X9408YZ24-2.7T5 [XICOR]

Digital Potentiometer, 4 Func, 2500ohm, 2-wire Serial Control Interface, 64 Positions, CMOS, PBGA24, XBGA-24;
X9408YZ24-2.7T5
型号: X9408YZ24-2.7T5
厂家: XICOR INC.    XICOR INC.
描述:

Digital Potentiometer, 4 Func, 2500ohm, 2-wire Serial Control Interface, 64 Positions, CMOS, PBGA24, XBGA-24

文件: 总29页 (文件大小:175K)
中文:  中文翻译
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APPLICATION NOTES  
A V A I L A B L E  
AN99 • AN115 • AN124 • AN133 • AN134 • AN135  
Low Noise/Low Power/2-Wire Bus  
X9408  
Quad Digitally Controlled (XDCP) Potentiometers  
FEATURES  
DESCRIPTION  
• Four separate XDCP’s in one package  
• 64 resistor taps per potentiometer  
• 2-wire serial interface  
The X9408 integrates four digitally controlled  
potentiometers (XDCP) on a monolithic CMOS  
integrated circuit.  
• Wiper resistance, 150typical  
The digital controlled potentiometer is implemented  
using 63 resistive elements in a series array. Between  
each element are tap points connected to the wiper  
terminal through switches. The position of the wiper on  
the array is controlled by the user through the SPI bus  
interface. Each potentiometer has associated with it a  
volatile Wiper Counter Register (WCR) and four non-  
volatile Data Registers that can be directly written to  
and read by the user. The contents of the WCR  
controls the position of the wiper on the resistor array  
though the switches. Powerup recalls the contents of  
the default data register (DR0) to the WCR.  
• Four nonvolatile data registers for each pot  
• Nonvolatile storage of wiper position  
• Standby current < 1µA max (total package)  
• V  
= 2.7V to 5.5V operation  
CC  
V+ = 2.7V to 5.5V  
V– = –2.7V to –5.5V  
• 10K, 2.5Ktotal pot resistance  
• 100 year data retention  
• 24-lead SOIC, 24-lead TSSOP, and 24-lead XBGA  
packages  
The XDCP can be used as a three-terminal  
potentiometer or as a two terminal variable resistor in  
a wide variety of applications including control,  
parameter adjustments, and signal processing.  
BLOCK DIAGRAM  
V
V
V+  
V-  
Pot 0  
CC  
SS  
R0 R1  
R2 R3  
R
R0 R1  
R2 R3  
H0  
Wiper  
Counter  
Register  
(WCR)  
Wiper  
Counter  
Register  
(WCR)  
R
H2  
Resistor  
Array  
Pot 2  
R
L0  
WP  
R
L2  
R
SCL  
SDA  
A0  
W0  
R
W2  
Interface  
and  
Control  
A1  
8
Circuitry  
A2  
R
A3  
W1  
Data  
R
R
W3  
R0 R1  
R2 R3  
R0 R1  
R2 R3  
R
Wiper  
Counter  
Register  
(WCR)  
H1  
Resistor  
Array  
Pot 1  
Wiper  
Counter  
Register  
(WCR)  
H3  
Resistor  
Array  
Pot 3  
R
L1  
R
L3  
Characteristics subject to change without notice. 1 of 20  
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X9408  
PIN DESCRIPTIONS  
R
(R –R  
)
W
W0  
W3  
The wiper outputs are equivalent to the wiper output of  
a mechanical potentiometer.  
Host Interface Pins  
Serial Clock (SCL)  
Hardware Write Protect Input (WP)  
The SCL input is used to clock data into and out of the  
X9408.  
The WP pin when low prevents nonvolatile writes to  
the wiper counter registers.  
Serial Data (SDA)  
Analog Supplies V+, V-  
SDA is a bidirectional pin used to transfer data into  
and out of the device. It is an open drain output and  
may be wire-ORed with any number of open drain or  
open collector outputs. An open drain output requires  
the use of a pull-up resistor. For selecting typical  
values, refer to the guidelines for calculating typical  
values on the bus pull-up resistors graph.  
The Analog Supplies V+, V- are the supply voltages  
for the XDCP analog section.  
PIN NAMES  
Symbol  
Description  
Serial Clock  
SCL  
SDA  
A0-A3  
Serial Data  
Device Address (A A )  
0
3
Device Address  
The address inputs are used to set the least significant  
4 bits of the 8-bit slave address. A match in the slave  
address serial data stream must be made with the  
address input in order to initiate communication with  
the X9408. A maximum of 16 devices may occupy the  
2-wire serial bus.  
R
–R , R –R  
Potentiometer Pins  
(terminal equivalent)  
H0 H3 L0 L3  
R
–R  
Potentiometer Pins  
(wiper equivalent)  
W0 W3  
WP  
Hardware Write Protection  
Analog Supplies  
V+,V-  
Potentiometer Pins  
V
System Supply Voltage  
System Ground  
R (R –R ), R (R –R )  
CC  
H
H0 H3  
L
L0 L3  
V
The R and R inputs are equivalent to the terminal  
SS  
H
L
connections on either end of  
a
mechanical  
NC  
No Connection  
potentiometer.  
PIN CONFIGURATION  
DIP/SOIC  
XBGA  
TSSOP  
1
2
3
4
V+  
R
V
WP  
SDA  
1
2
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
1
2
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
CC  
R
A
A
1
L3  
L0  
2
R
R
R
A
1
A
W0  
L1  
2
A
R
R
R
V
R
R
A
R
R
3
R
W0  
H0  
L0  
H3  
3
H0  
L1  
R
R
SDA  
WP  
L0  
W1  
4
H1  
W3  
4
W0  
B
C
D
E
F
R
W1  
A
2
5
5
0
V
R
R
R
R
V
SS  
CC  
H0  
H3  
H1  
V
NC  
SS  
V-  
WP  
6
6
CC  
X9408  
X9408  
SDA  
A
3
7
V+  
7
V+  
R
V-  
H2  
R
SCL  
A
1
R
R
R
W2  
8
8
L3  
A
R
W2  
NC  
3
L3  
R
R
H2  
R
9
9
L2  
L1  
H3  
W3  
R
R
10  
L2  
H2  
10  
R
H1  
R
A
SCL  
R
L2  
0
W3  
R
A
14  
13  
SCL  
14  
13  
R
W2  
11  
12  
0
11  
12  
W1  
V
A
3
Top View–Bumps Down  
V-  
SS  
NC  
Characteristics subject to change without notice. 2 of 20  
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X9408  
PRINCIPLES OF OPERATION  
The X9408 will respond with an acknowledge after  
recognition of a start condition and its slave address  
and once again after successful receipt of the  
command byte. If the command is followed by a data  
byte the X9408 will respond with a final acknowledge.  
The X9408 is  
a
highly integrated microcircuit  
incorporating four resistor arrays and their associated  
registers and counters and the serial interface logic  
providing direct communication between the host and  
the XDCP potentiometers.  
