ADCMP605_15 [ADI]

Rail-to-Rail, Very Fast, 2.5 V to 5.5 V;
ADCMP605_15
型号: ADCMP605_15
厂家: ADI    ADI
描述:

Rail-to-Rail, Very Fast, 2.5 V to 5.5 V

文件: 总14页 (文件大小:301K)
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Rail-to-Rail, Very Fast, 2.5 V to 5.5 V,  
Single-Supply LVDS Comparators  
Data Sheet  
ADCMP604/ADCMP605  
FEATURES  
FUNCTIONAL BLOCK DIAGRAM  
V
CCO  
Fully specified rail to rail at VCCI = 2.5 V to 5.5 V  
Input common-mode voltage from −0.2 V to VCCI + 0.2 V  
Low glitch LVDS-compatible output stage  
1.6 ns propagation delay  
V
CCI  
(ADCMP605 ONLY)  
V
NONINVERTING  
INPUT  
P
Q OUTPUT  
Q OUTPUT  
37 mW at 2.5 V  
Shutdown pin  
Single-pin control for programmable hysteresis and latch  
Power supply rejection > 60 dB  
ADCMP604/  
ADCMP605  
LVDS  
V
INVERTING  
INPUT  
N
−40°C to +125°C operation  
LE/HYS INPUT  
(ADCMP605  
ONLY)  
S
INPUT  
DN  
APPLICATIONS  
Figure 1.  
High speed instrumentation  
Clock and data signal restoration  
Logic level shifting or translation  
Pulse spectroscopy  
High speed line receivers  
Threshold detection  
Peak and zero-crossing detectors  
High speed trigger circuitry  
Pulse-width modulators  
Current-/voltage-controlled oscillators  
Automatic test equipment (ATE)  
GENERAL DESCRIPTION  
A flexible power supply scheme allows the devices to operate  
with a single 2.5 V positive supply and a −0.5 V to +2.7 V input  
signal range up to a 5.5 V positive supply with a −0.5 V to +5.7 V  
input signal range. Split input/output supplies, with no sequencing  
restrictions on the ADCMP605, support a wide input signal  
range with greatly reduced power consumption.  
The ADCMP604/ADCMP605 are very fast comparators fabricated  
on the Analog Devices, Inc. proprietary XFCB2 process. These  
comparators are exceptionally versatile and easy to use. Features  
include an input range from VEE − 0.5 V to VCCI + 0.2 V, l ow noi s e ,  
LVDS-compatible output drivers, and TTL/CMOS latch inputs  
with adjustable hysteresis and/or shut-down inputs.  
The LVDS-compatible output stage is designed to drive any  
standard LVDS input. The comparator input stage offers robust  
protection against large input overdrive, and the outputs do not  
phase reverse when the valid input signal range is exceeded. High  
speed latch and programmable hysteresis features are also provided  
in a unique single-pin control option.  
The devices offer 1.5 ns propagation delays with 1 ps rms  
random jitter (RJ). Overdrive and slew rate dispersion are  
typically less than 50 ps.  
The ADCMP604 is available in a 6-lead SC70 package, and the  
ADCMP605 is available in a 12-lead LFCSP.  
Rev. B  
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rights of third parties that may result from its use. Specifications subject to change without notice. No  
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Tel: 781.329.4700 ©2006–2014 Analog Devices, Inc. All rights reserved.  
Technical Support  
www.analog.com  
 
 
 
 
ADCMP604/ADCMP605  
Data Sheet  
TABLE OF CONTENTS  
Features .............................................................................................. 1  
Applications Information.............................................................. 10  
Power/Ground Layout and Bypassing..................................... 10  
LVDS-Compatible Output Stage.............................................. 10  
Using/Disabling the Latch Feature........................................... 10  
Optimizing Performance........................................................... 10  
Comparator Propagation Delay Dispersion ........................... 11  
Comparator Hysteresis .............................................................. 11  
Crossover Bias Points................................................................. 12  
Minimum Input Slew Rate Requirement................................ 12  
Typical Application Circuits ......................................................... 13  
Outline Dimensions....................................................................... 14  
Ordering Guide .......................................................................... 14  
Applications....................................................................................... 1  
Functional Block Diagram .............................................................. 1  
General Description......................................................................... 1  
Revision History ............................................................................... 2  
Specifications..................................................................................... 3  
Electrical Characteristics............................................................. 3  
Timing Information ......................................................................... 5  
Absolute Maximum Ratings............................................................ 6  
Thermal Resistance ...................................................................... 6  
ESD Caution.................................................................................. 6  
Pin Configurations and Function Descriptions ........................... 7  
Typical Performance Characteristics ............................................. 8  
REVISION HISTORY  
11/14—Rev. A to Rev. B  
Changes to Layout.............................................................................7  
Changes to Figure 8...........................................................................8  
Changes to Figure 14.........................................................................9  
Changes to Power/Ground Layout and Bypassing Section, and  
Using/Disabling the Latch Feature Section................................. 10  
Changes to Comparator Hysteresis Section................................ 11  
Changes to Crossover Bias Points Section .................................. 12  
Changes to Ordering Guide.......................................................... 14  
Changes to Figure 4 and Table 6 ..................................................... 7  
Changes to Figure 15 and Figure 16............................................... 9  
Updated Outline Dimensions ....................................................... 14  
Changes to Ordering Guide .......................................................... 14  
8/07—Rev. 0 to Rev. A  
Changes to Features and General Description ............................. 1  
Changes to Electrical Characteristics Section .............................. 3  
Changes to Table 3............................................................................ 6  
10/06—Revision 0: Initial Version  
Rev. B | Page 2 of 14  
 
