SOD4001T-SH [LRC]
Surface Mount Glass Passivated Junction Rectifiers Reverse Voltage 50 to 1000V Forward Current 1.0A;
| 型号： | SOD4001T-SH |
| 厂家： | 
LESHAN RADIO COMPANY |
| 描述： | Surface Mount Glass Passivated Junction Rectifiers Reverse Voltage 50 to 1000V Forward Current 1.0A 光电二极管 |
| 文件： | 总11页 (文件大小：310K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SOD4001T-SH thru SOD4007T-SH
Surface Mount Glass Passivated Junction Rectifiers
Reverse Voltage 50 to 1000V Forward Current 1.0A
FEATURES
* Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
* High temperature metallurgically
bonded construction
* Cavity-free glass passivated junction
* Capable of meeting environmental standards
of MIL-S-19500
* 1.0 A operation at TA=75°C with no thermal runaway
* Typical IR less than 1.0µA
* High temperature soldering guaranteed:
260°C/10 seconds
Mechanical Data
Case: JEDEC SOD123-FL/MINI SMA, molded plastic over glass DIE
Terminals: Plated leads, solderable per
MIL-STD-750, Method 2026
We declare that the material of product is
Haloggen free (green epoxy compound)
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.0155 g
Handling precautin:None
Electrical Characteristic
1.Maximum & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
SOD40 SOD40 SOD40 SOD40 SOD40 SOD40 SOD40
01T-SH 02T-SH 03T-SH 04T-SH 05T-SH 06T-SH 07T-SH
Parameter Symbol
symbol
Unit
Device marking code
A1T
50
A2T
100
70
A3T
200
140
200
A4T
400
280
400
A5T
600
420
600
A6T
800
560
800
A7T
1000
700
Maximum repetitive peak reverse voltage
Maximum RMS voltage
VRRM
VRMS
VDC
V
V
V
35
Maximum DC blocking voltage
Maximum average forward rectified current
50
100
1000
1.0
30
18
IF(AV)
IFSM
A
A
lead length at T = 75°C(Note 1)
C
Peak forward surge current 8.3ms single half sine-wave
superimposed on rated load (JEDEC Method)
IRSM
reverse surger current(20mS)
mA
1800
110
Typical reverse recovery time (Note 1)
Typical thermal resistance (Note 2)
Operating junction temperature range
storage temperature range
trr
RθJA
TJ
ns
°C/W
°C
–55 to +150
–65 to +175
TSTG
°C
Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
SOD40 SOD40 SOD40 SOD40 SOD40 SOD40 SOD40
01T-SH 02T-SH 03T-SH 04T-SH 05T-SH 06T-SH 07T-SH
Parameter Symbol
symbol
Unit
V
VF
1.1
Maximum instantaneous forward voltage at 1.0A
5.0
50
Maximum DC reverse current TJ= 25°C
at rated DC blocking voltage TJ = 125°C
IR
µA
PF
15.0
Typical junction capacitance at 4.0V, 1MHz
CJ
NOTES:
1. IF = 0.5A, IR = 1.0A, IRR = 0.25A
2. 8.0mm2 (.013mm thick) land areas
SOD4001T-SH thru SOD4007T-SH
2.Ratings and Characteristic Curves ( TA = 25°C unless otherwise noted )
Fig. 2 – Maximum Non-repetitive Peak
Fig. 1 – Forward Current Derating Curve
Forward Surge Current
TJ = TJ max
60 Hz
8.3ms Single Half Sine-wave
(JEDEC Method)
Resistive or
Inductive Load
1.0
0.5
30
15
0.375" (9.5mm) Lead Length
0
0
1
10
100
0
25
50 75 100 125 150 175
CASE TEMPERATURE:Tc(°C)
Number of Cycles at 60Hz
Fig 3. – Typical Instantaneous Forward
Fig 4. – Typical Reverse Characteristics
Characteristics
10
100
10
1.0
Tj=125℃
Tj=75℃
Tj=25℃
0.1
0.01
1.0
TJ = 25°C
Pulse width = 300µs
1% Duty Cycle
0.1
0.001
0.01
0.6
0.8
1.0
1.2
1.4
1.6
0
20
40
60
80
100
Instantaneous Forward Voltage (V)
Percent of Rated Peak Reverse Voltage (%)
Fig 5. –typical transient thermal
Fig 6. – Typical Junction Capacitance
impedance
100
10
100
10
