EVB-EP53A7LQI [ALTERA]
1A PowerSoC Light Load Mode Buck Regulator with Integrated Inductor;型号: | EVB-EP53A7LQI |
厂家: | ALTERA CORPORATION |
描述: | 1A PowerSoC Light Load Mode Buck Regulator with Integrated Inductor |
文件: | 总19页 (文件大小:998K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Enpirion® Power Datasheet
EP53A7LQI/EP53A7HQI 1A PowerSoC
Light Load Mode Buck Regulator
with Integrated Inductor
Description
Features
The EP53A7xQI (x = L or H) is a 1000mA
PowerSOC. The EP53A7xQI integrates MOSFET
switches, control, compensation, and the
magnetics in an advanced 3mm x 3mm QFN
Package.
• Integrated Inductor Technology
• 3mm x 3mm x 1.1mm QFN package
• Total Solution Footprint < 21mm2
• Low VOUT ripple for RF compatibility
• High efficiency, up to 94%
Integrated magnetics enables a tiny solution
footprint, low output ripple, low part-count, and
high reliability, while maintaining high efficiency.
The complete solution can be implemented in as
little as 21mm2.
• 1000mA continuous output current
• 55µA quiescent current
• Less than 1µA standby current
A proprietary light load mode (LLM) provides high • 5 MHz switching frequency
efficiency in light load conditions.
• 3 pin VID for glitch free voltage scaling
The EP53A7xQI uses a 3-pin VID to easily select
the output voltage setting. Output voltage
settings are available in 2 optimized ranges
providing coverage for typical VOUT settings.
• VOUT Range 0.6V to V – 0.5V
IN
• Short circuit and over current protection
• UVLO and thermal protection
• IC level reliability in a PowerSOC solution
The VID pins can be changed on the fly for fast
dynamic voltage scaling. EP53A7LQI further has
the option to use an external voltage divider.
Application
• Portable wireless and RF applications
The EP53A7xQI offers the optimal combination
of very small solution footprint and advanced
performance features.
• Solid state storage applications
• Space constrained applications requiring high
efficiency and very small solution size
3.5mm
100 ohm
4.7uF
VOUT
100 Ohm
PVIN
VOUT
VIN
VSENSE
AVIN
ENABLE
LLM
10µF
4.7µF
VFB
VS0
EP53A7xQI
6mm
VS1
VS2
AGND
PGND
10uF
Figure 2: Typical Application Schematic
Figure 1: Total Solution Footprint
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Pin Assignments(Top View)
Ordering Information
Part Number
Comment
Package
EP53A7LQI
LOW VID Range 16-pin QFN T&R
HIGH VID Range 16-pin QFN T&R
EP53A7LQI Evaluation Board
EP53A7HQI
EVB-EP53A7LQI
EVB-EP53A7HQI
EP53A7HQI Evaluation Board
Figure 3: EP53A7LQI Pin Out Diagram (Top View)
Figure 4: EP53A7HQI Pin Out Diagram (Top View)
Pin Description
PIN
NAME
FUNCTION
NO CONNECT – These pins are internally connected to the common switching node of the
internal MOSFETs. NC (SW) pins are not to be electrically connected to any external signal,
ground, or voltage. However, they must be soldered to the PCB. Failure to follow this
guideline may result in part malfunction or damage to the device.
Power ground. Connect this pin to the ground electrode of the Input and output filter
capacitors.
1, 15,
16
NC(SW)
2
3
PGND
LLM
LLM ( Light load mode – “LLM”) pin. Logic-High enables automatic LLM/PWM and logic-
low places the device in fixed PWM operation.
VFB
NC
VSENSE
EP53A7LQI: Feed back pin for external resistor divider option.
EP53A7HQI: No Connect
Sense pin for preset output voltages. Refer to application section for proper configuration.
4
5
Analog ground. This is the quiet ground for the internal control circuitry, and the ground
return for external feedback voltage divider
Regulated Output Voltage. Refer to application section for proper layout and decoupling.
6
AGND
VOUT
7, 8
2
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PIN
NAME
FUNCTION
Output voltage select. VS2 = pin 9, VS1 = pin 10, VS0 = pin 11.
EP53A7LQI: Selects one of seven preset output voltages or an external resistor divider.