Array Description  
The X9408 is comprised of four resistor arrays. Each  
array contains 63 discrete resistive segments that are  
connected in series. The physical ends of each array  
are equivalent to the fixed terminals of a mechanical  
Serial Interface  
The X9408 supports a bidirectional bus oriented  
protocol. The protocol defines any device that sends  
data onto the bus as a transmitter and the receiving  
device as the receiver. The device controlling the  
transfer is a master and the device being controlled is  
the slave. The master will always initiate data transfers  
and provide the clock for both transmit and receive  
operations. Therefore, the X9408 will be considered a  
slave device in all applications.  
potentiometer (R and R inputs).  
H
L
At both ends of each array and between each resistor  
segment is a CMOS switch connected to the wiper  
(R ) output. Within each individual array only one  
W
switch may be turned on at a time. These switches are  
controlled by the Wiper Counter Register (WCR). The  
six bits of the WCR are decoded to select, and enable,  
one of sixty-four switches.  
Clock and Data Conventions  
Data states on the SDA line can change only during  
The WCR may be written directly, or it can be changed  
by transferring the contents of one of four associated  
Data Registers into the WCR. These Data Registers  
and the WCR can be read and written by the host  
system.  
SCL LOW periods (t  
). SDA state changes during  
LOW  
SCL HIGH are reserved for indicating start and stop  
conditions.  
Start Condition  
All commands to the X9408 are preceded by the start  
condition, which is a HIGH to LOW transition of SDA  
Device Addressing  
Following a start condition the master must output the  
address of the slave it is accessing. The most  
significant four bits of the slave address are the device  
type identifier (refer to Figure 1 below). For the X9408  
this is fixed as 0101[B].  
while SCL is HIGH (t  
). The X9408 continuously  
HIGH  
monitors the SDA and SCL lines for the start condition  
and will not respond to any command until this  
condition is met.  
Stop Condition  
Figure 1. Slave Address  
All communications must be terminated by a stop  
condition, which is a LOW to HIGH transition of SDA  
while SCL is HIGH.  
Device Type  
Identifier  
Acknowledge  
0
1
0
1
A3  
A2  
A1  
A0  
Acknowledge is a software convention used to provide  
a positive handshake between the master and slave  
devices on the bus to indicate the successful receipt of  
data. The transmitting device, either the master or the  
slave, will release the SDA bus after transmitting eight  
bits. The master generates a ninth clock cycle and  
during this period the receiver pulls the SDA line LOW  
to acknowledge that it successfully received the eight  
bits of data.  
Device Address  
The next four bits of the slave address are the device  
address. The physical device address is defined by the  
state of the A -A inputs. The X9408 compares the  
serial data stream with the address input state; a  
successful compare of all four address bits is required  
for the X9408 to respond with an acknowledge. The  
0
3
A –A inputs can be actively driven by CMOS input  
0
3
signals or tied to V or V  
.
CC  
SS  
Characteristics subject to change without notice. 3 of 20  
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X9408  
Acknowledge Polling  
point to one of the two pots and when applicable they  
point to one of four associated registers. The format is  
shown below in Figure 2.  
The disabling of the inputs, during the internal  
Nonvolatile write operation, can be used to take  
advantage of the typical 5ms EEPROM write cycle  
time. Once the stop condition is issued to indicate the  
end of the nonvolatile write command the X9408  
initiates the internal write cycle. ACK polling can be  
initiated immediately. This involves issuing the start  
condition followed by the device slave address. If the  
X9408 is still busy with the write operation no ACK will  
be returned. If the X9408 has completed the write  
operation an ACK will be returned and the master can  
then proceed with the next operation.  
Figure 2. Instruction Byte Format  
Register  
Select  
I3  
I2  
I1  
I0  
R1 R0  
P1 P0  
Wiper Counter  
Register Select  
Instructions  
Flow 1. ACK Polling Sequence  
The four high order bits define the instruction. The next  
two bits (R1 and R0) select one of the four registers  
that is to be acted upon when a register oriented  
instruction is issued. The last bits (P1, P0) select which  
one of the four potentiometers is to be affected by the  
instruction.  
Nonvolatile Write  
Command Completed  
Enter ACK Polling  
Four of the nine instructions end with the transmission  
of the instruction byte. The basic sequence is  
illustrated in Figure 3. These two-byte instructions  
exchange data between the Wiper Counter Register  
and one of the Data Registers. A transfer from a Data  
Register to a Wiper Counter Register is essentially a  
write to a static RAM. The response of the wiper to this  
Issue  
START  
Issue Slave  
Issue STOP  
Address  
action will be delayed t  
Counter Register (current wiper position), to a data  
register is a write to nonvolatile memory and takes a  
. A transfer from the Wiper  
WRL  
NO  
ACK  
Returned?  
minimum of t  
to complete. The transfer can occur  
YES  
WR  
between one of the four potentiometers and one of its  
associated registers; or it may occur globally, wherein  
the transfer occurs between all of the potentiometers  
and one of their associated registers.  
NO  
Further  
Operation?  
YES  
Four instructions require a three-byte sequence to  
complete. These instructions transfer data between the  
host and the X9408; either between the host and one  
of the data registers or directly between the host and  
the Wiper Counter Register. These instructions are:  
Read Wiper Counter Register (read the current wiper  
position of the selected pot), Write Wiper Counter  
Register (change current wiper position of the selected  
pot), Read Data Register (read the contents of the  
selected nonvolatile register) and Write Data Register  
(write a new value to the selected Data Register). The  
sequence of operations is shown in Figure 4.  
Issue  
Instruction  
Issue STOP  
Proceed  
Proceed  
Instruction Structure  
The next byte sent to the X9408 contains the instruction  
and register pointer information. The four most  
significant bits are the instruction. The next four bits  
Characteristics subject to change without notice. 4 of 20  
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X9408  
Figure 3. Two-Byte Instruction Sequence  
SCL  
SDA  
S
T
A
R
T
0
1
0
1
A3 A2 A1 A0  
A
C
K
I3 I2  
I1 I0 R1 R0 P1 P0  
A
C
K
S
T
O
P
The Increment/Decrement command is different from  
the other commands. Once the command is issued and  
the X9408 has responded with an acknowledge, the  
master can clock the selected wiper up and/or down in  
one segment steps; thereby, providing a fine tuning  
resistor segment towards the V terminal. Similarly, for  
each SCL clock pulse while SDA is LOW, the selected  
H
wiper will move one resistor segment towards the V  
L
terminal. A detailed illustration of the sequence and  
timing for this operation are shown in Figures 5 and 6  
respectively.  
