Kodak Gray Card
18
inches
(whisurfce)
Optics: Open viw no glass, no optical attenuation)
NOTES: 1. Parameter is ensured by design or cracterization and is not tested.
2. Proximity noise is defined as one tandd deviation of 600 samples.
3. Proximity noise typically increaes √PPULSE
4. Greater operating distances are avable with appropriate optical system design considerations. See available TAOS application
notes for additional information.
5. Maximum operating distane is dependent upon emitter and the reflective properties of the object’s surface.
6. Proximity noise test wadone using the following circuit:
V
DD
22 W
V
DD
1
3
15.0 W
1 mF
TSL2672
4
GND
LDR
Copyright E 2012, TAOS Inc.
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r
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TSL2672
DIGITAL PROXIMITY DETECTOR
TAOS133 − MAY 2012
Wait Characteristics, VDD = 3 V, TA = 25ꢁ C, WEN = 1 (unless otherwise noted)
PARAMETER
Wait step size
Wait number of integration steps (Note 1)
NOTE 1: Parameter ensured by design and is not tested.
TEST CONDITIONS
CHANNEL
MIN
2.58
1
TYP
MAX
2.9
UNIT
ms
WTIME = 0xFF
2.73
256
steps
AC Electrical Characteristics, VDD = 3 V, TA = 25ꢁ C (unless otherwise noted)
†
PARAMETER
TEST CONDITIONS
MIN
0
TYP
MAX
UNIT
kHz
μs
2
f
t
Clock frequency (I C only)
400
(SCL)
(BUF)
Bus free time between start and stop condition
1.3
Hold time after (repeated) start condition. After
this period, the first clock is generated.
t
0.6
μs
(HDSTA)
t
t
t
t
t
t
t
t
Repeated start condition setup time
Stop condition setup time
Data hold time
0.6
0.6
0
μs
μs
μs
ns
μs
μs
ns
ns
pF
(SUSTA)
(SUSTO)
(HDDAT)
(SUDAT)
(LOW)
(HIGH)
F
Data setup time
10
1.3
0.6
SCL clock low period
SCL clock high period
Clock/data fall time
300
300
10
Clock/data rise time
Input pin capacitance
R
C
i
†
Specified by design and characterization; not production tested.
PARAMER MEASURENT INFORMATION
t
t
(R)
t
(F)
(LOW)
V
IH
SCL
SDA
V
IL
t
t
t
(HDSTA)
(HIGH)
(SUSTA)
t
t
t
(SUSTO)
t
(BUF)
(HDDAT)
(SUDAT)
V
V
IH
IL
P
S
S
P
Stop
Condition
Strt
nditio
Figure 1. Timing Diagrams
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TSL2672
DIGITAL PROXIMITY DETECTOR
TAOS133 − MAY 2012
TYPICAL CHARACTERISTICS
NORMALIZED RESPONSIVITY
vs.
SPECTRAL RESPONSIVITY
ANGULAR DISPLACEMENT
1
0.8
0.6
1.0
0.8
Both Axes
0.6
0.4
Ch 0
0.4
0.2
0
Ch 1
0.2
0
-Q
−30
+Q
30
90
−90
−0
0
60
300 400 500 600 700 800 900 1000 110
Q − Angular Displacement − °
λ − Wavelength − nm
Figure 2
Figure 3
TYPICAL LDR CURENT
TYPICAL LDR CURRENT
vs.
vs.
VOLTAGE
VOLTAGE
20
18
16
14
12
10
8
160
PDL = 1
PDL = 0
140
120
100
15 mA
120 mA
80
60
40
20
7.5 mA
0 mA
6
4
3.8 mA
1.9 mA
30 mA
15 mA
2
0
0.5
1
1.5
2
2.5
3
0
0.5
1
1.5
2
2.5
3
LDR Voltage − V
LDR Voltage − V
Figure 4
Figure 5
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TSL2672
DIGITAL PROXIMITY DETECTOR
TAOS133 − MAY 2012
RESPONSE to WHITE LED
RESPONSE to IR (850 nm) LED
vs.
TEMPERATURE
115%
vs.
TEMPERATURE
115%
110%
Ch 0
Ch 1
110%
105%
105%
100%
95%
Ch 0
100%
95%
90%
Ch 1
90%
0
10
20
30
40
50
60
70
0
0
20
30
40
50
60
70
Temperature − °C
Temerae − °C
Figure 6
Figure 7
NORMALIZED IDD
vs.
VDanTEMPERATUE
110%
108%
106%
104%
102%
100%
0ꢁC
5
25ꢁC
75ꢁC
98%
96%
94%
92%
2.7
2.8
2.9
3
3.1
3.2
3.3
V
— V
DD
Figure 8
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TSL2672
DIGITAL PROXIMITY DETECTOR
TAOS133 − MAY 2012
PRINCIPLES OF OPERATION
System States
An internal state machine provides system control of the proximity detection and power management features
of the device. At power up, an internal power-on-reset initializes the device and puts it in a low-power Sleep
state.