EP53A7HQI: Selects one of eight preset output voltages.
9, 10,
11
VS2, VS1,
VS0
(Refer to section on output voltage select for more details.)
Output Enable. Enable = logic high; Disable = logic low
Input power supply for the controller circuitry. Connect to PVIN through a 100 Ohm resistor.
Input Voltage for the MOSFET switches.
12
13
14
ENABLE
AVIN
PVIN
Absolute Maximum Ratings
CAUTION: Absolute Maximum ratings are stress ratings only. Functional operation beyond the
recommended operating conditions is not implied. Stress beyond the absolute maximum ratings may
cause permanent damage to the device. Exposure to absolute maximum rated conditions for
extended periods may affect device reliability.
PARAMETER
SYMBOL MIN
MAX
UNITS
Input Supply Voltage
VIN
-0.3
-0.3
-0.3
6.0
V
VIN+ 0.3
2.7
V
V
Voltages on: ENABLE, VSENSE, VSO – VS2
Voltages on: VFB (EP53A7LQI)
Maximum Operating Junction Temperature
Storage Temperature Range
TJ-ABS
TSTG
150
150
°C
°C
°C
V
-65
Reflow Temp, 10 Sec, MSL3 JEDEC J-STD-020C
ESD Rating (based on Human Body Mode)
260
2000
Recommended Operating Conditions
PARAMETER
Input Voltage Range
SYMBOL MIN
MAX UNITS
VIN
TA
TJ
2.4
- 40
- 40
5.5
V
Operating Ambient Temperature
+85
°C
°C
Operating Junction Temperature
+125
Thermal Characteristics
PARAMETER
Thermal Resistance: Junction to Ambient –0 LFM (Note 1)
SYMBOL
θJA
TYP
UNITS
°C/W
80
+155
25
Thermal Overload Trip Point
TJ-TP
°C
°C
Thermal Overload Trip Point Hysteresis
Note 1: Based on a four layer copper board and proper thermal design per JEDEC EIJ/JESD51 standards
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Electrical Characteristics
NOTE: TA = -40°C to +85°C unless otherwise noted. Typical values are at TA = 25°C, VIN = 3.6V.
CIN = -4.7µF MLCC, COUT = 10µF MLCC
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX UNITS
Operating Input Voltage
VIN
2.4
5.5
V
Under Voltage Lock-out –
VIN Rising
VUVLO_R
2.0
V
Under Voltage Lock-out –
VIN Falling
VUVLO_F
RDO
1.9
V
mΩ
V
Drop Out Resistance
Input to Output Resistance
350
500
VIN-VDO
3.3
0.6
1.8
EP53A7LQI (VDO = ILOAD X RDO
EP53A7HQI
)
Output Voltage Range
VOUT
Dynamic VoltageSlew
Rate
EP53A7LQI
EP53A7HQI
4
8
V/mS
%
VSLEW
TA = 25°C, VIN = 3.6V;
ILOAD = 100mA ;
0.8V ≤ VOUT ≤ 3.3V
VID Preset VOUT Initial
Accuracy
∆VOUT
-2
+2
TA = 25°C, VIN = 3.6V;
ILOAD = 100mA ;
0.8V ≤ VOUT ≤ 3.3V
Feedback Pin Voltage
Initial Accuracy
VFB
.588
0.6
0.612
V
Line Regulation
2.4V ≤ VIN ≤ 5.5V
0.03
0.6
30
%/V
%/A
∆VOUT_LINE
∆VOUT_LOAD
∆VOUT_TEMPL
Load Regulation
0A ≤ ILOAD ≤ 1000mA
Temperature Variation
ppm/°C
-40°C ≤ TA ≤ +85°C
Output Current
IOUT
ISD
1000
mA
µA
Shut-down Current
Enable = Low
0.75
55
EP53A7HQI Operating
Quiescent Current
ILOAD=0; Preset Output Voltages,
IQ
µA
LLM=High
EP53A7LQI Operating
Quiescent Current
I
LOAD=0; Preset Output Voltages,
IQ
65
1.4
µA
A
LLM=High
2.4V ≤ VIN ≤ 5.5V
0.6V ≤ VOUT ≤ 3.3V
OCP Threshold
ILIM
IFB
1.25
Feedback Pin Input
Current
Note 1
Note 1
<100
nA
VS0-VS2, Pin Logic Low
VS0-VS2, Pin Logic High
VVSLO
VVSHI
0.0
1.4
0.3
VIN
V
V
VS0-VS2, Pin Input
Current
IVSX
<100
<100
nA
Enable Pin Logic Low
Enable Pin Logic High
Enable Pin Current
VENLO
VENHI
IENABLE
0.3
V
V
1.4
700
1.4
Note 1
nA
Minimum difference between VIN
LLM Engage Headroom
mV
and VOUT to ensure proper LLM
operation
LLM Pin Logic Low
LLM Pin Logic High
VLLMLO
VLLMHI
0.3
V
V
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PARAMETER