TJ = 25°C
f = 1.0 MHz
Vsig = 50mVp-p
1.0
0.1
1.0
0.01
0.1
1.0
10
100
0.1
1
10
100
t,Pulse duration,sec
Reverse Voltage (V)
SOD4001T-SH thru SOD4007T-SH
3. dimension:
SOD123-FL
MILLIMETERS
INCHES
MIN
0.138
0.029
0.103
0.063
DIM
MIN
3.5
MAX
3.9
MAX
0.159
0.037
0.119
0.079
A
B
C
D
E
H
J
0.75
2.6
0.95
3.0
1.6
2.0
0.45Typ
0.018Typ
0.9
1.2
0.036
0.005
0.047
0.009
0.12
0.22
0.8Typ
0.032Typ
K
Suggested solder pad layout
B
C
A
Dimensions in inches and (millimeters)
PACKAGE
SOD123-FL
A
B
C
0.044(1.10
0.040(1.00)
0.079(2.00)
Title:
DOC NO.： WI-258
Version: 5 Modification: 0
Page: 2
Power Diode SMD Package Pa cking Spec
5.1 、SMD Packing Reel Spec & Packing Quantity
5.1.1 Reel Packing
A. Reel Spec
unit：mm
A
B
C
W
Quantity/Reel
SPEC
SMA 7" reel
SMA13" reel
SMA-FL13" reel
TO277 13" reel
177.0±2.0 54.0±0.5
330.0±2.0 75.0±0.5
330.0±2.0 75.0±0.5
330.0±2.0 75.0±0.5
177.0±2.0 50.0±0.5
177.0±2.0 50.0±0.5
330.0±2.0 75.0±0.5
13.0±0.5
13.0±0.5
13.0±0.5
13.0±0.5
13.0±0.5
13.0±0.5
13.0±0.5
13.2±0.2
13.2±0.2
13.2±0.2
13.2±0.2
9.4±1.5
9.4±1.5
13.2±0.2
2K
5K
5K
5K
3K
3K
5K
SOD123FL 7" reel
SOD323HE 7" reel
SMB-FL 13" reel
B. 13" reel packing box
unit：mm
A
B
C
size
335±5.0
335±2.0
40±1.0
as per above packing
Spec
Q'ty/Box
SMA13" reel
TO277 13" reel
SMB-FL 13" reel
10K
10K
10K
Title:
DOC NO.： WI-258
DOC NO.： WI-258
Page: 3
Power Diode SMD Package Packing Spec
C. 7" reel packing box
unit：mm
A
B
C
SMA/SMA-FL 188±2.0
188±2.0
138±2.0
SOD123FL
SOD323HE
186±2.0
139±2.0
185±2.0
as per above packing
Q'ty/Box
16K
SMA/SMA-FL
SOD123FL
30K
SOD323HE
unit：mm
A
30K
D. reel packing carton
B
C
size
350±2.0
340±2.0
350±2.0
as per above packing
Spec
Q'ty/Carton
SMA/SMA-FL 7" reel
SMA13"reel
80K
80K
80K
80K
80K
SMA-FL13"reel
TO277 13" reel
SMB-FL 13" reel
unit：mm
A
B
C
SOD123FL
SOD323HE
455±2.0
400±2.0
410±2.0
as per above packing
Spec
SOD123-FL 7" reel
SOD323HE 7" reel
Q'ty/Carton
360K
5.1.2 Tape Spec
360K
A. Cover Tape
unit：mm
B
A
SMA
/SMA-FL
SMB-FL
/TO277
9.5±0.10
0.062±0.007
SOD123FL
SOD323HE
5.4±0.10
Title:
DOC NO.： WI-258
Version: 5 Modification: 0
Page: 4
Power Diode SMD Package Packing Spec
B. Carrier Tape
t
Do
P2
Po
B'
D1
P1
A'
A
B
SEC.:B-B'
Cathode(tape
hole side）
Ao
SEC.:A-A'
Item
W
SOD323HE SOD123FL SMA
SMA-FL
12±0.3
4±0.1
SMB-FL
12±0.3
TO277
8±0.3
8±0.3
12±0.3
4±0.1
12±0.3
P1
E
4±0.1
4±0.1
8±0.1
8±0.1
1.75±0.1
3.5±.05
1.75±0.1
3.5±.05
1.75±0.1
5.5±.05
1.75±0.1
5.5±.05
1.75±0.1
5.5±.05
1.55±0.05
1.5±0.1
4±0.1
1.75±0.1
5.5±0.05
1.55±0.05
1.55±0.05
4±0.1
F
D0
D1
P0
P2
10P0
A0
B0
K0
T
1.55±0.05 1.55±0.05 1.55±0.05 1.55±0.05
1.1±0.1
4±0.1
1.1±0.1
4±0.1
1.5±0.1
4±0.1
1.5±0.1
4±0.1
2±0.05
2±0.05
2±0.05
2±0.05
2±0.05
2±0.05
40±0.2
40±0.2
40±0.2
40±0.2
40±0.2
40±0.2
1.45±0.1
2.75±0.1
0.80±0.1
1.95±0.1
3.95±0.1
1.30±0.1
2.79±0.1
5.33±0.1
2.36±0.1
2.83±0.1
4.75±0.1
1.42±0.1
4.3±0.1
6.8±0.1
1.35±0.1
0.25±0.05
3.8±0.1
5.75±0.1
1.4±0.1
0.25±0.05
0.25±0.05 0.25±0.05 0.25±0.05 0.25±0.05
Title:
DOC NO.： WI-258
Version: 5
Modification: 0
Page: 5
Power Diode SMD Package Packing Spec
5.2、SMD Power Diode General Packing Spec
A. 7" reel
all labels will be at cathode side of reel
；
C
A
C
side
front
A:LRC label;
B:Environment Label C:Halide free label
B. 13" reel
A
A
A:LRC label;
B:Environment Labe C:Halide free label
C.Tape lead: face anode side of the reel,upper side is the tape lead position. All labels are at cathode side of the reel.