2
When a start condition is detected on the I C bus, the device transitions to the Idle state where it checks the
Enable register (0x00) PON bit. If PON is disabled, the device will return to the Sleep state to save power
Otherwise, the device will remain in the Idle state until the proximity function is enabled. Once enabed, the
device will execute the Prox and Wait states in sequence as indicated in Figure 9. Upon completion and rturn
to Idle, the device will automatically begin a new prox-wait cycle as long as PON and PEN remain enled.
If the Prox function generates an interrupt and the Sleep-After-Interrupt (SAI) feature is enabled, te dice will
2
transition to the Sleep state and remain in a low-power mode until an I C command is receivd. See the
Interrupts section for additional information.
Sleep
I2C
!PON
Start
INT & SAI
PEN
Wait
Prox
Figure 9. Simplified State Diagram
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TSL2672
DIGITAL PROXIMITY DETECTOR
TAOS133 − MAY 2012
Proximity Detection
Proximity detection is accomplished by measuring the amount of light energy, generally from an IR LED,
reflected off an object to determine its distance. The proximity light source, which is external to the TSL2672
device, is driven by the integrated proximity LED current driver as shown in Figure 10.
PDL(r0x0D,b0)
PPULSE(r0x0E)
PDRIVE(r0x0F, b7:6)
V
DD
PGAIN(r0x0F, b3:2)
POFFSET(r0x1E)
PTIME(r0x02)
External IR
LED
Prox LED
LDR
Current Driver
PVALID(r0x13, b1
PSAT(r0x13, b6
Prox Control
Prox
Prox
Prox
Data
PDIODE(r0x0F, b5:4)
PDATAH(r0x019)
PDAAL(r0x018)
Object
Integration ADC
H1
CH0
Background Energy
Figure 10. Proximiy Detection
The LED current driver, output on the LDR terinalprovides a regulatecurrent sink that eliminates the need
for an external current limiting resistor. The combination of proximiED drive strength (PDRIVE) and proximity
drive level (PDL) determine the drive current. PDRIVE sets the rive current to 120 mA, 60 mA, 30 mA, or 15 mA
when PDL is not asserted. However, hen PDL is asserted, the drive current is reduced by a factor of about
8 at V
= 1.6 V. To drive an externalighsource with moe tha120 mA or to minimize on-chip ground bounce,
LDR
LDR can be used to drive an externp-type transistor, whch in turn drives the light source.
Referring to the Detailed State Machine figure, the Lurrent driver pulses the external IR LED as shown in
Figure 11 during the Prox Accum state. Figur11 also illustrates that the LED On pulse has a fixed width of
7.3 μs and period of 16.0 μs. So, in addition to seting the proximity drive current, 1 to 255 proximity pulses
(PPULSE) can be programmed. When dciding on the number of proximity pulses, keep in mind that the signal
increases proportionally to PPULSE, while noise increases by the square root of PPULSE.
Reected IR LED + Background
Bckground Energy Energy
LED On
LED Off
7.3 ms
16.0 ms
IR LED Pulses
Figure 11. Proximity LED Current Driver Waveform
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TSL2672
DIGITAL PROXIMITY DETECTOR
TAOS133 − MAY 2012
Figure 10 illustrates light rays emitting from an external IR LED, reflecting off an object, and being absorbed
by the CH0 and CH1 photodiodes. The proximity diode selector (PDIODE) determines which of the two
photodiodes is used for a given proximity measurement. Note that neither photodiode is selected when the
device first powers up, so PDIODE must be set for proximity detection to work.
Referring again to Figure 11, the reflected IR LED and the background energy is integrated during the LED On
time, then during the LED Off time, the integrated background energy is subtracted from the LED On time
energy, leaving the external IR LED energy to accumulate from pulse to pulse. The proximity gain (PGAIN)
determines the integration rate, which can be programmed to 1×, 2×, 4×, or 8× gain. At power up, PGAIN
defaults to 1× gain, which is recommended for most applications. For reference, PGAIN equal to 8× i
comparable to the TSL2771 1× gain setting. During LED On time integration, the proximity saturation bit in he
Status register (0x13) will be set if the integrator saturates. This condition can occur if the proximity gain s se
too high for the lighting conditions, such as in the presence of bright sunlight. Once asserted, PSAT wilremain
set until a special function proximity interrupt clear command is received from the host (see command ster).
After the programmed number of proximity pulses have been generated, the proximity ADC convertand scales
the proximity measurement to a 16-bit value, then stores the result in two 8-bit proximity data (PDATAx)
registers. ADC scaling is controlled by the proximity ADC conversion time (PTIME) whch is programmable from
1 to 256 2.73-ms time units. However, depending on the application, scaling the proximity data will equally scale
any accumulated noise. Therefore, in general, it is recommended to leave PTIME at the default value of one
2.73-ms ADC conversion time (0xFF).
In many practical proximity applications, a number of opcal sstem and envonmntal conditions can produce
an offset in the proximity measurement result. counter these effects, a proximity offset (POFFSET) is
provided which allows the proximity data to be shd positive or negaive. Additional information on the use
of the proximity offset feature is provided in availabe TAOS application notes.
Once the first proximity cycle has compleed, the proximity valid (PVALID) bit in the Status register will be set
and remain set until the proximity detection function is disab(PEN).
