XC17256EPD8C [XILINX]
Configuration PROMs; 配置PROM
| 型号： | XC17256EPD8C |
| 厂家： | 
XILINX, INC |
| 描述： | Configuration PROMs |
| 文件： | 总12页 (文件大小：124K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
0
R
XC1700E and XC1700L Series
Configuration PROMs
0
8
DS027 (v3.1) July 5, 2000
Product Specification
Features
Description
•
One-time programmable (OTP) read-only memory
designed to store configuration bitstreams of Xilinx
FPGA devices
The XC1700 family of configuration PROMs provides an
easy-to-use, cost-effective method for storing large Xilinx
FPGA configuration bitstreams.
•
Simple interface to the FPGA; requires only one user
I/O pin
When the FPGA is in Master Serial mode, it generates a
configuration clock that drives the PROM. A short access
time after the rising clock edge, data appears on the PROM
DATA output pin that is connected to the FPGA DIN pin. The
FPGA generates the appropriate number of clock pulses to
complete the configuration. Once configured, it disables the
PROM. When the FPGA is in Slave Serial mode, the PROM
and the FPGA must both be clocked by an incoming signal.
•
•
Cascadable for storing longer or multiple bitstreams
Programmable reset polarity (active High or active
Low) for compatibility with different FPGA solutions
•
XC17128E/EL, XC17256E/EL, XC1701 and XC1700L
series support fast configuration
•
•
•
•
Low-power CMOS Floating Gate process
Multiple devices can be concatenated by using the CEO
output to drive the CE input of the following device. The
clock inputs and the DATA outputs of all PROMs in this
chain are interconnected. All devices are compatible and
can be cascaded with other members of the family.
XC1700E series are available in 5V and 3.3V versions
XC1700L series are available in 3.3V only
Available in compact plastic packages: 8-pin SOIC,
8-pin VOIC, 8-pin PDIP, 20-pin SOIC, 20-pin PLCC,
44-pin PLCC or 44-pin VQFP.
For device programming, either the Xilinx Alliance or Foun-
dation series development system compiles the FPGA
design file into a standard Hex format, which is then trans-
ferred to most commercial PROM programmers.
•
•
•
Programming support by leading programmer
manufacturers.
Design support using the Xilinx Alliance and
Foundation series software packages.
Guaranteed 20 year life data retention
V
CC
V
PP
GND
RESET/
OE
or
CEO
CE
OE/
RESET
Address Counter
CLK
TC
EPROM
Cell
OE
Output
DATA
Matrix
DS027_01_021500
Figure 1: Simplified Block Diagram (does not show programming circuit)
© 2000 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
DS027 (v3.1) July 5, 2000
www.xilinx.com
1
Product Specification
1-800-255-7778
R
XC1700E and XC1700L Series Configuration PROMs
VPP
Pin Description
Programming voltage. No overshoot above the specified
max voltage is permitted on this pin. For normal read oper-
ation, this pin must be connected to VCC. Failure to do so
may lead to unpredictable, temperature-dependent opera-
tion and severe problems in circuit debugging. Do not leave
VPP floating!
DATA
Data output is in a high-impedance state when either CE or
OE are inactive. During programming, the DATA pin is I/O.
Note that OE can be programmed to be either active High or
active Low.
CLK
VCC and GND
Each rising edge on the CLK input increments the internal
address counter, if both CE and OE are active.
Positive supply and ground pins.
PROM Pinouts
RESET/OE
8-pin
PDIP
When High, this input holds the address counter reset and
puts the DATA output in a high-impedance state. The polar-
ity of this input pin is programmable as either RESET/OE or
OE/RESET. To avoid confusion, this document describes
the pin as RESET/OE, although the opposite polarity is pos-
sible on all devices. When RESET is active, the address
counter is held at "0", and puts the DATA output in a
high-impedance state. The polarity of this input is program-
mable. The default is active High RESET, but the preferred
option is active Low RESET, because it can be driven by the
FPGAs INIT pin.
