XC17S05XLVOG8I [XILINX]
Memory Circuit, 54544X1, CMOS, PDSO8, PLASTIC, TSOP-8;![XC17S05XLVOG8I](http://pdffile.icpdf.com/pdf2/p00222/img/icpdf/XC17S05XLVOG_1298060_icpdf.jpg)
型号: | XC17S05XLVOG8I |
厂家: | ![]() |
描述: | Memory Circuit, 54544X1, CMOS, PDSO8, PLASTIC, TSOP-8 光电二极管 内存集成电路 |
文件: | 总11页 (文件大小:171K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Product Obsolete or Under Obsolescence
X-Ref Target - Figure 0
R
Spartan/XL Family One-Time Programmable
Configuration PROMs (XC17S00/XL)
DS030 (v1.12) June 20, 2008
Product Specification
Features
•
Configuration one-time programmable (OTP) read-only
memory designed to store configuration bitstreams for
Spartan , and Spartan-XL FPGAs
•
•
Available in compact plastic 8-pin DIP, 8-pin VOIC, or
20-pin SOIC packages
®
Programming support by leading programmer
manufacturers
•
Simple interface to the Spartan device requires only
one user I/O pin
•
•
Lead-free (RoHS-compliant) packaging available
•
•
•
Programmable reset polarity (active High or active Low)
Low-power CMOS floating-gate process
Available in 5V and 3.3V versions
®
Design support using the Xilinx Alliance and
Foundation™ series software packages
•
Guaranteed 20 year life data retention
Introduction
The Spartan family of PROMs provides an easy-to-use,
cost-effective method for storing Spartan device
configuration bitstreams.
complete the configuration. Once configured, it disables the
PROM. When a Spartan device is in Slave Serial mode, the
PROM and the Spartan device must both be clocked by an
incoming signal.
When the Spartan device is in Master Serial mode, it
generates a configuration clock that drives the Spartan
FPGA PROM. A short access time after the rising clock
edge, data appears on the PROM DATA output pin that is
For device programming, either the Xilinx Alliance or the
Foundation series development systems compiles the
Spartan device design file into a standard HEX format which
is then transferred to most commercial PROM programmers.
connected to the Spartan device D pin. The Spartan
IN
device generates the appropriate number of clock pulses to
Spartan FPGA
Configuration Bits
53,984
Compatible Spartan PROM
XC17S05
XCS05
XCS05XL
XCS10
54,544
95,008
XC17S05XL
XC17S10
XCS10XL
XCS20
95,752
XC17S10XL
XC17S20
178,144
179,160
247,968
249,168
329,312
330,696
559,200
781,216
1,040,096
XCS20XL
XCS30
XC17S20XL
XC17S30
XCS30XL
XCS40
XC17S30XL
XC17S40
XCS40XL
XC2S50(1)
XC2S100(1)
XC2S150(1)
XC17S40XL
XC17S50XL
XC17S100XL
XC17S150XL
Notes:
1. For new Spartan-II FPGA designs, it is recommended to use the 17S00A family.
© Copyright 1998-2008 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE and other designated brands included herein are trademarks of Xilinx in the United States and
other countries. All other trademarks are the property of their respective owners.
DS030 (v1.12) June 20, 2008
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Product Specification
1
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ProduScptarOtabn/XsLoFlaemtiely Oonre-UTimnedPerorgrOambmsaobleleCsoncfiegunractieon PROMs (XC17S00/XL)
Pin Description
Pins not listed are in Table 1 are "no connects."
Table 1: Spartan PROM Pinouts
8-pin
PDIP (PD8) and
VOIC/TSOP (VO8)
20-pin
SOIC
(SO20)
Pin Name
Pin Description
Data output, High-Z state when either CE or OE are inactive. During
programming, the DATA pin is I/O. Note that OE can be programmed to be either
active High or active Low.
DATA
CLK
1
2
1
3
Each rising edge on the CLK input increments the internal address counter, if both
CE and OE are active.
When High, this input holds the address counter reset and puts the DATA output
in a high-impedance state. The polarity of this input pin is programmable as either
RESET/OE or OE/RESET. To avoid confusion, this document describes the pin
as RESET/OE, although the opposite polarity is possible on all devices. When
RESET is active, the address counter is held at zero, and the DATA output is in a
high-impedance state. The polarity of this input is programmable. The default is
active High RESET, but the preferred option is active Low RESET, because it can
be driven by the FPGAs INIT pin.
