6N138-500E [AGILENT]
Logic IC Output Optocoupler, 1-Element, 3750V Isolation, 0.300 INCH, LEAD FREE, SURFACE MOUNT, DIP-8;
| 型号： | 6N138-500E |
| 厂家： | 
AGILENT TECHNOLOGIES, LTD. |
| 描述： | Logic IC Output Optocoupler, 1-Element, 3750V Isolation, 0.300 INCH, LEAD FREE, SURFACE MOUNT, DIP-8 输出元件 光电 |
| 文件： | 总16页 (文件大小：125K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Low Input Current, High Gain
Optocouplers
Technical Data
6N139
HCPL-0701
HCNW139
6N138
HCPL-0700
HCNW138
Features
• High Current Transfer Ratio
– 2000% Typical (4500%
Typical for HCNW139/138)
• Low Input Current
Requirements – 0.5 mA
• TTL Compatible Output –
0.1 V VOL Typical
• Performance Guaranteed
over Temperature 0°C
to 70°C
• Base Access Allows Gain
Bandwidth Adjustment
Applications
Description
• Ground Isolate Most Logic
Families – TTL/TTL, CMOS/
TTL, CMOS/CMOS, LSTTL/
TTL, CMOS/LSTTL
• Low Input Current Line
Receiver
• High Voltage Insulation
(HCNW139/138)
• EIA RS-232C Line Receiver
• Telephone Ring Detector
• 117 V ac Line Voltage Status
Indicator – Low Input Power
Dissipation
• Low Power Systems –
Ground Isolation
These high gain series couplers
use a Light Emitting Diode and an
integrated high gain photodetec-
tor to provide extremely high
current transfer ratio between
input and output. Separate pins
for the photodiode and output
stage result in TTL compatible
saturation voltages and high
speed operation. Where desired
the VCC and VO terminals may be
tied together to achieve conven-
tional photodarlington operation.
A base access terminal allows a
gain bandwidth adjustment to be
made.
• High Output Current –
60 mA
• Safety Approval
UL Recognized – 3750 V rms
for 1 Minute and 5000 V rms*
for 1 Minute per UL 1577
CSA Approved
Functional Diagram
IEC/EN/DIN EN 60747-5-2
Approved with VIORM = 1414
V peak for HCNW139 and
HCNW138
• Available in 8-Pin DIP or
SOIC-8 Footprint or
Widebody Package
8
7
6
5
NC
ANODE
CATHODE
NC
1
2
3
4
V
V
V
CC
B
TRUTH TABLE
LED
V
O
ON
OFF
LOW
HIGH
O
GND
• MIL-PRF-38534 Hermetic
Version Available (HCPL-
5700/1)
*5000 V rms/1 minute rating is for HCNW139/138 and Option 020 (6N139/138) products only.
A 0.1 µF bypass capacitor connected between pins 8 and 5 is recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
2
The 6N139, HCPL-0701, and
CNW139 are for use in CMOS,
LSTTL or other low power appli-
cations. A 400% minimum current
transfer ratio is guaranteed over
0 to 70°C operating range for only
0.5 mA of LED current.
(1 TTL Unit load ). A 300%
minimum CTR enables operation
with 1 TTL Load using a 2.2 kΩ
pull-up resistor.
The SOIC-8 does not require
“through holes” in a PCB. This
package occupies approximately
one-third the footprint area of the
standard dual-in-line package.
The lead profile is designed to be
compatible with standard surface
mount processes.
Selection for lower input current
down to 250 µA is available upon
request.
The 6N138, HCPL-0700, and
HCNW138 are designed for use
mainly in TTL applications.
Current Transfer Ratio (CTR) is
300% minimum over 0 to 70°C
for an LED current of 1.6 mA
The HCPL-0701 and HCPL-0700
are surface mount devices
packaged in an industry standard
SOIC-8 footprint.
The HCNW139 and HCNW138
are packaged in a widebody
encapsulation that provides creep-
age and clearance dimensions
suitable for safety approval by
regulatory agencies worldwide.