SOIC 20-pin 20-pin 44-pin 44-pin
Pin Name VOIC SOIC PLCC VQFP PLCC
DATA
CLK
1
2
3
1
3
8
2
4
6
40
43
13
2
5
RESET/OE
(OE/RESET)
19
CE
4
5
6
7
8
10
11
13
18
20
8
15
18, 41
21
21
24, 3
27
The polarity of this pin is controlled in the programmer inter-
face. This input pin is easily inverted using the Xilinx
HW-130 Programmer. Third-party programmers have differ-
ent methods to invert this pin.
GND
CEO
VPP
VCC
10
14
17
20
35
41
38
44
CE
When High, this pin disables the internal address counter,
puts the DATA output in a high-impedance state, and forces
the device into low-ICC standby mode.
Capacity
Devices
XC1704L
Configuration Bits
4,194,304
2,097,152
1,048,576
524,288
CEO
Chip Enable output, to be connected to the CE input of the
next PROM in the daisy chain. This output is Low when the
CE and OE inputs are both active AND the internal address
counter has been incremented beyond its Terminal Count
(TC) value. In other words: when the PROM has been read,
CEO will follow CE as long as OE is active. When OE goes
inactive, CEO stays High until the PROM is reset. Note that
OE can be programmed to be either active High or active
Low.
XC1702L
XC1701/L
XC17512L
XC1736E
36,288
XC1765E/EL
XC17128E/EL
XC17256E/EL
65,536
131,072
262,144
2
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1-800-255-7778
DS027 (v3.1) July 5, 2000
Product Specification
R
XC1700E and XC1700L Series Configuration PROMs
Configuration
Xilinx FPGAs and Compatible PROMs
Device
XC5206
XC5210
XC5215
XCV50
Bits
PROM
Configuration
106,288
XC17128E
XC17256E
XC17256E
XC1701L
XC1701L
XC1701L
XC1702L
XC1702L
XC1704L
XC1704L
Device
XC4003E
Bits
PROM
XC17128E(1)
XC17128E
XC17128E
XC17256E
XC17256E
XC17256E
XC1701
165,488
53,984
237,744
XC4005E
95,008
559,232
XC4006E
119,840
147,552
178,144
247,968
329,312
422,176
61,100
XCV100
XCV150
XCV200
XCV300
XCV400
XCV600
XCV800
781,248
XC4008E
1,041,128
1,335,872
1,751,840
2,546,080
3,608,000
4,715,648
XC4010E
XC4013E
XC4020E
XC4025E
XC1701
XC4002XL
XC17128EL(1)
XC17256EL
XC17512L
XC17512L
XC17512L
XC1701L
XC1701
XC1704L +
XC1701L
XC4005XL
151,960
283,424
393,632
521,880
668,184
668,184
832,528
832,528
1,014,928
1,215,368
1,433,864
1,924,992
2,686,136
3,373,448
4,551,056
XC4010XL
XCV1000
6,127,776
XC1704L +
XC1702L
XC4013XL/XLA
XC4020XL/XLA
XC4028XL/XLA
XC4028EX
XCV50E
XCV100E
XCV200E
XCV300E
XCV400E
XCV405E
XCV600E
XCV812E
XCV1000E
XCV1600E
XCV2000E
XCV2600E
XCV3200E
630,048
863,840
XC1701L
XC1701L
1,442,106
1,875,648
2,693,440
3,340,400
3,961,632
6,519,648
6,587,520
8,308,992
10,159,648
12,922,336
16,283,712
XC1702L
XC4036EX/XL/XLA
XC4036EX
XC1701L
XC1701
XC1702L
XC1704L
XC4044XL/XLA
XC4052XL/XLA
XC4062XL/XLA
XC4085XL/XLA
XC40110XV
XC40150XV
XC40200XV
XC1701L
XC1702L
XC1702L
XC1702L
XC1704L
XC1704L
XC1704L
XC1704L
2 of XC1704L
2 of XC1704L
2 of XC1704L
3 of XC1704L
4 of XC1704L
4 of XC1704L
XC1704L +
XC17512L
XC40250XV
5,433,888
XC1704L+
XC1702L
Notes:
1. The suggested PROM is determined by compatibility with the
higher configuration frequency of the Xilinx FPGA CCLK.