RESET/OE
(OE/RESET)
3
8
The polarity of this pin is controlled in the programmer interface. This input pin is
easily inverted using the Xilinx HW-130 programmer software. Third-party
programmers have different methods to invert this pin.
When High, this pin disables the internal address counter, puts the DATA output
in a high-impedance state, and forces the device into low-ICC standby mode.
CE
4
10
GND
VCC
5
11
GND is the ground connection.
7, 8
18, 20
The VCC pins are to be connected to the positive voltage supply.
Pinout Diagrams
1
2
3
4
5
6
7
8
20
19
18
17
16
15
14
13
12
11
DATA(D0)
VCC
NC
VCC
NC
NC
NC
NC
NC
NC
DATA(D0)
CLK
1
2
3
4
8
7
6
5
VCC
VCC
NC
CLK
NC
NC
PD8/PDG8
SOG8
VO8/VOG8
Top View
SO20
Top
View
OE/RESET
CE
NC
NC
NC
OE/RESET
GND
9
10
NC
CE
DS030_05_060508
GND
DS030_04_110102
DS030 (v1.12) June 20, 2008
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Product Specification
2
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ProduScptarOtabn/XsLoFlaemtiely Oonre-UTimnedPerorgrOambmsaobleleCsoncfiegunractieon PROMs (XC17S00/XL)
If the user-programmable, dual-function D pin on the
IN
Controlling PROMs
Connecting the Spartan device with the PROM:
Spartan device is used only for configuration, it must still be
held at a defined level during normal operation. The
Spartan family takes care of this automatically with an on-
chip default pull-up resistor.
•
•
•
The DATA output of the PROM drives the D input of
the lead Spartan device.
IN
The Master Spartan device CCLK output drives the
CLK input of the PROM.
Programming the FPGA With Counters
Unchanged Upon Completion
The RESET/OE input of the PROM is driven by the
INIT output of the Spartan device. This connection
assures that the PROM address counter is reset before
the start of any (re)configuration, even when a
When multiple-configurations for a single Spartan device
are stored in a PROM, the OE pin should be tied Low. Upon
power-up, the internal address counters are reset and
configuration begins with the first program stored in
memory. Since the OE pin is held Low, the address
counters are left unchanged after configuration is complete.
Therefore, to reprogram the FPGA with another program,
the DONE line is pulled Low and configuration begins at the
last value of the address counters.
reconfiguration is initiated by a V glitch. Other
CC
methods—such as driving RESET/OE from LDC or
system reset—assume that the PROM internal power-
on-reset is always in step with the FPGAs internal
power-on-reset, which is not a safe assumption.
•
The CE input of the PROM is driven by the DONE
output of the Spartan device, provided that DONE is
not permanently grounded. Otherwise, LDC can be
used to drive CE, but must then be unconditionally
High during user operation. CE can also be
permanently tied Low, but this keeps the DATA output
active and causes an unnecessary supply current of
10 mA maximum.
This method fails if a user applies RESET during the
Spartan device configuration process. The Spartan device
aborts the configuration and then restarts a new
configuration, as intended, but the PROM does not reset its
address counter, since it never saw a High level on its OE
input. The new configuration, therefore, reads the remaining
data in the PROM and interprets it as preamble, length
count etc. Since the Spartan device is the Master, it issues
the necessary number of CCLK pulses, up to 16 million
FPGA Master Serial Mode Summary
24
(2 ) and DONE goes High. However, the Spartan device
configuration will be completely wrong, with potential
contentions inside the Spartan device and on its output
pins. This method must, therefore, never be used when
there is any chance of external reset during configuration.
The I/O and logic functions of the Configurable Logic Block
(CLB) and their associated interconnections are established
by a configuration program. The program is loaded either
automatically upon power up, or on command, depending
on the state of the Spartan device MODE pin. In Master
Serial mode, the Spartan device automatically loads the
configuration program from an external memory. The
Spartan FPGA PROM has been designed for compatibility
with the Master Serial mode.
Standby Mode
The PROM enters a low-power standby mode whenever CE
is asserted High. The output remains in a high-impedance
state regardless of the state of the OE input.