Selection Guide
Widebody
Package
8-Pin DIP
Hermetic
(300 Mil)
Small Outline SO-8
(400 mil)
Single and
Dual
Single
Dual
Minimum
Input ON
Current
(IF)
Absolute
Maxi-
mum
Dual
Single
Channel
Package
Channel Channel
Package Package
Channel
Package
HCPL-
Single
Channel
Package
Channel
Packages
HCPL-
Minimum
CTR
HCPL-
2731[1]
2730[1]
4731[1]
HCPL-
VCC
6N139
6N138
0701
0731
0730
HCNW139
HCNW138
0.5 mA
1.6 mA
40 µA
400%
300%
800%
300%
18 V
7 V
0700
HCPL-4701[1]
070A[1]
073A[1]
18 V
20 V
0.5 mA
5701[1]
5700[1]
5731[1]
5730[1]
Note:
1.TechnicaldataareonseparateAgilentpublications.
3
Ordering Information
Specify Part Number followed by Option Number (if desired).
Example:
6N139#XXXX
020 = 5000 V rms/1 Minute UL Rating Option*
300 = Gull Wing Surface Mount Option†
500 = Tape and Reel Packaging Option
XXXE = Lead Free Option
Option data sheets available. Contact your Agilent sales representative or authorized distributor for
information.
*For 6N139 and 6N138 only.
†Gull wing surface mount option applies to through hole parts only.
Remarks: The notation “#” is used for existing products, while (new) products launched since 15th July
2001 and lead free option will use “-”
Schematic
V
CC
8
I
CC
I
F
2
+
ANODE
V
F
–
3
CATHODE
I
O
6
5
V
O
GND
SHIELD
I
B
7
V
B
4
Package Outline Drawings
8-Pin DIP Package (6N139/6N138)**
7.62 ± 0.25
(0.300 ± 0.010)
9.65 ± 0.25
(0.380 ± 0.010)
8
1
7
6
5
6.35 ± 0.25
(0.250 ± 0.010)
TYPE NUMBER
OPTION CODE*
DATE CODE
A XXXXZ
YYWW
U R
UL
2
3
4
RECOGNITION
1.78 (0.070) MAX.
1.19 (0.047) MAX.
+ 0.076
- 0.051
0.254
5° TYP.
+ 0.003)
- 0.002)
3.56 ± 0.13
(0.140 ± 0.005)
(0.010
4.70 (0.185) MAX.
0.51 (0.020) MIN.
2.92 (0.115) MIN.
DIMENSIONS IN MILLIMETERS AND (INCHES).
1.080 ± 0.320
0.65 (0.025) MAX.
(0.043 ± 0.013)
* MARKING CODE LETTER FOR OPTION NUMBERS
"L" = OPTION 020
OPTION NUMBERS 300 AND 500 NOT MARKED.
2.54 ± 0.25
(0.100 ± 0.010)
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
**JEDEC Registered Data.
8-Pin DIP Package with Gull Wing Surface Mount Option 300 (6N139/6N138)
LAND PATTERN RECOMMENDATION
9.65 ± 0.25
1.016 (0.040)
(0.380 ± 0.010)
6
5
8
1
7
6.350 ± 0.25
(0.250 ± 0.010)
10.9 (0.430)
2.0 (0.080)
2
3
4
1.27 (0.050)
9.65 ± 0.25
(0.380 ± 0.010)
1.780
(0.070)
MAX.
1.19
(0.047)
MAX.
7.62 ± 0.25
(0.300 ± 0.010)
+ 0.076
- 0.051
0.254
3.56 ± 0.13
(0.140 ± 0.005)
+ 0.003)
- 0.002)
(0.010
1.080 ± 0.320
(0.043 ± 0.013)
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
0.635 ± 0.130
(0.025 ± 0.005)
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
5
Small Outline SO-8 Package (HCPL-0701/HCPL-0700)
LAND PATTERN RECOMMENDATION
8
7
6
5
5.994 ± 0.203
(0.236 ± 0.008)
XXX
3.937 ± 0.127
(0.155 ± 0.005)
YWW
TYPE NUMBER
(LAST 3 DIGITS)
7.49 (0.295)
DATE CODE
1
2
3
4
PIN ONE
1.9 (0.075)
0.406 ± 0.076
(0.016 ± 0.003)
1.270
(0.050)
BSC
0.64 (0.025)
0.432
(0.017)
*
7°
5.080 ± 0.127
(0.200 ± 0.005)
45° X
3.175 ± 0.127
(0.125 ± 0.005)
0 ~ 7°
0.228 ± 0.025
(0.009 ± 0.001)
1.524
(0.060)
0.203 ± 0.102
(0.008 ± 0.004)
TOTAL PACKAGE LENGTH (INCLUSIVE OF MOLD FLASH)
5.207 ± 0.254 (0.205 ± 0.010)
*
0.305
(0.012)
MIN.