标题:
DOC NO.： WI-258
Version: 5
Modification: 0
Page: 6
Power Diode SMD Package Packing Spec
C. Label Content：
Two-dimension code
LRC Label
Manufacturing
P/N
Lot No.
Date code
Maker
Quantity
lot: 140106049X: 140106---2014/1/6；049----lot number:49；X：product code
Environment Label
Halide-free Label
Green
SOD4001T-SH thru SOD4007T-SH
Reel packing
APPOX.
GROSS
WEIGHT
(kg)
8.7
COMPONENT
SPACING
(mm)
CARTON
SIZE
(mm)
REEL
(PCS)
BOX
(pcs)
INNER BOX
(mm)
REEL DIA.
(mm)
CARTON
(PCS)
PACKAGE
SOD123-FL
REEL SIZE
7"
3,000
4.0
30,000
183*183*123
178
382*262*387
240,000
5.Suggested thermal profile for soldering process
1. Storage environment：Temperature=5~40℃ Humidity=55±25%
2. Reflow soldering of surface-mount device
3. Reflow soldering
Profile Feature
Average ramp-up rate(T
Preheat
Soldering Condition
L
to T
P
)
<3℃/sec
- Temperature Min(Tsmin)
- Temperature Max(Tsmax)
150℃
200℃
- Time(min to max)(t
Tsmax to T
- Ramp-up Rate
s
)
60~120sec
L
<3sec
Time maintained above:
L
- Temperature (T )
217℃
- Time(t
L
)
60-260sec
Peak Temperature(T
P
)
255 -0/+5℃
Time within 5℃ of actual Peak
10~30sec
P
Temperature(T )
Ramp-down Rate
<6℃/sec
Time 25℃ to Peak Temperature
<6minutes
SOD4001T-SH thru SOD4007T-SH
6.High reliability test capabilities
Item Test
Condition
Reference
at 260±5℃ for 10±2sec immerse
body into solder 1/16" ± 1/32"
MIL-STD-750D METHOD-2031
Solder Resistance
MIL-STD-202F METHOD-208
MIL-STD-750D METHOD-1038
Solderability
at 245±5℃ for 5 sec
High Temperature Reverse Bias
V
R
=80% rate at T=150℃ for 168hrs
j
Rated average rectifier current
TA=25℃ for 500hrs
MIL-STD-750D METHOD-1027
MIL-STD-750D METHOD-1036
Forward Operation Life
T
A=25℃，I
F
=I
O
On state:power on for 5 min.
Off state:power off for 5 min.
on and off for 500 cycles
Intermittent Operation Life
Pressure Cooker
15PSIG at TA=121℃ for 4hrs
JESD22-A102
-55℃ to +125℃ dwelled for 30 min.
and transferred for 5min. Total 10
cycles
MIL-STD-750D METHOD-1051
Temperature Cycling
0℃ for 5min. Rise to 100℃ for 5min.
Total 10 cycles
MIL-STD-750D METHOD-1056
MIL-STD-750D METHOD-4066-2
Thermal Shock
Forward Surge
8.3ms single half sine-wave
superimposed on rated load,one surge
MIL-STD-750D METHOD-1021
MIL-STD-750D METHOD-1031
Humidity
at TA=85℃，RH=85% for 1000hrs
at 175℃ for 1000hrs
High Temperature Storage Life
SOD4001T-SH thru SOD4007T-SH
7. Update Record
更新记录
第一版
更新作者
周杰
更新日期
版次
1
2013.07.19
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