LLM Pin Current
SYMBOL
ILLM
TEST CONDITIONS
MIN
TYP
<100
5
MAX UNITS
nA
Operating Frequency
FOSC
MHz
Soft Start Operation
EP53A7LQI (VID only)
EP53A7HQI (VID only)
4
8
Soft Start Slew Rate
V/mS
∆VSS
∆TSS
Soft Start Rise Time
EP53A7LQI (VFB mode); Note 2
170
225
280
µS
Note 1: Parameter guaranteed by design
Note 2: Measured from when VIN ≥ VUVLO_R & ENABLE pin crosses its logic High threshold.
Typical PerformanceCharacteristics
95
90
85
80
75
70
65
60
55
50
45
95
90
85
80
75
70
65
60
55
50
45
LLM
LLM
VOUT=1.2V
VOUT=1.8V
PWM
PWM
10
100
Load Current (mA)
1000
10
100
Load Current (mA)
1000
Efficiency vs. Load Current: VOUT = 1.2V, VIN (from
top to bottom) = 2.5, 3.3, 3.7, 4.3, 5.0V
Efficiency vs. Load Current: VOUT = 1.8V, VIN (from
top to bottom) = 2.5, 3.3, 3.7, 4.3, 5.0V
95
90
85
80
75
70
65
60
55
50
45
95
LLM
LLM
90
85
80
75
70
65
60
55
50
45
VOUT=2.5V
VOUT=3.3V
PWM
PWM
10
100
Load Current (mA)
1000
10
100
1000
Load Current (mA)
Efficiency vs. Load Current: VOUT = 2.5V, VIN (from
top to bottom) = 3.3, 3.7, 4.3, 5.0V
Efficiency vs. Load Current: VOUT = 3.3V, VIN (from
top to bottom) = 3.7, 4.3, 5.0V
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Start Up Waveform: VIN = 5.0V, VOUT = 3.3V;
ILOAD = 1000mA; VID Mode
Start Up Waveform: VIN = 5.0V, VOUT = 3.3V;
ILOAD = 10mA; VID Mode
Shut-down Waveform: VIN = 5.0V, VOUT = 3.3V;
ILOAD = 1000mA, PWM
Shut-down Waveform: VIN = 5.0V, VOUT = 3.3V;
ILOAD = 10mA, PWM
5mV/Div
50mV/Div
Output Ripple: VIN = 5.0V, VOUT = 1.2V, Load = 10mA
LLM enabled
Output Ripple: VIN = 5.0V, VOUT = 1.2V,
Load = 1A
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50mV/Div
5mV/Div
Output Ripple: VIN = 5.0V, VOUT = 3.3V,
Load = 1A
Output Ripple: VIN = 5.0V, VOUT = 3.3V, Load = 10mA
LLM enabled
50mV/Div
5mV/Div
Output Ripple: VIN = 3.3V, VOUT = 1.8V, Load = 10mA
LLM enabled
Output Ripple: VIN = 3.3V, VOUT = 1.8V
Load = 1A
5mV/Div
50mV/Div
Output Ripple: VIN = 3.3V, VOUT = 1.2V,
Load = 1A
Output Ripple: VIN = 3.3V, VOUT = 1.2V, Load = 10mA
LLM enabled
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Load Transient: VIN = 5.0V, VOUT = 3.3V
Load stepped from 0mA to 1000mA
Load Transient: VIN = 5.0V, VOUT = 3.3V
Load steppedfrom 10mA to 1000mA, LLM enabled
Load Transient: VIN = 5.0V, VOUT = 1.2V
Load stepped from 0mA to 1000mA
Load Transient: VIN = 5.0V, VOUT = 1.2V
Load steppedfrom 10mA to 1000mA, LLM enabled
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Load Transient: VIN = 3.7V, VOUT = 1.2V
Load stepped from 0mA to 1000mA
Load Transient: VIN = 3.7V, VOUT = 1.2V
Load steppedfrom 10mA to 1000mA, LLM enabled
Load Transient: VIN = 3.3V, VOUT = 1.8V
Load steppedfrom 10mA to 1000mA, LLM enabled
Load Transient: VIN = 3.3V, VOUT = 1.8V
Load stepped from 0mA to 1000mA
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Functional Block Diagram
LLM
PVIN
UVLO
Thermal Limit
Current Limit
Mode Logic
NC(SW)
VOUT
ENABLE
Soft Start
P-Drive
N-Drive
Logic
(-)
PWM
Comp
(+)
PGND
VSENSE
Sawtooth
Generator
Compensation
Network
(-)
Switch
VFB
Error
Amp
(+)
DAC
Voltage
Select
VREF
Package Boundry
AVIN AGND
VS0 VS1 VS2
Figure 5: Functional Block Diagram
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Detailed Description
Functional Overview
Integrated Inductor
The EP53A7xQI utilizes a proprietary low loss
integrated inductor. The integration of the
inductor greatly simplifies the power supply
