A3932SEQTR [ALLEGRO]

Brushless DC Motor Controller, BIPolar, PQCC32, PLASTIC, LCC-32;
A3932SEQTR
型号: A3932SEQTR
厂家: ALLEGRO MICROSYSTEMS    ALLEGRO MICROSYSTEMS
描述:

Brushless DC Motor Controller, BIPolar, PQCC32, PLASTIC, LCC-32

控制器
文件: 总12页 (文件大小:365K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
A3932  
Three-Phase Power MOSFET Controller  
Features and Benefits  
Description  
Drives wide range of N-channel MOSFETs  
Synchronous rectification  
The A3932 is a three-phase MOSFET controller for use with  
bipolar brushless DC motors. Its high gate-current drive  
capability allows driving a wide range of N-channel power  
MOSFETs and can support motor supply voltages to 50 V.  
Bootstrapped high-side drive blocks provide the floating  
positivesuppliesforthegatedriveandminimizethecomponent  
countnormallyrequired.Thehigh-sidecircuitryalsoemploysa  
uniqueFETmonitoringcircuitthatensuresthegatevoltagesare  
at the proper levels before turn-on and during the ON cycle.  
Power MOSFET protection  
Adjustable dead time for cross-conduction protection  
100% duty cycle operation  
Selectable fast or slow current-decay modes  
Internal PWM peak current control  
High-current gate drive  
Motor lead short-to-ground protection  
Internal 5 V regulator  
Brake input  
PWM torque-control input  
Fault-diagnostic output  
Tachometer output  
Thermal shutdown  
Undervoltage protection  
Internal fixed off-time PWM current-control circuitry can be  
used to regulate the maximum load current to a desired value.  
The peak load-current limit is set by the user’s selection of  
an input reference voltage and external sensing resistor. The  
fixed off-time pulse duration is set by a user-selected external  
RC timing network. For added flexibility, the PWM input can  
be used to provide speed/torque control, allowing the internal  
current control circuit to set the maximum current limit.  
Optionalsynchronousrectificationisincluded.Thisfeaturewill  
short out the current path through the power MOSFET reverse  
body diodes during the PWM off-cycle current decay.This can  
minimize power dissipation in the power MOSFET, eliminate  
theneedforexternalpowerclampdiodes,andpotentiallyallow  
more economical choices for the MOSFET application.  
Packages  
The A3932 includes the commutation logic for Hall sensors  
configuredfor120degreespacing.PowerMOSFETprotection  
features include bootstrap capacitor charging current monitor,  
undervoltagemonitor,motor-leadshort-to-ground,andthermal  
shutdown.  
38-pin TSSOP (sufx LD)  
The–S–’part-numbersuffixindicatesanoperatingtemperature  
rangeof-20°Cto+85°C.The–LD–’suffixindicatesa38-lead  
TSSOP package. The initial ‘–TR–’ variant suffix indicates  
tape and reel packing. The ‘–T’ final variant suffix indicates  
lead (Pb) free composition, with 100% matte tin leadframe  
plating.  
Not to scale  
26301.101H  
A3932  
Three-Phase Power MOSFET Controller  
Selection Guide  
Part Number  
Packing  
A3932SLDTR-T  
4000 pieces per reel  
Absolute Maximum Ratings  
Characteristic  
Symbol  
VBB  
Notes  
Rating  
Units  
V
Supply Voltage  
50  
15  
Peak Regulator Voltage  
Logic Input Voltage Range  
Sense Voltage Range  
Output Voltage Range  
SA, SB, SC Pins  
VREG  
VIN  
V
–0.3 to VLCAP + 0.3  
–5 to 1.5  
V
VSENSE  
V
V
–5 to 50  
–5 to VBB + 17  
VSx + 17  
V
GHA, GHB, GHC Pins  
CA, CB, CC Pins  
V
V
Operating Ambient Temperature  
Junction Temperature  
Storage Temperature  
TA  
TJ  
Range S  
–20 to 85  
150  
ºC  
ºC  
ºC  
T
stg  
–55 to 150  
2
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
A3932  
Three-Phase Power MOSFET Controller  
Pin-Out Diagram  
38-pin TSSOP (sufx LD)  
RESET  
GLC  
SC  
1
2
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
NC  
NC  
3
PGND  
AGND  
DEAD  
REF  
SENSE  
RC  
NC  
4
NC  
5
GHC  
CC  
6
7
GLB  
SB  
8
9
PWM  
TACH  
SR  
GHB  
CB  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
CONTROL  
LOGIC  
GLA  
SA  
BRAKE  
DIR  
GHA  
CA  
H2  
H3  
VREG  
LCAP  
NC  
NC  
FAULT  
H1  
VBB  
MODE  
FAULT  
3
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
A3932  
Three-Phase Power MOSFET Controller  
Functional Block Diagram  
NOTE — For 12 V applications, VBB is shorted to VREG.  