Data Sheet  
ADCMP604/ADCMP605  
SPECIFICATIONS  
ELECTRICAL CHARACTERISTICS  
VCCI = VCCO = 2.5 V, T A = −40°C to +125°C, typical at TA = 25 °C, unless otherwise noted.  
Table 1.  
Parameter  
Symbol  
Conditions  
Min  
Typ Max  
VCCI + 0.2  
Unit  
DC INPUT CHARACTERISTICS  
Voltage Range  
Common-Mode Range  
Differential Voltage  
Offset Voltage  
Bias Current  
Offset Current  
Capacitance  
VP, VN  
VCCI = 2.5 V to 5.5 V  
VCCI = 2.5 V to 5.5 V  
VCCI = 2.5 V to 5.5 V  
−0.5  
−0.2  
V
V
V
VCCI + 0.2  
VCCI  
+5.0  
VOS  
IP, IN  
−5.0  
−5.0  
−2.0  
mV  
µA  
µA  
pF  
kΩ  
kΩ  
dB  
dB  
2
+5.0  
+2.0  
CP, CN  
1
Resistance, Differential Mode  
Resistance, Common Mode  
Active Gain  
−0.1 V to VCCI  
−0.5 V to VCCI + 0.5 V  
200  
100  
750  
370  
62  
7500  
4000  
AV  
CMRR  
Common-Mode Rejection Ratio  
VCCI = 2.5 V, VCCO = 2.5 V,  
50  
50  
V
CM = −0.2 V to +2.7 V  
VCCI = 2.5 V, VCCO = 5.0 V  
RHYS = ∞  
dB  
mV  
Hysteresis  
<0.1  
LATCH ENABLE PIN CHARACTERISTICS  
(ADCMP605 ONLY )  
VIH  
VIL  
IIH  
IIL  
Hysteresis is shut off  
Latch mode guaranteed  
VIH = VCCO + 0.2 V  
VIL = 0.4 V  
2.0  
−0.2  
−6  
VCCO  
+0.4 +0.8  
+6  
V
V
µA  
mA  
−0.1  
+0.1  
HYSTERESIS MODE AND TIMING (ADCMP605 ONLY )  
Hysteresis Mode Bias Voltage  
Minimum Resistor Value  
Hysteresis Current  
Latch Setup Time  
Latch Hold Time  
Latch-to-Output Delay  
Latch Minimum Pulse Width  
Current sink −1 µA  
Hysteresis = 120 mV  
Hysteresis = 120 mV  
VOD = 50 mV  
1.145 1.25 1.40  
V
30  
−25  
110  
−8  
kΩ  
µA  
ns  
ns  
ns  
ns  
tS  
tH  
−2  
2.7  
20  
24  
VOD = 50 mV  
tPLOH, tPLOL VOD = 50 mV  
tPL  
VOD = 50 mV  
SHUTDOWN PIN CHARACTERISTICS (ADCMP605 ONLY )  
VIH  
VIL  
IIH  
IIL  
Comparator is operating  
Shutdown guaranteed  
VIH = VCCO  
VIL = 0 V  
10% output swing  
VOD = 50 mV, output valid  
2.0  
−0.2  
−6  
VCCO  
+0.4 +0.6  
V
V
µA  
mA  
ns  
ns  
+6  
−0.1  
Sleep Time  
Wake-Up Time  
tSD  
tH  
1.4  
25  
DC OUTPUT CHARACTERISTICS  
VCCI =VCCO = 2.5 V to 5.0 V  
(ADCMP604)  
VCCO = 2.5 V to 5.0 V (ADCMP605)  
RLOAD = 100 Ω  
RLOAD = 100 Ω  
RLOAD = 100 Ω  
RLOAD = 100 Ω  
Differential Output Voltage Level  
ΔVOD  
Common-Mode Voltage  
Peak-to-Peak Common-Mode Output  
VOD  
245  
350  
445  
50  
1.375  
50  
mV  
mV  
V
VOCI  
VOC (p-p)  
1.125  
mV  
Rev. B | Page 3 of 14  
 