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES) MAX.
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
8-Pin Widebody DIP Package (HCNW139/HCNW138)
11.00
MAX.
11.15 ± 0.15
(0.442 ± 0.006)
(0.433)
9.00 ± 0.15
(0.354 ± 0.006)
7
6
5
8
TYPE NUMBER
DATE CODE
A
HCNWXXXX
YYWW
1
3
2
4
10.16 (0.400)
TYP.
1.55
(0.061)
MAX.
7° TYP.
+ 0.076
- 0.0051
0.254
+ 0.003)
- 0.002)
(0.010
5.10
(0.201)
MAX.
3.10 (0.122)
3.90 (0.154)
0.51 (0.021) MIN.
2.54 (0.100)
TYP.
1.78 ± 0.15
(0.070 ± 0.006)
0.40 (0.016)
0.56 (0.022)
DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
6
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300 (HCNW139/HCNW138)
11.15 ± 0.15
(0.442 ± 0.006)
LAND PATTERN RECOMMENDATION
7
6
5
8
9.00 ± 0.15
(0.354 ± 0.006)
13.56
(0.534)
1
3
2
4
2.29
1.3
(0.09)
(0.051)
12.30 ± 0.30
(0.484 ± 0.012)
1.55
(0.061)
MAX.
11.00
MAX.
(0.433)
4.00
MAX.
(0.158)
1.78 ± 0.15
(0.070 ± 0.006)
1.00 ± 0.15
(0.039 ± 0.006)
0.75 ± 0.25
(0.030 ± 0.010)
+ 0.076
- 0.0051
2.54
(0.100)
BSC
0.254
+ 0.003)
- 0.002)
(0.010
DIMENSIONS IN MILLIMETERS (INCHES).
7° NOM.
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
Solder Reflow Temperature Profile
300
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
PEAK
TEMP.
245°C
PEAK
TEMP.
240°C
PEAK
TEMP.
230°C
200
2.5°C ± 0.5°C/SEC.
SOLDERING
TIME
200°C
30
160°C
150°C
140°C
SEC.
30
SEC.
3°C + 1°C/–0.5°C
100
PREHEATING TIME
150°C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
ROOM
TEMPERATURE
0
0
50
100
150
200
250
TIME (SECONDS)
7
Recommended Pb-Free IR Profile
TIME WITHIN 5 °C of ACTUAL
PEAKTEMPERATURE
t
p
20-40 SEC.
260 +0/-5 °C
T
T
p
217 °C
L
RAMP-UP
3 °C/SEC. MAX.
150 - 200 °C
RAMP-DOWN
6 °C/SEC. MAX.
T
smax
T
smin
t
s
t
L
60 to 150 SEC.
PREHEAT
60 to 180 SEC.
25
t 25 °C to PEAK
TIME
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
= 200 °C, T = 150 °C
T
smax
smin
Regulatory Information
UL
IEC/EN/DIN EN 60747-5-2
Approved under
The 6N139/138, HCNW139/138,
and HCPL-0701/0700 have been
approved by the following
organizations:
Recognized under UL 1577,
Component Recognition Program, IEC 60747-5-2:1997 + A1:2002
File E55361.
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884
Teil 2):2003-01
CSA
(HCNW139/138 only)
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
Insulation and Safety Related Specifications
8-Pin DIP
Widebody
(300 Mil) SO-8 (400 Mil)
Parameter
Symbol
Value
Value
Value
Units
Conditions
Minimum External
Air Gap (External
Clearance)
L(101)
7.1
4.9
9.6
mm
Measured from input terminals
to output terminals, shortest
distance through air.
Minimum External
Tracking (External
Creepage)
Minimum Internal
Plastic Gap
L(102)
7.4
4.8
10.0
1.0
mm
mm
Measured from input terminals
to output terminals, shortest
distance path along body.
Through insulation distance,
conductor to conductor, usually
the direct distance between the
photoemitter and photodetector
inside the optocoupler cavity.
0.08
0.08
(Internal Clearance)
Minimum Internal
Tracking (Internal
Creepage)
Tracking Resistance
(Comparative
Tracking Index)
Isolation Group
NA
200
IIIa
NA
200
IIIa
4.0
200
IIIa
mm
Measured from input terminals
to output terminals, along
internal cavity.
