SP8604ACM [ZARLINK]
ADVANCE INFORMATION; 超前信息
| 型号： | SP8604ACM |
| 厂家： | 
ZARLINK SEMICONDUCTOR INC |
| 描述： | ADVANCE INFORMATION |
| 文件： | 总7页 (文件大小：321K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
This product is obsolete.
This information is available for your
convenience only.
For more information on
Zarlink’s obsolete products and
replacement product lists, please visit
http://products.zarlink.com/obsolete_products/
THIS DOCUMENT IS FOR MAINTENANCE
PURPOSES ONLY AND IS NOT
RECOMMENDED FOR NEW DESIGNS
ADVANCE INFORMATION
DS3658-1·2
SP8602 500MHz42
SP8604 300MHz42
The SP8602 and SP8604 are emitter coupled logic dividers
which feature ECL10K compatible outputs when used with
external pulldown resistors. The inputs are AC coupled.
V
EE
(CASE)
FEATURES
OUTPUT
CLOCK INPUT
■ ECL Compatible Outputs
■ AC-Coupled Inputs (Internal Bias)
8
1
7
5
6
2
OUTPUT
CLOCK INPUT
3
4
QUICK REFERENCE DATA
■ Supply Voltage: 25·2V
■ Power Consumption: 85mW
■Temperature Range:
V
CC
(0V)
INTERNAL BIAS
DECOUPLING
NC
CM8
Fig. 1 Pin connections - bottom view
255°C to 1125°C (A Grade)
230°C to 170°C (B Grade)
ORDERING INFORMATION
ABSOLUTE MAXIMUM RATINGS
28V
10mA
265°C to 1150°C
1175°C
Supply voltage, VEE
Output current
Storage temperature range
Max. junction temperature
Max. clock input voltage
SP8602 A CM
SP8602 B CM
SP8604 A CM
SP8604 B CM
5962-92059 (SMD) (SP8602)
2·5V p-p
INTERNAL BIAS
V
(0V)
5
DECOUPLING
CC
3
6
7
1
2
OUTPUT
OUTPUT
CLOCK INPUT
DIVIDE BY
2
CLOCK INPUT
8
V
EE
Fig. 2 Functional diagram
SP8602/4
ELECTRICAL CHARACTERISTICS
Unless otherwise stated, the Electrical Characteristics are guaranteed over specified supply, frequency and temperature range
Supply voltage, VCC = 0V, VEE = 25·2V 6 0·25V
Temperature, TAMB = 255°C to 1125°C (A Grade), 230°C to 170°C (B Grade)
Value
Notes
Characteristic
Symbol
Units
Type
Conditions
Min.
Max.
Maximum frequency (sinewave input)
fMAX
500
300
MHz SP8602 Input = 400-800mV p-p
MHz SP8604 Input = 400-800mV p-p
Minimum frequency (sinewave input)
Power supply current
fMIN
IEE
40
18
MHz
mA
Both
Both
Input = 400-800mV p-p
EE = 25·2V, outputs
unloaded
V
Output low voltage
Output high voltage
Minimum output swing
VOL
VOH
VOUT
21·8
20·85 20·7
400
21·4
V
V
mV
Both
Both
Both
VEE = 25·2V
VEE = 25·2V
VEE = 25·2V
3
3
NOTES
1. The temperature coefficients of VOH = 11·63mV/°C, and VOL = 10·34mV/°C but these are not tested.
2. The test configuration for dynamic testing is shown in Fig.5.
3. Tested at 25°C only.
SP8604
T
= 255°C TO 1125°C (A GRADE)
= 230°C TO 170°C (B GRADE)
AMB
1000
800
600
400
200
0
T
SP8602
AMB
GUARANTEED
OPERATING
WINDOW
*
Tested as specified
in table of Electrical
Characteristics
*
0
100
200
300
400
500
INPUT FREQUENCY (MHz)
Fig. 3 Typical input characteristics of SP8602 and SP8604
j1
j0.5
j2
j0.2
j5
0.5
5
0.2
1
2
0
50
100
2j5
200
300
2j0.2
400
500
2j2
2j0.5
2j1
Fig. 4 Typical input impedance. Test conditions: supply voltage = 25·2V, ambient
temperature = 25°C, frequencies in MHz, Impedances normalised to 50Ω
2
SP8602/4
OPERATING NOTES
3.The circuit will operate down to DC but slew rate must be better
than 100V/µs.
4.TheoutputsarecompatiblewithECLII. Thereisaninternalload
of 4kΩ on each output. The outputs can be interfaced to ECL10K
bytheadditionof1·5kΩpulldownresistorsfromtheoutputstoVEE
to increase output voltage swing.
1.The clock inputs (pins 1 and 2) can be driven single ended or
differentially and should be capacitively coupled to the signal
source. The input signal path is completed by connecting a
capacitor from the internal bias decoupling, pin 3, to ground.
2.In the absence of a signal the device will self-oscillate. If this is
undesirable, it may be prevented by connecting a 15kΩ resistor
from the unused input to VEE. This will reduce the input sensitivity
by approximately 100mV.
