X9408YZ24I-2.7T4
更新时间:2024-09-18 18:16:41
品牌:XICOR
描述:Digital Potentiometer, 4 Func, 2500ohm, 2-wire Serial Control Interface, 64 Positions, CMOS, PBGA24, XBGA-24
X9408YZ24I-2.7T4 概述
Digital Potentiometer, 4 Func, 2500ohm, 2-wire Serial Control Interface, 64 Positions, CMOS, PBGA24, XBGA-24 数字电位计
X9408YZ24I-2.7T4 规格参数
生命周期: | Obsolete | 包装说明: | XBGA-24 |
Reach Compliance Code: | unknown | 风险等级: | 5.65 |
其他特性: | NONVOLATILE MEMORY | 控制接口: | 2-WIRE SERIAL |
转换器类型: | DIGITAL POTENTIOMETER | JESD-30 代码: | R-PBGA-B24 |
长度: | 3.824 mm | 功能数量: | 4 |
位置数: | 64 | 端子数量: | 24 |
最高工作温度: | 85 °C | 最低工作温度: | -40 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | VFBGA |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
认证状态: | Not Qualified | 电阻定律: | LINEAR |
最大电阻容差: | 20% | 最大电阻器端电压: | 5.5 V |
最小电阻器端电压: | -5.5 V | 座面最大高度: | 0.763 mm |
表面贴装: | YES | 技术: | CMOS |
标称温度系数: | 300 ppm/°C | 温度等级: | INDUSTRIAL |
端子形式: | BALL | 端子节距: | 0.5 mm |
端子位置: | BOTTOM | 标称总电阻: | 2500 Ω |
宽度: | 2.605 mm | Base Number Matches: | 1 |
X9408YZ24I-2.7T4 数据手册
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PDF下载APPLICATION NOTES
A V A I L A B L E
AN99 • AN115 • AN124 • AN133 • AN134 • AN135
Low Noise/Low Power/2-Wire Bus
X9408
Quad Digitally Controlled (XDCP™) Potentiometers
FEATURES
DESCRIPTION
• Four separate XDCP’s in one package
• 64 resistor taps per potentiometer
• 2-wire serial interface
The X9408 integrates four digitally controlled
potentiometers (XDCP) on a monolithic CMOS
integrated circuit.
• Wiper resistance, 150Ω typical
The digital controlled potentiometer is implemented
using 63 resistive elements in a series array. Between
each element are tap points connected to the wiper
terminal through switches. The position of the wiper on
the array is controlled by the user through the SPI bus
interface. Each potentiometer has associated with it a
volatile Wiper Counter Register (WCR) and four non-
volatile Data Registers that can be directly written to
and read by the user. The contents of the WCR
controls the position of the wiper on the resistor array
though the switches. Powerup recalls the contents of
the default data register (DR0) to the WCR.
• Four nonvolatile data registers for each pot
• Nonvolatile storage of wiper position
• Standby current < 1µA max (total package)
• V
= 2.7V to 5.5V operation
CC
V+ = 2.7V to 5.5V
V– = –2.7V to –5.5V
• 10KΩ, 2.5KΩ total pot resistance
• 100 year data retention
• 24-lead SOIC, 24-lead TSSOP, and 24-lead XBGA
packages
The XDCP can be used as a three-terminal
potentiometer or as a two terminal variable resistor in
a wide variety of applications including control,
parameter adjustments, and signal processing.
BLOCK DIAGRAM
V
V
V+
V-
Pot 0
CC
SS
R0 R1
R2 R3
R
R0 R1
R2 R3
H0
Wiper
Counter
Register
(WCR)
Wiper
Counter
Register
(WCR)
R
H2
Resistor
Array
Pot 2
R
L0
WP
R
L2
R
SCL
SDA
A0
W0
R
W2
Interface
and
Control
A1
8
Circuitry
A2
R
A3
W1
Data
R
R
W3
R0 R1
R2 R3
R0 R1
R2 R3
R
Wiper
Counter
Register
(WCR)
H1
Resistor
Array
Pot 1
Wiper
Counter
Register
(WCR)
H3
Resistor
Array
Pot 3
R
L1
R
L3
Characteristics subject to change without notice. 1 of 20
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X9408
PIN DESCRIPTIONS
R
(R –R
)
W
W0
W3
The wiper outputs are equivalent to the wiper output of
a mechanical potentiometer.
Host Interface Pins
Serial Clock (SCL)
Hardware Write Protect Input (WP)
The SCL input is used to clock data into and out of the
X9408.
The WP pin when low prevents nonvolatile writes to
the wiper counter registers.
Serial Data (SDA)
Analog Supplies V+, V-
SDA is a bidirectional pin used to transfer data into
and out of the device. It is an open drain output and
may be wire-ORed with any number of open drain or
open collector outputs. An open drain output requires
the use of a pull-up resistor. For selecting typical
values, refer to the guidelines for calculating typical
values on the bus pull-up resistors graph.
The Analog Supplies V+, V- are the supply voltages
for the XDCP analog section.
PIN NAMES
Symbol
Description
Serial Clock
SCL
SDA
A0-A3
Serial Data
Device Address (A –A )
0
3
Device Address
The address inputs are used to set the least significant
4 bits of the 8-bit slave address. A match in the slave
address serial data stream must be made with the
address input in order to initiate communication with
the X9408. A maximum of 16 devices may occupy the
2-wire serial bus.
