HMC129ALC4 [ADI]
4 GHz to 8 GHz GaAs MMIC Double-Balanced Mixer;
| 型号： | HMC129ALC4 |
| 厂家： | 
ADI |
| 描述： | 4 GHz to 8 GHz GaAs MMIC Double-Balanced Mixer |
| 文件： | 总16页 (文件大小：205K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
4 GHz to 8 GHz GaAs MMIC
Double-Balanced Mixer
Data Sheet
HMC129ALC4
FEATURES
FUNCTIONAL BLOCK DIAGRAM
Conversion loss: 7 dB
LO to RF and IF isolation: 40 dB
Input IP3: 17 dBm
RoHS compliant, 24-terminal, 4 mm × 4 mm LCC package
NIC
GND
RF
1
2
3
4
5
6
18 NIC
GND
HMC129ALC4
17
16 LO
APPLICATIONS
15
GND
GND
NIC
14 NIC
13 NIC
Microwave and very small aperture terminal (VSAT) radios
Test equipment
NIC
Military electronic warfare (EW); electronic countermeasure
(ECM); and command, control, communications and
intelligence (C3I)
PACKAGE
BASE
GND
Figure 1.
GENERAL DESCRIPTION
The HMC129ALC4 is a general-purpose, double-balanced
monolithic microwave integrated circuit (MMIC) mixer housed
in a leadless Pb-free, RoHS compliant LCC package, that can be
used as an upconverter or downconverter in the 4 GHz to 8 GHz
band. The HMC129ALC4 is ideally suited for applications where
small size, no dc bias, and consistent IC performance are required.
This mixer can operate over a wide LO drive input of 9 dBm to
18 dBm. It performs equally well as a biphase modulator or
demodulator. The HMC129ALC4 eliminates the need for wire
bonding, allowing use of surface-mount manufacturing
techniques.
Rev. 0
Document Feedback
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registeredtrademarks arethe property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
Technical Support
©2017 Analog Devices, Inc. All rights reserved.
www.analog.com
HMC129ALC4
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Downconverter Performance ......................................................6
Upconverter Performance............................................................8
Isolation and Return Loss ............................................................9
IF Bandwidth—Downconverter............................................... 11
IF Bandwidth—Upconverter .................................................... 12
Spurious and Harmonics Performance ................................... 13
Theory of Operation ...................................................................... 14
Applications Information.............................................................. 15
Typical Application Circuit....................................................... 15
Evaluation PCB Information .................................................... 15
Outline Dimensions....................................................................... 16
Ordering Guide .......................................................................... 16
Applications....................................................................................... 1
Functional Block Diagram .............................................................. 1
General Description......................................................................... 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution.................................................................................. 4
Pin Configuration and Function Descriptions............................. 5
Interface Schematics..................................................................... 5
Typical Performance Characteristics ............................................. 6
REVISION HISTORY
7/2017—Revision 0: Initial Version
Rev. 0 | Page 2 of 16
Data Sheet
HMC129ALC4
SPECIFICATIONS
TA = 25°C, IF = 100 MHz, LO = 15 dBm, upper side band. All measurements performed as a downconverter, unless otherwise noted, on the
evaluation printed circuit board (PCB).
Table 1.
Parameter
Min
Typ
Max
Unit
FREQUENCY
RF Pin
IF Pin
LO Pin
4
DC
4
8
3
8
GHz
GHz
GHz
dBm
LO DRIVE LEVEL
9
15
18
RADIO FREQUENCY (RF) PERFORMANCE
Downconverter
Conversion Loss
7
9
dB
Single Sideband (SSB) Noise Figure
Input Third-Order Intercept (IIP3)
Input 1 dB Compression Point (IP1dB)
Input Second-Order Intercept (IIP2)
RF to IF Isolation
7
dB
15
35
17
10
50
20
40
40
dBm
dBm
dBm
dB
dB
dB
LO to RF Isolation
LO to IF Isolation
Upconverter
Conversion Loss
7
dB
Input Third-Order Intercept (IIP3)
Input 1 dB Compression Point (IP1dB)
17
7
dBm
dBm
Rev. 0 | Page 3 of 16
HMC129ALC4
Data Sheet
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 2.
Thermal performance is directly linked to PCB design and
operating environment. Careful attention to PCB thermal
design is required.
Parameter
Rating
25 dBm
27 dBm
25 dBm
6 mA
RF Input Power
LO Input Power
IF Input Power
IF Source/Sink Current
Reflow Temperature
Maximum Junction Temperature
θJA is the natural convection junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure. θJC is
the junction to case thermal resistance.