Upon power-up or reconfiguration, the Spartan device
enters the Master Serial mode when the MODE pin is
Low. Data is read from the PROM sequentially on a single
data line. Synchronization is provided by the rising edge
of the temporary signal CCLK, which is generated during
configuration.
Programming the Spartan Family
PROMs
The devices can be programmed on programmers supplied
by Xilinx or qualified third-party vendors. The user must
ensure that the appropriate programming algorithm and the
latest version of the programmer software are used. The
wrong choice can permanently damage the device.
Master Serial mode provides a simple configuration
interface (Figure 1, page 4). Only a serial data line and two
control lines are required to configure the Spartan device.
Data from the PROM is read sequentially, accessed via the
internal address and bit counters which are incremented on
every valid rising edge of CCLK.
DS030 (v1.12) June 20, 2008
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Product Specification
3
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ProduScptarOtabn/XsLoFlaemtiely Oonre-UTimnedPerorgrOambmsaobleleCsoncfiegunractieon PROMs (XC17S00/XL)
X-Ref Target - Figure 1
Spartan
Master Serial
3.3V
V
V
CC
MODE
4.7K
V
CC
CC
DATA
CLK
DIN
CCLK
DONE
INIT
Spartan
PROM
CE
OE/RESET
(Low Resets the Address Pointer)
CCLK
(Output)
DIN
DOUT
(Output)
DS030_01_101001
Figure 1: Master Serial Mode
Note: The one-time-programmable Spartan PROM supports automatic loading of configuration programs. An early DONE inhibits the
PROM data output one CCLK cycle before the Spartan FPGA I/Os become active.
DS030 (v1.12) June 20, 2008
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Product Specification
4
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ProduScptarOtabn/XsLoFlaemtiely Oonre-UTimnedPerorgrOambmsaobleleCsoncfiegunractieon PROMs (XC17S00/XL)
X-Ref Target - Figure 2
V
CC
GND
RESET/
CE
OE
or
OE/
RESET
Address Counter
CLK
TC
EPROM
Cell
OE
Output
DATA
Matrix
DS030_02_011300
Figure 2: Simplified Block Diagram (Does not Show Programming Circuit)
Caution! Always tie the two VCC pins together in the application.
Table 2: Truth Table for XC17S00 Control Inputs
Control Inputs
Outputs
Internal Address(2)
RESET(1)
CE
DATA
ICC
If address < TC: increment
If address > TC: don’t change
Active
High-Z
Active
Reduced
Inactive
Low
Active
Inactive
Active
Low
High
High
Held reset
Not changing
Held reset
High-Z
High-Z(3)
High-Z(3)
Active
Standby
Standby
Notes:
1. The XC17S00 RESET input has programmable polarity.
2. TC = Terminal Count = highest address value. TC + 1 = address 0.
3. Pull DATA pin to GND or V to meet I
standby current.
CCS
CC
DS030 (v1.12) June 20, 2008
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Product Specification
5
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ProduScptarOtabn/XsLoFlaemtiely Oonre-UTimnedPerorgrOambmsaobleleCsoncfiegunractieon PROMs (XC17S00/XL)
XC17S05, XC17S10, XC17S20, XC17S30, XC17S40
Absolute Maximum Ratings(1)
Symbol
VCC
VIN
Description
Value
–0.5 to +7.0
–0.5 to VCC +0.5
–0.5 to VCC +0.5
–65 to +150
+125
Units
V
Supply voltage relative to GND
Input voltage relative to GND
Voltage applied to High-Z output
Storage temperature (ambient)
Junction temperature
V
VTS
V
TSTG
TJ
°C
°C
Notes:
1. Stresses beyond those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied.
Exposure to Absolute Maximum Ratings conditions for extended periods of time can affect device reliability.