design process. The integrated inductor
provides the optimal solution to the complexity,
output ripple, and noise that plague low power
DCDC converter design.
The EP53A7xQI requires only 2 small MLCC
capacitors and an 0201 resistor for a complete
DC-DC converter solution.
integrates MOSFET switches, PWM controller,
Gate-drive, compensation, and inductor into a
tiny 3mm x 3mm x 1.1mm QFN package.
Advanced package design, along with the high
level of integration, provides very low output
The device
Voltage Mode Control
ripple and noise.
The EP53A7xQI uses
voltage mode control for high noise immunity
and load matching to advanced ≤90nm loads.
A 3-pin VID allows the user to choose from one
of 8 output voltage settings. The EP53A7xQI
comes with two VID output voltage ranges.
The EP53A7HQI provides VOUT settings from
1.8V to 3.3V, the EP53A7LQI provides VID
settings from 0.8V to 1.5V, and also has an
external resistor divider option to program
The EP53A7xQI utilizes an integrated type III
compensation network. Voltage mode control
is inherently impedance matched to the sub
90nm process technology that is used in
today’s advanced ICs. Voltage mode control
also provides a high degree of noise immunity
at light load currents so that low ripple and high
accuracy are maintained over the entire load
range.
The very high switching frequency
output setting over the 0.6V to V -0.5V range.
allows for a very wide control loop bandwidth
IN
The EP53A7xQI provides the industry’s highest
power density of any 1A DCDC converter
solution.
and hence excellent transient performance.
Light Load Mode (LLM) Operation
The EP53A7xQI uses a proprietary light load
mode to provide high efficiency in the low load
operating condition. When the LLM pin is high,
the device is in automatic LLM/PWM mode.
When the LLM pin is low, the device is in PWM
mode. In automatic LLM/PWM mode, when a
light load condition is detected, the device will
(1) step VOUT up by approximately 1.5% above
the nominal operating output voltage setting,
The key enabler of this revolutionary
integration is Altera Enpirion’s proprietary
power MOSFET technology. The advanced
MOSFET switches are implemented in deep-
submicron CMOS to supply very low switching
loss at high switching frequencies and to allow
a high level of integration. The semiconductor
process allows seamless integration of all
switching, control, and compensation circuitry.
VNOM, and then (2) shut down unnecessary
The proprietary magnetics design provides
high-density/high-value magnetics in a very
small footprint. Altera Enpirion magnetics are
carefully matched to the control and
compensation circuitry yielding an optimal
solution with assured performance over the
entire operating range.
circuitry, and (3) monitor VOUT. When VOUT falls
below VNOM, the device will repeat (1), (2), and
(3). The voltage step up, or pre-positioning,
improves transient droop when a load transient
causes a transition from LLM mode to PWM
mode. If a load transient occurs, causing VOUT
to fall below the threshold VMIN, the device will
exit LLM operation and begin normal PWM
Protection features include under-voltage lock-
out (UVLO), over-current protection (OCP),
short circuit protection, and thermal overload
protection.
operation. Figure
6
demonstrates VOUT
behavior during transition into and out of LLM
operation.
