HSDL-3210-011G [AGILENT]
Interface Circuit, BICMOS, ULTRA SMALL, SMT-8;
| 型号： | HSDL-3210-011G |
| 厂家： | 
AGILENT TECHNOLOGIES, LTD. |
| 描述： | Interface Circuit, BICMOS, ULTRA SMALL, SMT-8 信息通信管理 接口集成电路 |
| 文件： | 总12页 (文件大小：473K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
1
IrDA Data 1.3 Low Power
Compliant 1.15Mbps Infrared
Transceiver
PRELIMINARY
Preliminary Product Data Sheet
Revison: 1.0 (22 Feb. 02)
HSDL-3210
Features
· Ult ra Small Surface Mount
Package
· Low Shutdown Current –
10 nA t ypical
· Complete Shutdown
– TxD, RxD, PIN Diode
· Three opt ional ext ernal
component s
· Temperature performance
guarant eed, -25°C to 85°C
· Int egrat ed EMI Shield
· IEC60825-1 Class 1 Eye
Safe
· Edge Det ect ion Input
– Prevents the LED from
long t urn on t ime
· Minimal Height : 2.5 mm
· Vcc from 2.7 to 3.6 volts
· Int erface t o 1.8 volt s
input /out put logic circuit s
· Wit hst ands 100 mVp-p
power supply ripple
t ypically
· LED supply volt age can
range from 2.7 to 5.5 volts
· Adjust able Opt ical Power
for link distance from 5 to
20 cm
ONE
CELL
PHONES
C
PAGERS
PDA
S
LLUMINATION
CAMERAS
30° I
C
ELL PHONES
PAGERS
P
PC
PDA
RINTERS
£
£
20 CM TO
30 CM TO
L
S
OW
P
OWER
D
EVICES
S
TANDARD
DEVICES
S
C
AMERAS
Preliminary Product Disclaimer
These products are under development. Until Agilent Technologies releases these products for general sales, Agilent
reserves the right at any time to alter prices, specifications, features, capabilities, functions, manufacturing release dates,
and even general availability of the product. It is advisable to consult your local Agilent field sales engineer when
considering these products for design-ins and production volumes.
2
Applications
Application Circuit
· Mobile Telecom
– Cellular Phones
– Pagers
– Smart Phones
· Dat a Communicat ion
– PDAs
– Portable Printers
· Digit al Imaging
– Digit al Cameras
– Phot o-Imaging Print ers
VLED
TXD/
8
Adjustable
Optical
Power
C1
1.0 mF
7
6
5
SWDAT
RXD/
SRDAT
SD
Serial Transceiver
Control
4
SCLK
Vcc
3
I/O Vcc
2
C2
6.8
m
F
C3
0.47
m
F
GND1
Description
Pinout, Rear View
The HSDL-3210 is one of a new
generation of low-cost Infrared
(IR) transceiver modules from
Agilent Technologies. It
features one of the smallest
footprint in the industry at 2.5
H x 8.0 W x 3.0 D mm.
Although the supply voltage
can range from 2.7V to 5.5V,
the LED is driven by an
internal constant current source
of 80mA.
8
7
6
5
4
3
2
1
I/O Pins Configuration Table
Pin Symbol Description Not es
1
2
GND
Ground
Connect to system ground.
Input/Output Connect to ASIC logic controller Vcc
IOVcc
Vcc
voltage.
Supply
Voltage
3
4
5
VCC
SCLK
SD
Regulated, 2.7 to 3.6 Volts
Use as clock input pin for programming
mode. See Table 1 for details.
This pin must be driven either high or low,
The HSDL-3210 incorporates
the capability for adjustable
optical power. The optical
power can be adjusted lower
when the nominal desired link
distance is very short . At 5cm
link distance, only 6% of the
full power is required.
Serial Clock
Shut Down
Active High do NOT float the pin
Output is a low pulse when a light pulse is
received. SRDAT is the read data for the
Serial Transceiver Control (STC). Do NOT
float this pin.
Logic High turns on the LED. If held high
longer than ~ 20 ms, the LED is turned off.
SWDAT is the write data for the Serial
Transceiver Control (STC). Do NOT float this
pin.
Receiver
Data Output.
Active Low
RXD/
SRDAT
6
7
Transmitter
Data Input /
Serial Write
Data
TXD/
SWDAT
The HSDL-3210 supports the
Serial Interface for Transceiver
Control Specification that
provides a common interface
between the transceiver and
controller. It is also designed
to interface to input/output
logic circuits as low as 1.8V.
LED Supply
Voltage
8
-
VLED
May be unregulated, 2.7 to 5.5 volts.
