AP10N70R [A-POWER]

N-CHANNEL ENHANCEMENT MODE POWER MOSFET; N沟道增强型功率MOSFET
AP10N70R
型号: AP10N70R
厂家: ADVANCED POWER ELECTRONICS CORP.    ADVANCED POWER ELECTRONICS CORP.
描述:

N-CHANNEL ENHANCEMENT MODE POWER MOSFET
N沟道增强型功率MOSFET

文件: 总4页 (文件大小:98K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
AP10N70R/P-A  
Pb Free Plating Product  
Advanced Power  
Electronics Corp.  
N-CHANNEL ENHANCEMENT MODE  
POWER MOSFET  
100% Avalanche Rated Test  
Fast Switching Performance  
BVDSS  
RDS(ON)  
ID  
650V  
0.6Ω  
10A  
D
S
Simple Drive Requirement  
RoHS Compliant  
G
Description  
G
D
AP10N70 series are specially designed as main switching devices for  
TO-262(R)  
TO-220(P)  
S
universal 90~265VAC off-line AC/DC converter applications.Both TO-220  
and TO-262 type provide high blocking voltage to overcome voltage surge  
and sag in the toughest power system with the best combination of fast  
switching,ruggedized design and cost-effectiveness.  
The TO-220 and TO-262 package is universally preferred for all commercial-  
industrial applications. The device is suited for switch mode power supplies  
,DC-AC converters and high current high speed switching circuits.  
G
D
S
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
650  
Units  
V
VDS  
VGS  
Drain-Source Voltage  
Gate-Source Voltage  
V
± 30  
10  
ID@TC=25  
ID@TC=100℃  
IDM  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current1  
A
6.8  
40  
A
A
PD@TC=25℃  
Total Power Dissipation  
174  
1.39  
50  
W
Linear Derating Factor  
Single Pulse Avalanche Energy2  
W/℃  
mJ  
A
EAS  
IAR  
Avalanche Current  
10  
TSTG  
TJ  
Storage Temperature Range  
Operating Junction Temperature Range  
-55 to 150  
-55 to 150  
Thermal Data  
Symbol  
Parameter  
Thermal Resistance Junction-case  
Thermal Resistance Junction-ambient  
Value  
Unit  
/W  
/W  
Rthj-c  
Max.  
Max.  
0.72  
62  
Rthj-a  
Data & specifications subject to change without notice  
200519062-1/4  
AP10N70R/P-A  
Electrical Characteristics@Tj=25oC(unless otherwise specified)  
Symbol  
BVDSS  
RDS(ON)  
VGS(th)  
Parameter  
Test Conditions  
VGS=0V, ID=1.0mA  
Min. Typ. Max. Units  
Drain-Source Breakdown Voltage  
Static Drain-Source On-Resistance  
Gate Threshold Voltage  
650  
-
-
-
-
0.6  
4
V
Ω
V
VGS=10V, ID=5.0A  
VDS=VGS, ID=250uA  
-
2
gfs  
Forward Transconductance  
Drain-Source Leakage Current (Tj=25oC)  
Drain-Source Leakage Current (Tj=150oC)  
Gate-Source Leakage  
Total Gate Charge3  
VDS=10V, ID=5A  
5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
S
IDSS  
uA  
uA  
nA  
nC  
nC  
nC  
ns  
ns  
ns  
ns  
pF  
pF  
pF  
VDS=600V, VGS=0V  
VDS=480V, VGS=0V  
10  
100  
±100  
IGSS  
VGS  
=
± 30V  
Qg  
ID=10A  
35.9 57  
Qgs  
Qgd  
td(on)  
tr  
Gate-Source Charge  
Gate-Drain ("Miller") Charge  