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LLM
LLM Threshold Current vs. VOUT
Ripple
VMAX
250
200
150
100
50
PWM
Ripple
VNOM
VMIN
VOUT
VIN=5V (top curve)
VIN=4.2V
Load
Step
VIN=3.7V
VIN=3.3V (bottom curve)
0
IOUT
0.8
1.1
1.4
1.7
2.0
2.3
2.6
2.9
3.2
VOUT (V)
Figure 6: VOUT Behavior in LLM Operation
Figure 8: Typical load current for LLM engage and
disengage versus VOUT for selected input voltages
Table 1: Load current below which the device can be
certain to be in LLM operation. These values are
guaranteed by design
VIN
VOUT
3.30
3.00
2.90
2.60
2.50
2.20
2.10
1.80
1.50
1.45
1.20
1.15
1.10
1.05
0.80
3.3
3.7
4.3
105
122
126
136
138
141
141
138
130
128
117
114
111
108
92
5.0
147
156
158
162
162
160
158
150
138
136
122
119
116
113
94
62
89
Device exits LLM,
tests load current
56
69
106
111
120
122
124
120
119
111
108
106
104
89
101
105
111
111
111
105
103
101
99
Figure 7: VOUT Droop during Periodic LLM Exit
Many multi-mode DCDC converters suffer from
a condition that occurs when the load current
increases only slowly so that there is no load
transient driving VOUT below the VMIN threshold
(shown in Figure 6). In this condition, the
device would never exit LLM operation. This
could adversely affect efficiency and cause
unwanted ripple. To prevent this from
occurring, the EP53A7xQI periodically exits
LLM mode into PWM mode and measures the
load current. If the load current is above the
LLM threshold current, the device will remain in
PWM mode. If the load current is below the
LLM threshold, the device will re-enter LLM
operation. There will be a small droop in VOUT
at the point where the device exits and re-
enters LLM, as shown in Figure 7.
87
which the device will enter LLM operation. The
actual load current at which the device will
enter LLM operation can vary by +/-30%. Table
1 shows the minimum load current below which
the device is guaranteed to be in LLM
operating mode.
To ensure normal LLM operation, LLM mode
should be enabled/disabled with specific
sequencing. For applications with explicit LLM
pin control, enable LLM after VIN ramp up
complete; disable LLM before VIN ramp down.
For applications with ENABLE control, tie LLM
to ENABLE; enable device after VIN ramp up
complete and disable device before VIN ramp
The load current at which the device will enter
LLM mode is a function of input and output
voltage. Figure 8 shows the typical value at
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down begins. For devices with ENABLE and
LLM tied to VIN, contact Altera Applications
engineering for specific recommendations.
EP53A7LUI in external divider mode:
OUT_TOTAL_MAX = 2.25x10-4/VOUT Farads
C
Increased output filter capacitance and/or
increased bulk capacitance at the load will
decrease the magnitude of the LLM ripple.
Refer to the section on output filter capacitance
for maximum values of output filter capacitance
and the Soft-Start section for maximum bulk
capacitance at the load.
The nominal value for COUT is 10uF. See the
applications section for more details.
Over Current/Short Circuit Protection
The current limit function is achieved by
sensing the current flowing through a sense P-
MOSFET which is compared to a reference
current. When this level is exceeded the P-
FET is turned off and the N-FET is turned on,
pulling VOUT low. This condition is maintained
for approximately 0.5mS and then a normal
NOTE: For proper LLM operation the
EP53A7xQI requires a minimum difference
between V and VOUT of 700mV.
If this
IN
condition is not met, the device cannot be
assured proper LLM operation.
soft start is initiated.
If the over current
NOTE: Automatic LLM/PWM is not available
when using the external resistor divider option
for VOUT programming.
condition still persists, this cycle will repeat.