capability to the host. For each SCL clock pulse (t  
)
HIGH  
while SDA is HIGH, the selected wiper will move one  
Table 1. Instruction Set  
Instruction Set  
Instruction  
I
I
I
I
R
R
P
P
Operation  
1/0 1/0 Read the contents of the Wiper Counter Register  
pointed to by P –P  
3
2
1
0
1
0
1
0
Read Wiper Counter  
Register  
1
1
1
1
1
0
0
0
1
1
0
1
1
0
0
1
0
1
0
1
0
0
1
0
Write Wiper Counter  
Register  
0
0
1/0 1/0 Write new value to the Wiper Counter Register pointed  
to by P –P  
1
0
Read Data Register  
1/0 1/0 1/0 1/0 Read the contents of the Data Register pointed to by  
P –P and R –R  
1
0
1
0
Write Data Register  
1/0 1/0 1/0 1/0 Write new value to the Data Register pointed to by  
P –P and R –R  
1
0
1
0
XFR Data Register to  
Wiper Counter Register  
1/0 1/0 1/0 1/0 Transfer the contents of the Data Register pointed to  
by P –P and R –R to its associated Wiper Counter  
1
0
1
0
Register  
XFR Wiper Counter  
Register to Data  
Register  
1
0
1
0
1
0
0
0
1
0
0
1
0
1
0
0
1/0 1/0  
1/0 1/0  
1/0 1/0  
0
0
0
1/0 Transfer the contents of the Wiper Counter Register  
pointed to by P –P to the Data Register pointed to  
1
0
by R –R  
1
0
Global XFR Data Reg-  
isters to Wiper Counter  
Registers  
0
0
Transfer the contents of the Data Registers pointed to  
by R –R of all four pots to their respective Wiper  
Counter Registers  
1
0
Global XFR Wiper  
Counter Registers to  
Data Register  
Transfer the contents of both Wiper Counter Regis-  
ters to their respective Data Registers pointed to by  
R –R of all four pots  
1
0
Increment/Decrement  
Wiper Counter Register  
0
0
1/0 1/0 Enable Increment/decrement of the Wiper Counter  
Register pointed to by P –P  
1
0
Note: (7) 1/0 = data is one or zero  
Characteristics subject to change without notice. 5 of 20  
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X9408  
Figure 4. Three-Byte Instruction Sequence  
SCL  
SDA  
S
T
A
R
T
0
1
0
1
A3 A2 A1 A0  
A
C
K
I3 I2  
I1 I0 R1 R0 P1 P0  
A
C
K
0
0
D5 D4 D3 D2 D1 D0  
A
C
K
S
T
O
P
Figure 5. Increment/Decrement Instruction Sequence  
SCL  
SDA  
S
T
A
R
T
0
1
0
1
A3 A2 A1 A0  
A
C
K
I3 I2  
I1 I0 R1 R0 P1 P0  
A
C
K
I
I
D
E
C
1
S
T
O
P
I
D
N
C
1
N
C
2
N
C
n
E
C
n
Figure 6. Increment/Decrement Timing Limits  
INC/DEC  
CMD  
Issued  
t
WRID  
SCL  
SDA  
Voltage Out  
V
/R  
W
W
Characteristics subject to change without notice. 6 of 20  
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X9408  
Figure 7. Acknowledge Response from Receiver  
SCL from  
Master  
1
8
9
Data Output  
from Transmitter  
Data Output  
from Receiver  
START  
Acknowledge  
Figure 8. Detailed Potentiometer Block Diagram  
Serial Data Path  
Serial  
Bus  
Input  
R
H
From Interface  
Circuitry  
C
o
u
n
t
Register 0  
Register 2  
Register 1  
8
6
Parallel  
Bus  
Input  
e
r
Wiper  
D
e
c
o
d
e
Register 3  
Counter  
Register  
(WCR)  
INC/DEC  
Logic  
If WCR = 00[H] then R = R  
W
L
UP/DN  
UP/DN  
If WCR = 3F[H] then R = R  
W
H
R
Modified SCL  
L
CLK  
R
W
Characteristics subject to change without notice. 7 of 20  
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X9408  
DETAILED OPERATION  
If the application does not require storage of multiple  
settings for the potentiometer, these registers can be  
used as regular memory locations that could possibly  
store system parameters or user preference data.  
All XDCP potentiometers share the serial interface  
and share a common architecture. Each potentiometer  
has a Wiper Counter Register and four Data Registers.  
A detailed discussion of the register organization and  
array operation follows.  
Register Descriptions  
Data Registers, (6-Bit), Nonvolatile  
Wiper Counter Register  
D5  
NV  
D4  
NV  
D3  
NV  
D2  
NV  
D1  
NV  
D0  
NV  
The X9408 contains four Wiper Counter Registers,  
one for each XDCP potentiometer. The Wiper Counter  
Register can be envisioned as a 6-bit parallel and  
serial load counter with its outputs decoded to select  
one of sixty-four switches along its resistor array. The  
contents of the WCR can be altered in four ways: it  
may be written directly by the host via the Write Wiper  
Counter Register instruction (serial load); it may be  
written indirectly by transferring the contents of one of  
four associated data registers via the XFR Data  
Register instruction (parallel load); it can be modified  
one step at a time by the Increment/ Decrement  
instruction. Finally, it is loaded with the contents of its  
data register zero (DR0) upon power-up.  
(MSB)  
(LSB)  
Four 6-bit Data Registers for each XDCP. (sixteen 6-bit  
registers in total).  
– {D5~D0}: These bits are for general purpose not vol-  
atile data storage or for storage of up to four different  
wiper values. The contents of Data Register 0 are  
automatically moved to the wiper counter register on  
power-up.  
Wiper Counter Register, (6-Bit), Volatile  
WP5  
V
WP4  
V
WP3  
V
WP2  
V
WP1  
V
WP0  
V
The WCR is a volatile register; that is, its contents are  
lost when the X9408 is powered-down. Although the  
register is automatically loaded with the value in R0  
upon power-up, it should be noted this may be  
different from the value present at power-down.  
(MSB)  
(LSB)  
One 6-bit Wiper Counter Register for each XDCP.  
(Four 6-bit registers in total.)  
Data Registers  
– {D5~D0}:These bits specify the wiper position of the  
respective XDCP. The Wiper Counter Register is  
loaded on power-up by the value in Data Register 0.  
The contents of the WCR can be loaded from any of  
the other Data Register or directly. The contents of  
the WCR can be saved in a DR.  
Each potentiometer has four nonvolatile Data  
Registers. These can be read or written directly by the  
host and data can be transferred between any of the  
four data registers and the WCR. It should be noted all  
operations changing data in one of these registers is a  
nonvolatile operation and will take a maximum of  
10ms.  
Characteristics subject to change without notice. 8 of 20  
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X9408  
Instruction Format  
Notes: (1) “MACK”/”SACK”: stands for the acknowledge sent by the master/slave.  
(2) “A3 ~ A0”: stands for the device addresses sent by the master.  
(3) “X”: indicates that it is a “0” for testing purpose but physically it is a “don’t care” condition.  
(4) “I”: stands for the increment operation, SDA held high during active SCL phase (high).  
(5) “D”: stands for the decrement operation, SDA held low during active SCL phase (high).  