Designers using the default slow configuration frequency
(CCLK) can use the XC1765E or XC1765EL for the noted
FPGA devices.
XC5202
XC5204
42,416
70,704
XC1765E
XC17128E
DS027 (v3.1) July 5, 2000
Product Specification
www.xilinx.com
1-800-255-7778
3
R
XC1700E and XC1700L Series Configuration PROMs
read sequentially, accessed via the internal address and bit
counters which are incremented on every valid rising edge
of CCLK.
Controlling PROMs
Connecting the FPGA device with the PROM.
•
The DATA output(s) of the of the PROM(s) drives the
DIN input of the lead FPGA device.
If the user-programmable, dual-function DIN pin on the
FPGA is used only for configuration, it must still be held at a
defined level during normal operation. The Xilinx FPGA
families take care of this automatically with an on-chip
default pull-up resistor.
•
•
•
The Master FPGA CCLK output drives the CLK input(s)
of the PROM(s).
The CEO output of a PROM drives the CE input of the
next PROM in a daisy chain (if any).
Programming the FPGA With Counters
Unchanged Upon Completion
The RESET/OE input of all PROMs is best driven by
the INIT output of the lead FPGA device. This
connection assures that the PROM address counter is
reset before the start of any (re)configuration, even
when a reconfiguration is initiated by a VCC glitch.
When multiple FPGA-configurations for a single FPGA are
stored in a PROM, the OE pin should be tied Low. Upon
power-up, the internal address counters are reset and con-
figuration begins with the first program stored in memory.
Since the OE pin is held Low, the address counters are left
unchanged after configuration is complete. Therefore, to
reprogram the FPGA with another program, the DONE line
is pulled Low and configuration begins at the last value of
the address counters.
Other methods—such as driving RESET/OE from LDC
or system reset—assume the PROM internal
power-on-reset is always in step with the FPGA’s
internal power-on-reset. This may not be a safe
assumption.
•
•
The PROM CE input can be driven from either the LDC
or DONE pins. Using LDC avoids potential contention
on the DIN pin.
This method fails if a user applies RESET during the FPGA
configuration process. The FPGA aborts the configuration
and then restarts a new configuration, as intended, but the
PROM does not reset its address counter, since it never
saw a High level on its OE input. The new configuration,
therefore, reads the remaining data in the PROM and inter-
prets it as preamble, length count etc. Since the FPGA is
the master, it issues the necessary number of CCLK pulses,
up to 16 million (224) and DONE goes High. However, the
FPGA configuration will be completely wrong, with potential
contentions inside the FPGA and on its output pins. This
method must, therefore, never be used when there is any
chance of external reset during configuration.
The CE input of the lead (or only) PROM is driven by
the DONE output of the lead FPGA device, provided
that DONE is not permanently grounded. Otherwise,
LDC can be used to drive CE, but must then be
unconditionally High during user operation. CE can
also be permanently tied Low, but this keeps the DATA
output active and causes an unnecessary supply
current of 10 mA maximum.
FPGA Master Serial Mode Summary
The I/O and logic functions of the Configurable Logic Block
(CLB) and their associated interconnections are established
by a configuration program. The program is loaded either
automatically upon power up, or on command, depending
on the state of the three FPGA mode pins. In Master Serial
mode, the FPGA automatically loads the configuration pro-
gram from an external memory. The Xilinx PROMs have
been designed for compatibility with the Master Serial
mode.
Cascading Configuration PROMs
For multiple FPGAs configured as a daisy-chain, or for
future FPGAs requiring larger configuration memories, cas-
caded PROMs provide additional memory. After the last bit
from the first PROM is read, the next clock signal to the
PROM asserts its CEO output Low and disables its DATA
line. The second PROM recognizes the Low level on its CE
input and enables its DATA output. See Figure 2.