 
ADCMP604/ADCMP605  
Data Sheet  
Parameter  
Symbol  
Conditions  
Min  
Typ Max  
Unit  
AC PERFORMANCE1  
Rise Time/Fall Time  
Propagation Delay  
tR, tF  
tPD  
10% to 90%  
VCCI = VCCO = 2.5 V to 5.0 V,  
VOD = 50 mV  
600  
1.6  
ps  
ns  
VCCI = VCCO = 2.5 V, VOD = 10 mV  
VCCI = VCCO = 2.5 V to 5.0 V  
VCCI = VCCO = 2.5 V to 5.0 V  
10 mV < VOD < 125 mV  
3.0  
70  
70  
1.6  
250  
500  
1.3  
ns  
ps  
ps  
ns  
ps  
MHz  
ns  
Propagation Delay Skew—Rising to Falling Transition  
Propagation Delay Skew—Q to QB  
Overdrive Dispersion  
Common-Mode Dispersion  
Input Bandwidth  
tPINSKEW  
VCM = −0.2 V to VCCI + 0.2 V  
Minimum Pulse Width  
PWMIN  
VCCI = VCCO = 2.5 V to 5.0 V,  
PWOUT = 90% of PWIN  
POWER SUPPLY  
Input Supply Voltage Range  
Output Supply Voltage Range  
Positive Supply Differential (ADCMP605)  
VCCI  
VCCO  
2.5  
2.5  
−3  
5.5  
5.0  
+3  
V
V
V
VCCI − VCCO Operating  
VCCI − VCCO Nonoperating  
−5.0  
+5.0  
21  
3.0  
23  
55  
120  
V
Positive Supply Current (ADCMP604)  
Input Section Supply Current (ADCMP605)  
Output Section Supply Current (ADCMP605)  
Power Dissipation  
IVCCI/VCCO  
IVCCI  
VCCI = VCCO = 2.5 V to 5.0 V  
VCCI = 2.5 V to 5.5 V  
15  
1.6  
15  
37  
95  
mA  
mA  
mA  
mW  
mW  
dB  
mA  
µA  
IVCCO  
PD  
VCCO = 2.5 V to 5.0 V  
VCCI = VCCO = 2.5 V  
VCCI = VCCO = 5.0 V  
Power Supply Rejection Ratio  
Shutdown Mode ICCI  
Shutdown Mode ICCO  
PSRR  
VCCI = VCCO = 2.5 V to 5.0 V  
VCCI = VCCO = 2.5 V to 5.0 V  
VCCI = VCCO = 2.5 V to 5.0 V  
−50  
−30  
0.92 1.1  
+30  
1 VIN = 100 mV square input at 50 MHz, VOD = 50 mV, VCM = 1.25 V, VCCI = VCCO = 2.5 V, unless otherwise noted.  
Rev. B | Page 4 of 14  
Data Sheet  
ADCMP604/ADCMP605  
TIMING INFORMATION  
Figure 2 illustrates the ADCMP604/ADCMP605 latch timing relationships. Table 2 provides definitions of the terms shown in Figure 2.  
1.1V  
LATCH ENABLE  
tS  
tPL  
tH  
V
IN  
DIFFERENTIAL  
INPUT VOLTAGE  
V
± V  
OS  
N
V
OD  
tPDL  
tPLOH  
Q OUTPUT  
50%  
50%  
tF  
tPDH  
Q OUTPUT  
tPLOL  
tR  
Figure 2. System Timing Diagram  
Table 2. Timing Descriptions  
Symbol Timing  
Description  
tPDH  
tPDL  
tPLOH  
tPLOL  
tH  
Input-to-Output High Delay  
Propagation delay measured from the time the input signal crosses the reference  
( the input offset voltage) to the 50% point of an output low-to-high transition.  
Propagation delay measured from the time the input signal crosses the reference  
( the input offset voltage) to the 50% point of an output high-to-low transition.  
Propagation delay measured from the 50% point of the latch enable signal low-to-high  
transition to the 50% point of an output low-to-high transition.  
Propagation delay measured from the 50% point of the latch enable signal low-to-high  
transition to the 50% point of an output high-to-low transition.  
Input-to-Output Low Delay  
Latch Enable-to-Output High Delay  
Latch Enable-to-Output Low Delay  
Minimum Hold Time  
Minimum time after the negative transition of the latch enable signal that the input signal  
must remain unchanged to be acquired and held at the outputs.  
tPL  
tS  
Minimum Latch Enable Pulse Width Minimum time that the latch enable signal must be high to acquire an input signal change.  
Minimum Setup Time  
Output Rise Time  
Output Fall Time  
Minimum time before the negative transition of the latch enable signal occurs that an  
input signal change must be present to be acquired and held at the outputs.  
Amount of time required to transition from a low to a high output as measured at the  
20% and 80% points.  
Amount of time required to transition from a high to a low output as measured at the  
20% and 80% points.  
tR  
tF  
VOD  
Voltage Overdrive  
Difference between the input voltages, VA and VB.  
Rev. B | Page 5 of 14  
 