260°C
175°C
Table 3. Thermal Resistance
Package Type
E-24-11
Continuous Power Dissipation, PDISS
(TA = 85°C, Derate 5 mW/°C Above 85°C)
Operating Temperature Range
Storage Temperature Range
Electrostatic Discharge (ESD) Sensitivity
Human Body Model (HBM)
450 mW
θJA
θJC
Unit
−40°C to +85°C
−65°C to +150°C
120
200
°C/W
1 Test Condition 1: JEDEC standard JESD51-2.
250 V
500 V
ESD CAUTION
Field Induced Charged Device Model
(FICDM)
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. 0 | Page 4 of 16
Data Sheet
HMC129ALC4
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
NIC
GND
RF
1
2
3
4
5
6
18 NIC
17
16
GND
LO
HMC129ALC4
TOP VIEW
(Not to Scale)
15 GND
14 NIC
13 NIC
GND
NIC
NIC
PACKAGE
BASE
GND
NOTES
1. NIC = NOT INTERNALLY CONNECTED. THESE
PINS CAN BE CONNECTED TO RF/DC
GROUND. PERFORMANCE IS NOT AFFECTED.
2. EXPOSED PAD. THE EXPOSED PAD MUST BE
CONNECTED TO RF/DC GROUND.
Figure 2. Pin Configuration
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1, 5, 6, 7, 11 to 14, NIC
18 to 24
Not Internally Connected. These pins can be connected to RF/dc ground. Performance is not affected.
2, 4, 8, 10, 15, 17
3
9
GND
RF
IF
Ground. These pins and package bottom must be connect to RF/dc ground.
Radio Frequency Port. This pin is ac-coupled and matched to 50 Ω.
Intermediate Frequency Port. This pin is dc-coupled. For applications not requiring operation to dc, dc
block this port externally using a series capacitor of a value chosen to pass the necessary IF frequency
range. For operation to dc, this pin must not source/sink more than 6 mA of current or die malfunction
and possible die failure may result.
16
LO
EPAD
Local Oscillator Port. This pin is dc-coupled and matched to 50 Ω.
Exposed Pad. The exposed pad must be connected to RF/dc ground.
INTERFACE SCHEMATICS
GND
IF
Figure 5. IF Interface Schematic
Figure 3. GND Interface Schematic
RF
LO
Figure 6. RF Interface Schematic
Figure 4. LO Interface Schematic
Rev. 0 | Page 5 of 16
HMC129ALC4
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
DOWNCONVERTER PERFORMANCE
Downconverter performance at IF = 100 MHZ, upper sideband (low-side LO).
0
0
–5
–5
–10
–15
–10
–15
–20
18dBm
15dBm
13dBm
11dBm
+85°C
+25°C
–40°C
–20
3
4
5
6
7
8
9
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 7. Conversion Gain vs. RF Frequency
at Various Temperatures, LO = 15 dBm
Figure 10. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
25
20
15
10
30
25
20
15
10
18dBm
15dBm
13dBm
11dBm
+85°C
+25°C
–40°C
3
4
5
6
7
8
9
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 8. Input IP3 vs. RF Frequency at Various Temperatures, LO = 15 dBm
Figure 11. Input IP3 vs. RF Frequency at Various LO Power Levels, TA = 25°C
20
15
10
5
0
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
Figure 9. Noise Figure vs. RF Frequency at 25°C, LO = 15 dBm
Rev. 0 | Page 6 of 16
Data Sheet
HMC129ALC4
Downconverter P1dB and IP2
IF = 100 MHZ, upper sideband (low-side LO).
18
18
17
16
15
14
13
12
11
10
9
+85°C
17
+25°C
–40°C
16
15
14
13
12
11
10
9
18dBm
15dBm
13dBm
8
8
3
4
5
6
7
8
9
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 12. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 14. Input P1dB vs. RF Frequency at Various LO Power Levels, TA = 25°C
80
70
60
50
80
70
60
50
+85°C
+25°C
–40°C
18dBm
15dBm
13dBm
11dBm
40
40
3
4
5
6
7
8
9
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 13. Input IP2 vs. RF Frequency at Various Temperatures, LO = 15 dBm
Figure 15. Input IP2 vs. RF Frequency at Various LO Power Levels, TA = 25°C
Rev. 0 | Page 7 of 16
HMC129ALC4
Data Sheet
UPCONVERTER PERFORMANCE
Upconverter performance at IF = 100 MHZ, upper sideband.
