ZL60401TBD [ZARLINK]
622 Mbps, 1310 nm Uncooled Fabry-Perot Laser Diode Module with Monitor; 高达622 Mbps ， 1310 nm的非制冷法布里 - 珀罗激光二极管模块与监控
| 型号： | ZL60401TBD |
| 厂家： | 
ZARLINK SEMICONDUCTOR INC |
| 描述： | 622 Mbps, 1310 nm Uncooled Fabry-Perot Laser Diode Module with Monitor |
| 文件： | 总9页 (文件大小：311K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ZL60401
622 Mbps, 1310 nm Uncooled Fabry-Perot
Laser Diode Module with Monitor
Data Sheet
December 2003
Ordering Information
ZL60401TBD TO-56 with lens
ZL60401TDD ST type connector
ZL60401TED SC type connector
ZL60401TFD FC type connector
-40°C to +85°C
Description
The Fabry-Perot Laser Diode Receptacle type series is
designed for use with SC, FC and ST type fiber
connectors as source in telecom and datacom
applications.
Features
•
•
•
•
•
•
Uncooled 1300 nm Fabry-Perot Laser Diode
Wide operating temperature range -40°C to +85°C
The ZL60401 is a 1310 nm MQW (Multiple Quantum
Well) Fabry-Perot laser diode, integrated with a
monitor diode.
High reliability
Built-in monitor diode
622 Mbps
The hermatically sealed package includes a ball lens
for improved coupling efficiency.
Ball lens or receptable type of packaging
Applications
•
Telecommunications applications, SONET OC-3,
OC-12, SDH STM-1 and STM-4
•
Optical communications systems
LD anode
case
Monitor Cathode
Monitor anode
LD Cathode
Monitor Anode
Case
LD Anode
Bottom View
LD Cathode
Monitor cathode
Figure 1 - PIN Diagram
Figure 2 - Functional Schematic
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2003, Zarlink Semiconductor Inc. All Rights Reserved.
ZL60401
Data Sheet
Electrical and Optical Characteristics (T = 25°C)
C
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Unit
Threshold Current
Operating Voltage
Optical Output Power
Wavelength
I
CW
10
1.3
0.6
1310
1
15
mA
V
th
V
CW, I = I +20 mA
1.5
op
f
th
P
CW, I = I +20 mA
mW
nm
nm
ps
f
f
th
λ
CW, I +20 mA
1290
1330
3
th
Spectral Width
∆λ
t , t
CW, I +20 mA
th
Rise and Fall Times
I = I +20 mA,
500
r
f
f
th
20-80%
Tracking Error
∆ P / P
APC, 0 - +70°C
-1.5
-2.5
100
1.5
2.5
dB
µA
f
f
-40°C - +85°C
Monitor Current
I
I
CW, I +20 mA,
th
D
D
V
= 1 V
RD
RD
Monitor Dark Current
Monitor Capacitance
V
= 5 V
1
µA
pF
C
V
= 5 V, f = 1 MHz
RD
10
15
D
Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
LD Reverse Voltage
PD Reverse Voltage
PD Forward Current
Operating Temperature
Storage Temperature
V
2
V
V
RL
V
20
RD
I
2.0
mA
°C
°C
f
T
-40 - +85
-40 - +85
op
T
stg
2
Zarlink Semiconductor Inc.
ZL60401
Data Sheet
+25 degrees C
1.20
1.00
0.80
0.60
0.40
0.20
0.00
0.045
0.04
0.035
0.03
0.025
0.02
0.015
0.01
0.005
0
Power
Slope efficiency
Forward Current (mA)
Figure 3 - Typical Fiber Coupled Power and Slope Efficiency at Room Temperature
-40 degrees C
1.20
1.00
0.80
0.60
0.40
0.20
0.00
0.05
0.045
0.04
0.035
0.03
0.025
0.02
0.015
0.01
0.005
0
Power
Slope efficiency
Forward Current (mA)
Figure 4 - Typical Fiber Coupled Power and Slope Efficiency at Low Temperature
3
Zarlink Semiconductor Inc.
ZL60401
Data Sheet
+85 degrees C
1.20
1.00
0.80
0.60
0.40
0.20
0.00
0.03
0.025
0.02
0.015
0.01
0.005
0
Power
Slope efficiency
Forward Current (mA)
Figure 5 - Typical Fiber Coupled Power and Slope Efficiency at High Temperature
4
Zarlink Semiconductor Inc.
FRONT VIEW ( 2 : 1 )
n2,501`0,001
SIDE VIEW
BOTTOM VIEW
n7
*
A
n0.25
A
r
11,7`0,6
8,9`0,1
6,75
* Slot side.