Upon power-up or reconfiguration, an FPGA enters the
Master Serial mode whenever all three of the FPGA
mode-select pins are Low (M0=0, M1=0, M2=0). Data is
read from the PROM sequentially on a single data line. Syn-
chronization is provided by the rising edge of the temporary
signal CCLK, which is generated during configuration.
After configuration is complete, the address counters of all
cascaded PROMs are reset if the FPGA RESET pin goes
Low, assuming the PROM reset polarity option has been
inverted.
To reprogram the FPGA with another program, the DONE
line goes Low and configuration begins where the address
counters had stopped. In this case, avoid contention
between DATA and the configured I/O use of DIN.
Master Serial Mode provides a simple configuration inter-
face. Only a serial data line and two control lines are
required to configure an FPGA. Data from the PROM is
4
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1-800-255-7778
DS027 (v3.1) July 5, 2000
Product Specification
R
XC1700E and XC1700L Series Configuration PROMs
V
CC
D
OUT
OPTIONAL
Daisy-chained
FPGAs with
Different
configurations
OPTIONAL
FPGA
Slave FPGAs
with Identical
Configurations
MODES*
V
CC
3.3V
4.7K
V
CC
V
PP
DATA
CLK
DATA
CLK
D
Cascaded
Serial
Memory
IN
RESET
RESET
PROM
CCLK
DONE
INIT
CE
CEO
CE
OE/RESET
OE/RESET
* For mode pin connections,
refer to the appropriate FPGA data sheet.
(Low Resets the Address Pointer)
CCLK
(Output)
D
IN
D
OUT
(Output)
DS027_02_060100
Figure 2: Master Serial Mode. The one-time-programmable PROM supports automatic loading of configuration programs.
Multiple devices can be cascaded to support additional FPGAs. An early DONE inhibits the PROM data output one CCLK
cycle before the FPGA I/Os become active.
DS027 (v3.1) July 5, 2000
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5
Product Specification
1-800-255-7778
R
XC1700E and XC1700L Series Configuration PROMs
Standby Mode
Programming
The PROM enters a low-power standby mode whenever CE
is asserted High. The output remains in a high impedance
state regardless of the state of the OE input.
The devices can be programmed on programmers supplied
by Xilinx or qualified third-party vendors. The user must
ensure that the appropriate programming algorithm and the
latest version of the programmer software are used. The
wrong choice can permanently damage the device.
Table 1: Truth Table for XC1700 Control Inputs
Control Inputs
Outputs
RESET
CE
Internal Address
DATA
CEO
ICC
Inactive
Low
If address < TC(1): increment
If address > TC(2): don’t change
Active
High-Z
High
Low
Active
Reduced
Active
Inactive
Active
Low
High
High
Held reset
Not changing
Held reset
High-Z
High-Z
High-Z
High
High
High
Active
Standby
Standby
Notes:
1. The XC1700 RESET input has programmable polarity
2. TC = Terminal Count = highest address value. TC + 1 = address 0.
6
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1-800-255-7778
DS027 (v3.1) July 5, 2000
Product Specification
R
XC1700E and XC1700L Series Configuration PROMs
XC1701, XC1736E, XC1765E, XC17128E and XC17256E
Absolute Maximum Ratings
Symbol
VCC
Description
Supply voltage relative to GND
Conditions
–0.5 to +7.0
–0.5 to +12.5
–0.5 to VCC +0.5
–0.5 to VCC +0.5
–65 to +150
+260
Units
V
V
V
V
C
C
VPP
Supply voltage relative to GND
VIN
Input voltage relative to GND
VTS
Voltage applied to High-Z output
Storage temperature (ambient)
TSTG
TSOL
Notes:
Maximum soldering temperature (10s @ 1/16 in.)
1. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond those
listed under Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended
periods of time may affect device reliability.