 
 
ADCMP604/ADCMP605  
Data Sheet  
ABSOLUTE MAXIMUM RATINGS  
THERMAL RESISTANCE  
Table 3.  
θJA is specified for the worst-case conditions, that is, a device  
soldered in a circuit board for surface-mount packages.  
Parameter  
Rating  
Supply Voltages  
Input Supply Voltage (VCCI to GND)  
Output Supply Voltage (VCCO to GND)  
Positive Supply Differential (VCCI − VCCO  
Input Voltages  
−0.5 V to +6.0 V  
−0.5 V to +6.0 V  
−6.0 V to +6.0 V  
Table 4. Thermal Resistance  
Package Type  
1
θJA  
426  
62  
Unit  
°C/W  
°C/W  
)
6-Lead SC70 (KS-6)  
12-Lead LFCSP_VQ (CP-12-1)  
1 Measurement in still air.  
Input Voltage  
−0.5 V to VCCI + 0.5 V  
(VCCI + 0.5 V)  
50 mA  
Differential Input Voltage  
Maximum Input/Output Current  
Shutdown Control Pin  
Applied Voltage (SDN to GND)  
Maximum Input/Output Current  
Latch/Hysteresis Control Pin  
Applied Voltage (HYS to GND)  
Maximum Input/Output Current  
Output Current  
ESD CAUTION  
−0.5 V to VCCO + 0.5 V  
50 mA  
−0.5 V to VCCO + 0.5 V  
50 mA  
50 mA  
Temperature  
Operating Temperature Range, Ambient  
Operating Temperature, Junction  
Storage Temperature Range  
−40°C to +125°C  
150°C  
−65°C to +150°C  
Stresses at or above those listed under Absolute Maximum  
Ratings may cause permanent damage to the product. This is a  
stress rating only; functional operation of the product at these  
or any other conditions above those indicated in the operational  
section of this specification is not implied. Operation beyond  
the maximum operating conditions for extended periods may  
affect product reliability.  
Rev. B | Page 6 of 14  
 
 
 
Data Sheet  
ADCMP604/ADCMP605  
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS  
Q
1
2
3
6
5
4
Q
V
ADCMP604  
V
/V  
TOP VIEW  
EE  
CCI CCO  
(Not to Scale)  
V
V
P
N
Figure 3. ADCMP604 Pin Configuration  
Table 5. ADCMP604 Pin Function Descriptions (6-Lead SC70)  
Pin No. Mnemonic Description  
1
Q
Noninverting Output. Q is at logic high if the analog voltage at the noninverting input, VP, is greater than the  
analog voltage at the inverting input, VN.  
2
3
4
5
6
VEE  
VP  
VN  
VCCI/VCCO  
Q
Negative Supply Voltage.  
Noninverting Analog Input.  
Inverting Analog Input.  
Input Section Supply/Output Section Supply. VCCI and VCCO are shared pin.  
Inverting Output. Q is at logic low if the analog voltage at the noninverting input, VP, is greater than the analog  
voltage at the inverting input, VN.  
PIN 1  
INDICATOR  
9 V  
EE  
V
1
2
3
CCO  
ADCMP605  
TOP VIEW  
(Not to Scale)  
8 LE/HYS  
V
CCI  
7 S  
DN  
V
EE  
NOTES  
1. EXPOSED PAD. IF CONNECTED, THE  
EPAD MUST BE CONNECTED TO V  
.
EE  
Figure 4. ADCMP605 Pin Configuration  
Table 6. ADCMP605 Pin Function Descriptions (12-Lead LFCSP_VQ)  
Pin No.  
Mnemonic Description  
1
2
VCCO  
VCCI  
VEE  
Output Section Supply.  
Input Section Supply.  
Negative Supply Voltages.  
3, 5, 9, 11  
4
VP  
Noninverting Analog Input.  
6
VN  
Inverting Analog Input.  
7
8
10  
SDN  
LE/HYS  
Q
Shutdown. Drive this pin low to shut down the device.  
Latch/Hysteresis Control. Bias with resistor or current for hysteresis; drive low to latch.  
Inverting Output. Q is at Logic low if the analog voltage at the noninverting input, VP, is greater than the  
analog voltage at the inverting input, VN, if the comparator is in compare mode.  
12  
Q
Noninverting Output. Q is at Logic high if the analog voltage at the noninverting input, VP, is greater  
than the analog voltage at the inverting input, VN, if the comparator is in compare mode.  
Heat Sink Paddle  
VEE  
The metallic back surface of the package is electrically connected to VEE. It can be left floating because  
Pin 3, Pin 5, Pin 9, and Pin 11 provide adequate electrical connection. It can also be soldered to the  
application board if improved thermal and/or mechanical stability is desired.  
EPAD  
Exposed Pad. If connected, the EPAD must be connected to VEE.  
Rev. B | Page 7 of 14  
 
