MSA-0520 [AGILENT]

Cascadable Silicon Bipolar MMIC Amplifier; 级联硅双极MMIC放大器
MSA-0520
型号: MSA-0520
厂家: AGILENT TECHNOLOGIES, LTD.    AGILENT TECHNOLOGIES, LTD.
描述:

Cascadable Silicon Bipolar MMIC Amplifier
级联硅双极MMIC放大器

射频和微波 射频放大器 微波放大器
文件: 总4页 (文件大小:51K)
中文:  中文翻译
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Cascadable Silicon Bipolar  
MMIC Amplifier  
Technical Data  
MSA-0520  
BeO disk package for good  
Features  
200 mil BeO Package  
thermal characteristics. This  
MMIC is designed for use as a  
general purpose 50 gain block.  
Typical applications include  
narrow and broad band IF and RF  
amplifiers in industrial and  
military applications.  
• Cascadable 50 Gain Block  
• High Output Power:  
+23 dBm Typical P1 dB at  
1.0 GHz  
• LowDistortion:  
33dBmTypicalIP3 at1.0 GHz  
• 8.5 dB Typical Gain at  
1.0 GHz  
The MSA-series is fabricated using  
HP’s10GHzf ,25 GHzf  
,
T
MAX  
• Hermetic Metal/Beryllia  
Microstrip Package  
silicon bipolar MMIC process  
which uses nitride self-alignment,  
ion implantation, and gold metalli-  
zation to achieve excellent  
performance, uniformity and  
reliability. The use of an external  
bias resistor for temperature and  
current stability also allows bias  
flexibility.  
Description  
The MSA-0520 is a high perfor-  
mance silicon bipolar Monolithic  
Microwave Integrated Circuit  
(MMIC) housed in a hermetic,  
Typical Biasing Configuration  
R
bias  
VCC > 15 V  
RFC (Optional)  
4
C
C
block  
block  
3
IN  
MSA  
OUT  
1
V
= 12 V  
d
2
5965-9582E  
6-358  
MSA-0520 Absolute Maximum Ratings  
Thermal Resistance[2,4]  
:
Parameter  
AbsoluteMaximum[1]  
θjc =25°C/W  
Device Current  
Power Dissipation[2,3]  
RF Input Power  
Junction Temperature  
Storage Temperature  
Notes:  
225mA  
3.0W  
+25dBm  
200°C  
–65to200°C  
1. Permanent damage may occur if any of these limits are exceeded.  
2. TCASE =25°C.  
3. Derate at 40 mW/°C for TC > 125°C.  
4. The small spot size of this technique results in a higher, though more  
accurate determination of θjc than do alternate methods. See MEASURE-  
MENTS section “Thermal Resistance” for more information.  
Electrical Specifications[1], TA = 25°C  
Symbol  
Parameters and Test Conditions: Id = 165 mA, ZO = 50  
Units Min. Typ. Max.  
P1 dB  
GP  
Output Power at 1 dB Gain Compression  
PowerGain(|S21|2)  
Gain Flatness  
f=1.0GHz  
dBm  
dB  
21.0  
7.5  
23.0  
8.5  
f=0.1GHz  
9.5  
GP  
f3 dB  
f=0.1to2.0GHz  
dB  
± 0.75  
2.8  
3 dB Bandwidth[2]  
GHz  
Input VSWR  
f=0.1to2.0GHz  
f=0.1to2.0GHz  
f=1.0GHz  
2.0:1  
2.5:1  
33.0  
6.5  
VSWR  
Output VSWR  
IP3  
Third Order Intercept Point  
50 Noise Figure  
dBm  
dB  
NF50  
tD  
f=1.0GHz  
Group Delay  
f=1.0GHz  
psec  
V
170  
Vd  
Device Voltage  
10.5  
12.0  
–16.0  
13.5  
dV/dT  
Device Voltage Temperature Coefficient  
mV/°C  
Notes:  
1. The recommended operating current range for this device is 80 to 200 mA. Typical performance as a function of current  