Operating Conditions (5V Supply)
Symbol
Description
Min
4.750
4.50
Max
5.25
5.50
Units
(1)
VCC
Supply voltage relative to GND (TA = 0 C to +70 C)
Supply voltage relative to GND (TA = –40 C to +85 C)
Commercial
Industrial
V
V
Notes:
1. During normal read operation VPP MUST be connect to VCC.
DC Characteristics Over Operating Condition
Symbol
VIH
Description
Min
Max
VCC
0.8
-
Units
V
High-level input voltage
Low-level input voltage
2
VIL
0
V
VOH
VOL
VOH
VOL
ICCA
ICCS
ICCS
IL
High-level output voltage (IOH = –4 mA)
Low-level output voltage (IOL = +4 mA)
High-level output voltage (IOH = –4 mA)
Low-level output voltage (IOL = +4 mA)
Supply current, active mode (at maximum frequency)
Supply current, standby mode
Commercial
3.86
V
-
0.32
-
V
Industrial
3.76
V
-
0.37
10
V
-
mA
A
-
50
Supply current, standby mode (XC1701)
Input or output leakage current
-
100
10
A
–10
A
CIN
Input capacitance (VIN = GND, f = 1.0 MHz)
Output capacitance (VIN = GND, f = 1.0 MHz)
-
-
10
pF
pF
COUT
10
DS027 (v3.1) July 5, 2000
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7
Product Specification
1-800-255-7778
R
XC1700E and XC1700L Series Configuration PROMs
XC1704L, XC1702L, XC1701L, XC17512L, XC1765EL, XC17128EL and XC17256EL
Absolute Maximum Ratings
Symbol
VCC
Description
Supply voltage relative to GND
Conditions
–0.5 to +7.0
–0.5 to +12.5
–0.5 to VCC +0.5
–0.5 to VCC +0.5
–65 to +150
+260
Units
V
V
V
V
C
C
VPP
Supply voltage relative to GND
VIN
Input voltage relative to GND
VTS
Voltage applied to High-Z output
Storage temperature (ambient)
TSTG
TSOL
Notes:
Maximum soldering temperature (10s @ 1/16 in.)
1. Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond those
listed under Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended
periods of time may affect device reliability.
Operating Conditions (3V Supply)
Symbol
Description
Min
3.0
3.0
Max
3.6
Units
(1)
VCC
Supply voltage relative to GND (TA = 0 C to +70 C)
Supply voltage relative to GND (TA = –40 C to +85 C)
Commercial
Industrial
V
V
3.6
Notes:
1. During normal read operation VPP MUST be connect to VCC.
DC Characteristics Over Operating Condition
Symbol
VIH
Description
Min
Max
VCC
0.8
-
Units
V
High-level input voltage
Low-level input voltage
2
0
VIL
V
VOH
VOL
High-level output voltage (IOH = –3 mA)
2.4
-
V
Low-level output voltage (IOL = +3 mA)
0.4
10
5
V
ICCA
ICCA
Supply current, active mode (at maximum frequency) (XC1700L)
-
mA
mA
Supply current, active mode (at maximum frequency)
(XC1765EL, XC17128EL, XC17256EL)
-
ICCS
Supply current, standby mode (XC1701L, XC17512L, XC17256L,
X1765EL, XC17128EL)
-
50
A
ICCS
IL
Supply current, standby mode (XC1702L, XC1704L)
Input or output leakage current
-
350
10
A
A
–10
CIN
Input capacitance (VIN = GND, f = 1.0 MHz)
Output capacitance (VIN = GND, f = 1.0 MHz)
-
-
10
pF
pF
COUT
10
8
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DS027 (v3.1) July 5, 2000
1-800-255-7778