Operating Conditions(1)
Symbol
Description
Commercial
Industrial
Conditions
Min
4.75
4.50
Max
5.25
5.50
Units
Supply voltage relative to GND (TA = 0°C to +70°C)
Supply voltage relative to GND (TA = –40°C to +85°C)
V
V
VCC
Notes:
1. During normal read operation both V pins must be connected together.
CC
DC Characteristics Over Operating Condition
Symbol
VIH
Description
Min
2.0
0
Max
VCC
0.8
–
Units
High-level input voltage
Low-level input voltage
V
V
V
V
V
V
VIL
VOH
VOL
High-level output voltage (IOH = –4 mA)
Low-level output voltage (IOL = +4 mA)
High-level output voltage (IOH = –4 mA)
Low-level output voltage (IOL = +4 mA)
3.86
–
Commercial
Industrial
0.32
–
VOH
VOL
3.76
–
0.37
XC17S05, XC17S10, XC17S20,
XC17S30
10
20
mA
mA
μA
Supply current, active mode
(at maximum frequency)
ICCA
XC17S40
–
–
XC17S05, XC17S10, XC17S20,
XC17S30
50(1)
ICCS
Supply current, standby mode
XC17S40
–
–10
–
100(1)
10
μA
μA
pF
pF
IL
Input or output leakage current
CIN
Input Capacitance (VIN = GND, f = 1.0 MHz)
Output Capacitance (VIN = GND, f = 1.0 MHz)
10
COUT
–
10
Notes:
1.
I
standby current is specified for DATA pin that is pulled to V or GND.
CC
CCS
DS030 (v1.12) June 20, 2008
www.xilinx.com
Product Specification
6
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ProduScptarOtabn/XsLoFlaemtiely Oonre-UTimnedPerorgrOambmsaobleleCsoncfiegunractieon PROMs (XC17S00/XL)
XC17S05XL, XC17S10XL, XC17S20XL, XC17S30XL, XC17S40XL, XC17S50XL,
XC17S100XL, XC17S150XL
Absolute Maximum Ratings(1)
Symbol
VCC
Description
Value
Units
V
Supply voltage relative to GND
Input voltage with respect to GND
Voltage applied to High-Z output
Storage temperature (ambient)
–0.5 to +4.0
VIN
–0.5 to VCC +0.5
–0.5 to VCC +0.5
–65 to +150
V
VTS
V
TSTG
°C
Notes:
1. Stresses beyond those listed under Absolute Maximum Ratings can cause permanent damage to the device. These are stress ratings only,
and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied.
Exposure to Absolute Maximum Ratings conditions for extended periods of time can affect device reliability.
Operating Conditions(1)
Symbol
Description
Commercial
Industrial
Min
3.0
3.0
Max
3.6
Units
Supply voltage relative to GND (TA = 0°C to +70°C)
Supply voltage relative to GND (TA = –40°C to +85°C)
V
V
VCC
3.6
Notes:
1. During normal read operation both V pins must be connected together.
CC
DC Characteristics Over Operating Condition
Symbol
VIH
Description
Min
2.0
0
Max
VCC
0.8
–
Units
V
High-level input voltage
Low-level input voltage
VIL
V
VOH
VOL
ICCA
ICCS
IL
High-level output voltage (IOH = –3 mA)
Low-level output voltage (IOL = +3 mA)
Supply current, active mode (at maximum frequency)
Supply current, standby mode
2.4
–
V
0.4
5
V
–
mA
μA
μA
pF
pF
–
50(1)
10
Input or output leakage current
–10
–
CIN
Input Capacitance (VIN = GND, f = 1.0 MHz)
Output Capacitance (VIN = GND, f = 1.0 MHz)
10
COUT
–
10
Notes:
1.
I
standby current is specified for DATA pin that is pulled to V or GND.
CC
CCS
DS030 (v1.12) June 20, 2008
www.xilinx.com
Product Specification
7
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ProduScptarOtabn/XsLoFlaemtiely Oonre-UTimnedPerorgrOambmsaobleleCsoncfiegunractieon PROMs (XC17S00/XL)
AC Characteristics over Operating Condition(1)
CE
T
T
T
HCE
SCE
SCE
RESET/OE
CLK
T
HOE
T
T
HC
LC
T
CYC
T
T
DF
OE
T
T
CAC
OH
T
CE
DATA
T
OH
DS0306_03_011300
Symbol
Description
Min
–
Max
45
60
80
–
Units
TOE
TCE
RESET/OE to Data Delay
CE to Data Delay
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
–
TCAC
TOH
CLK to Data Delay
–
Data Hold From CE, RESET/OE, or CLK(2)
CE or RESET/OE to Data Float Delay(2,3)
Clock Periods
0
TDF
–
50
–
TCYC
TLC
100
50
50
25
0
CLK Low Time(2)
–
THC
CLK High Time(2)
–
TSCE
THCE
THOE
CE Setup Time to CLK (to guarantee proper counting)
CE Hold Time to CLK (to guarantee proper counting)
RESET/OE Hold Time (guarantees counters are reset)
–
–
25
–
Notes:
1. AC test load = 50 pF.
2. Guaranteed by design, not tested.
3. Float delays are measured with 5 pF AC loads. Transition is measured at 200 mV from steady state active levels.
4. All AC parameters are measured with V = 0.0V and V = 3.0V.
IL
IH
DS030 (v1.12) June 20, 2008
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Product Specification
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Ordering Information
XC17S20XL VO8 C
Operating Range/Processing
Device Number
C = Commercial (TA = 0°C to +70°C)
I = Industrial (TA = –40°C to +85°C)
XC17S05
XC17S05XL
XC17S10
XC17S10XL
XC17S20
(1)
Package Type
PD8/PDG08 = 8-pin Plastic DIP
XC17S20XL
XC17S30
XC17S30XL
XC17S40
VO8/VOG8 = 8-pin Plastic Small-Outline Thin Package
SOG8 = 8-pin Plastic Small-Outline Package
SO20 = 20-pin Plastic Small-Outline Package
XC17S40XL
XC17S50XL
XC17S100XL
XC17S150XL
Notes:
1. G in the package-type codes designates Lead-free packaging.
Spartan 5V Valid Ordering Combinations (XC17S00)
XC17S05PD8C
XC17S05VO8C
XC17S05PD8I
XC17S05VO8I
XC17S10PD8C
XC17S10VO8C
XC17S10VOG8C
XC17S10PD8I
XC17S10VO8I
XC17S20PD8C
XC17S20VO8C
XC17S20PD8I
XC17S20VO8I
XC17S30PD8C
XC17S30VO8C
XC17S30PD8I
XC17S30VO8I
XC17S30SOG8I
XC17S40PD8C
XC17S40SO20C
XC17S40PD8I
XC17S40SO20I
Spartan 3.3V Valid Ordering Combinations (XC17S00XL)
XC17S05XLPD8C
XC17S05XLVO8C
XC17S05XLPD8I
XC17S05XLVO8I
XC17S10XLPD8C
XC17S10XLPDG8C
XC17S10XLVO8C
XC17S10XLVOG8C
XC17S10XLPD8I
XC17S10XLVO8I
XC17S10XLVOG8I
XC17S100XLPD8C
XC17S100XLSO20C
XC17S100XLPD8I
XC17S100XLSO20I
XC17S150XLPD8C
XC17S150XLSO20C
XC17S150XLPD8I
XC17S150XLSO20I
XC17S20XLPD8C
XC17S20XLVO8C
XC17S20XLVOG8C
XC17S20XLPD8I
XC17S20XLVO8I
XC17S30XLPD8C
XC17S30XLPDG8C
XC17S30XLVO8C
XC17S30XLVOG8C
XC17S30XLPD8I
XC17S30XLVO8I
XC17S30XLVOG8I
XC17S40XLPD8C
XC17S40XLPDG8C
XC17S40XLSO20C
XC17S40XLPD8I
XC17S40XLSO20I
XC17S50XLPD8C
XC17S50XLSO20C
XC17S50XLPD8I
XC17S50XLSO20I
DS030 (v1.12) June 20, 2008
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Product Specification
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ProduScptarOtabn/XsLoFlaemtiely Oonre-UTimnedPerorgrOambmsaobleleCsoncfiegunractieon PROMs (XC17S00/XL)
Marking Information
Due to the small size of the PROM package, the complete ordering part number cannot be marked on the package. The XC
prefix is deleted and the package code is simplified. Device marking is as follows.
17S20L V C
Operating Range/Processing
Device Number
C = Commercial (TA = 0°C to +70°C)
I = Industrial (TA = –40°C to +85°C)
17S05
17S05L
17S10
17S10L
17S20
Package Mark
O = 8-pin Plastic Small-Outline Package, Lead-Free
P = 8-pin Plastic DIP
17S20L
17S30
H = 8-pin Plastic DIP, Lead-Free
17S30L
17S40
17S40L
17S50L
17S100L
17S150L
V = 8-pin Plastic Small-Outline Thin Package
G = 8-pin Plastic Small-Outline Thin Package, Lead-Free
S = 20-pin Plastic Small-Outline Package
Note: When marking the device number on the XL parts, an L is used in place of an XL.