The VREG absolute maximum rating (15 V) must not be  
exceeded.  
4
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
A3932  
Three-Phase Power MOSFET Controller  
ELECTRICAL CHARACTERISTICS: unless otherwise noted at TA = 25°C; VBB = 18 V to 50 V; CLCAP  
,
Cboot = 0.1 μF; CREG = 10 μF; Cload = 3300 pF; fPWM = 22.5 kHz Square Wave; Two Phases Active.  
Limits  
Parameter  
Symbol  
Conditions  
Min  
Typ  
Max Units  
Supply Current  
Quiescent Current  
Reference Voltage  
Output Voltage  
IBB  
RESET high, coast mode, stopped  
ILCAP = -3 mA  
4.75  
10.8  
12.4  
5.0  
8.0  
5.25  
13.2  
13.6  
mA  
V
VLCAP  
VREG  
VBB = VREG 15 V, IREG = -10 mA  
18 V VBB 50 V, IREG = -10 mA  
V
13  
V
V
BB = 13.2 V to 18 V, IREG = -10 mA  
VBB - 2.5  
25  
V
Output Voltage Regulation  
VREG(IREG) IREG = -1 to -30 mA, coast  
VREG(VBB) IREG = -10 mA, coast  
mV  
mV  
40  
Digital Logic Levels  
Logic Input Voltage  
VIH  
VIL  
All inputs except SR  
SR input only  
All inputs except SR  
SR input only  
VIH = 2 V  
2.0  
3.0  
V
V
0.8  
1.8  
-90  
-130  
V
V
Logic Input Current  
IIH  
IIL  
-30  
-50  
μA  
μA  
VIL = 0.8 V  
Gate Drive  
Low-Side Output Voltage  
High-Side Output Voltage  
Pulldown Switch Resistance  
Pullup Switch Resistance  
VGLxH  
VGHxH  
rDS(on)  
rDS(on)  
trGLx  
tfGLx  
trGHx  
tfGHx  
tpr  
IGLx = 0  
VREG - 0.8 VREG - 0.5  
12.8  
V
IGHx = 0  
10.4  
11.6  
4.0  
14  
V
IGLx = 50 mA  
IGHx = -50 mA  
Low-Side Output  
Switching Time  
10% to 90%, with Cload  
90% to 10%, with Cload  
10% to 90%, with Cload  
90% to 10%, with Cload  
GHx, GLx rising, Cload = 0  
GHx, GLx falling, Cload = 0  
GHx to GLx, VDEAD = 0 V, Cload = 0  
GLx to GHx, IDEAD = 780 μA, Cload = 0  
120  
60  
ns  
ns  
ns  
ns  
ns  
ns  
μs  
ns  
High-Side Output  
Switching Time  
120  
60  
Propagation Delay Time  
(PWM to gate output)  
220  
110  
5.6  
100  
tpf  
Maximum Dead Time  
Minimum Dead Time  
tdead  
tdead  
3.5  
50  
7.6  
150  
Continued —  
NOTES: 1. Typical Data is for design information only.  
2. Negative current is dened as coming out of (sourcing) the specied device terminal.  
5
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
A3932  
Three-Phase Power MOSFET Controller  
ELECTRICAL CHARACTERISTICS: unless otherwise noted at TA = 25°C; VBB = 18 V to 50 V; CLCAP  
,
Cboot = 0.1 μF; CREG = 10 μF; Cload = 3300 pF; fPWM = 22.5 kHz Square Wave; Two Phases Active.  