Connect to system ground via a low
inductance trace. For best performance, do
not connect to GND directly at the part.
SHIELD
EMI Shield
Preliminary Product Disclaimer
These products are under development. Until Agilent Technologies releases these products for general sales, Agilent
reserves the right at any time to alter prices, specifications, features, capabilities, functions, manufacturing release dates,
and even general availability of the product. It is advisable to consult your local Agilent field sales engineer when
considering these products for design-ins and production volumes.
3
The STC requires three
signals : a serial clock
(SCLK) that is used for
timing, and two
unidirectional lines
multiplexed with the
transmitter (write)
TXD/SWDAT and receiver
(read) RXD/SRDAT infrared
signal lines.
disable/enable the RXD line
and 4-level optical power
adjustment.
Serial Interface for
Transceiver Control
The Serial Interface for
Transceiver Control (STC)
is used to control and
program the features of the
transceiver. These features
include input/output (I/O)
control, optical power
A set of commands is
provided to handle the
programming control
features. The general
command format is shown
in Figure 1. The HSDL-3210
STC Write Data Commands
are shown in Table 1.
adjustment and shut down.
The HSDL-3210 supports the
write function to
disable/enable the TXD line,
Address [2-0]]
Index [3-0]
C
Data
Figure 1 General Command Format
Table 1. Serial Interface for Transceiver Control – Write Data Format
Address [2-0]
Index [3-0]
C
Data
IrDA Dat a –dat a rat es
SIR (2.4 to 115.2 Kbps)
MIR (0.576, 1.152 Mbps)
I/O Control
000
000
0001
0001
1
00000000
1
00000001
SD Normal Mode
SD Sleep Mode
000
000
000
000
000
000
0000
0000
0000
0000
0000
0000
1
1
1
1
1
1
XXXXXXX1
XXXXXXX0
XXXXXX0X
XXXXXX1X
XXXXX0XX
XXXXX1XX
RXD disable
RXD enable
TXD disable
TXD enable
Opt ical Power Adjust ment
10% link distance
25% link distance
50% link distance
100% link distance
000
000
000
000
0010
0010
0010
0010
1
1
1
1
00XXXXXX
01XXXXXX
10XXXXXX
11XXXXXX
Preliminary Product Disclaimer
These products are under development. Until Agilent Technologies releases these products for general sales, Agilent
reserves the right at any time to alter prices, specifications, features, capabilities, functions, manufacturing release dates,
and even general availability of the product. It is advisable to consult your local Agilent field sales engineer when
considering these products for design-ins and production volumes.
4
Table 2 Serial Interface for Transceiver Control – Read Data Format
Address [2-0]
Index [3-0]
C
Data
IrDA Dat a –dat a rat es
SIR (2.4 to 115.2 Kbps)
MIR (0.576, 1.152 Mbps)
I/O Control
000
000
0001
0001
0
00000000
0
00000001
SD Normal Mode
SD Sleep Mode
RXD disable
000
000
000
000
000
000
0000
0000
0000
0000
0000
0000
0
0
0
0
0
0
XXXXXXX0
XXXXXXX1
XXXXXX0X
XXXXXX1X
XXXXX0XX
XXXXX1XX
RXD enable
TXD disable
TXD enable
Opt ical Power Adjust ment
10% link distance
25% link distance
50% link distance
100% link distance
ID
000
000
000
000
0010
0010
0010
0010
0
0
0
0
00XXXXXX
01XXXXXX
10XXXXXX
11XXXXXX
Manufacturer
000
000
1111
1111
0
0
00000001
01000001
Product
Recommended Application Circuit Components
Component
Recommended Value
Not es
C1
C2
C3
1
1
1
1.0 mF, ± 20%, Tantalum
6.8 mF, ± 20%, Tantalum
0.47 mF, ± 20%, Tantalum
Order Information
Part Number
Packaging Type
Tape and Reel
Tape and Reel
Tape Strip
Package
Quant it y
2500
500
10
HSDL-3210-021
HSDL-3210-001
HSDL-3210-011
Front View
Front View
Front View
Preliminary Product Disclaimer
These products are under development. Until Agilent Technologiesreleases these products for general sales, Agilent
reserves the right at any time to alter prices, specifications, features, capabilities, functions, manufacturing release dates,
and even general availability of the product. It is advisable to consult your local agilent field sales engineer when
considering these products for design-ins and production volumes.