is on the following page.  
2. Referenced from 0.1 GHz Gain (GP).  
6-359  
MSA-0520 Typical Scattering Parameters (TA = 25°C, Id = 165 mA)  
S11  
S21  
S12  
S22  
Freq.  
MHz  
Mag  
Ang  
dB  
Mag  
Ang  
dB  
Mag  
Ang  
Mag  
Ang  
k
5
25  
.57  
.25  
.15  
.11  
.10  
.10  
.11  
.13  
.15  
.22  
.30  
.37  
.41  
.45  
.46  
–38  
–90  
14.4  
10.7  
9.5  
8.9  
8.8  
8.7  
8.6  
8.5  
8.4  
8.0  
7.4  
6.7  
5.6  
4.5  
3.3  
5.25 165  
3.42 160  
2.97 163  
2.80 166  
2.75 163  
2.72 152  
2.70 140  
2.67 128  
2.64 115  
–19.4  
–14.9  
–14.4  
–14.2  
–14.1  
–14.1  
–14.0  
–14.1  
–14.1  
–13.7  
–13.3  
–12.9  
–12.7  
–12.1  
–11.7  
.107  
.180  
.190  
.195  
.197  
.198  
.199  
.199  
.198  
.206 –12  
.216 –16  
.227 –18  
.232 –23  
.249 –31  
.259 –39  
38  
17  
9
.67  
.29  
.18  
.11  
.10  
.14  
.18  
.22  
.27  
.34  
.43  
.48  
.51  
.55  
.56  
–35  
–81  
–97  
0.57  
0.93  
1.10  
1.16  
1.17  
1.16  
1.14  
1.12  
1.09  
0.98  
0.85  
0.75  
0.70  
0.63  
0.66  
50  
–111  
–138  
–152  
–152  
–147  
–142  
–140  
–142  
–156  
–170  
170  
100  
3
–113  
–125  
–123  
–123  
–127  
–131  
–143  
–158  
–166  
–177  
173  
200  
1
400  
–2  
–4  
–6  
–8  
600  
800  
1000  
1500  
2000  
2500  
3000  
3500  
4000  
2.52  
2.36  
2.16  
1.91  
85  
55  
33  
8
149  
124  
1.68 –16  
1.45 –40  
162  
A model for this device is available in the DEVICE MODELS section.  
Typical Performance, TA = 25°C  
(unless otherwise noted)  
10  
200  
150  
100  
50  
36  
32  
T
T
T
= +100°C  
= +25°C  
= –50°C  
C
C
C
8
IP  
3
0.1 GHz  
0.5 GHz  
28  
24  
6
1.0 GHz  
1.5 GHz  
4
2.0 GHz  
P
1 dB  
2
20  
16  
0
0
0
3
6
9
12  
15  
14 16 18 20 22  
24 26 28 30  
80  
120  
160  
200  
V
(V)  
I
(mA)  
POWER OUT (dBm)  
d
d
Figure 1. Typical Gain vs. Power Out,  
A = 25°C, Id = 165 mA.  
Figure 3. Output Power at 1 dB Gain  
Compression, Third Order Intercept  
vs. Current, f = 1.0 GHz.  
Figure 2. Device Current vs. Voltage.  
T
28  
26  
24  
22  
20  
10  
8
4
3
0.5 GHz  
1.0 GHz  
Output  
6
2
4
Input  
1
I
I
I
= 200 mA  
= 165 mA  
= 80 mA  
d
d
d
2
0
18  
16  
2.0 GHz  
-50  
+25  
+100  
4.0  
4.0  
0.1  
0.2 0.3 0.5  
1.0  
2.0  
0.1  
0.2 0.3 0.5  
1.0  
2.0  
CASE TEMPERATURE (°C)  
FREQUENCY (GHz)  
FREQUENCY, (GHz)  
Figure 5. Gain vs. Frequency.  
Figure 6. VSWR vs. Frequency,  
Id = 165 mA.  
Figure 4. Output Power @ 1 dB Gain  
Compression vs. Temperature,  
Id = 165 mA.  
6-360  
200 mil BeO Package Dimensions  
4
GROUND  
.300 ± .025  
7.62 ± .64  
.030  
.76  
45°  
3
1
RF INPUT  
NO REFERENCE  
GROUND  
RF OUTPUT  
AND BIAS  
Notes:  
(unless otherwise specified)  
1. Dimensions are  
in  
mm  
2
2. Tolerances  
in .xxx = ± 0.005  
mm .xx = ± 0.13  
.060  
1.52  
3. Base of package is  
electrically isolated.  
.048 ± .010  
1.21 ± .25  
.004 ± .002  
.10 ± .05  
.128  
3.25  
.205  
5.21  
.023  
.57  
6-361  

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