Limits  
Parameter  
Symbol  
Conditions  
Min  
Typ  
Max Units  
Bootstrap Capacitor  
Bootstrap Charge Current  
Bootstrap Output Voltage  
Bootstrap Resistance  
Current Limit Circuitry  
Input Offset Voltage  
ICx  
VCx  
rCx  
100  
10.4  
mA  
V
VSx = 0, ICx = 0, VREG = 13 V  
ICx = -50 mA  
11.6  
9.0  
12.8  
12  
Ω
Vio  
ISENSE  
IREF  
±5.0  
mV  
μA  
μA  
μs  
mA  
V
0 V VIC 1.5 V  
SENSE Input Current  
REFERENCE Input Current  
Blank Time  
-25  
0
VIC 0 V, VID 1.5 V  
VIC 0 V, VID 1.5 V  
RT = 56 kΩ, CT = 470 pF  
tblank  
IRC  
0.91  
-1.0  
1.1  
3.0  
RC Charge Current  
-0.9  
1.0  
2.7  
-1.1  
1.2  
3.3  
VRCL  
VRCH  
RC Voltage Threshold  
V
Protection Circuitry  
Bootstrap Charge Threshold  
Motor Short-to-Ground Monitor  
ICx  
1.3  
9.2  
8.6  
-9.0  
2.0  
9.7  
9.1  
2.7  
10.2  
9.6  
0.5  
0.5  
mA  
V
VDSH  
VBB - VSX, high side on  
Increasing VREG  
Decreasing VREG  
IO = 1 mA  
V
Undervoltage Threshold  
UVLO  
V
FAULT Output Voltage  
TACH Output Voltage  
VFAULT  
VTACH  
tTACH  
TJ  
V
IO = 1 mA  
V
TACH Output Pulse Width  
Thermal Shutdown Temp.  
IO = 1 mA, CTACH = 50 pF  
0.75  
165  
μs  
°C  
Thermal Shutdown Hyster-  
esis  
TJ  
10  
°C  
Package EQ Four-layer PCB  
Package LD Four-layer PCB  
37  
51  
°C/W  
°C/W  
Thermal Resistance  
RθJA  
NOTES:  
1. Typical Data is for design information only.  
2. Negative current is defined as coming out of (sourcing) the specified device terminal.  
6
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
A3932  
Three-Phase Power MOSFET Controller  
Terminal Descriptions  
RESET — A logic input used to enable the device, internally  
pulled up to VLCAP (+5 V). A RESET = 1 will disable the device  
and force all gate drivers to 0 V, coasting the motor. A RESET  
= 0 allows the gate drive to follow the commutation logic. The  
RESET = 1 overrides BRAKE.  
LD  
Name  
RESET  
GLC  
SC  
1
2
3
4,5,18,  
23,37,38  
6
NC  
GLA/GLB/GLC — Low-side, gate-drive outputs for external  
NMOS drivers. External series-gate resistors (as close as pos-  
sible to the NMOS gate) can be used to control the slew rate  
seen at the power-driver gate, thereby controlling the di/dt and  
dv/dt of the SA/SB/SC outputs. GLx = 1 (or “high”) means that  
the upper half (PMOS) of the driver is turned on and its drain  
will source current to the gate of the low-side FET in the exter-  
nal motor-driving bridge. GLx = 0 (or “low”) means that the  
lower half (NMOS) of the driver is turned on and its drain will  
sink current from the external FET’s gate circuit.  
GHC  
CC  
7
8
GLB  
SB  
9
10  
11  
GHB  
CB  
12  
13  
14  
15  
16  
17  
19  
20  
21  
22  
24  
25  
26  
27  
28  
29  
30  
31  
32  
33  
34  
35  
36  
GLA  
SA  
SA/SB/SC — Directly connected to the motor, these terminals  
sense the voltages switched across the load. These terminals are  
also connected to the negative side of the bootstrap capacitors  
and are the negative supply connections for the oating high-  
side drivers.  
GHA  
CA  
VREG  
LCAP  
FAULT  
MODE  
VBB  
H1  
GHA/GHB/GHC — High-side, gate-drive outputs for external  
NMOS drivers. External series-gate resistors can be used to  
control the slew rate seen at the power-driver gate, thereby con-  
trolling the di/dt and dv/dt of the SA/SB/SC outputs.  