5
Transceiver I/O Truth Table
STC SD Mode
SCLK
SD
Low
High
TXD
LED
Receiver
Don’t care
IrDA Signal
No Signal
Don’t care
Don’t care
RXD
Not Valid
Low
Notes
2,3
High
On
Normal Mode
4,5
Low
Low
Off
High
Sleep Mode
Don’t care
Don’t care
Don’t care
Off
Off
High
6
6
Don’t care
High
Caution: The BiCMOS inherent to this design of this component increases the component’s
susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static
precautions be taken in handling and assembly of this component to prevent damage and/or
degradation which may be induced by ESD.
Preliminary Product Disclaimer
These products are under development. Until Agilent Technologiesreleases these products for general sales, Agilent
reserves the right at any time to alter prices, specifications, features, capabilities, functions, manufacturing release dates,
and even general availability of the product. It is advisable to consult your local agilent field sales engineer when
considering these products for design-ins and production volumes.
6
Absolute Maximum Ratings
For implementations where case to ambient thermal resistance is £50°C/W.
Paramet er
Symbol Min.
Max.
Unit s
Storage Temperature
Operating Temperature
LED Supply Voltage
Supply Voltage
Input/Output Voltage
Input voltage: TXD,
MIR_SEL
Output Voltage: RXD
Solder Reflow
Temperature Profile
TS
TA
VLED
VCC
-40
-25
0
0
0
100
85
6.5
6.5
Vcc
°C
°C
V
V
V
IOVcc
V
I
0
VCC+ 0.5
VCC+ 0.5
V
V
VO
-0.5
See Reflow Profile, page 11
Recommended Operating Conditions
Paramet er
Operating Temperature
Supply Voltage
Input/Output Voltage
LED Supply Voltage
Symbol
Min.
Max.
85
Unit s
Condit ions
Not es
°
TA
-25
C
VCC
IOVcc
VLED
2.7
1.8
2.7
3.6
Vcc
5.5
V
V
V
Logic Input
Voltage for
TXD,SCLK
,SD
Logic
High
V
2/3 IOVCC
0
IOVCC
1/3 IOVCC
500
V
1.8V £IOVcc £ 3.6V
1.8V £IOVcc £ 3.6V
IH
Logic Low
V
IL
V
For in-band signals £
115.2kb/s
0.009
0.0225
mW/cm2
mW/cm2
7
7
Logic
High
EIH
EIL
Receiver Input
Irradiance
500
0.576 Mb/s £ in-band
signals £ 1.15Mb/s
Logic Low
0.3
mW/cm2 For in-band signals.
Receiver Data Rate
Ambient Light
0.0024
1.152
Mb/s
See Test Methods on page 12 for details
Preliminary Product Disclaimer
These products are under development. Until Agilent Technologiesreleases these products for general sales, Agilent
reserves the right at any time to alter prices, specifications, features, capabilities, functions, manufacturing release dates,
and even general availability of the product. It is advisable to consult your local agilent field sales engineer when
considering these products for design-ins and production volumes.
7
Electrical & Optical Specifications
Specifications hold over the recommended operating conditions unless otherwise noted. Unspecified test
conditions may be anywhere in their operating range. All typical values are at 25°C and 3.0 V unless
otherwise noted.
Paramet er
Receiver
Symbol
Min
Typ
Max
Unit s
Condit ions
Not es
Viewing Angle
Peak Sensitivity
Wavelength
2f
30
°
½
l p
880
nm
Logic High
VOH
VOL
IOV -0.2
IOV
V
V
IOH=-200 mA, EI £ 0.3 mW/cm2
IOL=200 mA
RXD Output
Voltage
CC
CC
Logic Low
0
1
0.4
7.5
8
8,9
9
RXD Pulse Width (SIR)] tPW (SIR)
ms CL =10 pF
RXD Pulse Width (MIR) tPW(MIR)
200
750
ns CL =10 pF
RXD Rise and Fall
Times
tR, tF
25
100
ns CL =10 pF
t
Receiver Latency Time
25
30
50
ms
ms
10
11
L
t
Receiver Wake Up Time
100
RW
Transmit t er
°
°,
Radiant Intensity
IEH
2q
9
18
72
60
mW/Sr
TA=25 C, q £ 15 TXD ³ V
½
IH
Viewing Angle
30
°
½
Peak Wavelength
Spectral Line Half Width
l p
Dl
875
35
nm
nm
½
High
Low
V
2/3 IOVCC
0
IOVcc
V
V
TXD Logic
Levels
IH
V
IL
1/3 IOVcc
TXD Input
Current
I
High
10
200
nA V ³ V
I IH
H
I
Low
-10
-200
nA 0 £ V £ V
I IL
L
On
Off
Shutdown
IVLED
IVLED
IVLED
120
4
50
180
25
200
mA VVLED=VCC=3.6 V, V (TXD) ³ V
I
IH
LED
Current
mA VVLED=VCC=3.6 V, V (TXD) £ V
I
IL
nA V (SD) ³ V
I IH
Transceiver
SD / SCLK
Logic
Levels
High
Low
V
2/3 IOVCC
0
IOV
V
V
IH
CC
V
IL
1/3 IOVCC
I
High
Low
10
10
200
200
nA V ³ V
I
IH
SCLK Input
Current
H
I
nA 0 £ V £ V
I
IL
L
VCC=3.6 V, V ³ VCC - 0.5,
TA=25 °C
SD
Shutdown
Idle
Active,
receive
Active ,
transmit
ICC1
10
200
nA
ICC2
ICC3
300
0.8
350
3.0
mA VCC=3.6 V, V (TXD) £ V ,EI=0
I IL
Supply
Current
mA VCC=3.6 V, V (TXD) £ V
12,13
14
I
IL
ICC4
5.0
mA VCC=3.6 V, V (TXD) ³ V
I
IH
Preliminary Product Disclaimer
These products are under development. Until Agilent Technologies releases these products for general sales, Agilent
reserves the right at any time to alter prices, specifications, features, capabilities, functions, manufacturing release dates,
and even general availability of the product. It is advisable to consult your local Agilent field sales engineer when
considering these products for design-ins and production volumes.