Read Wiper Counter Register  
S device type  
device  
addresses  
instruction  
opcode  
wiper  
addresses  
wiper position  
(sent by slave on SDA)  
S
A
C
K
S
A
C
K
M S  
A T  
C O  
K P  
T
A
R
T
identifier  
W W W W W W  
0 0 P P P P P P  
A A A A  
P P  
1 0  
0
1
0
1
1
0
0
1
0
0
3
2
1
0
5
4 3 2 1 0  
Write Wiper Counter Register  
S device type  
device  
addresses  
instruction  
opcode  
wiper  
addresses  
wiper position  
(sent by master on SDA)  
S
A
C
K
S
A
C
K
S S  
A T  
C O  
K P  
T
A
R
T
identifier  
W W W W W W  
0 0 P P P P P P  
A A A A  
P P  
1 0  
0
1
0
1
1
0
1
0
0
0
3
2
1
0
5
4 3 2 1 0  
Read Data Register  
S device type device  
instruction  
opcode  
wiper  
addresses  
wiper position  
(sent by slave on SDA)  
S
A
C
K
S
A
C
K
M S  
A T  
C O  
K P  
T
A
R
T
identifier  
addresses  
W W W W W W  
0 0 P P P P P P  
A A A A  
R R P P  
0
1
0
1
1
0
1
1
3
2
1
0
1
0
1 0  
5
4 3 2 1 0  
Write Data Register  
S device type  
device  
addresses  
instruction  
opcode  
wiper  
addresses  
wiper position  
(sent by master on SDA)  
S
S
A
C
K
S S  
T
A
R
T
identifier  
A
C
K
A T HIGH-VOLTAGE  
C O WRITE CYCLE  
K P  
W W W W W W  
0 0 P P P P P P  
5 4 3 2 1 0  
A A A A  
3 2 1 0  
R R P P  
1 0 1 0  
0 1 0 1  
1 1 0 0  
XFR Data Register to Wiper Counter Register  
S device type  
device  
addresses  
instruction  
opcode  
wiper  
addresses  
S
A
C
K
S S  
T
A
R
T
identifier  
A T  
C O  
K P  
A A A A  
3 2 1 0  
R R P P  
1 0 1 0  
0 1 0 1  
1 1 0 1  
Write Wiper Counter Register to Data Register  
S device type  
device  
addresses  
instruction  
opcode  
wiper  
addresses  
S
A
C
K
S S  
T
A
R
T
identifier  
A T HIGH-VOLTAGE  
C O WRITE CYCLE  
K P  
A A A A  
3 2 1 0  
R R P P  
1 0 1 0  
0 1 0 1  
1 1 1 0  
Characteristics subject to change without notice. 9 of 20  
REV 1.0 6/20/00  
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X9408  
Increment/Decrement Wiper Counter Register  
S
T
A
R
T
device type  
identifier  
device  
addresses  
instruction  
opcode  
wiper  
addresses  
increment/decrement  
(sent by master on SDA)  
S
A
C
K
S
A
C
K
S
T
O
P
A A A A  
P P  
1 0  
I/ I/  
D D  
I/ I/  
D D  
0
1
0
1
0
0
1
0
0
0
.
.
.
.
3
2
1
0
Global XFR Data Register to Wiper Counter Register  
S
T
A
R
T
device type  
identifier  
device  
addresses  
instruction  
opcode  
wiper  
addresses  
S
A
C
K
S S  
A T  
C O  
K P  
A A A A  
R R  
1 0  
0
1
0
1
0
0
0
1
0 0  
3
2
1
0
Global XFR Wiper Counter Register to Data Register  
S device type  
device  
addresses  
instruction  
opcode  
wiper  
addresses  
S
A
C
K
S S  
A T  
C O  
K P  
T
A
R
T
identifier  
HIGH-VOLTAGE  
WRITE CYCLE  
A A A A  
3 2 1 0  
R R  
0 0  
1 0  
0 1 0 1  
1 0 0 0  
SYMBOL TABLE  
Guidelines for Calculating Typical Values of Bus  
Pull-Up Resistors  
WAVEFORM  
INPUTS  
OUTPUTS  
120  
V
CC MAX  
OL MIN  
R
=
=1.8KΩ  
Must be  
steady  
Will be  
steady  
MIN  
I
100  
80  
t
R
R
=
MAX  
May change  
from Low to  
High  
Will change  
from Low to  
High  
C
BUS  
Max.  
Resistance  
60  
40  
20  
0
May change  
from High to  
Low  
Will change  
from High to  
Low  
Min.  
Resistance  
Don’t Care:  
Changes  
Allowed  
Changing:  
State Not  
Known  
0
20 40 60 80 100 120  
N/A  
Center Line  
is High  
Impedance  
Bus Capacitance (pF)  
Characteristics subject to change without notice. 10 of 20  
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X9408  
ABSOLUTE MAXIMUM RATINGS  
COMMENT  
Temperature under bias....................–65°C to +135°C  
Storage temperature.........................–65°C to +150°C  
Voltage on SDA, SCL or any address  
Stresses above those listed under “Absolute Maximum  
Ratings” may cause permanent damage to the device.  
This is a stress rating only; the functional operation of  
the device (at these or any other conditions above  
those listed in the operational sections of this  
specification) is not implied. Exposure to absolute  
maximum rating conditions for extended periods may  
affect device reliability.  
input with respect to V ......................... –1V to +7V  
SS  
Voltage on V+ (referenced to V ) ........................ 10V  
SS  
Voltage on V- (referenced to V ) ........................ -10V  
SS  
(V+) – (V-) ............................................................. 12V  
Any V .................................................................... V+  
H
Any V ...................................................................... V-  
L
Lead temperature (soldering, 10 seconds) ........300°C  
I
(10 seconds) ............................................... ±12mA  
W
RECOMMENDED OPERATING CONDITIONS  
Temperature  
Commercial  
Industrial  
Min.  
0°C  
Max.  
+70°C  
+85°C  
Device  
X9408  
Supply Voltage (V ) Limits  
CC  
5V ±10%  
–40°C  
X9408-2.7  
2.7V to 5.5V  
ANALOG CHARACTERISTICS (Over recommended operating conditions unless otherwise stated.)  
Limits  
Symbol  
Parameter  
End to end resistance tolerance  
Power rating  
Min.  
Typ.  
Max.  
±20  
50  
Unit  
%
Test Condition  
mW  
mA  
25°C, each pot  
I
Wiper current  
±6  
W
R
Wiper resistance  
150  
500  
+5.5  
+5.5  
-4.5  
-2.7  
V+  
Wiper Current = ± 3mA  
X9118  
W
V +  
Voltage on V+ pin  
+4.5  
+2.7  
-5.5  
-5.5  
V-  
V
V
X9118-2.7  
X9118  
V -  
V
Voltage on V- pin  
V
V
X9118-2.7  
V
Voltage on any R or R pin  
V
= 0V  
SS  
TERM  
H
L
Noise  
Resolution (4)  
-120  
0.1  
dBV/Hz Ref: 1V  
%
(5)  
Absolute linearity (1)  
Relative linearity (2)  
±1  
MI(3)  
MI(3)  
R
R
–R  
w(n)(actual) w(n)(expected)  
(5)  
±0.2  
–[R  
]
w(n + 1)  
w(n) + MI  
Temperature coefficient of R  
±300  
ppm/°C  
ppm/°C  
pF  
TOTAL  
Ratiometric Temperature Coefficient  
Potentiometer Capacitances  
20  
C /C /C  
W
10/10/25  
See Macro model  
H
L
Characteristics subject to change without notice. 11 of 20  
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X9408  
D.C. OPERATING CHARACTERISTICS (Over the recommended operating conditions unless otherwise specified.)  
Limits  
Symbol  
Parameter  
Min.  
Typ.  
Max.  