GHx = 1 (or “high”) means that the upper half (PMOS) of the  
driver is turned on and its drain will source current to the gate of  
the high-side FET in the external motor-driving bridge. GHx =  
0 (or “low”) means that the lower half (NMOS) of the driver is  
turned on and its drain will sink current from the external FET’s  
gate circuit.  
H3  
H2  
DIR  
BRAKE  
SR  
TACH  
PWM  
RC  
CA/CB/CC — High-side connections for the bootstrap capaci-  
tors, positive supply for high-side gate drivers. The bootstrap  
capacitors are charged to approximately VREG when the asso-  
ciated output Sx terminal is low. When the output swings high,  
the voltage on this terminal rises with the output to provide the  
boosted gate voltage needed for N-channel power MOSFETs.  
SENSE  
REF  
DEAD  
AGND  
PGND  
continued next page  
7
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
A3932  
Three-Phase Power MOSFET Controller  
Terminal Descriptions (cont’d)  
FAULT — Open-drain output to indicate fault condition; FAULT  
= 1 (external pull-up) for any of the following:  
PWM — Speed control input, internally pulled up to VLCAP  
(+5 V). A PWM = 0 turns off selected drivers. A PWM = 1 will  
turn on selected drivers as determined by H1/H2/H3 input logic.  
Holding PWM = 1 allows speed/torque control solely by the  
internal current-limit circuit with the REF analog voltage. See  
1 – invalid HALL input code,  
2 – undervoltage condition detected at VREG.  
3 – thermal shutdown, or  
also the Input Logic table  
.
RC — An analog input used to set the xed off time with an  
external resistor (RT) and capacitor (CT). The tblank time is con-  
trolled by the value of the external capacitor (see Applications  
Information). See Application Information.  
4 – motor lead (SA/SB/SC) shorted to ground.  
Except for a short-to-ground fault that only turns off the  
high-side drivers, faults will force a coast condition that turns off  
all power MOSFETs. Only the short-to-ground fault is latched  
but is cleared at each commutation. If the motor has stalled  
due to a short-to-ground being detected, toggling the RESET  
terminal or repeating a power-up sequence will clear the fault.  
Typically pulled up to VLCAP (+5 V) with an external 5.1 kΩ  
resistor.  
SENSE — An analog input to the current-limit comparator.  
A voltage representing load current appears on this terminal dur-  
ing on time, when it reaches REF voltage, the comparator trips  
and load current decays for the xed off-time interval. Volt-  
age transients seen at this terminal when the drivers turn on are  
ignored for time tblank  
.
MODE — A logic input to set current-decay method, internally  
pulled up to VLCAP (+5 V). When in slow-decay mode (MODE  
= 1), only the high-side MOSFET is switched off during a  
PWM-off cycle. The fast-decay mode (MODE = 0) switches  
both the high-side and low-side MOSFETs.  
REF — An analog input to the current-limit comparator. Volt-  
age applied here with respect to AGND sets the peak load cur-  
rent.  
Ipeak = VREF/RS.  
VREG — A regulated 13 V output; supply for low-side gate  
drive and bootstrap capacitor charge circuits. It is good practice  
to connect a decoupling capacitor from this terminal to AGND,  
as close to the device terminals as possible. This terminal should  
be shorted to VBB for 12 V applications.  
H1/H2/H3 — Hall-sensor inputs; internally pulled up to VLCAP  
(+5 V). Congured for 120° electrical spacing.  
DIR — A logic input to reverse rotation, see Commutation Truth  
Table. Internally pulled up to VLCAP (+5 V).  
BRAKE — An active-low logic input for a braking function.  
A BRAKE = 0 will turn on the low-side FETs and turn off the  
high-side FETs. This will effectively short-circuit the BEMF in  
the windings and brake the motor. The braking torque applied  
will depend on the speed. Internally pulled up to VLCAP (+5 V).  
RESET = 1 overrides BRAKE and will coast the motor.  
VBB — The A3932 supply voltage. It is good practice to con-  
nect a decoupling capacitor from this terminal to AGND, as  
close to the device terminals as possible.  
LCAP — Connection for 0.1 μF decoupling capacitor for the  
internal 5 V reference. This terminal can source no more than  
3 mA for the DEAD input, TACH and FAULT outputs.  
