ZL60404TBD [ZARLINK]
1.25 Gbps, 1310 nm Uncooled Fabry-Perot Laser Diode Module with Monitor; 1.25 Gbps的1310纳米的非制冷法布里 - 珀罗激光二极管模块与监控
| 型号： | ZL60404TBD |
| 厂家： | 
ZARLINK SEMICONDUCTOR INC |
| 描述： | 1.25 Gbps, 1310 nm Uncooled Fabry-Perot Laser Diode Module with Monitor |
| 文件： | 总9页 (文件大小：312K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ZL60404
1.25 Gbps, 1310 nm Uncooled Fabry-Perot
Laser Diode Module with Monitor
Data Sheet
December 2003
Ordering Information
ZL60404TBD TO-56 with lens
ZL60404TDD ST type connector
ZL60404TED SC type connector
ZL60404TFD FC type connector
-40°C to +85°C
Description
The Fabry-Perot Laser Diode Receptacle type series is
designed for use with SC, FC and ST type fiber
connectors as source in telecom and datacom
applications.
Features
•
•
•
•
•
•
Uncooled 1300 nm Fabry-Perot Laser Diode
Wide operating temperature range -40°C to +85°C
The ZL60404 is a 1310 nm MQW (Multiple Quantum
Well) Fabry-Perot laser diode, integrated with a
monitor diode.
High reliability
The hermatically sealed package includes a ball lens
for improved coupling efficiency.
Built-in monitor diode
1.25 Gbps
Ball lens or receptable type of packaging
Applications
•
Fiber Channel and Gigabit Ethernet applications
up to 1.25 Gbps
•
Optical communications systems
LD anode
case
Monitor Cathode
Monitor anode
LD Cathode
Monitor Anode
Case
LD Anode
Bottom View
LD Cathode
Monitor cathode
Figure 2 - Functional Schematic
Figure 1 - PIN Diagram
1
Zarlink Semiconductor Inc.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright 2003, Zarlink Semiconductor Inc. All Rights Reserved.
ZL60404
Data Sheet
Electrical and Optical Characteristics (T = 25°C)
C
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Unit
Threshold Current
Operating Voltage
Optical Output Power
Wavelength
I
CW
10
1.3
0.6
1310
1
15
mA
V
th
V
CW, I = I +20 mA
1.5
op
f
th
P
CW, I = I +20 mA
mW
nm
nm
ps
f
f
th
λ
CW, I +20 mA
1290
1330
3
th
Spectral Width
∆λ
t , t
CW, I +20 mA
th
Rise and Fall Times
I = I +20 mA,
300
r
f
f
th
20-80%
Tracking Error
∆ P / P
APC, 0 - +70°C
-1.5
-2.5
100
1.5
2.5
dB
µA
f
f
-40°C - +85°C
Monitor Current
I
I
CW, I +20 mA,
th
D
D
V
= 1 V
RD
RD
Monitor Dark Current
Monitor Capacitance
V
= 5 V
1
µA
pF
C
V
= 5 V, f = 1 MHz
RD
10
15
D
Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
LD Reverse Voltage
PD Reverse Voltage
PD Forward Current
Operating Temperature
Storage Temperature
V
2
V
V
RL
V
20
RD
I
2.0
mA
°C
°C
f
T
-40 - +85
-40 - +85
op
T
stg
2
Zarlink Semiconductor Inc.
ZL60404
Data Sheet
+25 degrees C
1.20
1.00
0.80
0.60
0.40
0.20
0.00
0.045
0.04
0.035
0.03
0.025
0.02
0.015
0.01
0.005
0
Power
Slope efficiency
Forward Current (mA)
Figure 3 - Typical Fiber Coupled Power and Slope Efficiency at Room Temperature
-40 degrees C
1.20
1.00
0.80
0.60
0.40
0.20
0.00
0.05
0.045
0.04
0.035
0.03
0.025
0.02
0.015
0.01
0.005
0
Power
Slope efficiency
Forward Current (mA)
Figure 4 - Typical Fiber Coupled Power and Slope Efficiency at Low Temperature
3
Zarlink Semiconductor Inc.