Unit  
Test Conditions  
I
V
write)  
supply current (nonvolatile  
1
mA  
f = 400kHz, SDA = Open,  
SCL  
CC1  
CC  
Other Inputs = V  
SS  
I
V
supplycurrent(movewiper,  
100  
µA  
f
= 400kHz, SDA = Open,  
SCL  
CC2  
CC  
write, read)  
Other Inputs = V  
SS  
I
V
current (standby)  
1
µA  
µA  
µA  
V
SCL = SDA = V , Addr. = V  
CC SS  
SB  
CC  
I
Input leakage current  
Output leakage current  
Input HIGH voltage  
Input LOW voltage  
Output LOW voltage  
10  
10  
V
V
= V to V  
SS CC  
LI  
IN  
I
= V to V  
SS CC  
LO  
OUT  
V
V
x 0.7  
V
V
x 0.5  
IH  
CC  
CC  
V
–0.5  
x 0.1  
V
IL  
CC  
V
0.4  
V
I
= 3mA  
OL  
OL  
Notes: (1) Absolute linearity is utilized to determine actual wiper voltage versus expected voltage as determined by wiper position when used  
as a potentiometer.  
(2) Relative linearity is utilized to determine the actual change in voltage between two successive tap positions when used as a potenti-  
ometer. It is a measure of the error in step size.  
(3) MI = RTOT/63 or (V –V )/63, single pot  
H
L
(4) Max. = all four arrays cascaded together, Typical = individual array resolutions.  
ENDURANCE AND DATA RETENTION  
Parameter  
Minimum endurance  
Data retention  
Min.  
100,000  
100  
Unit  
Data changes per bit per register  
years  
CAPACITANCE  
Symbol  
Test  
Max.  
Unit  
pF  
Test Condition  
(5)  
I/O  
C
Input/output capacitance (SDA)  
8
6
V
= 0V  
= 0V  
I/O  
(5)  
IN  
C
Input capacitance (A0, A1, A2, A3, and SCL)  
pF  
V
IN  
POWER-UP TIMING  
Symbol  
Parameter  
Min.  
Max.  
1
Unit  
ms  
(6)  
PUR  
t
Power-up to initiation of read operation  
Power-up to initiation of write operation  
(6)  
PUW  
t
5
ms  
(7)  
CC  
t V  
V Power Up Ramp  
CC  
0.2  
50  
V/msec  
R
POWER-UP AND POWER-DOWN  
There are no restrictions on the power-up or power-down sequencing of the bias supplies V , V+, and V- provided  
CC  
that all three supplies reach their final values within 1msec of each other. However, at all times, the voltages on the  
potentiometer pins must be less than V+ and more than V–. The recall of the wiper position from nonvolatile  
memory is not in effect until all supplies reach their final value.  
Notes: (5) This parameter is periodically sampled and not 100% tested  
(6) t  
and t  
are the delays required from the time the third (last) power supply (V , V+ or V-) is stable until the specific  
PUR  
PUW CC  
instruction can be issued.These parameters are periodically sampled and not 100% tested.  
(7) This is not a tested or guaranteed parameter and should only be used as a guidance.  
Characteristics subject to change without notice. 12 of 20  
REV 1.0 6/20/00  
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X9408  
A.C. TEST CONDITIONS  
Test Circuit #3 SPICE Macro Model  
Input pulse levels  
V
x 0.1 to V x 0.9  
CC  
CC  
R
TOTAL  
Input rise and fall times  
Input and output timing level  
10ns  
R
R
L
H
C
V
x 0.5  
L
CC  
C
H
C
W
10pF  
EQUIVALENT A.C. LOAD CIRCUIT  
10pF  
25pF  
5V  
2.7V  
R
W
1533Ω  
SDA Output  
100pF  
100pF  
AC TIMING (over recommended operating condition)  
Symbol Parameter  
Min.  
Max.  
Unit  
kHz  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
f
Clock frequency  
400  
SCL  
t
Clock cycle time  
2500  
600  
1300  
600  
600  
600  
100  
30  
CYC  
t
Clock high time  
HIGH  
t
Clock low time  
LOW  
t
Start setup time  
SU:STA  
HD:STA  
SU:STO  
t
Start hold time  
t
Stop setup time  
t
SDA data input setup time  
SDA data input hold time  
SCL and SDA rise time  
SCL and SDA fall time  
SCL low to SDA data output valid time  
SDA Data output hold time  
SU:DAT  
HD:DAT  
t
t
300  
300  
900  
R
t
F
t
AA  
DH  
t
50  
50  
1300  
0
T
Noise suppression time constant at SCL and SDA inputs  
Bus free time (prior to any transmission)  
WP, A0, A1, A2 and A3 setup time  
I
t
BUF  
t
SU:WPA  
t
WP, A0, A1, A2 and A3 hold time  
0
HD:WPA  
HIGH-VOLTAGE WRITE CYCLE TIMING  
Symbol  
Parameter  
Typ.  
Max.  
Unit  
t
High-voltage write cycle time (store instructions)  
5
10  
ms  
WR  
Characteristics subject to change without notice. 13 of 20  
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X9408  
XDCP TIMING  
Symbol  
Parameter  
Min. Max. Unit  
t
Wiper response time after the third (last) power supply is stable  
10  
10  
10  
µs  
µs  
µs  
WRPO  
t
Wiper response time after instruction issued (all load instructions)  
Wiper response time from an active SCL/SCK edge (increment/decrement instruction)  
WRL  
t
WRID  
Notes: (9) A device must internally provide a hold time of at least 300ns for the SDA signal in order to bridge the undefined region of the falling  
edge of SCL.  
TIMING DIAGRAMS  
START and STOP Timing  
g
(START)  
(STOP)  
t
t
F
R
SCL  
SDA  
t
t
t
SU:STO  
SU:STA  
HD:STA  
t
t
F
R
Input Timing  
t
t
CYC  
HIGH  
SCL  
SDA  
t
LOW  
t
t
t
BUF  
SU:DAT  
HD:DAT  
Output Timing  
SCL  
SDA  
t
t
DH  
AA  
Characteristics subject to change without notice. 14 of 20  
REV 1.0 6/20/00  
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X9408  
XDCP Timing (for All Load Instructions)  
(STOP)  
SCL  
SDA  
VWx  
LSB  
t
WRL  
XDCP Timing (for Increment/Decrement Instruction)  
SCL  
Wiper Register Address  
Inc/Dec  
Inc/Dec  
SDA  
VWx  
t
WRID  
Write Protect and Device Address Pins Timing  
(START)  
(STOP)  
SCL  
...  
(Any Instruction)  
...  
SDA  
...  
t
t
SU:WPA  
HD:WPA  
WP  
A0, A1  
A2, A3  
Characteristics subject to change without notice. 15 of 20  
REV 1.0 6/20/00  
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X9408  
PACKAGING INFORMATION  
24-Lead Plastic Dual In-Line Package Type P  
1.265 (32.13)  
1.230 (31.24)  
0.557 (14.15)  
0.530 (13.46)  
Pin 1 Index  
Pin 1  
0.080 (2.03)  
0.065 (1.65)  
1.100 (27.94)  
Ref.  
