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MSYSTEM
RLF36100CU64AE1
POWERPACT R-FRAME, MOLDED CASE CIRCUIT BREAKER, 600V, 1000A, 3P, 50kA
SCHNEIDER
LT8300
42VIN Micropower No-Opto Isolated Flyback Converter with 65V/3.6A Switch
ADI
DYELEC
MSYSTEM
SANYOU
VISHAY
VISHAY
STM32G031F6U3TR
Arm® Cortex®-M0 32-bit MCU, up to 64 KB Flash, 8 KB RAM, 2x USART, timers, ADC, comm. I/Fs, 1.7-3.6V
STMICROELECTR
FRT-ZA-L
Space-saving Plug-in Signal Conditioners F-UNIT
MSYSTEM
W2SP-1AC-M2/N
Space-saving Dual Output Signal Conditioners Mini-MW Series
MSYSTEM
W2SP-232-R2/CE
Space-saving Dual Output Signal Conditioners Mini-MW Series
MSYSTEM
ROHM
LUMINUS
SANYOU
WALSIN
DEIAZ
VISHAY
HUAXINAN
W2SP-2AD-P/UL
Space-saving Dual Output Signal Conditioners Mini-MW Series
MSYSTEM
VISHAY
VISHAY
W2SP-12B-P/UL
Space-saving Dual Output Signal Conditioners Mini-MW Series
MSYSTEM
MSYSTEM
VISHAY
MSYSTEM
IMBG120R090M1H
是采用D2PAK-7L (TO-263-7)封装的1200 V, 90 mΩ CoolSiC™ SiC MOSFET，它基于先进的沟槽工艺，该工艺经过优化，兼具性能与可靠性。它采用改良版1200V SMD封装，将CoolSiC技术的低功耗特性与.XT互联技术相结合，可在电机驱动、充电模块以及工业电源等应用中实现最高效率和被动制冷。
INFINEON
VISHAY
NEXPERIA
W2SP-213-P
Space-saving Dual Output Signal Conditioners Mini-MW Series
MSYSTEM
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KYOCERA AVX
AMPHENOL
SAMTEC
WALSIN
VISHAY
MSYSTEM
GLENAIR
ITT
MICROSEMI
YAGEO
ECLIPTEK
ABRACON
MOLEX
VICOR
KEMET
MTRONPTI
TI
PANASONIC
CTS
SCHURTER
KNOWLES
MURATA
TE
TOREX
SILICON
BOURNS
GOLLEDGE
STMICROELECTRONICS
RCD
BEL
NXP
MICROCHIP
TDK
KOA
INFINEON
FOXCONN
EUROQUARTZ
MAXIM
LITTELFUSE
VCC
RENESAS
CDE
IDT
AVAGO
HONEYWELL
ONSEMI
FH
NICHICON
APITECH
ROHM
EPCOS
AGILENT
GRAYHILL
ADI
Carling Technologies
RICOH