Under Voltage Lockout
During initial power up, an under voltage
lockout circuit will hold-off the switching
circuitry until the input voltage reaches a
sufficient level to insure proper operation. If
the voltage drops below the UVLO threshold,
the lockout circuitry will again disable the
switching. Hysteresis is included to prevent
chattering between states.
Soft Start
Internal soft start circuits limit in-rush current
when the device starts up from a power down
condition or when the “ENABLE” pin is
asserted “high”. Digital control circuitry limits
the VOUT ramp rate to levels that are safe for
the Power MOSFETS and the integrated
inductor.
Enable
The EP53A7HQI has a soft-start slew rate that
is twice that of the EP53A7LQI.
The ENABLE pin provides a means to shut
down the converter or enable normal
When the EP53A7LUI is configured in external
resistor divider mode, the device has a fixed
VOUT ramp time. Therefore, the ramp rate will
vary with the output voltage setting. Output
voltage ramp time is given in the Electrical
Characteristics Table.
operation.
A logic low will disable the
converter and cause it to shut down. A logic
high will enable the converter into normal
operation.
NOTE: The ENABLE pin must not be left
floating.
Excess bulk capacitance on the output of the
device can cause an over-current condition at
startup. The maximum total capacitance on
the output, including the output filter capacitor
and bulk and decoupling capacitance, at the
load, is given as:
Thermal Shutdown
When excessive power is dissipated in the
chip, the junction temperature rises. Once the
junction temperature exceeds the thermal
shutdown temperature, the thermal shutdown
circuit turns off the converter output voltage
thus allowing the device to cool. When the
junction temperature decreases by 25C°, the
device will go through the normal startup
process.
EP53A7LQI:
C
OUT_TOTAL_MAX = COUT_Filter + COUT_BULK = 200uF
EP53A7HQI:
OUT_TOTAL_MAX = COUT_Filter + COUT_BULK = 100uF
C
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Application Information
which in turn is connected to the non-inverting
input of the error amplifier. This allows the use
of a single feedback divider with constant loop
gain and optimum compensation, independent
of the output voltage selected.
100 ohm
VOUT
PVIN
VOUT
VIN
VSENSE
AVIN
ENABLE
10µF
4.7µF
LLM
VS0
VS1
VS2
NOTE: The VID pins must not be left floating.
AGND
PGND
EP53A7L Low VID Range Programming
The EP53A7LQI is designed to provide a high
degree of flexibility in powering applications
that require low VOUT settings and dynamic
voltage scaling (DVS). The device employs a
3-pin VID architecture that allows the user to
choose one of seven (7) preset output voltage
settings, or the user can select an external
voltage divider option. The VID pin settings
can be changed on the fly to implement glitch-
free voltage scaling.
Figure 9: ApplicationCircuit, EP53A7HQI. Note that
all control signals should be connected to an
external control signal, AVIN or AGND.
100 ohm
VOUT
PVIN
VOUT
VIN
VSENSE
AVIN
ENABLE
LLM
10µF
4.7µF
VFB
VS0
VS1
VS2
Table 2: EP53A7LQI VID Voltage Select Settings
AGND
PGND
VS2
0
0
0
0
1
1
1
VS1
0
0
1
1
0
0
1
VS0
0
1
0
1
0
1
0
VOUT
1.50
1.45
1.20
1.15
1.10
1.05
0.8
Figure 10: Application Circuit, EP53A7LQI showing
the VFB function.
Output Voltage Programming
1
1
1
EXT
The EP53A7xQI utilizes a 3-pin VID to program
the output voltage value. The VID is available
in two sets of output VID programming ranges.
The VID pins should be connected either to an
external control signal, AVIN or to AGND to
avoid noise coupling into the device. The VID
pins must not be left floating.
Table 2 shows the VS2-VS0 pin logic states for
the EP53A7LQI and the associated output
voltage levels.
A logic “1” indicates a
connection to AVIN or to a “high” logic voltage
level. A logic “0” indicates a connection to
AGND or to a “low” logic voltage level. These
pins can be either hardwired to AVIN or AGND
or alternatively can be driven by standard logic
levels. Logic levels are defined in the electrical
characteristics table. Any level between the
logic high and logic low is indeterminate.