For additional information on using the proximity detection function behind glass and for optical system design
guidance, please see available TAOS application notes
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TSL2672
DIGITAL PROXIMITY DETECTOR
TAOS133 − MAY 2012
Interrupts
The interrupt feature simplifies and improves system efficiency by eliminating the need to poll the sensor for
proximity values outside a user-defined range. While the interrupt function is always enabled and its status is
available in the Status register (0x13), the output of the interrupt state can be enabled using the proximity
interrupt enable (PIEN) field in the Enable register (0x00).
Two 16-bit interrupt threshold registers allow the user to set limits below and above a desired proximity range.
An interrupt can be generated when the proximity data (PDATA) is less than the proximity interrupt low threshold
(PILTx) or is greater than the proximity interrupt high threshold (PIHTx).
It is important to note that the thresholds are evaluated in sequence, first the low threshold, then the hih
threshold. As a result, if the low threshold is set above the high threshold, the high threshold is ignored and only
the low threshold is evaluated.
To further control when an interrupt occurs, the device provides an interrupt persistence featue. The
persistence filter allows the user to specify the number of consecutive out-of-range proximity occuences
before an interrupt is generated. The persistence filter register (0x0C) allows the user to set the proximity
persistence filter (PPERS) values. See the persistence filter register for details on the persstene filter values.
Once the persistence filter generates an interrupt, it will continue until a special function interrupclear command
is received (see Command register).
PIHTH(r0x0B), PIHTL(r x0A)
PPERS(r 0x0C, b7:4)
Upper Li
Prox Psistence
Prox
Integration
Prox
ADC
Prox
Data
Lowr Limit
Channel 0
Channel 1
PTH(r 0x09), PILTL(r 0x8)
Fire 12. Progrble Interrupt
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TSL2672
DIGITAL PROXIMITY DETECTOR
TAOS133 − MAY 2012
System Timing
The system state machine shown in Figure 9 provides an overview of the states and state transitions that
provide system control of the device. This section highlights the programmable features, which affect the state
machine cycle time, and provides details to determine system level timing.
When the proximity detection feature is enabled (PEN), the state machine transitions through the Prox Init, Prox
Accum, Prox Wait, and Prox ADC states. The Prox Init and Prox Wait times are a fixed 2.73 ms, whereas the
Prox Accum time is determined by the number of proximity LED pulses (PPULSE) and the Prox ADC time is
determined by the integration time (PTIME). The formulas to determine the Prox Accum and Prox ADC time
are given in the associated boxes in Figure 12. If an interrupt is generated as a result of the proximity cycle, it
will be asserted at the end of the Prox ADC state and transition to the Sleep state if SAI is enabled.
When the power management feature is enabled (WEN), the state machine will transition in turn to te Wait
state. The wait time is determined by WLONG, which extends normal operation by 12× when asse, and
WTIME. The formula to determine the wait time is given in the box associated with the Wait state Figure 13.
Prox
Sleep
Prox
Init
Time: 2.73 ms
!PO
PEN
2
I C S
PPULSE: 0 ~ 255 pulses
Time: 16.0 μs/pulse
Range: 0 ~ 4.1 ms
Prox
Accum
Idle
IN& AI
Prox
Wait
!WEN
Time: 2.73 ms
WTIME: 1 ~ 256 steps
WLONG = 0
Time:
2.73 ms/step
Range: 2.73 ms ~ 699 ms
WLONG = 1
PTIME: 1 ~ 256 steps
Time: 2.73 ms/step
Range: 2.73 ms ~ 699 ms
Prox
ADC
Wait
WEN
Time:
32.8 ms/step
Range: 32.8 ms ~ 8.39s
Note: PON, PEN, WEN, and SAI ae fies in the Enable register (0x00).
Figure 13. Detailed State Diagram
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TSL2672
DIGITAL PROXIMITY DETECTOR
TAOS133 − MAY 2012
Power Management
Power consumption can be managed with the Wait state, because the Wait state typically consumes only 90 μA
of I current. An example of the power management feature is given below. With the assumptions provided
DD
in the example, average I is estimated to be 167 μA.
DD
Table 1. Power Management
SYSTEM STATE MACHINE
STATE
PROGRAMMABLE
PARAMETER
TYPICAL
PROGRAMMED VALUE
DURATION
2.73 ms
CURRENT
Prox Init
0.200 mA
Prox Accum
PPULSE
0x04
0.064 ms
Prox Accum − LED On
Prox Accum − LED OFF
Prox Wait
0.029 ms (Note 1)
0.035 ms (Note 2)
2.73 ms
119 mA
0.200 mA
0.200 mA
0.200 mA
Prox ADC
PTIME
WTIME
WLONG
0xFF
0xEE
0
2.73 ms
Wait
49.2 ms
.090 mA
NOTES: 1. Prox Accum − LED On time = 7.3 μs per pulse × 4 pulses = 29.3μs = 0.029 ms
2. Prox Accum − LED Off time = 8.7 μs per pulse × 4 pulses = 34.7s = 0.5 ms
Average I Current = ((0.029 × 119) + (0.035 x 0.20) + (2.73 × 0.200) +
DD
(49.2 × 0.090) + (2.73 × 0.202)) / 57 ꢀ 167 μ
Keeping with the same programmed values as the example, Table 2 hows how the average I current is
DD
affected by the Wait state time, which is determineby WEN, WT, and WLONG. Note that the worst-case
current occurs when the Wait state is not enbled.