ADCMP604/ADCMP605  
Data Sheet  
TYPICAL PERFORMANCE CHARACTERISTICS  
VCCI = VCCO = 2.5 V, T A = 25°C, unless otherwise noted.  
800  
1.60  
1.50  
600  
400  
OUTPUT HI  
1.40  
1.30  
1.20  
V
= 2.5V  
V
= 5.5V  
CC  
CC  
200  
OUTPUT V  
CM  
0
–200  
–400  
1.10  
1.00  
0.90  
OUTPUT LO  
–600  
–800  
–1  
0
1
2
3
4
5
6
7
2.4  
2.9  
3.4  
3.9  
4.4  
(V)  
4.9  
5.4  
5.9  
LE/HYS PIN (V)  
V
CCO  
Figure 8. LVDS Output Level vs. VCCO (V)  
Figure 5. LE/HYS Pin Current vs. Voltage  
200  
150  
100  
850  
800  
750  
700  
V
= 2.5V  
V
= 5.5V  
CC  
CC  
+125°C  
50  
0
650  
600  
550  
500  
+25°C  
–40°C  
–50  
–100  
–150  
450  
400  
–1  
0
1
2
3
PIN (V)  
4
5
6
7
2.40 2.80 3.20 3.60 4.00 4.40 4.80 5.20 5.60 6.00  
S
V
(V)  
DN  
CCO  
Figure 9. LVDS Output Rise/Fall Time vs. VCCO (V)  
Figure 6. SDN Pin Current vs. Voltage  
250  
200  
150  
10  
8
+125°C  
+25°C  
–40°C  
6
4
2
0
–2  
100  
50  
0
–4  
–6  
V
= 2.5V  
CC  
–8  
V
= 5.5V  
CC  
–10  
–1.0 –0.5  
50  
100  
150  
200  
250  
300  
350  
400  
450  
500  
0.0  
0.5  
1.0  
1.5  
CC  
2.0  
2.5  
3.0  
3.5  
V
AT V = 2.5V  
HYSTERESIS RESISTOR (kΩ)  
CM  
Figure 10. Hysteresis vs. Hysteresis Resistor  
Figure 7. Input Bias Current vs. Input Common-Mode Voltage  
Rev. B | Page 8 of 14  
 
Data Sheet  
ADCMP604/ADCMP605  
350  
300  
250  
200  
0.44  
0.43  
0.42  
+125°C  
+25°C  
0.41  
0.40  
0.39  
0.38  
150  
100  
50  
–40°C  
–14  
0.37  
0.36  
0
0
–2  
–4  
–6  
–8  
–10  
–12  
–16 –18  
2.4  
3.4  
4.4  
(V)  
5.4  
HYS PIN CURRENT (µA)  
V
CCO  
Figure 11. Hysteresis vs. HYS Pin Current  
Figure 14. LVDS Output Swing vs. VCCO (V)  
3.5  
3.0  
2.5  
1.425V  
Q
2.0  
1.5  
1.0  
PROPAGATION  
DELAY  
Q
925.0mV  
2.000ns/DIV  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
OVERDRIVE (mV)  
Figure 12. Propagation Delay vs. Input Overdrive  
Figure 15. 50 MHz Output Voltage Waveform at VCCO = 2.5 V  
1.6  
1.5  
1.4  
1.3  
1.543V  
Q
PROPAGATION  
DELAY RISE ns  
PROPAGATION  
DELAY FALL ns  
Q
1.043V  
2.000ns/DIV  
–0.6 –0.2  
0.2  
0.6  
1.0  
1.4  
CC  
1.8  
2.2  
2.6  
3.0  
V
AT V (2.5V)  
CM  
Figure 13. Propagation Delay vs. Input Common-Mode Voltage  
Figure 16. 50 MHz Output Voltage Waveform at VCCO = 5.5 V  
Rev. B | Page 9 of 14  
 