SR — Synchronous rectication input. An SR = 0 disables this  
feature, forcing current decay through the body diodes of the  
power MOSFETs. An SR = 1 will result in appropriate high-  
and low-side gate outputs to switch in response to a PWM-off  
command. Internally pulled up to VLCAP (+5 V). See also the  
Input Logic table.  
DEAD — An analog input. A resistor between DEAD and  
LCAP is selected to adjust the turn-off to turn-on time. This  
delay is needed to prevent shoot-through in the external power  
MOSFETs. See Applications Information for details on setting  
dead time.  
AGND — The low-level (analog) reference point.  
TACH — An open-drain digital output whose frequency is pro-  
portional to speed of rotation. A pulse appears at every HALL  
transition. Typically pulled up to VLCAP (+5 V) with an external  
5.1 kΩ resistor.  
PGND — The return for all low-side gate drivers. This should  
be connected to the system power ground.  
8
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
A3932  
Three-Phase Power MOSFET Controller  
Commutation Truth Table  
Logic Inputs  
H3  
Driver Outputs  
Motor Terminals  
H1  
H2  
DIR  
GLA  
GLB  
GLC  
GHA  
GHB  
GHC  
SA  
SB  
SC  
1
1
1
0
0
0
1
1
1
0
0
0
0
1
0
0
0
1
1
1
0
0
0
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
1
1
0
0
1
0
0
0
0
1
0
0
0
0
1
1
0
1
1
0
0
0
1
1
0
0
0
0
0
0
0
1
1
0
1
0
0
0
0
1
0
0
1
1
0
0
0
1
1
0
0
0
0
0
0
0
1
1
0
0
0
1
1
0
1
1
0
0
0
0
H
Z
L
Z
H
H
Z
L
L
L
0
1
1
1
0
0
0
1
1
1
0
Z
H
H
Z
H
H
Z
L
L
Z
H
L
L
Z
L
Z
H
H
Z
L
L
Z
H
H
L
Z
Input Logic  
MODE  
PWM  
SR  
RESET  
Operation  
0
0
1
1
0
0
1
1
X
0
1
0
1
0
1
0
1
X
0
0
0
0
1
1
1
1
X
0
0
0
0
0
0
0
0
1
PWM chop mode, fast decay, all drivers off  
Peak current limit, selected drivers on  
PWM chop mode. slow decay, selected low side drivers on  
Peak current limit, selected drivers on  
PWM chop mode, fast decay with opposite of selected drivers on  
Peak current limit, selected drivers on  
PWM chop, slow decay with both low-side drivers on  
Peak current limit, selected drivers on  
All gate drive outputs off, clear fault logic, coast  
L = Low (less positive) level  
H = High (more positive) level  
X = Don’t care  
Z = High impedance  
1 = Active or true logic condition  
0 = Inactive or false logic condition  
9
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
A3932  
Three-Phase Power MOSFET Controller  
Applications Information  
Additionally, a 0.1 μF (or larger) decoupling capacitor  
should be connected between LCAP and AGND as close to the  
Synchronous Rectication. To reduce power dissipation  
in the external MOSFETs, the A3932 control logic turns on the  
appropriate low-side and high-side driver during the load-current  
recirculation, PWM-off cycle. Synchronous rectication allows  
current to ow through the MODE-selected MOSFET, rather  
than the body diode, during the decay time. The body diodes of  
the SR power MOSFETs will conduct only during the dead time  
required at each PWM transition.  
device terminals as possible.  
Protection Circuitry. The A3932 has several protection  
features:  
1) Bootstrap Circuit. The bootstrap capacitor is charged  
whenever a low-side MOSFET is on, Sx output goes low,  
and the load current recirculates. This happens constantly  
during normal operation. The high-side MOSFET will not be  
allowed to turn on before the charging has decayed to less than  
approximately 9 mA. No fault will be registered.  
Dead Time. It is required to have a dead-time delay between a  
high- or low-side turn off and the next turn-on event to prevent  
cross conduction. The potential for cross conduction occurs with  
synchronous rectication, direction changes, PWM, or after a  
bootstrap capacitor charging cycle. The dead time is set by a  
resistor (Rdead) between the DEAD terminal and LCAP  
(+5 V) and can be set between 100 ns and 5.5 μs.  