CTI
Volts DIN IEC 112/VDE 0303 Part 1
Material Group
(DIN VDE 0110, 1/89, Table 1)
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
8
IEC/EN/DIN EN 60747-5-2 Insulation Related Characteristics (HCNW139 and HCNW138)
Description
Symbol Characteristic Units
Installation Classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage ≤ 600 V rms
I-IV
I-III
for rated mains voltage ≤ 1000 V rms
Climatic Classification
55/100/21
2
Pollution Degree (DIN VDE 0110/1.89)
Maximum Working Insulation Voltage
V
IORM
1414
V peak
V peak
Input to Output Test Voltage, Method b*
VPR = 1.875 x VIORM, 100% Production Test with tP = 1 sec,
Partial Discharge < 5 pC
VPR
VPR
2652
Input to Output Test Voltage, Method a*
VPR = 1.5 x VIORM, Type and Sample Test,
2121
8000
V peak
V peak
tP = 60 sec, Partial Discharge < 5 pC
Highest Allowable Overvoltage*
(Transient Overvoltage, tini = 10 sec)
V
IOTM
Safety Limiting Values
(Maximum values allowed in the event of a failure,
also see Figure 11, Thermal Derating curve.)
Case Temperature
TS
IS,INPUT
PS,OUTPUT
175
400
700
°C
mA
mW
Current (Input Current IF, PS = 0)
Output Power
Insulation Resistance at TS, V = 500 V
RS
> 109
Ω
IO
*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section, IEC/EN/DIN EN
60747-5-2, for a detailed description.
Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must be ensured by protective circuits in
application.
9
Absolute Maximum Ratings* (No Derating Required up to 85°C)
Parameter
Storage Temperature
Operating Temperature**
Symbol
Min.
-55
-40
Max.
125
85
Units
°C
°C
TS
TA
Average Forward Input Current
Peak Forward Input Current
IF(AVG)
IFPK
20
40
mA
mA
(50% Duty Cycle, 1 ms Pulse Width)
Peak Transient Input Current
(<1 µs Pulse Width, 300 pps)
Reverse Input Voltage
IF(TRAN)
VR
1.0
A
5
3
V
V
HCNW139/138
Input Power Dissipation
Output Current (Pin 6)
Emitter Base Reverse Voltage (Pin 5-7)
PI
IO
VEB
35
60
0.5
mW
mA
V
Supply Voltage and Output Voltage
(6N139, HCPL-0701, HCNW139)
VCC
VCC
-0.5
-0.5
18
7
V
V
Supply Voltage and Output Voltage
(6N138, HCPL-0700, HCNW138)
Output Power Dissipation
PO
PT
100
135
mW
mW
Total Power Dissipation
Lead Solder Temperature (for Through Hole Devices)
HCNW139/138
260°C for 10 sec., 1.6 mm below seating plane
260°C for 10 sec., up to seating plane
See Package Outline Drawings section
Reflow Temperature Profile
(for SOIC-8 and Option #300)
*JEDEC Registered Data for 6N139 and 6N138.
**0°C to 70°C on JEDEC Registration.
Recommended Operating Conditions
Parameter
Power Supply Voltage
Symbol
VCC
Min.
4.5
0.5
0
Max.
18
Units
V
Forward Input Current (ON)
Forward Input Voltage (OFF)
Operating Temperature
IF(ON)
VF(OFF)
TA
12.0
0.8
mA
V
0
70
°C
10
Electrical Specifications
0°C ≤ TA ≤ 70°C, 4.5 V ≤ VCC ≤ 18 V, 0.5 mA ≤ IF(ON) ≤ 12 mA, 0 V ≤ VF(OFF) ≤ 0.8 V, unless otherwise
specified. All Typicals at TA = 25°C. See Note 7.
Parameter
Current Transfer
Ratio
Sym.