0.162 (4.11)  
0.140 (3.56)  
Seating  
Plane  
0.030 (0.76)  
0.015 (0.38)  
0.150 (3.81)  
0.125 (3.18)  
0.110 (2.79)  
0.090 (2.29)  
0.065 (1.65)  
0.040 (1.02)  
0.022 (0.56)  
0.014 (0.36)  
0.625 (15.87)  
0.600 (15.24)  
0°  
Typ. 0.010 (0.25)  
15°  
NOTE:  
1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)  
2. PACKAGE DIMENSIONS EXCLUDE MOLDING FLASH  
Characteristics subject to change without notice. 16 of 20  
REV 1.0 6/20/00  
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X9408  
PACKAGING INFORMATION  
24-Lead Plastic Small Outline Gull Wing Package Type S  
0.393 (10.00)  
0.290 (7.37)  
0.299 (7.60)  
0.420 (10.65)  
Pin 1 Index  
Pin 1  
0.014 (0.35)  
0.020 (0.50)  
0.598 (15.20)  
0.610 (15.49)  
(4X) 7°  
0.092 (2.35)  
0.105 (2.65)  
0.003 (0.10)  
0.012 (0.30)  
0.050 (1.27)  
0.050"Typical  
0.010 (0.25)  
0.020 (0.50)  
X 45°  
0.050"  
Typical  
0° – 8°  
0.009 (0.22)  
0.013 (0.33)  
0.420"  
0.015 (0.40)  
0.050 (1.27)  
0.030" Typical  
24 Places  
FOOTPRINT  
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)  
Characteristics subject to change without notice. 17 of 20  
REV 1.0 6/20/00  
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X9408  
PACKAGING INFORMATION  
24-Lead Plastic, TSSOP Package Type V  
.026 (.65) BSC  
.169 (4.3)  
.177 (4.5)  
.252 (6.4) BSC  
.303 (7.70)  
.311 (7.90)  
.047 (1.20)  
.0075 (.19)  
.0118 (.30)  
.002 (.06)  
.005 (.15)  
.010 (.25)  
Gage Plane  
(7.72)  
(4.16)  
0°–8°  
Seating Plane  
.020 (.50)  
.030 (.75)  
(1.78)  
(0.42)  
Detail A (20X)  
(0.65)  
ALL MEASUREMENTS ARE TYPICAL  
.031 (.80)  
.041 (1.05)  
See Detail “A”  
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)  
Characteristics subject to change without notice. 18 of 20  
REV 1.0 6/20/00  
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X9408  
PACKAGING INFORMATION  
24-Ball BGA (X9408WC)  
a
a
l
j
m
1
2
3
4
4
3
2
1
A
B
C
D
E
F
A
B
C
D
E
F
k
b
b
f
Top View (Bump Side Down)  
Bottom View (Bump Side Up)  
Note: Drawing not to scale  
d
= Die Orientation mark  
c
e
Side View (Bump Side Down)  
Millimeters  
Inches  
Symbol Min  
Nom.  
Max  
Min  
Nom  
Max  
Package Body Dimension X  
Package Body Dimension Y  
Package Height  
a
b
c
d
e
f
2.575 2.605 2.635 0.10138 0.10258 0.10374  
3.794 3.824 3.854 0.14937 0.15055 0.15173  
0.697 0.750 0.763 0.02744 0.02874 0.03004  
Package Body Thickness  
Ball Height  
0.444 0.457 0.470 0.01748 0.01799 0.01850  
0.253 0.273 0.293 0.00996 0.01075 0.01154  
Ball Diameter  
0.360 0.374 0.388 0.01417 0.01472 0.01528  
Total Ball Count  
g
h
i
24  
Ball Count X Axis  
Ball Count Y Axis  
Pins Pitch XAxis  
4
6
j
0.5  
Pins Pitch Y Axis  
k
l
0.5  
Edge to Ball Center (Corner) Distance Along X  
Edge to Ball Center (Corner) Distance Along Y  
0.523 0.553 0.583 0.02057 0.02175 0.02293  
0.632 0.662 0.692 0.02488 0.02606 0.02724  
m
Characteristics subject to change without notice. 19 of 20  
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X9408  
Ordering Information  
X9408  
Y
P
T
V
V
Limits  
CC  
Device  
Blank = 5V ±10%  
–2.7 = 2.7 to 5.5V  
Temperature Range  
Blank = Commercial = 0°C to +70°C  
I = Industrial = –40°C to +85°C  
Package  
S24 = 24-Lead SOIC  
V24 = 24-Lead TSSOP  
Z24 = 24-Lead XBGA  
Potentiometer Organization  
Pot 0 Pot 1 Pot 3 Pot 4  
W =  
Y =  
10K10K10K10KΩ  
2.5K2.5K2.5K2.5KΩ  
Part Mark Convention  
24 Lead XBGA  
X9408WZ24I-2.7  
X9408WZ24  
Top Mark  
XABO  
XABP  
XACB  
XACA  
X9408YZ24  
X9408YZ24I-2.7  
©Xicor, Inc. 2000 Patents Pending  
LIMITED WARRANTY  
Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc. makes no warranty,  
express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement.  
Xicor, Inc. makes no warranty of merchantability or fitness for any purpose. Xicor, Inc. reserves the right to discontinue production and change specifications and prices  
at any time and without notice.  
Xicor, Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No other circuits, patents, or licenses are implied.  
TRADEMARK DISCLAIMER:  
Xicor and the Xicor logo are registered trademarks of Xicor, Inc. AutoStore, Direct Write, Block Lock, SerialFlash, MPS, and XDCP are also trademarks of Xicor, Inc. All  
others belong to their respective owners.  
U.S. PATENTS  
Xicor products are covered by one or more of the following U.S. Patents: 4,326,134; 4,393,481; 4,404,475; 4,450,402; 4,486,769; 4,488,060; 4,520,461; 4,533,846;  
4,599,706; 4,617,652; 4,668,932; 4,752,912; 4,829,482; 4,874,967; 4,883,976; 4,980,859; 5,012,132; 5,003,197; 5,023,694; 5,084,667; 5,153,880; 5,153,691;  
5,161,137; 5,219,774; 5,270,927; 5,324,676; 5,434,396; 5,544,103; 5,587,573; 5,835,409; 5,977,585. Foreign patents and additional patents pending.  
LIFE RELATED POLICY  
In situations where semiconductor component failure may endanger life, system designers using this product should design the system with appropriate error detection  
and correction, redundancy and back-up features to prevent such an occurrence.  
Xicor’s products are not authorized for use in critical components in life support devices or systems.  
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to  
perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user.  
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life  
support device or system, or to affect its safety or effectiveness.  
Characteristics subject to change without notice. 20 of 20  
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Xicor Product Change Notice 02/04/00  
Page 1 of 9  
Product Change Notice : PCN February 4, 2000  
February 4, 2000  
Ref: PCN-00-01  
Dear Xicor Customer,  
At Xicor, we continuously strive to improve the performance and efficiency of our operations, and  
the quality of our products. Consistent with this effort, we are currently adding additional wafer  
fabrication capacity for various IIC and SPI serial products.  
This added wafer fabrication capacity will complement current operations and will expand Xicor’s  
capabilities to accommodate future growth.  
In addition, several of the IIC and SPI serial products are undergoing a die revision change. The  
new die revision is functionally and pin to pin compatable with the existing die revision.  
