SOD323_07 [ZETEX]
Surface mounted, 2 pin package; 表面安装， 2引脚封装
| 型号： | SOD323_07 |
| 厂家： | 
ZETEX SEMICONDUCTORS |
| 描述： | Surface mounted, 2 pin package |
| 文件： | 总3页 (文件大小：189K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Package information - SOD323
Surface mounted, 2 pin package
Package outline
Top mark
H
Anode
Cathode
YZ
Cathode terminal is to RIGHT HAND side of part mark
Part marking text displayed is for example only
G
D
F
C
A
B
E
DIM
Millimeters
DIM
Millimeters
Min. Max.
Min.
Max.
1.16
0.10
-
A
B
C
D
0.91
0.00
-
E
F
0.127
1.52
1.11
2.46
0.200
1.77
1.37
2.71
G
H
0.33
0.40
Soldering footprint
0.63
0.025
0.83
0.033
1.6
0.063
mm
inches
2.85
0.112
Issue 3 - March 2007
© Zetex Semiconductors plc 2007
1
www.zetex.com
Package information - SOD323
Nominal weight
Nominal weight per device 4.9mg.
Tape and reel information
Tape width
(mm)
Reel size
(inches)
No. of
components
Tape option
indicator
Orientation
8
7
3,000
TA
Cathode
8
13
10,000
TC
Embossed carrier tape configuration
10 pitches culmulative
tolerance on tape
0.2mm ꢀ 0.008ꢁꢂ
P0
K
D
P2
t
E
Top cover
tape
SeeAN0ote 1
F
See Note 1
W
B0
P
B1
K0
See Note 1
D1
Center lines
of cavity
Embossment
User direction of feed
Dimensions
mm (inches)
Tape size (mm)
8
12
16
See note
12.10 (0.476)
24
*
*
*
*
A0, B0, K0
See note
See note
See note
B1 (max.)
4.55 (0.179)
8.20 (0.323)
20.10 (0.791)
D
1.50 + 0.10 - 0.00 1.50 + 0.10 - 0.00 1.50 + 0.10 - 0.00 1.50 + 0.10 - 0.00
D1 (max.)
1.00 (0.039)
1.75 0.10
1.50 (0.059)
1.75 0.10
1.50 (0.059)
1.75 0.10
1.50 (0.059)
1.75 0.10
E
F
3.50 0.10
5.50 0.05
7.50 0.10
11.50 0.10
(0.138 0.004)
(0.217 0.002)
(0.295 0.004)
(0.453 0.004)
P
4.00 0.10
(0.157 0.004)
4.00 0.10
(0.157 0.004)
8.00 0.10
4.00 0.10
(0.157 0.004)
8.00 0.10
(0.315 0.004)
12.00 0.10
(0.472 0.004)
4.00 0.10
(0.157 0.004)
to 20.00 0.10
(0.787 0.004)
in 4.00 (0.157)
increments
(0.315 0.004)
P0
P2
4.00 0.10
2.00 0.05
0.40
4.00 0.10
2.00 0.05
0.40
4.00 0.10
2.00 0.05
0.40
4.00 0.10
2.00 0.05
0.40
t (max.)
W
8.00 (0.315)
12.00 0.30
16.30 (0.642)
24.30 (0.957)
(0.472 0.012)
NOTES:
*
A0, B0 and K0 dimensions are determined with respect to EIA/JEDEC rotational and lateral movement requirements
(see fig. 1).
Issue 3 - March 2007
© Zetex Semiconductors plc 2007
2
www.zetex.com
Package information - SOD323
20° maximum
0.5mm
maximum
Component
cavity
center line
B0
0.5mm
maximum
20° maximum
Component
center line
A0
Sketch B (side or front sectional view)
Component rotation - side view
Sketch C (top view)
Component rotation - top view
Sketch A (top view)
Component lateral movement
Figure 1 - rotational and lateral movement
Reel configuration
Tape slot in core
for tape start.
2.5mm min. width,
10mm min. depth
T
B
D
A
C
N
Full radius
G
Tape option
A max.
B min.
C
D min.
N min.
TA
TC
179 (7.047)
25.0 (0.984)
20.2 (0.795)
13.00 - 13.02
(0.512 - 0.52)
1.5 (0.06)
50 (1.969)
330 (12.992)
Tape size
G
T max.
8mm
12mm
16mm
24mm
8.4 -9.9 (0.33 - 0.39)
12.4 -16.4 (0.49 - 0.569)
16.4 -18.4 (0.65 - 0.729 )
24.4 - 26.4 (0.96 – 1.039)
14.4 (0.567)
18.4 (0.724)
22.4 (0.882)
30.4 (1.197)
This publication is issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or
reproduced for any purpose or form part of any order or contact or be regarded as a representation relating to the products or services concerned.
The company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.
Issue 3 - March 2007
© Zetex Semiconductors plc 2007
3
www.zetex.com
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