8
Notes:
1. C1, which is optional, must be placed within 0.7 cm of the HSDL-3210 to obtain optimum noise immunity.
2. If TXD is stuck in the high state, the LED will turn off after about 14 ms.
3. RXD will echo the TXD signalwhile TXD is transmitting data.
4. In-Band IrDA signals and data rates£ 1.152Mbps.
5. RXD Logic Low is pulsed response.
6. RXD Logic High during shutdown is a weak pull up (equivalent to an approximately 300kW resistor).
7. An in-band optical signal is a pulse/sequence where the peak wavelength, l p, is defined as 850 nm £ l p £ 900
nm, and the pulse characteristics are compliant with the IrDA Serial Infrared Physical Layer Link Specification.
8. For in band signals £1.152 Mbps where 9 mW/cm2 £ EI £ 500 mW/cm .
2
2
9. For 0.576Mbps £ in band signals £1.152Mbps where 22.5 mW/cm2 £ EI £ 500 mW/cm .
10. Latency is defined as the time from the last TXD light output pulse until the receiver has recovered full sensitivity.
11. Receiver wake up time is measured from the SD pin high to low transition or Vcc power on, to valid RXD output.
2
12. Typical values are at EI = 10mW/cm .
2
13. Maximum value is at EI = 500mW/cm .
14. Current is due to internal stages of the LED current mirror. This current is in addition to the ILED current.
Preliminary Product Disclaimer
These products are under development. Until Agilent Technologies releases these products for general sales, Agilent
reserves the right at any time to alter prices, specifications, features, capabilities, functions, manufacturing release dates,
and even general availability of the product. It is advisable to consult your local Agilent field sales engineer when
considering these products for design-ins and production volumes.
9
RXD Output Waveform
Receiver Wakeup Time Definition
VOH
tpw
90%
50%
10%
SD
VOL
RX
Light
tf
tr
RXD
LED Optical Waveform
tRW
tpw
LED ON
90%
Transmitter Wakeup Time Definition
50%
10%
LED OFF
SD
tr
tf
TXD
TXD “Stuck ON” Protection
TX
Light
TXD
tTW
LED
tpw (MAX)
Preliminary Product Disclaimer
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reserves the right at any time to alter prices, specifications, features, capabilities, functions, manufacturing release dates,
and even general availability of the product. It is advisable to consult your local Agilent field sales engineer when
considering these products for design-ins and production volumes.
10
Package Dimensions
Mounting
Center
4.0
1.025
C
L
2.05
Receiver
Emitter
2.2
2.5
1.175
0.35
0.65
0.80
1.05
1.25
2.55
2.85
4.0
8.0
3.0
2.9
1.85
C
L
Unit: mm
Tolerance: ± 0.2 mm
Coplanarity = 0.1mm max.
Pin 1
0.6
3.325
6.65
Preliminary Product Disclaimer
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reserves the right at any time to alter prices, specifications, features, capabilities, functions, manufacturing release dates,
and even general availability of the product. It is advisable to consult your local Agilent field sales engineer when
considering these products for design-ins and production volumes.