See the detailed product number list below for the implementation date and description of the  
change. Samples for qualification will be available approximately 4 weeks before the  
implementation date. Qualification data is available upon request.  
If you have any further questions, please contact your regional Xicor sales office.  
Sincerely,  
Xicor Marketing Department  
Xicor Part Number  
IIC Serial Products  
X24164P  
Implement Date  
Description of Change  
2/28/00  
2/28/00  
2/28/00  
2/28/00  
2/28/00  
2/28/00  
2/28/00  
2/28/00  
2/28/00  
5/31/00  
5/31/00  
5/31/00  
5/31/00  
5/31/00  
5/31/00  
Foundry Change  
X24164P-3  
Foundry Change  
X24164PI  
Foundry Change  
X24164PI-3  
X24164S  
Foundry Change  
Foundry Change  
X24164S-2.7  
X24164S-3  
Foundry Change  
Foundry Change  
X24164SI  
Foundry Change  
X24164SI-2.7  
X24C04P  
Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
X24C04P-2.7  
X24C04P-3  
X24C04P-3.5  
X24C04PI  
X24C04PI-2.7  
file://F:\export\projects\bitting2\imaging\BITTING\mail_pdf\recode\pcn_000204.html  
1/15/01  
Xicor Product Change Notice 02/04/00  
Page 2 of 9  
X24C04PI-3  
5/31/00  
5/31/00  
5/31/00  
5/31/00  
5/31/00  
5/31/00  
5/31/00  
5/31/00  
5/31/00  
5/31/00  
5/31/00  
5/31/00  
5/31/00  
5/31/00  
5/31/00  
5/31/00  
5/31/00  
5/31/00  
5/31/00  
5/31/00  
5/31/00  
5/31/00  
5/31/00  
5/31/00  
5/31/00  
8/31/00  
8/31/00  
8/31/00  
8/31/00  
8/31/00  
8/31/00  
8/31/00  
8/31/00  
8/31/00  
8/31/00  
8/31/00  
8/31/00  
8/31/00  
8/31/00  
8/31/00  
8/31/00  
8/31/00  
8/31/00  
8/31/00  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
X24C04PI-3.5  
X24C04PM  
X24C04PM-3  
X24C04PM-3.5  
X24C04S14  
X24C04S14-3  
X24C04S14-3.5  
X24C04S14I  
X24C04S14I-3  
X24C04S14I-3.5  
X24C04S14M  
X24C04S14M-3  
X24C04S14M-3.5  
X24C04S8  
X24C04S8-2.7  
X24C04S8-3  
X24C04S8-3.5  
X24C04S8I  
X24C04S8I-2.7  
X24C04S8I-3  
X24C04S8I-3.5  
X24C04S8M  
X24C04S8M-3  
X24C04S8M-3.5  
X24C08P  
X24C08P-2.7  
X24C08P-3  
X24C08P-3.5  
X24C08PI  
X24C08PI-2.7  
X24C08PI-3  
X24C08PI-3.5  
X24C08PM  
X24C08PM-3  
X24C08PM-3.5  
X24C08S  
X24C08S-3  
X24C08S-3.5  
X24C08S8  
X24C08S8-2.7  
X24C08S8-3  
X24C08S8I  
X24C08S8I-2.7  
file://F:\export\projects\bitting2\imaging\BITTING\mail_pdf\recode\pcn_000204.html  
1/15/01  
Xicor Product Change Notice 02/04/00  
Page 3 of 9  
X24C08S8I-3  
X24C08S8M  
X24C08SI  
8/31/00  
8/31/00  
8/31/00  
8/31/00  
8/31/00  
8/31/00  
8/31/00  
8/31/00  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
X24C08SI-3  
X24C08SI-3.5  
X24C08SM  
X24C08SM-3  
X24C08SM-3.5  
SPI Serial Products  
X25020P  
7/31/00  
7/31/00  
7/31/00  
7/31/00  
7/31/00  
7/31/00  
7/31/00  
7/31/00  
7/31/00  
7/31/00  
7/31/00  
7/31/00  
7/31/00  
7/31/00  
7/31/00  
7/31/00  
7/31/00  
7/31/00  
7/31/00  
8/31/00  
8/31/00  
8/31/00  
8/31/00  
8/31/00  
8/31/00  
8/31/00  
8/31/00  
8/31/00  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Die Rev / Foundry Change  
Foundry Change  
X25020P-2.7  
X25020PI  
X25020PI-2.7  
X25020S  
X25020S-2.7  
X25020S-3  
X25020SI  
X25020SI-2.7  
X25020SI-3  
X25040P  
X25040P-2.7  
X25040PI  
X25040PI-2.7  
X25040S  
X25040S-2.7  
X25040SI  
X25040SI-2.7  
X25040SM  
X25160S  
X25160S-2.7  
X25160SI  
Foundry Change  
Foundry Change  
X25160SI-2.7  
X25320P  
Foundry Change  
Foundry Change  
X25320S  
Foundry Change  
X25320S-2.7  
X25320SI  
Foundry Change  
Foundry Change  
X25320SI-2.7  
Foundry Change  
file://F:\export\projects\bitting2\imaging\BITTING\mail_pdf\recode\pcn_000204.html  
1/15/01  
Xicor Product Change Notice 02/04/00  
Page 4 of 9  
February 4, 2000  
Dear Xicor Customer,  
At Xicor, we continuously strive to improve the performance and efficiency of our operations, and  
the quality of our products. Consistent with this effort, we are revising the tape and reel "T" codes  
to eliminate partial reel quantities.  
See the detailed tape and reel "T" codes definitions list and definitions matrix below . The  
implementation date for the new tape and reel "T" codes is March 1, 2000. All existing orders with  
shipment dates on or after March 1, 2000 will be converted to the new tape and reel "T" codes. All  
new orders on or after March 1, 2000 must use the new tape and reel "T" codes.  
If you have any further questions, please contact your regional Xicor sales office.  