When a phase’s high-side driver is on for a long time (100%  
duty cycle operation) its charge pump is designed to maintain  
VGS > 9 V on the bridge FET if IGHx (the load on the gate driver)  
< 10 μA.  
The following equations are valid for Rdead between 5.6 kΩ  
and 470 kΩ. At 25°C,  
2) Hall Invalid. Illegal codes for the HALL inputs (000 or  
111) will force a fault and coast the motor. Noisy Hall lines  
may cause double TACH pulses and, therefore, code errors that  
produce faults. Additional external pullup loading and ltering  
may be required depending on the system.  
tdead (nom, ns) = 37 + (11.9 x 10-3 x (Rdead + 500))  
For predicting worst case, over voltage and temperature  
extremes,  
tdead (min, ns) = 10 + (6.55 x 10-3 x (Rdead + 350))  
tdead (max, ns) = 63 + (17.2 x 10-3 x (Rdead + 650))  
For comparison with IDEAD test currents,  
3) VREG Undervoltage. An internal regulator supplies the  
low-side gate driver and the bootstrap charge current. It is critical  
to ensure that VREG is at the proper level before enabling any of the  
outputs. The undervoltage circuit is active during power-up and  
will force a motor coast condition (all gate drives, GHx and GLx =  
0) until VREG is greater than approximately 9.7 V.  
IDEAD = (VLCAP – Vbe)/(Rdead + Rint)  
where (nominal values) VLCAP = 5 V, Vbe = 0.7 V at 25°C, and  
Rint = 500 Ω.  
Rather than use Rdead values near 470 kΩ, set DEAD =  
4) Thermal Shutdown. A junction temperature greater than  
165°C will signal a fault and coast the motor (all gate drives  
LOW). If the junction temperature then falls to less than 155°C  
(hysteresis), the fault will be cleared.  
ground (VDEAD = 0 V), which activates an internal (IDEAD  
=
10 μA) current source.  
The choice of power MOSFET and external series gate  
resistance determines the selection of the dead-time resistor. The  
dead time should be made long enough to cover the variation of  
the MOSFET gate capacitance and series gate resistance (both  
external and internal to the A3932) tolerances.  
5) Motor Lead Shorted to Ground. The A3932 will signal  
a fault if a motor lead is shorted to ground. A short to ground  
is assumed after a high side is turned on and greater than 2 V is  
measured between the drain (VBB) and source (SA/SB/SC) of the  
high-side power MOSFET. This fault is cleared at the beginning  
of each commutation. If a stalled motor results from a fault, the  
fault can only be cleared by toggling the RESET terminal or by a  
power-up sequence.  
Decoupling. The internal reference, VREG, supplies current  
for the gate-drive circuit. As the gates are driven high they  
will require current from an external capacitor to support the  
transients. This capacitor should be placed as close as possible  
to the VREG terminal. Its value should be at least 20 times larger  
than the bootstrap capacitor.  
continued next page  
10  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
A3932  
Three-Phase Power MOSFET Controller  
Applications Information (cont’d)  
Because the load current does not ow through the sense  
resistor during a dynamic brake, care must be taken to ensure  
that the power MOSFET’s maximum ratings are not exceeded.  
Current Control. Internal xed off-time PWM circuitry is  
implemented to limit load current to a desired value. When a  
high-side and low-side MOSFET are turned on, current will  
increase in the motor winding until it reaches a value given by  
RESET = 1 overrides BRAKE and turns all motor bridge  
FETs off, coasting the motor.  
ITRIP VREF/RS.  
At the trip point, the sense comparator resets the source-  
enable latch, turning off the high-side driver. Load inductance  
causes the current to recirculate (decay) for the xed off time.  
The current path during recirculation is determined by the  
conguration of the MODE and SR inputs.  
Low-Voltage Operation. Although VREG can be connected  
to VBB for 12 V systems, the VREG maximum rating of 15 V  
must be observed including transients. If transients cannot be  
adequately controlled, use VREG in the regulator mode (not  
connected to VBB). With VBB less than 18 V, the VREG output  
voltage level specication may not be met. Note that in this  
mode the VREG undervoltage threshold may leave the system  
with little headroom if VBB is less than 12 V.  