ADCMP604/ADCMP605  
Data Sheet  
APPLICATIONS INFORMATION  
POWER/GROUND LAYOUT AND BYPASSING  
LVDS-COMPATIBLE OUTPUT STAGE  
The ADCMP604/ADCMP605 comparators are very high speed  
devices. Despite the low noise output stage, it is essential to use  
proper high speed design techniques to achieve the specified  
performance. Because comparators are uncompensated amplifiers,  
feedback in any phase relationship is likely to cause oscillations  
or undesired hysteresis. The use of low impedance supply planes is  
Specified propagation delay dispersion performance is only  
achieved by keeping parasitic capacitive loads at or below the  
specified minimums. The outputs of the ADCMP604 and  
ADCMP605 are designed to directly drive any standard  
LVDS-compatible input.  
USING/DISABLING THE LATCH FEATURE  
of critical importance particularly the output supply plane (VCCO  
)
The latch input is designed for maximum versatility. It can safely be  
left floating or it can be driven low by any standard TTL/CMOS  
device as a high speed latch. In addition, the pin can be operated as  
a hysteresis control pin with a bias voltage of 1.25 V nominal and  
an input resistance of approximately 70 kΩ. This allows the  
comparator hysteresis to be easily controlled by either a resistor or  
an inexpensive CMOS DAC. Driving this pin high or floating the  
pin disables all hysteresis.  
and the ground plane (GND). Individual supply planes are  
recommended as part of a multilayer board. Providing the  
lowest inductance return path for switching currents ensures  
the best possible performance in the target application.  
It is also important to adequately bypass the input and output  
supplies. Multiple high quality 0.01 µF bypass capacitors should  
be placed as close as possible to each of the VCCI and VCCO supply  
pins and should be connected to the GND plane with redundant  
vias. At least one of these should be placed to provide a physically  
short return path for output currents flowing back from ground  
to the VCCI pin and the VCCO pin. High frequency bypass capacitors  
should be carefully selected for minimum inductance and ESR.  
Parasitic layout inductance should also be strictly controlled to  
maximize the effectiveness of the bypass at high frequencies.  
Hysteresis control and latch mode can be used together if an  
open drain, an open collector, or a three-state driver is connected in  
parallel to the hysteresis control resistor or current source.  
Due to the programmable hysteresis feature, the logic threshold  
of the latch pin is approximately 1.1 V, regardless of VCCO  
.
OPTIMIZING PERFORMANCE  
If the package allows, and the input and output supplies have  
been connected separately (VCCI ≠ VCCO), be sure to bypass each  
of these supplies separately to the GND plane. Do not connect a  
bypass capacitor between these supplies. It is recommended that  
the GND plane separate the VCCI and VCCO planes when the  
circuit board layout is designed to minimize coupling between  
the two supplies to take advantage of the additional bypass  
capacitance from each respective supply to the ground plane.  
This enhances the performance when split input/output supplies  
are used. If the input and output supplies are connected together  
for single-supply operation (VCCI = VCCO), coupling between the  
two supplies is unavoidable; however, careful board placement  
can help keep output return currents away from the inputs.  
As with any high speed comparator, proper design and layout  
techniques are essential for obtaining the specified performance.  
Stray capacitance, inductance, inductive power and ground  
impedances, or other layout issues can severely limit performance  
and often cause oscillation. Large discontinuities along input  
and output transmission lines can also limit the specified  
pulse-width dispersion performance. The source impedance  
should be minimized as much as is practicable. High source  
impedance, in combination with the parasitic input capacitance  
of the comparator, causes an undesirable degradation in bandwidth  
at the input, thus degrading the overall response. Thermal noise  
from large resistances can easily cause extra jitter with slowly  
slewing input signals. Higher impedances encourage undesired  
coupling.  
Rev. B | Page 10 of 14  
 
 
 
 
 