Table 2. Average I Current
DD
WEN
WTIME
n/a
WLOWAIT STATE
AVERAGE I CURRENT
DD
0
1
1
1
1
n/a
0
0 ms
622 μA
490 μA
167 μA
97 μA6
91 μA
0xFF
0xEE
0x00
0x00
2.73 m
49.2 m
99 ms
838ms
0
0
1
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TSL2672
DIGITAL PROXIMITY DETECTOR
TAOS133 − MAY 2012
I2C Protocol
2
Interface and control are accomplished through an I C serial compatible interface (standard or fast mode) to
a set of registers that provide access to device control functions and output data. The devices support the 7-bit
2
I C addressing protocol.
2
The I C standard provides for three types of bus transaction: read, write, and a combined protocol (Figure 14).
During a write operation, the first byte written is a command byte followed by data. In a combined protocol, the
first byte written is the command byte followed by reading a series of bytes. If a read command is issued, the
register address from the previous command will be used for data access. Likewise, if the MSB of the comman
is not set, the device will write a series of bytes at the address stored in the last valid command with a register
address. The command byte contains either control information or a 5-bit register address. The control
commands can also be used to clear interrupts.
2
2
The I C bus protocol was developed by Philips (now NXP). For a complete description of the I C protoclease
2
review the NXP I C design specification at http://www.i2c−bus.org/references/.
A
N
P
R
S
Acknowledge (0)
Not Acknowledged (1)
Stop Condition
Read (1)
Start Condition
Sr
W
Repeated Start Condition
Write (0)
... Continuation of protocol
Master-to-Slave
Slave-to-Master
1
7
1
1
8
1
8
1
1
...
...
S
Slave Address
W
A
Command Code
Data Byte
A
P
2
I C Write Protocol
1
7
1
1
1
8
1
1
S
Slave Address
R
A
Data
A
Data
A
P
2
I C Read Protocol
1
7
1
1
1
1
7
1
1
S
Slave Address
W
A
ommand Code
A
Sr
Slave Address
R
A
8
1
8
1
1
...
Data
A
Data
A
P
2
I C Read Protocol — Combined Format
2
Figure 14. I C Protocols
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TSL2672
DIGITAL PROXIMITY DETECTOR
TAOS133 − MAY 2012
Register Set
The device is controlled and monitored by data registers and a command register accessed through the serial
interface. These registers provide for a variety of control functions and can be read to determine results of the
ADC conversions. The register set is summarized in Table 1.
Table 3. Register Address
ADDRESS
−−
RESISTER NAME
COMMAND
ENABLE
PTIME
R/W
W
REGISTER FUNCTION
Specifies register address
RESET VALUE
0x00
0x00
0xFF
0xFF
0x0
x0
0x00
0x00
0x00
0x00
0x00
0x00
ID
0x00
0x02
0x03
0x08
0x09
0x0A
0x0B
0x0C
0x0D
0x0E
0x0F
0x12
0x13
0x18
0x19
0x1E
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R
Enables states and interrupts
Proximity ADC time
WTIME
Wait time
PILTL
Proximity interrupt low threshold low byte
Proximity interrupt low threshold high byte
Proximity interrupt high threshold low byte
Proximity interrupt high threshold high byte
Interrupt persistence filter
Configuration
PILTH
PIHTL
PIHTH
PERS
CONFIG
PPULSE
CONTROL
ID
Proximity pulse count
Control register
Device ID
STATUS
PDATAL
PDATAH
POFFSET
R
Device status
0x00
0x00
0x00
0x00
R
Proximity data low byte
Proximity ahh byte
ProximitOffset register
R
R/W
2
The mechanics of accessing a specc register depends n the specific protocol used. See the section on I C
protocols on the previous pages. general, the CMAND register is written first to specify the specific
control-status-data register for subsequent read/wrierations.
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TAOS133 − MAY 2012
Command Register
The command register specifies the address of the target register for future read and write operations, as well
as issues special function commands.
Table 4. Command Register
7
6
5
4
3
2
ADDR/SF
1
0
Reset
0x00
COMMAND
CMD
TYPE
FIELD
CMD
BITS
DESCRIPTION
7
Select Command Register. Must write as 1 when addressing COMMAND register.
Selects type of transaction to follow in subsequent data transfers:
TYPE
6:5
FIELD VALUE
DESCRIPTION
00
01
10
11
Repeated byte protocol transaction
Auto-increment protocol transacon
Reserved — Do not use
Special function — See descption elow
Transaction type 00 will repeatedly reathe se register with each data access.
Transaction type 01 will provide an au-incremnt function to read successive register bytes.
ADDR/SF
4:0
Address field/special function fild. Depending on the transaction type, see above, this field either
specifies a special function comor selects the specific control-status-data register for subsequent
read and write transactions. The values listed below pply only to special function commands:
FIELD VALUE
00100
DSCRITION
Interrupset — forces an interrupt
oximity interrupt clear
00101
other
Reerved — Do not write
The interrupt et secial function command ets the interrupt bits in the status register (0x13). For the
interrupt to be isible on the INT pin, he roximity interrupt enable bit (PIEN) in the enable register (0x00)
must be aerte.