An external resistor (RT) and capacitor (CT), connected  
in parallel from the RC terminal to AGND, are used to set the  
xed off-time period (toff = RT x CT). RT should be in the range  
of 10 kΩ to 500 kΩ. The toff should be in the range of 10 μs to  
50 μs. Larger values for toff can result in audible noise problems.  
Driving an H Bridge. The A3932 may be used to drive an  
H bridge (e.g., a brush dc motor load) by hard wiring one state  
for the Hall inputs (e.g., H1 = H2 = 1 (HIGH), H3 = 0 (LOW)).  
Leave the appropriate phase driver outputs oating (in this case  
CC, GHC, SC, and GLC because, from the Commutation Truth  
Table, SC = Z). The DIR input controls the motor rotation while  
the PWM, MODE, and SR inputs control the motor current  
behavior as described in the Input Logic table.  
Torque control can be implemented by varying the REF  
input voltage as long as the PWM input stays high. If direct  
control of the torque/current is desired by PWM input, a voltage  
can be applied to the REF input to set an absolute maximum  
current limit.  
PWM Blank. The capacitor (CT) also serves as the means to  
set the blank time duration. At the end of the PWM off cycle, a  
high-side gate selected by the commutation logic will turn on.  
At this time, large current transients can occur during the reverse  
recovery time (trr) of the intrinsic body diodes of the external  
power MOSFETs. To prevent false tripping of the current-sense  
comparator, the blank function disables the comparator for a  
time  
Layout. Careful consideration must be given to PCB layout  
when designing high-frequency, fast-switching, high-current  
circuits.  
1) The analog ground (AGND), the power ground (PGND),  
and the high-current return of the external MOSFETs (the  
negative side of the sense resistor) should return separately to the  
negative side of the motor supply ltering capacitor. This will  
minimize the effect of switching noise on the device logic and  
analog reference.  
tblank = 1.9 x CT/(0.001 - [2/RT])  
The user must ensure that CT is large enough to cover the  
current-spike duration.  
2) Minimize stray inductances by using short, wide copper  
runs at the drain and source terminals of all power MOSFETs.  
This includes motor lead connections, the input power buss,  
and the common source of the low-side power MOSFETs. This  
will minimize voltages induced by fast switching of large load  
currents.  
Braking. The A3932 will dynamically brake by forcing all  
low-side MOSFETs on and all high-side MOSFETs off. This  
will effectively short-circuit the BEMF and brake the motor.  
During braking, the load current can be approximated by:  
IBRAKE = VBEMF/RL  
3) Kelvin connect the SENSE terminal PC trace to the positive  
side of the sense resistor.  
11  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  
A3932  
Three-Phase Power MOSFET Controller  
Package LD, 38-Pin TSSOP  
1.60  
9.70  
0.50  
4º  
38  
0.30  
38  
0.15  
4.40 6.40  
6.00  
A
1
2
1
2
0.25  
B
PCB Layout Reference View  
SEATING PLANE  
GAUGE PLANE  
38X  
C
SEATING  
PLANE  
0.10  
C
All dimensions nominal, not for tooling use  
(reference JEDEC MO-153 BD-1)  
Dimensions in millimeters  
0.50  
0.22  
1.20 MAX  
0.10  
A
B
Terminal #1 mark area  
Reference pad layout (reference IPC SOP50P640X110-38M)  
All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary  
to meet application process requirements and PCB layout tolerances  
Copyright ©2002-2008, Allegro MicroSystems, Inc.  
The products described here are manufactured under one or more U.S. patents or U.S. patents pending.  
Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be required to per-  
mit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that the  
information being relied upon is current.  
Allegro’s products are not to be used in life support devices or systems, if a failure of an Allegro product can reasonably be expected to cause the  
failure of that life support device or system, or to affect the safety or effectiveness of that device or system.  
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use;  
nor for any infringement of patents or other rights of third parties which may result from its use.  
For the latest version of this document, visit our website:  
www.allegromicro.com  
12  
Allegro MicroSystems, Inc.  
115 Northeast Cutoff  
Worcester, Massachusetts 01615-0036 U.S.A.  
1.508.853.5000; www.allegromicro.com  

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