Data Sheet  
ADCMP604/ADCMP605  
COMPARATOR PROPAGATION DELAY  
DISPERSION  
COMPARATOR HYSTERESIS  
The addition of hysteresis to a comparator is often desirable in a  
noisy environment, or when the differential input amplitudes  
are relatively small or slow moving. The transfer function for a  
comparator with hysteresis is shown in Figure 19. As the input  
voltage approaches the threshold (0 V, in this example) from  
below the threshold region in a positive direction, the comparator  
switches from low to high when the input crosses +VH/2. The  
new switching threshold becomes −VH/2. The comparator remains  
in the high state until the threshold, −VH/2, is crossed from  
below the threshold region in a negative direction. In this manner,  
noise or feedback output signals centered on 0 V input cannot  
cause the comparator to switch states unless it exceeds the region  
bounded by VH/2.  
The ADCMP604/ADCMP605 comparators are designed to reduce  
propagation delay dispersion over a wide input overdrive range  
of 5 mV to VCCI − 1 V. Propagation delay dispersion is the variation  
in propagation delay that results from a change in the degree of  
overdrive or slew rate (how far or how fast the input signal is  
driven past the switching threshold).  
Propagation delay dispersion is a specification that becomes  
important in high speed, time-critical applications, such as data  
communications, automatic test and measurement, and  
instrumentation. It is also important in event-driven applications,  
such as pulse spectroscopy, nuclear instrumentation, and  
medical imaging. Dispersion is defined as the variation in  
propagation delay as the input overdrive conditions are changed  
(see Figure 17 and Figure 18).  
OUTPUT  
The ADCMP604/ADCMP605 dispersion is typically <1.6 ns as  
the overdrive varies from 10 mV to 125 mV. This specification  
applies to both positive and negative signals because each of the  
ADCMP604 and ADCMP605 has substantially equal delays for  
positive-going and negative-going inputs and very low output  
skews.  
V
OH  
V
OL  
0V  
500mV OVERDRIVE  
INPUT  
–V  
2
+V  
2
H
H
INPUT VOLTAGE  
Figure 19. Comparator Hysteresis Transfer Function  
10mV OVERDRIVE  
V
± V  
OS  
The customary technique for introducing hysteresis into a  
comparator uses positive feedback from the output back to the  
input. One limitation of this approach is that the amount of  
hysteresis varies with the output logic levels, resulting in  
hysteresis that is not symmetric about the threshold. The  
external feedback network can also introduce significant  
parasitics that reduce high speed performance and induce  
oscillation in some cases.  
N
DISPERSION  
Q/Q OUTPUT  
Figure 17. Propagation Delay—Overdrive Dispersion  
INPUT VOLTAGE  
1V/ns  
The ADCMP605 comparator offers a programmable hysteresis  
feature that significantly improves accuracy and stability.  
Connecting an external pull-down resistor or a current source  
from the LE/HYS pin to GND varies the amount of hysteresis in  
a predictable and stable manner. Leaving the LE/HYS pin  
disconnected or driving it high removes hysteresis. The  
maximum hysteresis that can be applied using this pin is  
approximately 160 mV. Figure 20 illustrates the amount of  
hysteresis applied as a function of external resistor value. Figure 11  
illustrates hysteresis as a function of current.  
V
± V  
OS  
N
10V/ns  
DISPERSION  
Q/Q OUTPUT  
Figure 18. Propagation Delay—Slew Rate Dispersion  
Rev. B | Page 11 of 14  
 
 
 
 
 
ADCMP604/ADCMP605  
Data Sheet  
The hysteresis control pin appears as a 1.25 V bias voltage seen  
through a series resistance of 70 kΩ 20% throughout the  
hysteresis control range. The advantages of applying hysteresis  
in this manner are improved accuracy, improved stability, reduced  
component count, and maximum versatility. An external bypass  
capacitor is not recommended on the HYS pin because it would  
likely degrade the jitter performance of the device and impair the  
latch function. As described in the Using/Disabling the Latch  
Feature section, hysteresis control need not compromise the  
latch function.  
CROSSOVER BIAS POINTS  
Rail-to-rail inputs of this type, in both op amps and comparators,  
have a dual front-end design. Certain devices are active near the  
VCCI rail and others are active near the VEE rail. At some  
predetermined point in the common-mode range, a crossover  
occurs. At this point, normally VCCI/2, the direction of the bias  
current reverses and there are changes in measured offset  
voltages and currents.  
MINIMUM INPUT SLEW RATE REQUIREMENT  
250  
With the rated load capacitance and normal good PCB design  
practice, as discussed in the Optimizing Performance section,  
these comparators should be stable at any input slew rate with  
no hysteresis. Broadband noise from the input stage is observed  
in place of the violent chattering seen with most other high  
speed comparators. With additional capacitive loading or poor  
bypassing, oscillation is observed. This oscillation is due to the  
high gain bandwidth of the comparator in combination with  
feedback parasitics in the package and PCB. In many applications,  
chattering is not harmful.  
200  
150  
100  
V
= 2.5V  
CC  
50  
0
V
= 5.5V  
CC  
50  
100  
150  
200  
250  
300  
350  
400  
450  
500  
HYSTERESIS RESISTOR (kΩ)  
Figure 20. Hysteresis vs. RHYS Control Resistor  
Rev. B | Page 12 of 14  
 
 
 