Product Specification
R
XC1700E and XC1700L Series Configuration PROMs
AC Characteristics Over Operating Condition
CE
T
T
T
HCE
SCE
SCE
RESET/OE
CLK
T
HOE
T
T
HC
LC
T
CYC
T
T
DF
OE
T
T
CAC
OH
T
CE
DATA
T
OH
DS027_03_021500
XC17128EL,
XC17256EL,
XC1704L,
XC1701,
XC17128E,
XC17256E
XC1702L,
XC1701L,
XC17512L
XC1736E,
XC1765E
XC1765EL
Symbol
Description
OE to data delay
Min Max
Min
-
Max
Min Max Min Max Units
TOE
TCE
-
-
25
45
45
50
-
30
45
45
50
-
-
-
45
60
80
50
-
-
-
40
ns
ns
ns
ns
ns
ns
ns
ns
ns
CE to data delay
CLK to data delay
-
60
TCAC
TDF
-
-
-
-
200
CE or OE to data float delay(2,3)
Data hold from CE, OE, or CLK(3)
Clock periods
-
-
-
-
50
-
TOH
TCYC
TLC
0
0
0
0
67
20
20
20
-
67
25
25
25
-
100
50
50
25
-
400
100
100
40
-
CLK Low time(3)
-
-
-
-
THC
TSCE
CLK High time(3)
-
-
-
-
CE setup time to CLK
-
-
-
-
(to guarantee proper counting)
THCE
THOE
CE hold time to CLK
(to guarantee proper counting)
0
-
-
0
-
-
0
-
-
0
-
-
ns
ns
OE hold time
20
25
100
100
(guarantees counters are reset)
Notes:
1. AC test load = 50 pF
2. Float delays are measured with 5 pF AC loads. Transition is measured at ±200 mV from steady state active levels.
3. Guaranteed by design, not tested.
4. All AC parameters are measured with VIL = 0.0V and VIH = 3.0V.
DS027 (v3.1) July 5, 2000
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9
Product Specification
1-800-255-7778
R
XC1700E and XC1700L Series Configuration PROMs
AC Characteristics Over Operating Condition When Cascading
RESET/OE
CE
CLK
T
CDF
Last Bit
First Bit
DATA
CEO
T
T
OOE
OCK
T
OCE
T
OCE
DS027_04_021500
Symbol
TCDF
Description
Min
Max
50
Units
ns
CLK to data float delay(2,3)
CLK to CEO delay(3)
-
-
-
-
TOCK
30
ns
TOCE
CE to CEO delay(3)
35
ns
TOOE
RESET/OE to CEO delay(3)
30
ns
Notes:
1. AC test load = 50 pF
2. Float delays are measured with 5 pF AC loads. Transition is measured at ±200 mV from steady
state active levels.
3. Guaranteed by design, not tested.
4. All AC parameters are measured with VIL = 0.0V and VIH = 3.0V.
10
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DS027 (v3.1) July 5, 2000
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Product Specification
R
XC1700E and XC1700L Series Configuration PROMs
Ordering Information
XC1701L PC20 C
Device Number
Operating Range/Processing
XC1736E
C = Commercial (TA = 0 to +70 C)
I = Industrial (TA = –40 to +85 C)
Package Type
PD8 = 8-pin Plastic DIP
XC1765E
XC1765EL
XC17128E
XC17128EL
XC17256E
XC17256EL
XC17512L
XC1701
SO8 = 8-pin Plastic Small-Outline Package
VO8 = 8-pin Plastic Small-Outline Thin Package
SO20 = 20-pin Plastic Small-Outline Package
PC20 = 20-pin Plastic Leaded Chip Carrier
VQ44 = 44-pin Plastic Quad Flat Package
PC44 = 44-pin Plastic Chip Carrier
XC1701L
XC1704L
XC1702L
Valid Ordering Combinations
XC1736EPD8C
XC1736ESO8C
XC1736EVO8C
XC1765EPD8C
XC1765ESO8C
XC1765EVO8C
XC17128EPD8C
XC17128EVO8C
XC17256EPD8C
XC17256EVO8C
XC1701PD8C
XC1701PC20C