Sincerely,  
Xicor Marketing Department  
Tape and Reel "T" Code Definitions  
CODE  
T1  
PACKAGE  
QTY  
REQUIREMENTS  
Tape and Reel  
Tape and Reel  
Tape and Reel  
Tape and Reel  
Tape and Reel  
Tape and Reel  
Tape and Reel  
Tape and Reel  
Tape and Reel  
REEL SIZE  
13"  
SOIC (150 MIL SOIC) "S"  
SOIC (300 MIL SOIC) "S"  
EIAJ (WIDE SOIC) "A"  
TSOP (THIN SOIC) "T"  
PLCC "J"  
=2500  
=1000  
=2000  
=1000  
=750  
13"  
T1  
13"  
T1  
13"  
T1  
13"  
T1  
MSOP "M"  
=2500  
=500  
13"  
T1  
GULL WING "R"  
TSSOP "V"  
13"  
T1  
=2500  
=10000  
13"  
T1  
XBGA "B" or "Z"  
13"  
T1  
SOIC (150 MIL SOIC) "S"  
SOIC (300 MIL SOIC) "S"  
EIAJ (WIDE SOIC) "A"  
=1000  
=500  
Tape and Reel  
Tape and Reel  
Tape and Reel  
7"  
T2  
13"  
7"  
T2  
=1000  
T2  
file://F:\export\projects\bitting2\imaging\BITTING\mail_pdf\recode\pcn_000204.html  
1/15/01  
Xicor Product Change Notice 02/04/00  
Page 5 of 9  
TSOP (THIN SOIC) "T"  
PLCC "J"  
=500  
Tape and Reel  
13"  
13"  
7"  
T2  
T2  
T2  
T2  
T2  
T2  
T3  
T3  
T3  
T3  
T3  
T3  
T3  
T3  
T3  
T4  
T4  
T4  
T4  
T4  
T4  
T4  
T4  
T4  
T5  
T5  
T5  
T6  
T6  
T6  
=500  
Tape and Reel  
MSOP "M"  
=1000  
=250  
Tape and Reel  
GULL WING "R"  
TSSOP "V"  
Tape and Reel  
13"  
7"  
=1000  
=5000  
=2500  
=1000  
=2000  
=1000  
=750  
Tape and Reel  
XBGA "B" or "Z"  
SOIC (150 MIL SOIC) "S"  
SOIC (300 MIL SOIC) "S"  
EIAJ (WIDE SOIC) "A"  
TSOP (THIN SOIC) "T"  
PLCC "J"  
Tape and Reel  
13"  
13"  
13"  
13"  
13"  
13"  
13"  
13"  
13"  
13"  
7"  
Tape and Reel & Dry Pack  
Tape and Reel & Dry Pack  
Tape and Reel & Dry Pack  
Tape and Reel & Dry Pack  
Tape and Reel & Dry Pack  
Tape and Reel & Dry Pack  
Tape and Reel & Dry Pack  
Tape and Reel & Dry Pack  
Tape and Reel & Dry Pack  
Tape and Reel & Dry Pack  
Tape and Reel & Dry Pack  
Tape and Reel & Dry Pack  
Tape and Reel & Dry Pack  
Tape and Reel & Dry Pack  
Tape and Reel & Dry Pack  
Tape and Reel & Dry Pack  
Tape and Reel & Dry Pack  
Tape and Reel & Dry Pack  
Tape and Reel  
MSOP "M"  
=2500  
=500  
GULL WING "R"  
TSSOP "V"  
=2500  
=10000  
=1000  
=500  
XBGA "B" or "Z"  
SOIC (150 MIL SOIC) "S"  
SOIC (300 MIL SOIC) "S"  
EIAJ (WIDE SOIC) "A"  
TSOP (THIN SOIC) "T"  
PLCC "J"  
13"  
7"  
=1000  
=500  
13"  
13"  
7"  
=500  
MSOP "M"  
=1000  
=250  
GULL WING "R"  
TSSOP "V"  
13"  
7"  
=1000  
=5000  
=3500  
=3500  
=2500  
=3500  
=3500  
=2500  
XBGA "B" or "Z"  
MSOP "M"  
13"  
13"  
13"  
13"  
13"  
13"  
13"  
TSSOP "V"  
Tape and Reel  
XBGA "B" or "Z"  
MSOP "M"  
Tape and Reel  
Tape and Reel & Dry Pack  
Tape and Reel & Dry Pack  
Tape and Reel & Dry Pack  
TSSOP "V"  
XBGA "B" or "Z"  
file://F:\export\projects\bitting2\imaging\BITTING\mail_pdf\recode\pcn_000204.html  
1/15/01  
Xicor Product Change Notice 02/04/00  
Page 6 of 9  
XBGA "B" or "Z"  
ALL PACKAGES  
=2500  
Tape and Reel & Dry Pack  
Dry Pack  
13"  
T6  
T7  
ALL QTYS.  
N/A  
Tape and Reel "T" Code Definition Matrix  
150 MIL SOIC "S" (8L, 14L,16L)  
Code  
T1  
2500  
1000  
Dry Pack  
x
x
x
x
x
x
x
T2  
x
T3  
T4  
x
x
x
x
x
T7*  
x
*NOTE: DRY PACK ONLY  
TSOP THIN SOIC "T"  
1000  
500  
Dry Pack  
Code  
T1  
x
x
x
x
x
T2  
x
x
T3  
x
x
x
x
x
T4  
x
x
x
T7*  
*NOTE: DRY PACK ONLY  
GULL WING "R"  
Code  
T1  
500  
x
250  
Dry Pack  
x
x
x
x
T2  
x
x
T3  
x
X
X
x
x
T4  
x
x
x
T7*  
file://F:\export\projects\bitting2\imaging\BITTING\mail_pdf\recode\pcn_000204.html  
1/15/01  
Xicor Product Change Notice 02/04/00  
Page 7 of 9  
*NOTE: DRY PACK ONLY  
300 MIL SOIC "S" (20L, 24L, 28L)  
Code 1000 500  
Dry Pack  
T1  
T2  
T3  
T4  
T7*  
X
x
X
x
x
x
X
x
X
x
x
x
X
X
X
*NOTE: DRY PACK ONLY  
XBGA "B" or "Z"  
Code  
T1  
10000  
5000 2500  
Dry Pack  
x
x
x
x
x
x
x
x
x
T2  
x
x
T3  
x
x
x
T4  
x
x
x
x
x
x
x
T5  
x
x
x
T6  
x
x
x
x
T7*  
*NOTE: DRY PACK ONLY  
EIAJ "A"  
Code  
T1  
2000  
1000  
Dry Pack  
x
x
x
x
x
T2  
x
x
T3  
x
x
x
x
x
T4  
x
x
x
T7*  
*NOTE: DRY PACK ONLY  
file://F:\export\projects\bitting2\imaging\BITTING\mail_pdf\recode\pcn_000204.html  
1/15/01  
Xicor Product Change Notice 02/04/00  
Page 8 of 9  
PLCC "J"  
Code  
T1  
750  
x
500  
x
Dry Pack  
x
T2  
x
x
x
T3  
x
X
X
X
x
T4  
x
x
T7*  
x
x
*NOTE: DRY PACK ONLY  
TSSOP "V"  
Code  
T1  
2500  
1000  
3500  
Dry Pack  
x
x
x
x
x
x
x
x
x
T2  
x
x
T3  
x
x
x
T4  
x
x
x
x
x
x
x
T5  
x
x
x
T6  
x
x
x
x
T7*  
*NOTE: DRY PACK ONLY  
MSOP "M"  
Code  
T1  
2500  
1000  
3500  
Dry Pack  
x
x
x
x
x
x
x
x
x
T2  
x
x
T3  
x
x
x
T4  
x
x
x
x
x
x
T5  
x
x
x
T6  
x
file://F:\export\projects\bitting2\imaging\BITTING\mail_pdf\recode\pcn_000204.html  
1/15/01  
Xicor Product Change Notice 02/04/00  
Page 9 of 9  
x
x
x
T7*  
x
*NOTE: DRY PACK ONLY  
Our web site makes extensive use Adobe Acrobat (PDF) documents to provide you with the highest quality in electronic  
publishing. If you do not have the Adobe Acrobat Reader, click this hyperlink for a free copy.  
Home | Products | Corporate | Support | Reps & Disti's | What's New  
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Copyright © 2000 Xicor Inc.  
file://F:\export\projects\bitting2\imaging\BITTING\mail_pdf\recode\pcn_000204.html  
1/15/01  

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