5.Input impedance is a function of frequency, See Fig. 4.
6.All components should be suitable for the frequency in use.
20
33
TO SAMPLING
SCOPE
1n
33
3
5
10n
10n
1n
450
450
FROM GENERATOR
INPUT 1
2
6
7
TO SAMPLING
SCOPE
1n
DUT
8
FROM GENERATOR
INPUT 2
1
33
33
3·5k
3·5k
TO SAMPLING
SCOPE
V
EE
20
1n
Fig. 5 Test circuit
1n
5
INPUT
1
2
6
7
ECL OUTPUT
DIVIDE BY
2
440
440
BIAS
15k
1n
4k
4k
1·5k
1·5k
8
V
EE
1n
Fig. 6 Typical application showing interfacing
3
SP8602/4
PACKAGE DETAILS
Dimensions are shown thus: mm (in).
4·19/4·70
(0·165/0·185)
12·70/14·28
(0·500/0·570)
1
8
7
6
2
3
4
8·00/8·51
8·63/9·39
4·83/5·33 P.C.D.
(0·190/0·210)
(0·315/0·335) (0·340/0·370)
5
0·41/0·53
(0·016/0·021)
45°
0·25/1·02
(0·010/0·040)
NOTES
1. Controllingdimensionsareinches.
2. This package outline diagram is for guidance
only. Please contact your GPS Customer
ServiceCentreforfurtherinformation.
8-LEAD METAL CAN - CM8
HEADQUARTERS OPERATIONS
GEC PLESSEY SEMICONDUCTORS
Cheney Manor, Swindon,
Wiltshire SN2 2QW, United Kingdom.
Tel: (0793) 518000
CUSTOMER SERVICE CENTRES
●
●
●
●
●
●
●
●
FRANCE & BENELUX Les Ulis Cedex Tel: (1) 64 46 23 45 Fax : (1) 64 46 06 07
GERMANY Munich Tel: (089) 3609 06-0 Fax : (089) 3609 06-55
ITALY Milan Tel: (02) 66040867 Fax: (02) 66040993
JAPAN Tokyo Tel: (3) 5276-5501 Fax: (3) 5276-5510
Fax: (0793) 518411
NORTH AMERICA Scotts Valley, USA Tel: (408) 438 2900 Fax: (408) 438 7023.
SOUTH EAST ASIA Singapore Tel: (65) 3827708 Fax: (65) 3828872
SWEDEN Stockholm Tel: 46 8 702 97 70 Fax: 46 8 640 47 36
UK, EIRE, DENMARK, FINLAND & NORWAY
GEC PLESSEY SEMICONDUCTORS
P.O. Box 660017
1500 Green Hills Road,
Scotts Valley, CA95067-0017
United States of America.
Tel (408) 438 2900
Swindon Tel: (0793) 518510 Fax : (0793) 518582
These are supported by Agents and Distributors in major countries world-wide.
© GEC Plessey Semiconductors 1994 Publication No. DS3658 Issue No. 1.2 March 1994
Fax: (408) 438 5576
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded
as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company
reserves the right to alter without prior knowledge the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute
any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information
and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
For more information about all Zarlink products
visit our Web Site at
www.zarlink.com
Information relating to products and services furnished herein by Zarlink Semiconductor Inc. or its subsidiaries (collectively “Zarlink”) is believed to be reliable.
However, Zarlink assumes no liability for errors that may appear in this publication, or for liability otherwise arising from the application or use of any such
information, product or service or for any infringement of patents or other intellectual property rights owned by third parties which may result from such application or
use. Neither the supply of such information or purchase of product or service conveys any license, either express or implied, under patents or other intellectual
property rights owned by Zarlink or licensed from third parties by Zarlink, whatsoever. Purchasers of products are also hereby notified that the use of product in
certain ways or in combination with Zarlink, or non-Zarlink furnished goods or services may infringe patents or other intellectual property rights owned by Zarlink.
This publication is issued to provide information only and (unless agreed by Zarlink in writing) may not be used, applied or reproduced for any purpose nor form part
of any order or contract nor to be regarded as a representation relating to the products or services concerned. The products, their specifications, services and other
information appearing in this publication are subject to change by Zarlink without notice. No warranty or guarantee express or implied is made regarding the
capability, performance or suitability of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute
any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user’s responsibility to fully determine the performance and
suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. Manufacturing does
not necessarily include testing of all functions or parameters. These products are not suitable for use in any medical products whose failure to perform may result in
significant injury or death to the user. All products and materials are sold and services provided subject to Zarlink’s conditions of sale which are available on request.
Purchase of Zarlink’s I2C components conveys a licence under the Philips I2C Patent rights to use these components in and I2C System, provided that the system
conforms to the I2C Standard Specification as defined by Philips.
Zarlink, ZL and the Zarlink Semiconductor logo are trademarks of Zarlink Semiconductor Inc.
Copyright Zarlink Semiconductor Inc. All Rights Reserved.
TECHNICAL DOCUMENTATION - NOT FOR RESALE
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