ZL60404
Data Sheet
+85 degrees C
1.20
1.00
0.80
0.60
0.40
0.20
0.00
0.03
0.025
0.02
0.015
0.01
0.005
0
Power
Slope efficiency
Forward Current (mA)
Figure 5 - Typical Fiber Coupled Power and Slope Efficiency at High Temperature
4
Zarlink Semiconductor Inc.
FRONT VIEW ( 2 : 1 )
n2,501`0,001
SIDE VIEW
BOTTOM VIEW
n7
*
A
n0.25
A
r
11,7`0,6
8,9`0,1
6,75
* Slot side.
12,2`0,1
7,85`1
n2,3 THRU (2x)
14,7
ISOMETRIC VIEW
Connector housing (PA66, 13% Glass fibre)
NOTES:-
Component *
1. All dimensions in mm.
2. General tol. ISO-2768-mK.
Housing (Stainless steel X10CrNiS18-9)
* For details of the component, see separate data sheet and/or package drawing.
Projection
© Zarlink Semiconductor 2002. All rights reserved.
Package code
Drawing type
TE
ISSUE
ACN
1
Previous package codes
TO-56 Package Outline in SC
101512rev 1
Connector housing
17-NOV-03
DATE
Title
APPRD. PD\US
101512
FRONT VIEW ( 2 : 1 )
n2,501`0,001
SIDE VIEW
BOTTOM VIEW
M8 x 0.75-6g
n7
A
*
n0,25
A
r
n8,9
3,5
11,7`0,6
(2x)
R9,5
6,88`1
5,95
7,95
n2,2 THRU
* Slot side.
v n4 x1,45
ISOMETRIC VIEW
NOTES:-
Component *
1. All dimensions in mm.
2. General tol. ISO-2768-mK.
Housing (Stainless steel X10CrNiS18-9)
Projection
* For details of the component, see separate data sheet and/or package drawing.
© Zarlink Semiconductor 2002. All rights reserved.
Package code
Drawing type
TF
ISSUE
ACN
1
Previous package codes
TO-56 Package Outline in FC
101513 rev1
Connector housing
17-NOV-03
DATE
Title
APPRD. PD\US
101513
SIDE VIEW
BOTTOM VIEW ( 10 : 1 )
+3
11
4,1
-
0
0,38 Max
n2
+0
0,6
n5,6
n0,89 Max
n1 (3x)
-
0,03
Brazed
*
0,03
0,04
+
-
(4x)
n0,45
NOTES:-
R0,3 Max
1,2`0,075
1. All dimensions in mm.
2. General tol. ISO-2768-mK.
3. Coating: Case: Ni 3-7 µm.
Header: Ni 2-4 µm / Au 0,5 µm.
* Lens n1,5`0,002
Projection Method
© Zarlink Semiconductor 2002. All rights reserved.
Package code
TB
ISSUE
ACN
1
Drawing type
Previous package codes
Package Drawing, TO-56 with lens
101615 rev1
21-NOV-03
DATE
Title
APPRD. MD/MA
101615
BOTTOM VIEW
n7
FRONT VIEW ( 2 : 1 )
SIDE VIEW
3/8''-32 UNEF
2-56 UNC - 2B (2x)
n2,501`0,001
A
*
n0.25
A
r
n7
i 0.2 A
* Slot side.
4,38`1
7,6
+0
i 0.02
A
3,85
11,7`0,6
-
0,05
i 0.2 A
6,65
9,4
ISOMETRIC VIEW
14,2
16,2
17,7
Component *
NOTES:-
1. All dimensions in mm.
2. General tol. ±0.1 mm.
Connector housing (Stainless steel X10CrNiS18-9)
* For details of the component, see separate data sheet and/or package drawing.
Projection
© Zarlink Semiconductor 2002. All rights reserved.
Package code
Drawing type
TD
ISSUE
ACN
1
Previous package codes
TO-56 Package Outline in ST
101514 rev1
Connector housing
17-NOV-03
DATE
Title
APPRD. PD\US
101514
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Copyright Zarlink Semiconductor Inc. All Rights Reserved.
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