Data Sheet  
ADCMP604/ADCMP605  
TYPICAL APPLICATION CIRCUITS  
2.5V TO 5V  
0.1µF  
2.5V  
INPUT  
2kΩ  
CMOS  
OUTPUT  
2kΩ  
ADCMP604  
LVDS  
PWM  
ADCMP604  
OUTPUT  
0.1µF  
INPUT  
1.25V  
±50mV  
Figure 21. Self-Biased, 50% Slicer  
INPUT  
1.25V  
REF  
2.5V TO 3.3V  
10kΩ  
10kΩ  
ADCMP601  
LVDS  
100Ω  
LVDS  
ADCMP604  
LE/HYS  
10kΩ  
82pF  
100kΩ  
Figure 22. LVDS to Repeater  
Figure 25. Oscillator and Pulse-Width Modulator  
2.5V TO 5V  
2.5V TO 5V  
ADCMP605  
ADCMP605  
LE/HYS  
DIGITAL  
INPUT  
74VHC  
1G07  
LE/HYS  
150kΩ  
DIGITAL  
74AHC  
INPUT  
1G07  
CONTROL  
VOLTAGE  
0V TO 2.5V  
150kΩ  
HYSTERESIS  
CURRENT  
10kΩ  
Figure 23. Hysteresis Adjustment with Latch  
Figure 26. Hysteresis Adjustment with Latch  
2.5V  
10kΩ  
LVDS  
82pF  
ADCMP605  
OUTPUT  
LE/HYS  
10kΩ  
CONTROL  
VOLTAGE  
0V TO 2.5V  
150kΩ  
150kΩ  
Figure 24. Voltage-Controlled Oscillator  
Rev. B | Page 13 of 14  
 
ADCMP604/ADCMP605  
OUTLINE DIMENSIONS  
Data Sheet  
2.20  
2.00  
1.80  
2.40  
2.10  
1.80  
6
1
5
2
4
3
1.35  
1.25  
1.15  
PIN 1  
1.30 BSC  
0.65 BSC  
1.00  
0.90  
0.70  
0.40  
0.10  
1.10  
0.80  
0.46  
0.36  
0.26  
0.30  
0.15  
0.22  
0.08  
0.10 MAX  
SEATING  
PLANE  
0.10 COPLANARITY  
COMPLIANT TO JEDEC STANDARDS MO-203-AB  
Figure 27. 6-Lead Thin Shrink Small Outline Transistor Package [SC70]  
(KS-6)  
Dimensions shown in millimeters  
3.15  
3.00 SQ  
0.60 MAX  
0.50  
BSC  
2.85  
0.60 MAX  
PIN 1  
INDICATOR  
12  
10  
9
7
2.95  
2.75 SQ  
2.55  
*
1.45  
1.30 SQ  
1.15  
1
PIN 1  
INDICATOR  
EXPOSED  
PAD  
0.75  
0.60  
0.50  
3
6
4
0.25 MIN  
TOP VIEW  
12° MAX  
BOTTOM VIEW  
0.80 MAX  
0.65 TYP  
FOR PROPER CONNECTION OF  
THE EXPOSED PAD, REFER TO  
THE PIN CONFIGURATION AND  
FUNCTION DESCRIPTIONS  
1.00  
0.85  
0.80  
0.05 MAX  
0.02 NOM  
SECTION OF THIS DATA SHEET.  
COPLANARITY  
0.08  
0.30  
0.23  
0.18  
SEATING  
PLANE  
0.20 REF  
*
COMPLIANT TO JEDEC STANDARDS MO-220-VEED-1  
EXCEPT FOR EXPOSED PAD DIMENSION.  
Figure 28. 12-Lead Lead Frame Chip Scale Package [LFCSP_VQ]  
3 mm × 3 mm Body, Very Thin Quad  
(CP-12-1)  
Dimensions shown in millimeters  
ORDERING GUIDE  
Package  
Option  
Model1  
Temperature Range  
−40°C to +125°C  
−40°C to +125°C  
−40°C to +125°C  
Package Description  
Branding  
G0Q  
G0Q  
ADCMP604BKSZ-R2  
ADCMP604BKSZ-REEL7  
ADCMP604BKSZ-RL  
EVAL-ADCMP604BKSZ  
ADCMP605BCPZ-WP  
ADCMP605BCPZ-R2  
ADCMP605BCPZ-R7  
EVAL-ADCMP605BCPZ  
6-Lead Thin Shrink Small Outline Transistor Package [SC70]  
6-Lead Thin Shrink Small Outline Transistor Package [SC70]  
6-Lead Thin Shrink Small Outline Transistor Package [SC70]  
Evaluation Board  
KS-6  
KS-6  
KS-6  
G0Q  
−40°C to +125°C  
−40°C to +125°C  
−40°C to +125°C  
12-Lead Lead Frame Chip Scale Package [LFCSP_VQ]  
12-Lead Lead Frame Chip Scale Package [LFCSP_VQ]  
12-Lead Lead Frame Chip Scale Package [LFCSP_VQ]  
Evaluation Board  
CP-12-1  
CP-12-1  
CP-12-1  
G0K  
G0K  
G0K  
1 Z = RoHS Compliant Part  
©2006–2014 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D05916-0-11/14(B)  
Rev. B | Page 14 of 14  
 
 

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