0
0
–5
–5
–10
–15
–10
–15
–20
18dBm
15dBm
13dBm
11dBm
+85°C
+25°C
–40°C
–20
3
4
5
6
7
8
9
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 16. Conversion Gain vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 19. Conversion Gain vs. RF Frequency at Various LO Power Levels,
TA = 25°C
30
25
20
15
30
25
20
15
10
5
10
18dBm
15dBm
13dBm
11dBm
+85°C
+25°C
–40°C
5
3
4
5
6
7
8
9
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 17. Input IP3 vs. RF Frequency at Various Temperatures, LO = 15 dBm
Figure 20. Input IP3 vs. RF Frequency at Various LO Power Levels, TA = 25°C
14
14
+85°C
+25°C
–40°C
12
10
8
12
10
8
6
6
18dBm
15dBm
13dBm
4
4
3
4
5
6
7
8
9
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 18. Input P1dB vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 21. Input P1dB vs. RF Frequency at Various LO Power Levels, TA = 25°C
Rev. 0 | Page 8 of 16
Data Sheet
HMC129ALC4
ISOLATION AND RETURN LOSS
Downconverter performance at IF = 100 MHZ, upper sideband.
70
70
60
50
40
30
20
10
0
60
50
40
30
20
18dBm
15dBm
13dBm
11dBm
+85°C
+25°C
–40°C
10
0
3
4
5
6
7
8
9
3
4
5
6
7
8
9
LO FREQUENCY (GHz)
LO FREQUENCY (GHz)
Figure 22. LO to RF Isolation vs. LO Frequency at Various Temperatures,
LO = 15 dBm
Figure 25. LO to RF Isolation vs. LO Frequency
at Various LO Power levels, TA = 25°C
70
60
50
40
30
70
60
50
40
30
20
10
0
20
18dBm
+85°C
+25°C
–40°C
10
15dBm
13dBm
11dBm
0
3
4
5
6
7
8
9
3
4
5
6
7
8
9
LO FREQUENCY (GHz)
LO FREQUENCY (GHz)
Figure 23. LO to IF Isolation vs. LO Frequency at Various Temperatures,
LO = 15 dBm
Figure 26. LO to IF Isolation vs. LO Frequency at Various LO Power Levels, TA
25°C
=
60
50
40
30
20
60
50
40
30
20
18dBm
15dBm
13dBm
11dBm
+85°C
+25°C
–40°C
10
0
10
0
3
4
5
6
7
8
9
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
RF FREQUENCY (GHz)
Figure 24. RF to IF Isolation vs. RF Frequency at Various Temperatures,
LO = 15 dBm
Figure 27. RF to IF Isolation vs. RF Frequency at Various LO Power Levels,
A = 25°C
T
Rev. 0 | Page 9 of 16
HMC129ALC4
Data Sheet
0
0
–5
–5
–10
–15
–20
–10
–15
–20
–25
–30
–35
3
4
5
6
7
8
9
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
LO FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 28. LO Return Loss vs. LO Frequency at 25°C, LO = 15 dBm
Figure 30. IF Return Loss vs. IF Frequency at 25°C, LO = 6 GHz, 15 dBm
0
–5
–10
–15
–20
–25
–30
–35
–40
3
4
5
6
7
8
9
RF FREQUENCY (GHz)
Figure 29. RF Return Loss vs. RF Frequency at 25°C, LO = 6 GHz, 15 dBm
Rev. 0 | Page 10 of 16
Data Sheet
HMC129ALC4
IF BANDWIDTH—DOWNCONVERTER
Upper sideband, LO frequency = 6 GHz
0
0
–5
–5
–10
–15
–20
–10
–15
–20
+85°C
+25°C
–40°C
18dBm
15dBm
13dBm
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
IF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 31. Conversion Gain vs. IF Frequency at Various Temperatures,
LO = 15 dBm
Figure 33. Conversion Gain vs. IF Frequency at Various LO Power Levels,
TA = 25°C
30
25
20
15
30
25
20
15
10
+85°C
+25°C
–40°C
18dBm
15dBm
13dBm
10
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
IF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 32. Input IP3 vs. IF Frequency at Various Temperatures,
LO = 15 dBm
Figure 34. Input IP3 vs. IF Frequency at Various LO Power Levels, TA = 25°C
Rev. 0 | Page 11 of 16
HMC129ALC4
Data Sheet
IF BANDWIDTH—UPCONVERTER
Upper sideband, LO frequency = 6 GHz.
0
0
–5
18dBm
15dBm
13dBm
–5
–10
–15
–20
–10
–15
–20
+85°C
+25°C
–40°C
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
IF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 35. Conversion Gain vs. IF Frequency at Various Temperatures,
LO = 15 dBm
Figure 37. Conversion Gain vs. IF Frequency at Various LO Power Levels,
A = 25°C
T
30
30
25
20
15
10
+85°C
+25°C
–40°C
18dBm
15dBm
13dBm
25
20
15
10
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
IF FREQUENCY (GHz)
IF FREQUENCY (GHz)
Figure 36. Input IP3 at vs. IF Frequency at Various Temperatures,
LO = 15 dBm
Figure 38. Input IP3 vs. IF Frequency at Various LO Power Levels, TA = 25°C
Rev. 0 | Page 12 of 16
Data Sheet
HMC129ALC4
Upconverter M × N Spurious Outputs
SPURIOUS AND HARMONICS PERFORMANCE
Spur values are (M × IF) + (N × LO).