The interset special functust be cleared with an interrupt clear special function. The proximity
interrupt clear special functioany pending interrupt and is self clearing.
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DIGITAL PROXIMITY DETECTOR
TAOS133 − MAY 2012
Enable Register (0x00)
The enable register is used to power the device on/off, enable functions, and interrupts.
Table 5. Enable Register
7
6
5
4
3
2
1
0
Reset
0x00
Reserved
SAI
PIEN
Reserved
WEN
PEN
Reserved
PON
ENABLE
FIELD
BITS
DESCRIPTION
Reserved
7
Reserved. Write as 0.
Sleep after interrupt. When asserted, the device will power down at the end of a proximity cycle if an intrrt
has been generated.
SAI
6
Proximity interrupt enable. When enabled, the proximity interrupt drives the INT pin. When disabled, he
interrupt is masked from the INT pin, but remains visible in the Status register (0x13).
PIEN
Reserved
WEN
5
4
3
Reserved. Write as 0.
Wait enable. This bit activates the wait feature. Writing a 1 activates the wait timer. riting a 0 disables the
wait timer.
Proximity enable. This bit activates the proximity fuction. Writing a 1 enables oximy. Writing a 0
disables proximity.
PEN
Reserved
PON
2
1
0
Reserved. Write as 0.
Power ON. This bit activates the internascillator to permit the timers and ADC channel to operate. Writing
a 1 activates the oscillator. Writing a 0 dhe oscillator.
Proximity Time Register (0x02)
The proximity time register controls the integrtion time of the proxity DC in 2.73 ms increments. Upon power
up, the proximity time register is set to 0xF. It is recommendethat this register be programmed to a value of
0xFF (1 integration cycle).
Table 6. Promity IntegratiTime Control Register
FIELD
BITS
DESCRIPTION
NTE_CYCLES
PTIME
7:0
VALUE
TIME
MAX COUNT
0xFF
1
2.73 ms
1023
Wait Time Register (0x03)
Wait time is set 2.73 ms incremnts unless the WLONG bit is asserted in which case the wait times are 12×
longer. WTIME is programmeas a 2’s complement number. Upon power up, the wait time register is set to
0xFF.
Table 7. Wait Time Register
FIELD
BITS
DESCRIPTION
TIME (WLONG = 0)
WTIME
7:0
REGISTER VALUE
WAIT TIME
TIME (WLONG = 1)
0.033 sec
0xFF
0xB6
0x00
1
2.73 ms
202 ms
699 ms
74
2.4 sec
256
8.4 sec
NOTE: The Proximity Wait Time Register should be configured before PEN is asserted.
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DIGITAL PROXIMITY DETECTOR
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Proximity Interrupt Threshold Registers (0x08 − 0x0B)
The proximity interrupt threshold registers provide the upper and lower threshold values to the proximity
interrupt comparators. See Interrupts in the Principles of Operation section for detailed information. Upon power
up, the interrupt threshold registers reset to 0x00.
Table 8. Proximity Interrupt Threshold Registers
REGISTER
PILTL
ADDRESS
0x08
BITS
7:0
DESCRIPTION
Proximity interrupt low threshold low byte
PILTH
0x09
7:0
Proximity interrupt low threshold high byte
Proximity interrupt high threshold low byte
Proximity interrupt high threshold high byte
PIHTL
0x0A
7:0
PIHTH
0x0B
7:0
Interrupt Persistence Filter Register (0x0C)
The interrupt persistence filter sets the number of consecutive proximity cycles that are out-of-range before an
interrupt is generated. Out-of-range is determined by the proximity interrupt threshod reisters (0x08 through
0x0B). See Interrupts in the Principles of Operation section for further informationUpon power up, the interrupt
persistence filter register resets to 0x00, which will geerate n interrupt at the end of each proximity cycle.
Table 9. Interrupt Pistence Filter Register
7
6
5
4
3
2
1
0
Reset
0x00
PERS
FIELD
PPERS
Reserved
BITS
DCIPTION
Proximity peristene. Controls rate of proxiity interrupt to the host processor.
PPERS
7:4
FIELD LUE
TERRUPT PERSISTENCE FUNCTION
Every proxity cyle generates an interrupt
00
0001
0010
...
1 proxime out of range
2 cnsecutive proximity values out of range
...
1111
15 consecutive proximity values out of range
Reserved
3:0
Reserved. Wte as 0.
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DIGITAL PROXIMITY DETECTOR
TAOS133 − MAY 2012
Configuration Register (0x0D)
The configuration register sets the proximity LED drive level and wait long time.
Table 10. Configuration Register
7
6
5
4
3
2
1
0
Reset
0x00
CONFIG
FIELD
WLONG
PDL
Reserved
BITS
DESCRIPTION
Reserved
WLONG
PDL
7:2
Reserved. Write as 0.
Wait Long. When asserted, the wait cycles are increased by a factor 12× from that programmed in the
1
0
WTIME register.
Proximity drive level. When asserted, the proximity LDR drive current is reduced by 9.