CTR
Device
6N139
Min. Typ.** Max. Units
400* 2000 5000 %
Test Conditions
IF = 0.5 mA
Fig. Note
VCC = 4.5 2, 3 1, 2,
VO = 0.4 V 4
HCPL-0701
HCNW139 400 4500
6N139
HCPL-0701
500* 1600 2600
IF = 1.6 mA
HCNW139 500 3000
300 1600
IF = 5.0 mA
IF = 12 mA
IF = 1.6 mA
200 850
6N138
300* 1600 2600
HCPL-0700
HCNW138
1500
0.1
Logic Low Output VOL
Voltage
6N139
HCPL-0701
HCNW139
0.4
V
IF = 0.5 mA,
IO = 2 mA
VCC = 4.5
1
2
IF = 1.6 mA,
IO = 8 mA
IF = 5.0 mA,
IO = 15 mA
IF = 12 mA,
IO = 24 mA
IF = 1.6 mA,
IO = 4.8 mA
0.2
0.1
6N138
HCPL-0700
HCNW138
Logic High
Output Current
IOH
6N139
0.05 100 µA
VO = VCC = 18 V IF = 0 mA
VO = VCC = 7 V
2
HCPL-0701
HCNW139
6N138
HCPL-0700
HCNW138
0.1 250
Logic Low Supply ICCL 6N138/139
0.4
0.5
1.5 mA IF = 1.6 mA, VO = Open,
VCC = 18 V
10
2
2
Current
HCPL-0701/
0700
HCNW139
2
HCNW138
Logic High
Supply Current
ICCH 6N138/139
HCPL-0701/
0700
0.01 10
µA
IF = 0 mA, VO = Open,
VCC = 18 V
HCNW139
1
1.25 1.40 1.7*
1.75
HCNW138
Input Forward
Voltage
VF
6N138
6N139
V
TA = 25°C IF = 1.6 mA
4, 8
HCPL-0701
HCPL-0700
HCNW139
HCNW138
1.0 1.45 1.85
T = 25°C
A
0.95
5.0*
3.0
1.95
Input Reverse
Breakdown
Voltage
BVR
V
IR = 10 µA, T = 25°C
IR = 100 µA, T = 25°C
A
HCNW139
HCNW138
A
Temperature
∆VF
-1.8
mV/°C IF = 1.6 mA
pF f = 1 MHz, VF = 0 V
8
Coefficient of
∆T
A
Forward Voltage
Input
Capacitance
CIN
60
90
HCNW139
HCNW138
*JEDEC Registered Data for 6N139 and 6N138.
**All typical values at TA = 25°C and VCC = 5 V, unless otherwise noted.
11
Switching Specifications (AC)
Over recommended operating conditions (TA = 0 to 70°C), VCC = 5 V, unless otherwise specified.
Parameter
Sym.
Device
Min. Typ.**
Max.
TA =25°C
Units Test Conditions Fig. Note
Propagation
Delay Time
to Logic Low
at Output
tPHL
6N139
HCPL-0701
HCNW139
5
25*
30
2
µs
µs
IF = 0.5 mA,
Rl = 4.7 kΩ
5, 6, 2, 4
7, 9,
12
6N139
0.2
1*
IF = 12 mA,
HCPL-0701
HCNW139
Rl = 270 Ω
11
15
6N138
HCPL-0700
HCNW138
1.6
10*
60*
7*
µs
IF = 1.6 mA,
Rl = 2.2 kΩ
11
90
Propagation
Delay Time
to Logic High
at Output
tPLH
6N139
HCPL-0701
HCNW139
18
µs
IF = 0.5 mA,
Rl = 4.7 kΩ
5, 6, 2, 4
7, 9,
12
115
10
6N139
HCPL-0701
HCNW139
2
10
µs
IF = 12 mA,
Rl = 270 Ω
11
50
6N138
35*
µs
IF = 1.6 mA,
HCPL-0700
HCNW138
Rl = 2.2 kΩ
70
Common Mode |CMH|
Transient
Immunity at
Logic High
1000 10000
V/µs
IF = 0 mA,
TA = 25°C
Rl = 2.2 kΩ
|VCM| = 10
Vp-p
13
13
5, 6
5, 6
Output
Common Mode |CML|
Transient
Immunity at
Logic Low
1000 10000
V/µs
IF = 1.6 mA,
TA = 25°C
Rl = 2.2 kΩ
|VCM| = 10
Vp-p
Output
*JEDEC Registered Data for 6N139 and 6N138.