11
Re-flow Profile
MAX 245C
R3
230
200
R4
183
170
150
R2
90 sec
MAX
Above 183 C
125
R5
R1
100
50
25
0
100
P2
SOLDER PASTE DRY
150
200
P3
SOLDER
250
P4
COOL DOWN
300
50
P1
HEAT
UP
t-TIME
(SECONDS)
REFLOW
Process Zone
Heat Up
Solder Paste Dry P2, R2 125°C to 170°C
Symbol
P1, R1 25°C to 125°C
DT
Maximum DT/Dtime
4°C/s
0.5°C/s
4°C/s
-4°C/s
-3°C/s
P3, R3 170°C to 230°C (245°C max.)
P3, R4 230°C to 170°C
P4, R5 170°C to 25°C
Solder Reflow
Cool Down
The reflow profile is a straight line representation of a nominal temperature profile for a convective
reflow solder process. The temperature profile is divided into four process zones, each with different
DT/Dtime temperature change rates. The DT/Dtime rates are detailed in the above table. The
temperatures are measured at the component to printed-circuit board connections.
In process zone P1, the PC board and HSDL-3210 castellation I/O pins are heated to a
temperature of 125°C to activate the flux in the solder paste. The temperature ramp up rate, R1, is
limited to 4°C per second to allow for even heating of both the PC board and HSDL-3210
castellation I/O pins.
Process zone P2 should be of sufficient time duration (> 60 seconds) to dry the solder paste. The
temperature is raised to a level just below the liquidus point of the solder, usually 170°C (338°F).
Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the
liquidus point of solder to 230°C (446°F) for optimum results. The dwell time above the liquidus point
of solder should be between 15 and 90 seconds. It usually takes about 15 seconds to assure proper
coalescing of the solder balls into liquid solder and the formation of good solder connections. Beyond a
dwell time of 90 seconds, the intermetallic growth within the solder connections becomes excessive,
resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced
to a point below the solidus temperature of the solder, usually 170°C (338°F), to allow the solder within
the connections to freeze solid.
Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus
point of the solder to 25°C (77°F) should not exceed - 3°C per second maximum. This limitation is
necessary to allow the PC board and HSDL-3210 castellation I/O pins to change dimensions evenly,
putting minimal stresses on the HSDL-3210 transceiver.
Preliminary Product Disclaimer
These products are under development. Until Agilent Technologies releases these products for general sales, Agilent
reserves the right at any time to alter prices, specifications, features, capabilities, functions, manufacturing release dates,
and even general availability of the product. It is advisable to consult your local Agilent field sales engineer when
considering these products for design-ins and production volumes.
12
3. Incandescent Lighting:
1000 lux maximum. This
is produced with general
service, tungsten-
signal is swept over the
frequency range from 20
kHz to 200 kHz.
Test Methods
Background light and
Electromagnetic Field
filament, gas-filled,
Due to the variety of
fluorescent lamps and
the range of IR
emissions, this condition
is not expected to cover
all circumstances. It will
provide a common floor
for IrDA operation
inside frosted lamps in
the 60 Watt to 100 Watt
range to generate 1000
lux over the horizontal
surface on which the
equipment under test
rests. The light sources
are above the test area.
The source is expected
to have a filament
There are four ambient
interference conditions in
which the receiver is to
operate correctly. The
conditions are to be applied
separately:
1. Electromagnetic field:
3V/m maximum (please
refer to IEC 61000-4-3
severity level 3 for
details).
temperature in the 2700
to 3050 Kelvin range and
a spectral peak in the
850 to 1050 nm range.
2. Sunlight:
10 kilolux maximum at
the optical port. This is
simulated with an IR
source having a peak
wavelength within the
range of 850 nm to 900
nm and a spectral width
of less than 50 nm
biased to provide 490
mW/cm2 (with no
4. Fluorescent Lighting:
1000 lux maximum. This
is simulated with an IR
source having a peak
wavelength within the
range of 850 nm to 900
nm and a spectral width
of less than 50 nm
biased and modulated to
provide an optical square
wave signal (0 mW/cm2
minimum and 0.3
modulation) at the
optical port. The light
source faces the optical
port.
mW/cm2 peak amplitude
with 10% to 90% rise and
fall times less than or
equal to 100 ns) over the
horizontal surface on
which the equipment
under test rests. The
light sources are above
the test area. The
This simulates sunlight
within the IrDA spectral
range. The effect of
longer wavelength
radiation is covered by
the incandescent
condition.
frequency of the optical
Preliminary Product Disclaimer
These products are under development. Until Agilent Technologies releases these products for general sales, Agilent
reserves the right at any time to alter prices, specifications, features, capabilities, functions, manufacturing release dates,
and even general availability of the product. It is advisable to consult your local Agilent field sales engineer when
considering these products for design-ins and production volumes.
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