Proximity Pulse Count Register (0x0E)
The proximity pulse count register sets the number of proximity pulses that the LDR pin wilgenerate during the
Prox Accum state.
Table 11. Proximity Pulse Count Register
7
6
5
4
3
2
1
0
Reset
0x00
PPULSE
PPULSE
FIELD
PPULSE
BITS
DESCRON
Proximity Pulse Count. Secifiethe number of pimity pulses to be generated.
7:0
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TAOS133 − MAY 2012
Control Register (0x0F)
The Control register provides eight bits of miscellaneous control to the analog block. These bits typically control
functions such as gain settings and/or diode selection.
Table 12. Control Register
7
6
5
4
3
2
1
0
Reset
0x00
CONTROL
FIELD
PDRIVE
PDIODE
PGAIN
DESCRIPTION
Reserved
BITS
PDRIVE
(Note 1)
7:6
Proximity LED Drive Strength.
FIELD VALUE
LED STRENGTH — PDL = 0
120 mA
LED STRENGTH — PDL
15 mA
00
01
10
11
60 mA
30 mA
15 mA
7.5 mA
3.8 mA
1.9 mA
PDIODE
5:4
3:2
1:0
Proximity Diode Selector.
FIELD VALUE
DIODE SELECTION
00
Proximity uses neiter diod
01
Proximity uhe CH0 diode
Proximity use CH1 diode
Reserved — Dnot write
10
11
PGAIN
Proximity Gain.
FIELD VALUE
ROXIMITY GAIN VALUE
00
01
10
1
1gain
2× gain
4× gain
8× gain
Reserved
Reserved. Write as 0.
NOTE 1: LED STRENGTH currents are nominal values. pecifications can be found in the Proximity Characteristics table.
ID Register (0x12)
The ID Register provides the vaufor the part number. The ID register is a read-only register.
Table 13. ID Register
7
6
5
4
3
2
1
0
Reset
ID
ID
ID
FIELD
BIS
DESCRIPTION
0x32 = TSL26721 & TSL26725
0x3B = TSL26723 & TSL2777
ID
70
Part number identification
Status Register (0x13)
The Status Register provides the internal status of the device. This register is read only.
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TSL2672
DIGITAL PROXIMITY DETECTOR
TAOS133 − MAY 2012
Table 14. Status Register
7
6
5
4
3
2
1
0
Reset
0x00
STATUS
FIELD
Reserved
PSAT
PINT
Reserved
PVALID
Reserved
BIT
7
DESCRIPTION
Reserved
PSAT
Reserved. Read as 0.
6
Proximity Saturation. Indicates that the proximity measurement saturated.
Proximity Interrupt. Indicates that the device is asserting a proximity interrupt.
Reserved. Read as 0.
PINT
5
Reserved
4:2
Proximity Valid. Indicates that the proximity channel has completed an integration cycle after PEN has been
asserted.
PVALID
1
0
Reserved
Reserved. Read as 0.
Proximity Data Registers (0x18 − 0x19)
Proximity data is stored as a 16-bit value. When the lower byte is read, the upper byte is ltched into a shadow
register. The shadow register ensures that both bytes are the result of the same roximity cycle, even if
additional proximity cycles occur between the lower byte ad uppbyte register readins. The simplest way
2
to read both bytes is to perform a two-byte I C read operation using the auto-incemet protocol, which is set
in the Command register TYPE field.
Table 15. Proximity Data Registers
REGISTER
PDATAL
ADDRESS
0x18
BTS
7:0
DESRIPTION
Proximity data bye
PDATAH
0x19
7:0
Proximity dta high byte
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TSL2672
DIGITAL PROXIMITY DETECTOR
TAOS133 − MAY 2012
Proximity Offset Register (0x1E)
The 8-bit proximity offset register provides compensation for proximity offsets caused by device variations,
optical crosstalk, and other environmental factors. Proximity offset is a sign-magnitude value where the sign
bit, bit 7, determines if the offset is negative (bit 7 = 0) or positive (bit 7 = 1). At power up, the register is set to
0x00. The magnitude of the offset compensation depends on the proximity gain (PGAIN), proximity LED drive
strength (PDRIVE), and the number of proximity pulses (PPULSE). Because a number of environmental factors
contribute to proximity offset, this register is best suited for use in an adaptive closed-loop control system. See
available TAOS application notes for proximity offset register application information.
Table 16. Proximity Offset Register
7
6
5
4
3
2
1
0
Res
0x00
POFFSET
SIGN
MAGNITUDE
FIELD
BIT
DESCRIPTION
Proximity Offset Sign. The offset sign shifts the proximity data negative when eual t0 and positive when
equal to 1.
SIGN
7
Proximity Offset Magnitude. The offset magniude shifts the proximity daposie or negative, depending
on the proximity offset sign. The actual amount of the shift depends on the roximty gain (PGAIN), proximity
LED drive strength (PDRIVE), and the nuber f pximity pulses (PPULSE).