**All typical values at TA = 25°C and VCC = 5 V, unless otherwise noted.
12
Package Characteristics
Parameter
Sym. Min. Typ.** Max. Units
Test Conditions
Fig. Note
Input-Output Momentary
Withstand Voltage†
V
ISO
3750
V rms RH < 50%, t = 1 min.,
3, 8
T = 25°C
A
Option 020
HCNW139
HCNW138
5000
3, 9
Resistance (Input-Output)
RI-O
CI-O
1012
0.6
Ω
VI-O = 500 Vdc
RH < 45%
f = 1 MHz
3
3
Capacitance (Input-Output)
pF
**All typicals at TA = 25°C, unless otherwise noted.
†The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output
continuous voltage rating. For the continuous voltage rating refer to the IEC/EN/DIN EN60747-5-2 Insulation Characteristics Table (if
applicable), your equipment level safety specification or Agilent Application Note 1074 entitled “Optocoupler Input-Output Endurance
Voltage.”
Notes:
8. In accordance with UL 1577, each
optocoupler is proof tested by applying
an insulation test voltage 4500 V rms
for 1 second (leakage detection current
limit, II-O < 5 µA). This test is per-
formed before the 100% production test
shown in the IEC/EN/DIN EN
able (positive) dVCM/dt of the common
mode pulse, VCM, to assure that the
output will remain in a Logic High state
(i.e., VO > 2.0 V). Common mode
transient immunity in a Logic Low level
is the maximum tolerable (negative)
dVCM/dt of the common mode pulse,
VCM, to assure that the output will
remain in a Logic Low state (i.e.,
VO < 0.8 V).
6. In applications where dV/dt may exceed
50,000 V/µs (such as static discharge) a
series resistor, RCC, should be included
to protect the detector IC from
destructively high surge currents. The
recommended value is RCC = 220 Ω.
7. Use of a 0.1 µF bypass capacitor
connected between pins 8 and 5
1. DC CURRENT TRANSFER RATI0
(CTR) is defined as the ratio of output
collector current, IO, to the forward
LED input current, IF, times 100%.
2. Pin 7 Open.
3. Device considered a two-terminal
device. Pins 1, 2, 3, and 4 shorted
together and Pins 5, 6, 7, and 8 shorted
together.
4. Use of a resistor between pin 5 and 7
will decrease gain and delay time.
Significant reduction in overall gain can
occur when using resistor values below
47 kΩ. For more information, please
contact your local HP Components
representative.
60747-5-2 Insulation Related
Characteristics Table, if applicable.
9. In accordance with UL 1577, each
optocoupler is proof tested by applying
an insulation test voltage > 6000 V rms
for 1 second (leakage detection current
limit, II-O < 5 µA). This test is per-
formed before the 100% production test
for partial discharge (method b) shown
in the IEC/EN/DIN EN 60747-5-2
Insulation Related Characteristics Table,
if applicable.
5. Common mode transient immunity in a
Logic High level is the maximum toler-
adjacent to the device is recommended.
13
5.0 mA
4.5 mA
4.0 mA
85°C
50
25
0
2000
1600
1200
800
100
70°C
25°C
70°C
-40°C
10
T
= 85° C
A
1.0
T
= 70° C
= 25° C
= 0° C
A
A
A
A
T
T
T
0.5 mA
V
V
O
= 5 V
= 0.4 V
0.1
CC
400
0
V
T
A
= 5 V
= 25° C
= -40° C
CC
0.01
0.01
0
1.0
– OUTPUT VOLTAGE – V
2.0
0.1
1.0
10
0.1
1
10
V
O
I
– INPUT DIODE FORWARD CURRENT – mA
I
– FORWARD CURRENT – mA
F
F
Figure 1. 6N138/6N139 DC Transfer
Characteristics.
Figure 2. Current Transfer Ratio vs.
Forward Current 6N138/6N139.
Figure 3. 6N138/6N139 Output
Current vs. Input Diode Forward
Current.
1000
40
24
I
F
I
= 0.5 mA
I
R
= 1.6 mA
F
F
21
18
15
12
9
= 2.2 kΩ
35
30
25
20
15
10
R = 4.7 kΩ
1/f = 50 µs
L
L
+
V
–
100
10
1/f = 50 µs
t
PLH
t
PLH
F
T
= 85°C
A
A
1.0
T
= 70°C
0.1
T
T
T
= 25°C
= 0°C
6
A
A
A
t
PHL
0.01
0.001
t
PHL
3
0
5
0
= -40°C
1.1
1.2
1.3
1.4
1.5
1.6
-60
-40
-20
0
20 40
60 80 100
-60 -40 -20
0
20 40 60 80 100
V
– FORWARD VOLTAGE – V
F
T
– TEMPERATURE – °C
T
– TEMPERATURE – °C
A
A
Figure 4. Input Diode Forward
Current vs. Forward Voltage.