The “Low” range is optimized for low voltage
applications. It comes with preset VID settings
ranging from 0.80V and 1.5V. This VID set
also has an external divider option.
To specify this VID range, order part number
EP53A7LQI.
EP53A7LQI External Voltage Divider
The external divider option is chosen by
connecting VID pins VS2-VS0 to AVIN or a
logic “1” or “high”. The EP53A7LQI uses a
separate feedback pin, VFB, when using the
external divider. VSENSE must be connected to
VOUT as indicated in Figure 11.
The “High” VID set provides output voltage
settings ranging from 1.8V to 3.3V.
This
version does not have an external divider
option. To specify this VID range, order part
number EP53A7HQI.
Internally, the output of the VID multiplexer
sets the value for the voltage reference DAC,
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EP53A7LQI/EP53A7HQI
or alternatively can be driven by standard logic
levels. Logic levels are defined in the electrical
characteristics table. Any level between the
logic high and logic low is indeterminate.
These pins must not be left floating.
100 Ohm
PVIN
VSense
VOUT
VOUT
VIN
10µF
AVIN
4.7uF
Ra
Rb
ENABLE
Table 3: EP53A7HQI VID Voltage Select Settings
VFB
VS0
VS1
VS2
VS2
0
VS1
0
VS0
0
VOUT
3.3
LLM
PGND AGND
0
0
1
3.0
0
1
0
2.9
0
1
1
2.6
1
0
0
2.5
1
1
0
1
1
0
2.2
2.1
Figure 11: EP53A7LQI using external divider
1
1
1
1.8
The output voltage is selected by the following
formula:
Power-Up/Down Sequencing
Ra
Rb
VOUT = 0.6V
(
1+
)
During power-up, ENABLE should not be
asserted before PVIN, and PVIN should not be
asserted before AVIN. The PVIN should never
be powered when AVIN is off. During power
down, the AVIN should not be powered down
before the PVIN. Tying PVIN and AVIN or all
three pins (AVIN, PVIN, ENABLE) together
during power up or power down meets these
requirements.
Ra must be chosen as 237KΩ to maintain loop
gain. Then Rb is given as:
142.2x103
=
Ω
Rb
VOUT − 0.6
VOUT can be programmed over the range of
0.6V to (V – 0.5V).
IN
NOTE: Dynamic Voltage Scaling is not allowed
between internal preset voltages and external
divider.
Pre-Bias Start-up
NOTE: LLM is not functional when using the
external divider option. Tie the LLM pin to
AGND when using this option.
The EP53A7xQI does not support startup into
a pre-biased condition. Be sure the output
capacitors are not charged or the output of the
EP53A7xQI is not pre-biased when the
EP53A7xQI is first enabled.
EP53A7HQI High VID Range
Programming
Input Filter Capacitor
The EP53A7HQI VOUT settings are optimized
for higher nominal voltages such as those
required to power IO, RF, or IC memory. The
preset voltages range from 1.8V to 3.3V.
There are eight (8) preset output voltage
settings. The EP53A7HQI does not have an
The input filter capacitor requirement is a
4.7µF 0402 or 0603 low ESR MLCC capacitor.
Output Filter Capacitor
The output filter capacitor requirement is a
external divider option.
As with the
minimum of 10µF 0805 MLCC.
Ripple
EP53A7LQI, the VID pin settings can be
changed while the device is enabled.
performance can be improved by using 2x10µF
0603 or 2x10µF 0805 MLCC capacitors.
Table 3 shows the VS0-VS2 pin logic states for
the EP53A7HQI and the associated output
The maximum output filter capacitance next to
the output pins of the device is 60µF low ESR
MLCC capacitance. VOUT has to be sensed at
the last output filter capacitor next to the
EP53A7xQI.
voltage levels.
A logic “1” indicates a
connection to AVIN or to a “high” logic voltage
level. A logic “0” indicates a connection to
AGND or to a “low” logic voltage level. These
pins can be either hardwired to AVIN or AGND
Additional bulk capacitance for decoupling and
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October 11, 2013
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EP53A7LQI/EP53A7HQI
bypass can be placed at the load as long as
there is sufficient separation between the VOUT
Sense point and the bulk capacitance. The
separation provides an inductance that isolates
the control loop from the bulk capacitance.
section on Soft-Start for the maximum total
capacitance on the output.