MAGNITUDE
6:0
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TSL2672
DIGITAL PROXIMITY DETECTOR
TAOS133 − MAY 2012
APPLICATION INFORMATION: HARDWARE
LED Driver Pin with Proximity Detection
In a proximity sensing system, the IR LED can be pulsed by the TSL2672 with more than 100 mA of rapidly
switching current, therefore, a few design considerations must be kept in mind to get the best performance. The
key goal is to reduce the power supply noise coupled back into the device during the LED pulses.
The first recommendation is to use two power supplies; one for the device V and the other for the IR LED.
DD
In many systems, there is a quiet analog supply and a noisy digital supply. By connecting the quiet supply to
the V pin and the noisy supply to the LED, the key goal can be meet. Place a 1-μF low-ESR decouplng
DD
capacitor as close as possible to the V pin and another at the LED anode, and a 22-μF capacitor at the output
DD
of the LED voltage regulator to supply the 100-mA current surge.
V
BUS
Voltage
Regulator
V
DD
R
P
R
P
R
PI
1 mF
C*
GND
LDR
TSL2672
INT
SCL
Voltage
Regulator
SDA
1 mF
ꢂ 22 mF
IR LED
* Cap Value Per Regulor Manufacturer Recommendation
Figure 15. Proximity Sening Using Separate Power Supplies
If it is not possible to provide two sepaate power supplies, the device can be operated from a single supply.
A 22-Ω resistor in series with the V supply line and a 1-μF low ESR capacitor effectively filter any power supply
D
noise. The previous capacitor placent considerations apply.
V
BUS
22 W
Voltage
Regulator
V
DD
R
P
R
P
R
PI
1 mF
ꢂ
2
2
m
F
GND
LDR
TSL2672
INT
SCL
SDA
1 m
IR LED
Fiure 16. Proximity Sensing Using Single Power Supply
2
V
in the above figures refers to the I C bus voltage which is either V or 1.8 V. Be sure to apply the specified
BUS
DD
2
I C bus ltage shown in the Available Options table for the specific device being used.
2
The I C signals and the Interrupt are open-drain outputs and require pull−up resistors. The pull-up resistor (R )
P
2
2
value ia function of the I C bus speed, the I C bus voltage, and the capacitive load. The TAOS EVM running
at 400 kbps, uses 1.5-kΩ resistors. A 10-kΩ pull-up resistor (R ) can be used for the interrupt line.
PI
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TSL2672
DIGITAL PROXIMITY DETECTOR
TAOS133 − MAY 2012
APPLICATION INFORMATION: HARDWARE
PCB Pad Layouts
Suggested land pattern based on the IPC−7351B Generic Requirements for Surface Mount Design and Land
Pattern Standard (2010) for the small outline no-lead (SON) package is shown in Figure 17.
2.70
1.20
1.20
0.35 ꢀ 6
0.65
0.65
TOW
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
Figure 17. Suggesed FN PackaPCB Layout
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TSL2672
DIGITAL PROXIMITY DETECTOR
TAOS133 − MAY 2012
PACKAGE INFORMATION
PACKAGE FN
Dual Flat No-Lead
TOP VIEW
398 ꢃ 10
PIN OUT
TOP VIEW
PIN 1
VDD
1
6 SDA
5 INT
355
ꢃ 10
2000 ꢃ 100
SCL 2
GND 3
4 LD
2000
ꢃ 100
Photodiode Arry Area
END VIEW
SIDE VIEW
295
Nomina
650 ꢃ 50
203 ꢃ 8
650
BSC
300
ꢃ 50
BOTTOM VIEW
C
of Photodiode Array Area
(Note B)
C
L of Solder Cntats
L
1 Nominal
144 Nominal
C
L of Solder Contacts
of Photodiode Array Area (Note B)
C
L
PIN 1
Pb
750 ꢃ 150
Lead Free
NOTES: A. All linear imesions are in micrometers.
B. This centered within the package within a tolerance of 75 μm.
. Paage top surface is molded with an electrically nonconductive clear plastic compound having an index of refraction of 1.55.
. Contct finish is copper alloy A194 with pre-plated NiPdAu lead finish.
E. This package contains no lead (Pb).
F. This drawing is subject to change without notice.
Figure 18. Package FN — Dual Flat No-Lead Packaging Configuration
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DIGITAL PROXIMITY DETECTOR
TAOS133 − MAY 2012
CARRIER TAPE AND REEL INFORMATION
TOP VIEW
2.00 ꢃ 0.05
1.75
ꢄ 1.50
4.00
4.00
B
+ 0.30
8.00
− 0.10
3.50 ꢃ 0.05
ꢄ 1.00
ꢃ 0.25
B
A
A
DETAIL A
DETAIL B
5ꢁ Max
5ꢁ Max
0.254
2.18 ꢃ 0.05
2.18 ꢃ 0.05
ꢃ 0.02
0.83 ꢃ 0.05
B
o
A
o
K
o
NOTES: A. Alineadimensions are in millimeters. Dimension tolerance is 0.10 mm unless otherwise noted.
B. The imensions on this drawing are for illustrative purposes only. Dimensions of an actual carrier may vary slightly.
C. Symbs on drawing A , B , and K are defined in ANSI EIA Standard 481−B 2001.
o
o
o
DEah reel is 178 millimeters in diameter and contains 3500 parts.