12,2`0,1
7,85`1
n2,3 THRU (2x)
14,7
ISOMETRIC VIEW
Connector housing (PA66, 13% Glass fibre)
NOTES:-
Component *
1. All dimensions in mm.
2. General tol. ISO-2768-mK.
Housing (Stainless steel X10CrNiS18-9)
* For details of the component, see separate data sheet and/or package drawing.
Projection
© Zarlink Semiconductor 2002. All rights reserved.
Package code
Drawing type
TE
ISSUE
ACN
1
Previous package codes
TO-56 Package Outline in SC
101512rev 1
Connector housing
17-NOV-03
DATE
Title
APPRD. PD\US
101512
FRONT VIEW ( 2 : 1 )
n2,501`0,001
SIDE VIEW
BOTTOM VIEW
M8 x 0.75-6g
n7
A
*
n0,25
A
r
n8,9
3,5
11,7`0,6
(2x)
R9,5
6,88`1
5,95
7,95
n2,2 THRU
* Slot side.
v n4 x1,45
ISOMETRIC VIEW
NOTES:-
Component *
1. All dimensions in mm.
2. General tol. ISO-2768-mK.
Housing (Stainless steel X10CrNiS18-9)
Projection
* For details of the component, see separate data sheet and/or package drawing.
© Zarlink Semiconductor 2002. All rights reserved.
Package code
Drawing type
TF
ISSUE
ACN
1
Previous package codes
TO-56 Package Outline in FC
101513 rev1
Connector housing
17-NOV-03
DATE
Title
APPRD. PD\US
101513
SIDE VIEW
BOTTOM VIEW ( 10 : 1 )
+3
11
4,1
-
0
0,38 Max
n2
+0
0,6
n5,6
n0,89 Max
n1 (3x)
-
0,03
Brazed
*
0,03
0,04
+
-
(4x)
n0,45
NOTES:-
R0,3 Max
1,2`0,075
1. All dimensions in mm.
2. General tol. ISO-2768-mK.
3. Coating: Case: Ni 3-7 µm.
Header: Ni 2-4 µm / Au 0,5 µm.
* Lens n1,5`0,002
Projection Method
© Zarlink Semiconductor 2002. All rights reserved.
Package code
TB
ISSUE
ACN
1
Drawing type
Previous package codes
Package Drawing, TO-56 with lens
101615 rev1
21-NOV-03
DATE
Title
APPRD. MD/MA
101615
BOTTOM VIEW
n7
FRONT VIEW ( 2 : 1 )
SIDE VIEW
3/8''-32 UNEF
2-56 UNC - 2B (2x)
n2,501`0,001
A
*
n0.25
A
r
n7
i 0.2 A
* Slot side.
4,38`1
7,6
+0
i 0.02
A
3,85
11,7`0,6
-
0,05
i 0.2 A
6,65
9,4
ISOMETRIC VIEW
14,2
16,2
17,7
Component *
NOTES:-
1. All dimensions in mm.
2. General tol. ±0.1 mm.
Connector housing (Stainless steel X10CrNiS18-9)
* For details of the component, see separate data sheet and/or package drawing.
Projection
© Zarlink Semiconductor 2002. All rights reserved.
Package code
Drawing type
TD
ISSUE
ACN
1
Previous package codes
TO-56 Package Outline in ST
101514 rev1
Connector housing
17-NOV-03
DATE
Title
APPRD. PD\US
101514
For more information about all Zarlink products
visit our Web Site at
www.zarlink.com
Information relating to products and services furnished herein by Zarlink Semiconductor Inc. or its subsidiaries (collectively “Zarlink”) is believed to be reliable.
However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such
information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or
use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual
property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. Purchasers of products are also hereby notified that the use of product in
certain ways or in combination with Zarlink, or non-Zarlink furnished goods or services may infringe patents or other intellectual property rights owned by Zarlink.
This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or reproduced for any purpose nor form part
of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other
information appearing in this publication are subject to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding the
capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute
any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user’s responsibility to fully determine the performance and
suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does
not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in
significant injury or death to the user. All products and materials are sold and services provided subject to Zarlink’s conditions of sale which are available on request.
Purchase of Zarlink’s I2C components conveys a licence under the Philips I2C Patent rights to use these components in and I2C System, provided that the system
conforms to the I2C Standard Specification as defined by Philips.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright Zarlink Semiconductor Inc. All Rights Reserved.
TECHNICAL DOCUMENTATION - NOT FOR RESALE
相关型号：
©2020 ICPDF网 联系我们和版权申明