Mixer spurious products are measured in dBc from the IF
output power level. N/A means not applicable.
IF = 100 MHz at −10 dBm, LO = 6 GHz at 15 dBm.
Downconverter M × N Spurious Outputs
Spur values are (M × RF) − (N × LO).
N × LO
0
1
2
3
4
N/A
74
24
0
15
30
61
85
93
29
39
72
88
89
39
53
84
85
86
0
1
2
3
4
RF = 6.1GHz at −10 dBm , LO = 6 GHz at 15 dBm.
N × LO
103
102
101
67
64
93
M × IF
0
1
2
3
4
N/A
13
85
86
84
7
34
34
68
87
89
30
46
65
74
92
53
72
88
80
101
0
1
2
3
4
0
66
89
85
M × RF
Rev. 0 | Page 13 of 16
HMC129ALC4
Data Sheet
THEORY OF OPERATION
The HMC129ALC4 is a general-purpose, double-balanced
mixer that can be used as an upconverter or a downconverter
from 4 GHz to 8 GHz.
When used as an upconverter, the mixer upconverts intermediate
frequencies between dc and 3 GHz to radio frequencies between
4 GHz and 8 GHz.
When used as a downconverter, the HMC129ALC4 downconverts
radio frequencies (RF) between 4 GHz and 8 GHz to intermediate
frequencies (IF) between dc and 3 GHz.
Rev. 0 | Page 14 of 16
Data Sheet
HMC129ALC4
APPLICATIONS INFORMATION
TYPICAL APPLICATION CIRCUIT
EVALUATION PCB INFORMATION
Figure 39 shows the typical application circuit for the
Use RF circuit design techniques for the circuit board used in
the application. Ensure that signal lines have 50 Ω impedance,
and connect the package ground leads and the exposed pad
directly to the ground plane (see Figure 40). Use a sufficient
number of via holes to connect the top and bottom ground
planes. The evaluation circuit board shown in Figure 40 is
available from Analog Devices, Inc., upon request.
HMC129ALC4. The HMC129ALC4 is a passive device
and does not require any external components. The LO pin
is internally ac-coupled. The RF and IF pins are internally
dc-coupled. When IF operation to dc is not required, using an
external series capacitor is recommended, of a value chosen to
pass the necessary IF frequency range. When IF operation to dc
is required, do not exceed the IF source and sink current rating
specified in the Absolute Maximum Ratings section.
Table 5. List of Materials for Evaluation PCB
EV1HMC129ALC4
Item
J1 to J3
U1
Description
PCB mount SMA connector
HMC129ALC4
109726 evaluation board on Rogers 4350
NIC
GND
RF
1
2
3
4
5
6
18 NIC
HMC129ALC4
17
16
15
GND
LO
PCB1
RF
LO
GND
GND
NIC
1 109726 is the raw bare PCB identifier. Reference EV1HMC129ALC4 when
ordering the complete evaluation PCB.
14 NIC
13 NIC
NIC
IF
Figure 39. Typical Application Circuit
Figure 40. Evaluation PCB Top Layer
Rev. 0 | Page 15 of 16
HMC129ALC4
Data Sheet
OUTLINE DIMENSIONS
4.05
3.90 SQ
3.75
0.36
0.30
0.24
PIN 1
0.08
BSC
INDICATOR
PIN 1
24
19
18
1
0.50
BSC
2.60
2.50 SQ
2.40
EXPOSED
PAD
13
6
12
7
BOTTOM VIEW
2.50 REF
0.32
BSC
TOP VIEW
SIDE VIEW
1.00
0.90
0.80
3.10 BSC
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SEATING
PLANE
SECTION OF THIS DATA SHEET.
Figure 41. 24-Terminal Ceramic Leadless Chip Carrier (LCC)
(E-24-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
Temperature Range
MSL Rating2
Package Description
Package Option
Branding
HMC129ALC4
−40°C to +85°C
3
24-Terminal Ceramic LCC
E-24-1
H129A
XXXX
HMC129ALC4TR
−40°C to +85°C
3
3
24-Terminal Ceramic LCC
24-Terminal Ceramic LCC
Evaluation PCB Assembly
E-24-1
E-24-1
H129A
XXXX
H129A
XXXX
HMC129ALC4TR-R5 −40°C to +85°C
EV1HMC129ALC4
1 The HMC129ALC4, HMC129ALC4TR, and HMC129ALC4TR-R5 are RoHS compliant.
2 The peak reflow temperature is 260°C. See the Absolute Maximum Ratings section, Table 2.
©2017 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D13882-0-7/17(0)
Rev. 0 | Page 16 of 16
相关型号：
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