NOTE: The Input and Output capacitors must
use a X5R or X7R or equivalent dielectric
formulation.
Y5V or equivalent dielectric
NOTE: Excess total capacitance on the output
(Output Filter + Bulk) can cause an over-
formulations lose capacitance with frequency,
bias, and temperature and are not suitable for
switch-mode DC-DC converter filter applications.
current condition at startup.
Refer to the
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October 11, 2013
Rev D
EP53A7LQI/EP53A7HQI
Layout Recommendation
Figure 12 shows critical components and layer
1 traces of a recommended minimum footprint
EP53A7LQI/EP53A7HQI layout with ENABLE
tied to V . Alternate ENABLE configurations,
IN
and other small signal pins need to be
connected and routed according to specific
customer application. Please see the Gerber
files
on
the
Altera
website
www.altera.com/enpirion for exact dimensions
and other layers. Please refer to Figure 12
while reading the layout recommendations in
this section.
Figure 12:Top PCB Layer Critical Components
and Copper for Minimum Footprint
Recommendation 1: Input and output filter
capacitors should be placed on the same side
of the PCB, and as close to the EP53A7QI
package as possible. They should be
connected to the device with very short and
wide traces. Do not use thermal reliefs or
spokes when connecting the capacitor pads to
the respective nodes. The +V and GND traces
between the capacitors and the EP53A7QI
should be as close to each other as possible
so that the gap between the two nodes is
minimized, even under the capacitors.
Recommendation 4: Multiple small vias
should be used to connect the ground traces
under the device to the system ground plane
on another layer for heat dissipation. The drill
diameter of the vias should be 0.33mm, and
the vias must have at least 1 oz. copper plating
on the inside wall, making the finished hole
size around 0.20-0.26mm. Do not use thermal
reliefs or spokes to connect the vias to the
ground plane. It is preferred to put these vias
under the capacitors along the edge of the
GND copper closest to the +V copper. Please
see Figure 12. These vias connect the
input/output filter capacitors to the GND plane
and help reduce parasitic inductances in the
input and output current loops. If the vias
cannot be placed under CIN and COUT, then put
them just outside the capacitors along the
GND. Do not use thermal reliefs or spokes to
connect these vias to the ground plane.
Recommendation 2: Input and output grounds
are separated until they connect at the PGND
pins. The separation shown on Figure 12
between the input and output GND circuits
helps minimize noise coupling between the
converter input and output switching loops.
Recommendation 3: The system ground
plane should be the first layer immediately
below the surface layer. This ground plane
should be continuous and un-interrupted below
the converter and the input/output capacitors.
Please see the Gerber files on the Altera
website www.altera.com/enpirion.
Recommendation 5: AVIN is the power supply
for the internal small-signal control circuits. It
should be connected to the input voltage at a
quiet point. In Figure 12 this connection is
made with RAVIN at the input capacitor close
to the V connection.
IN
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October 11, 2013
Rev D
EP53A7LQI/EP53A7HQI
Recommended PCB Footprint
Figure 123: EP53A7xQI Package PCB Footprint
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01543
October 11, 2013
Rev D
EP53A7LQI/EP53A7HQI
Package and Mechanical
Figure 14: EP53A7xQI Package Dimensions
Contact Information
Altera Corporation
101 Innovation Drive
San Jose, CA 95134
Phone: 408-544-7000
www.altera.com
© 2013 Altera Corporation—Confidential. All rightsreserved. ALTERA, ARRIA, CYCLONE, ENPIRION, HARDCOPY, MAX,MEGACORE, NIOS,
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countries. All other wordsand logosidentifiedastrademarksor service marks are the property of their respective holdersasdescribed at
www.altera.com/common/legal.html. Altera warrantsperformance of itssemiconductor productsto current specificationsin accordancewith Altera's
standard warranty, but reserves the right to make changesto any productsand servicesat any time without notice. Altera assumesno responsibility or
liability arisingout of the applicationor use of any information, product, or service described herein except asexpressly agreed to in writing by Altera.
Altera customersare advised to obtain thelatest version of device specificationsbefore relying on any publishedinformation andbefore placing orders
for products or services.
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Rev D
相关型号:
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