Turn-on Delay Time3  
Rise Time  
VDS=480V  
VGS=10V  
VDD=300V  
ID=10A  
8.3  
-
-
-
-
-
-
11.5  
14.9  
19.7  
51.7  
23.3  
td(off)  
tf  
Turn-off Delay Time  
RG=10Ω,VGS=10V  
RD=30Ω  
Fall Time  
Ciss  
Coss  
Crss  
Rg  
Input Capacitance  
VGS=0V  
1950 3120  
Output Capacitance  
VDS=15V  
f=1.0MHz  
f=1.0MHz  
630  
20  
2
-
-
Reverse Transfer Capacitance  
Gate Resistance  
3
Source-Drain Diode  
Symbol  
Parameter  
Test Conditions  
Min. Typ. Max. Units  
VSD  
trr  
Forward On Voltage3  
Reverse Recovery Time2  
Tj=25, IS=10A, VGS=0V  
IS=10A, VGS=0V,  
dI/dt=100A/µs  
-
-
-
-
1.5  
V
640  
7460  
-
-
ns  
nC  
Qrr  
Reverse Recovery Charge  
Notes:  
1.Pulse width limited by safe operating area.  
2.Starting Tj=25oC , VDD=50V , L=1.0mH , RG=25Ω , IAS=10A.  
3.Pulse width <300us , duty cycle <2%.  
2/4  
AP10N70P/R-A  
20  
16  
12  
8
16  
12  
8
10V  
6.0V  
5.0V  
T C =25 o  
C
T C =150 o  
C
10V  
6.0V  
5.0V  
4.5V  
V
G = 4.0V  
4
4.5V  
4
V
G =4.0V  
0
0
0
10  
20  
30  
40  
0
5
10  
15  
20  
V DS , Drain-to-Source Voltage (V)  
V DS , Drain-to-Source Voltage (V)  
Fig 1. Typical Output Characteristics  
Fig 2. Typical Output Characteristics  
3
2
1
0
1.2  
1.1  
1
I D =5A  
V
G =10V  
0.9  
0.8  
25  
50  
75  
100  
125  
150  
25  
50  
75  
100  
125  
150  
T j , Junction Temperature ( o C )  
T j , Junction Temperature ( o C)  
Fig 3. Normalized BVDSS v.s. Junction  
Temperature  
Fig 4. Normalized On-Resistance  
v.s. Junction Temperature  
10  
1.5  
T j = 150 o  
C
T j = 25 o  
C
1
0.5  
0
1
0.1  
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
25  
50  
75  
100  
125  
150  
T j , Junction Temperature ( o C)  
V SD , Source-to-Drain Voltage (V)  
Fig 5. Forward Characteristic of  
Reverse Diode  
Fig 6. Gate Threshold Voltage v.s.  
Junction Temperature  
3/4  
AP10N70P/R-A  
f=1.0MHz  
C iss  
10000  
100  
1
16  
I D =10A  
V
V
V
DS =320V  
DS =400V  
DS =480V  
12  
C oss  
8
4
C rss  
0
0
20  
40  
60  
1
5
9
13  
17  
21  
25  
29  
V DS , Drain-to-Source Voltage (V)  
Q G , Total Gate Charge (nC)  
Fig 7. Gate Charge Characteristics  
Fig 8. Typical Capacitance Characteristics  
100  
10  
1
1
Duty factor=0.5  
0.2  
0.1  
100us  
1ms  
0.1  
0.05  
PDM  
10ms  
t
0.02  
T c =25 o  
Single Pulse  
C
T
100ms  
0.01  
Duty factor = t/T  
1S  
Peak Tj = PDM x Rthjc + TC  
Single Pulse  
DC  
0.01  
0.1  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
1
10  
100  
1000  
V DS , Drain-to-Source Voltage (V)  
t , Pulse Width (s)  
Fig 9. Maximum Safe Operating Area  
Fig 10. Effective Transient Thermal Impedance  
VG  
VDS  
90%  
QG  
10V  
QGD  
QGS  
10%  
VGS  
t
td(on) tr  
d(off) tf  
Q
Charge  
Fig 11. Switching Time Waveform  
Fig 12. Gate Charge Waveform  
4/4  

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