Figure 5. Propagation Delay vs.
Temperature.
Figure 6. Propagation Delay vs.
Temperature.
4
1.6
I
= 12 mA
F
100
I
= 1.6 mA
R
= 270 kΩ
F
L
T
= 25° C
A
1/f = 50 µs
t
PLH
t
f
3
2
1.5
1.4
t
r
10
1.3
1.2
1
0
I
– ADJUSTED FOR V
= 2 V
t
PHL
F
OL
1
0.1
1.0
10
-60
-40
-20
0
20 40
60 80 100
-60 -40 -20
0
20 40 60 80 100
R
– LOAD RESISTANCE – kΩ
L
T
– TEMPERATURE – °C
T
– TEMPERATURE – °C
A
A
Figure 7. Propagation Delay vs.
Temperature.
Figure 8. Forward Voltage vs.
Temperature.
Figure 9. Nonsaturated Rise and Fall
Times vs. Load Resistance.
14
WIDEBODY
(mW)
1000
0.8
0.7
0.6
0.5
0.4
0.3
0.2
P
S
900
800
700
600
500
400
300
200
I
(mA)
S
V
= 18 V
CC
V
= 5 V
CC
0.1
0
100
0
0
25
50 75 100 125 150 175
0
2
4
6
8
10 12 14 16
T
– CASE TEMPERATURE – °C
S
I
– FORWARD CURRENT
F
Figure 10. Logic Low Supply Current
vs. Forward Current.
Figure 11. Thermal Derating Curve,
Dependence of Safety Limiting Value
with Case Temperature per IEC/EN/DIN
EN 60747-5-2.
I
F
I
PULSE
GEN.
F
0
8
7
6
5
+5 V
1
2
3
4
Z
t
= 50 Ω
= 5 ns
O
r
5 V
V
O
R
L
10% DUTY CYCLE
I/f < 100 µs
(SATURATED
RESPONSE)
1.5 V
1.5 V
V
O
V
OL
0.1 µF
I
MONITOR
F
t
t
PHL
PLH
C
= 15 pF*
L
R
M
5 V
* INCLUDES PROBE AND
FIXTURE CAPACITANCE
V
O
90%
10%
90%
10%
(NON-SATURATED
RESPONSE)
t
f
t
r
Figure 12. Switching Test Circuit.
15
R
(SEE NOTE 6)
CC
I
F
t , t = 16 ns
8
7
6
5
1
2
3
4
+5 V
r
f
10 V
0 V
90% 90%
V
CM
B
10%
10%
R
L
t
r
t
A
f
V
O
V
5 V
V
O
V
FF
SWITCH AT A: I = 0 mA
F
V
V
O
CM
OL
+
–
SWITCH AT B: I = 1.6 mA
F
PULSE GEN.
Figure 13. Test Circuit for Transient Immunity and Typical Waveforms.
www.agilent.com/semiconductors
For product information and a complete list of
distributors, please go to our web site.
For technical assistance call:
Americas/Canada: +1 (800) 235-0312 or
(916)788-6763
Europe: +49 (0) 6441 92460
China: 10800 650 0017
Hong Kong: (+65) 6756 2394
India, Australia, New Zealand: (+65) 6755 1939
Japan: (+81 3) 3335-8152 (Domestic/Interna-
tional), or 0120-61-1280 (Domestic Only)
Korea: (+65) 6755 1989
Singapore, Malaysia, Vietnam, Thailand,
Philippines, Indonesia: (+65) 6755 2044
Taiwan: (+65) 6755 1843
Data subject to change.
Copyright © 2004 Agilent Technologies, Inc.
Obsoletes 5989-0289EN
December 20, 2004
5989-2102EN
相关型号：
6N138-520E
Low Input Current, High Gain Optocouplers Low input current requirements â 0.5 mA
AVAGO
6N138-560E
Low Input Current, High Gain Optocouplers Low input current requirements â 0.5 mA
AVAGO
6N138-X001
Logic IC Output Optocoupler, 1-Element, 5300V Isolation, 0.1MBps, ROHS COMPLIANT, PLASTIC, DIP-8
VISHAY
6N138-X017
Optocoupler - IC Output, 1 CHANNEL LOGIC OUTPUT OPTOCOUPLER, 0.1 Mbps, ROHS COMPLIANT, SMD, 8 PIN
VISHAY
©2020 ICPDF网 联系我们和版权申明