XC1701SO20C
XC1701PD8I
XC1702LVQ44C
XC1702LPC44C
XC1704LVQ44C
XC1704LPC44C
XC1702LVQ44I
XC1702LPC44I
XC1704LVQ44I
XC1704LPC44I
XC17512LPD8C
XC17128EPC20C XC17256EPC20C
XC1736EPC20C XC1765EPC20C
XC17128EPD8I
XC17128EVO8I
XC17128EPC20I
XC17256EPD8I
XC17256EVO8I
XC17256EPC20I
XC1736EPD8I
XC1736ESO8I
XC1736EVO8I
XC1736EPC20I
XC1765EPD8I
XC1765ESO8I
XC1765EVO8I
XC1765EPC20I
XC1765ELPD8C
XC1765ELSO8C
XC1701PC20I
XC1701SO20I
XC17128ELPD8C XC17256ELPD8C
XC17128ELVO8C
XC1701LPD8C
XC17256ELVO8C XC1701LPC20C XC17512LPC20C
XC1765ELVO8C XC17128ELPC20C XC17256ELPC20C XC1701LSO20C XC17512LSO20C
XC1765ELPC20C XC17128ELPD8I
XC17256ELPD8I
XC17256ELVO8I
XC1701LPD8I
XC1701LPC20I
XC1701LSO20I
XC17512LPD8I
XC17512LPC20I
XC17512LSO20I
XC1765ELPD8I
XC1765ELSO8I
XC1765ELVO8I
XC1765ELPC20I
XC17128ELVO8I
XC17128ELPC20I XC17256ELPC20I
DS027 (v3.1) July 5, 2000
www.xilinx.com
11
Product Specification
1-800-255-7778
R
XC1700E and XC1700L Series Configuration PROMs
Marking Information
Due to the small size of the commercial serial PROM packages, the complete ordering part number cannot be marked on
the package. The XC prefix is deleted and the package code is simplified. Device marking is as follows:
1701L J C
Device Number
Operating Range/Processing
1736E
1765E
C = Commercial (TA = 0 to +70 C)
I = Industrial (TA = –40 to +85 C)
Package Type
1765X(1)
17128E
17128X(1)
17256E
17256X(1)
1704L
P
= 8-pin Plastic DIP
S(2) = 8-pin Plastic Small-Outline Package
V
= 8-pin Plastic Small-Outline Thin Package
S(3) = 20-pin Plastic Small-Outline Package
= 20-pin Plastic Leaded Chip Carrier
J
VQ44 = 44-pin Plastic Quad Flat Package
PC44 = 44-pin Plastic Chip Carrier
1702L
1701
1701L
17512L
Notes:
1. When marking the device number on the EL parts, an X is used in place of an EL.
2. For XC1700E/EL only.
3. For XC1700L only.
Revision History
The following table shows the revision history for this document.
Date
Version
Revision
7/14/98
1.1
Major revisions to include the XC1704L, XC1702L, and the XQ1701L devices, packages and
operating conditions. Also revised the timing specifications on page 9.
9/8/98
2.0
2.1
Revised the marking information for the VQ44. Updated "DC Characteristics Over Operating
Condition" on page 7 and page 8. Added references to the XC4000XLA and XC4000XV
families in "Xilinx FPGAs and Compatible PROMs" on page 3 and Figure 2 on page 5.
12/18/98
Added Virtex FPGAs to "Xilinx FPGAs and Compatible PROMs" on page 3. Added the PC44
package for the XC1702L and XC1704L products.
1/27/99
7/8/99
2.2
2.3
3.0
Changed Military ICCS.
Changed ICCS standby on XC1702/XC1704 from 50 A to 300 A.
3/30/00
Combined data sheets XC1700E and XC1700L. Added DS027, removed Military Specs.
Added Virtex-E and EM references.
07/05/00
3.1
Added 4.7K resistor to Figure 2, updated format.
12
www.xilinx.com
DS027 (v3.1) July 5, 2000
1-800-255-7778
Product Specification
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