Revision History
The following table shows the revision history for this document.
Date
Revision
1.1
Revision
07/14/98
09/08/98
Cosmetic edits for pages 1, 2, and 4.
1.2
Clarified the SPARTAN FPGA and PROM interface by removing references to CEO pin. Removed the ESD
notation in Absolute Maximum table since it is now included in Xilinx’s Reliability Monitor Report.
01/20/00
02/18/00
04/04/00
08/06/00
04/07/01
10/10/01
11/04/02
11/18/02
1.3
1.4
1.5
1.6
1.7
1.8
1.9
1.10
Added additional Spartan-XL parts, changed SPROM to PROM.
Changed device ordering numbers, added 4.7K resistor to OE/RESET in Figure 1.
Added XC17S200XL PROM for Spartan XC2S200.
Updated format.
Added to features: “Guaranteed 20 year life data retention.”
Added a note to Table 1. Changed VPP to VCC on Figure 1.
Updated Table 1, page 2. Updated the template. Added "Pinout Diagrams," page 2.
Modified document title.
DS030 (v1.12) June 20, 2008
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Product Specification
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07/09/07
1.11
• Updated document format.
• Left diagram under "Pinout Diagrams," page 2 updated to reflect new Lead-free packaging.
• Under "XC17S05, XC17S10, XC17S20, XC17S30, XC17S40,"
♦ Deleted parameter TSOL, Maximum Soldering Temperature, under "Absolute Maximum Ratings(1),"
page 6. Refer to UG112, Xilinx Device Package User Guide, for package soldering guidelines.
♦ Added note to "DC Characteristics Over Operating Condition," page 6 and corrected XC17S40 ICCA
value.
• Under "XC17S05XL, XC17S10XL, XC17S20XL, XC17S30XL, XC17S40XL, XC17S50XL, XC17S100XL,
XC17S150XL", added note to "DC Characteristics Over Operating Condition," page 7.
• Added Lead-free (RoHS-compliant) packages PDG8 and VOG8 to "Ordering Information," page 9.
• Added new part numbers to and deleted XC17S200XL from "Spartan 3.3V Valid Ordering Combinations
(XC17S00XL)," page 9.
• Added new Lead-free package types G and H to "Marking Information," page 10.
06/20/08
1.12
• Updated document template.
• Updated copyright statement.
• Added "Notice of Disclaimer," page 11.
• Added junction temperature to "Absolute Maximum Ratings(1)," page 6.
• Added support for XC17S30SOG8I.
• Added new Lead-free package type O to "Marking Information," page 10.
• Updated "Pinout Diagrams," page 2, "Ordering Information," page 9, and "Spartan 5V Valid Ordering
Combinations (XC17S00)," page 9.
Notice of Disclaimer
THE XILINX HARDWARE FPGA AND CPLD DEVICES REFERRED TO HEREIN (“PRODUCTS”) ARE SUBJECT TO THE TERMS AND
CONDITIONS OF THE XILINX LIMITED WARRANTY WHICH CAN BE VIEWED AT http://www.xilinx.com/warranty.htm. THIS LIMITED
WARRANTY DOES NOT EXTEND TO ANY USE OF PRODUCTS IN AN APPLICATION OR ENVIRONMENT THAT IS NOT WITHIN THE
SPECIFICATIONS STATED IN THE XILINX DATA SHEET. ALL SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE.
PRODUCTS ARE NOT DESIGNED OR INTENDED TO BE FAIL-SAFE OR FOR USE IN ANY APPLICATION REQUIRING FAIL-SAFE
PERFORMANCE, SUCH AS LIFE-SUPPORT OR SAFETY DEVICES OR SYSTEMS, OR ANY OTHER APPLICATION THAT INVOKES
THE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). USE OF PRODUCTS IN CRITICAL APPLICATIONS IS AT THE SOLE RISK OF CUSTOMER, SUBJECT TO
APPLICABLE LAWS AND REGULATIONS.
DS030 (v1.12) June 20, 2008
www.xilinx.com
Product Specification
11
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