E. TAOS packaging tape and reel conform to the requirements of EIA Standard 481−B.
F. In accordance with EIA standard, device pin 1 is located next to the sprocket holes in the tape.
G. This drawing is subject to change without notice.
Figure 19. Package FN Carrier Tape
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SOLDERING INFORMATION
The FN package has been tested and has demonstrated an ability to be reflow soldered to a PCB substrate.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The components should
be limited to a maximum of three passes through this solder reflow profile.
Table 17. Solder Reflow Profile
PARAMETER
Average temperature gradient in preheating
Soak time
REFERENCE
DEVICE
2.5°C/sec
t
2 to 3 minutes
Max 60 sec
Max 50 sec
Max 10 sec
260°C
soak
Time above 217°C (T1)
t
1
Time above 230°C (T2)
t
2
Time above T
−10°C (T3)
t
peak
3
Peak temperature in reflow
T
peak
Temperature gradient in cooling
Max −5°C/se
Not to scale — for reference only
T
peak
T
3
T
T
2
1
Time (sec)
t
t
t
3
2
1
t
soak
Figure 20. Solder Reflow Profile Graph
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STORAGE INFORMATION
Moisture Sensitivity
Optical characteristics of the device can be adversely affected during the soldering process by the release and
vaporization of moisture that has been previously absorbed into the package. To ensure the package contains
the smallest amount of absorbed moisture possible, each device is baked prior to being dry packed for shipping.
Devices are dry packed in a sealed aluminized envelope called a moisture-barrier bag with silica gel to protect
them from ambient moisture during shipping, handling, and storage before use.
Shelf Life
The calculated shelf life of the device in an unopened moisture barrier bag is 12 months from the date codon
the bag when stored under the following conditions:
Shelf Life: 12 months
Ambient Temperature: < 40°C
Relative Humidity: < 90%
Rebaking of the devices will be required if the devices exceed the 12 month shelf life or the Humidity Indicator
Card shows that the devices were exposed to conditions beyond the allowable oistue region.
Floor Life
The FN package has been assigned a moisture sitivity level of MSL 3. As a result, the floor life of devices
removed from the moisture barrier bag is 168 hourm the time the bawas opened, provided that the devices
are stored under the following conditions:
Floor Life: 168 hours
Ambient Temperature: < 30°C
Relative Humidity: < 60%
If the floor life or the temperature/humidity conditions havbeen exceeded, the devices must be rebaked prior
to solder reflow or dry packing.
Rebaking Instructions
When the shelf life or floor life limits have been exceeded, rebake at 50°C for 12 hours.
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PRODUCTION DATA — information in this document is current at publication date. Products conform to
specifications in accordance with the terms of Texas Advanced Optoelectronic Solutions, Inc. standard
warranty. Production processing does not necessarily include testing of all parameters.
LEAD-FREE (Pb-FREE) and GREEN STATEMENT
Pb-Free (RoHS) TAOS’ terms Lead-Free or Pb-Free mean semiconductor products that are compatible with the current
RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous
materials. Where designed to be soldered at high temperatures, TAOS Pb-Free products are suitable for use in specified
lead-free processes.
Green (RoHS & no Sb/Br) TAOS defines Green to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and
Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material).
Important Information and Disclaimer The information provided in this statement represents TAOS’ knowlege and
belief as of the date that it is provided. TAOS bases its knowledge and belief on information provided by third parties,
and makes no representation or warranty as to the accuracy of such information. Efforts are underway better integrate
information from third parties. TAOS has taken and continues to take reasonable steps to proide epresentative
and accurate information but may not have conducted destructive testing or chemical analysis on comng materials and
chemicals. TAOS and TAOS suppliers consider certain information to be proprietary, and thCAS numbers and other
limited information may not be available for release.
NOCE
Texas Advanced Optoelectronic Solutions, Inc. (TAOS) reservs the right to make chages to the products contained in this
document to improve performance or for any other purpose, or to discontinue tem without notice. Customers are advised
to contact TAOS to obtain the latest product information before placing orders r designing TAOS products into systems.
TAOS assumes no responsibility for the use f ay products or cicuits scibed in this document or customer product
design, conveys no license, either expressed oimplied, under any paent or other right, and makes no representation that
the circuits are free of patent infringement. TAOS further makes no aim as to the suitability of its products for any particular
purpose, nor does TAOS assume any liility arising out of the se of any product or circuit, and specifically disclaims any
and all liability, including without limitatconsequential oncidntal damages.
TEXAS ADVANCED OPTOELECTRONIC SOLUTIONS, IC. PRODUCTS ARE NOT DESIGNED OR INTENDED FOR
USE IN CRITICAL APPLICATIONS IN WHICH TE FILURE OR MALFUNCTION OF THE TAOS PRODUCT MAY
RESULT IN PERSONAL INJURY OR DEATH. USE OF TAOS PRODUCTS IN LIFE SUPPORT SYSTEMS IS EXPRESSLY
UNAUTHORIZED AND ANY SUCH USE BY CUSTOMER IS COMPLETELY AT THE CUSTOMER’S RISK.
LUMENOLOGY, TAOS, the TAOS logo, and Ts Advanced Optoelectronic Solutions are registered trademarks of Texas Advanced
Optoelectronic Solutions Incorpoated
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