R
–R , R –R
Potentiometer Pins
(terminal equivalent)
H0 H3 L0 L3
R
–R
Potentiometer Pins
(wiper equivalent)
W0 W3
WP
Hardware Write Protection
Analog Supplies
V+,V-
Potentiometer Pins
V
System Supply Voltage
System Ground
R (R –R ), R (R –R )
CC
H
H0 H3
L
L0 L3
V
The R and R inputs are equivalent to the terminal
SS
H
L
connections on either end of
a
mechanical
NC
No Connection
potentiometer.
PIN CONFIGURATION
DIP/SOIC
XBGA
TSSOP
1
2
3
4
V+
R
V
WP
SDA
1
2
24
23
22
21
20
19
18
17
16
15
1
2
24
23
22
21
20
19
18
17
16
15
CC
R
A
A
1
L3
L0
2
R
R
R
A
1
A
W0
L1
2
A
R
R
R
V
R
R
A
R
R
3
R
W0
H0
L0
H3
3
H0
L1
R
R
SDA
WP
L0
W1
4
H1
W3
4
W0
B
C
D
E
F
R
W1
A
2
5
5
0
V
R
R
R
R
V
SS
CC
H0
H3
H1
V
NC
SS
V-
WP
6
6
CC
X9408
X9408
SDA
A
3
7
V+
7
V+
R
V-
H2
R
SCL
A
1
R
R
R
W2
8
8
L3
A
R
W2
NC
3
L3
R
R
H2
R
9
9
L2
L1
H3
W3
R
R
10
L2
H2
10
R
H1
R
A
SCL
R
L2
0
W3
R
A
14
13
SCL
14
13
R
W2
11
12
0
11
12
W1
V
A
3
Top View–Bumps Down
V-
SS
NC
Characteristics subject to change without notice. 2 of 20
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X9408
PRINCIPLES OF OPERATION
The X9408 will respond with an acknowledge after
recognition of a start condition and its slave address
and once again after successful receipt of the
command byte. If the command is followed by a data
byte the X9408 will respond with a final acknowledge.
The X9408 is
a
highly integrated microcircuit
incorporating four resistor arrays and their associated
registers and counters and the serial interface logic
providing direct communication between the host and
the XDCP potentiometers.
Array Description
The X9408 is comprised of four resistor arrays. Each
array contains 63 discrete resistive segments that are
connected in series. The physical ends of each array
are equivalent to the fixed terminals of a mechanical
Serial Interface
The X9408 supports a bidirectional bus oriented
protocol. The protocol defines any device that sends
data onto the bus as a transmitter and the receiving
device as the receiver. The device controlling the
transfer is a master and the device being controlled is
the slave. The master will always initiate data transfers
and provide the clock for both transmit and receive
operations. Therefore, the X9408 will be considered a
slave device in all applications.
potentiometer (R and R inputs).
H
L
At both ends of each array and between each resistor
segment is a CMOS switch connected to the wiper
(R ) output. Within each individual array only one
W
switch may be turned on at a time. These switches are
controlled by the Wiper Counter Register (WCR). The
six bits of the WCR are decoded to select, and enable,
one of sixty-four switches.
Clock and Data Conventions
Data states on the SDA line can change only during
The WCR may be written directly, or it can be changed
by transferring the contents of one of four associated
Data Registers into the WCR. These Data Registers
and the WCR can be read and written by the host
system.
SCL LOW periods (t
). SDA state changes during
LOW
SCL HIGH are reserved for indicating start and stop
conditions.
Start Condition
All commands to the X9408 are preceded by the start
condition, which is a HIGH to LOW transition of SDA
Device Addressing
Following a start condition the master must output the
address of the slave it is accessing. The most
significant four bits of the slave address are the device
type identifier (refer to Figure 1 below). For the X9408
this is fixed as 0101[B].
while SCL is HIGH (t
). The X9408 continuously
HIGH
monitors the SDA and SCL lines for the start condition
and will not respond to any command until this
condition is met.
Stop Condition
Figure 1. Slave Address
All communications must be terminated by a stop
condition, which is a LOW to HIGH transition of SDA
while SCL is HIGH.
Device Type
Identifier
Acknowledge
0
1
0
1
A3
A2
A1
A0
Acknowledge is a software convention used to provide
a positive handshake between the master and slave
devices on the bus to indicate the successful receipt of
data. The transmitting device, either the master or the
slave, will release the SDA bus after transmitting eight
bits. The master generates a ninth clock cycle and
during this period the receiver pulls the SDA line LOW
to acknowledge that it successfully received the eight
bits of data.
Device Address
The next four bits of the slave address are the device
address. The physical device address is defined by the
state of the A -A inputs. The X9408 compares the
serial data stream with the address input state; a
successful compare of all four address bits is required
for the X9408 to respond with an acknowledge. The
0
3
A –A inputs can be actively driven by CMOS input
0
3
signals or tied to V or V
.
CC
SS
Characteristics subject to change without notice. 3 of 20
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X9408
Acknowledge Polling
point to one of the two pots and when applicable they
point to one of four associated registers. The format is
shown below in Figure 2.
The disabling of the inputs, during the internal
Nonvolatile write operation, can be used to take
advantage of the typical 5ms EEPROM write cycle
time. Once the stop condition is issued to indicate the
end of the nonvolatile write command the X9408
initiates the internal write cycle. ACK polling can be
initiated immediately. This involves issuing the start
condition followed by the device slave address. If the
X9408 is still busy with the write operation no ACK will
be returned. If the X9408 has completed the write
operation an ACK will be returned and the master can
then proceed with the next operation.
Figure 2. Instruction Byte Format
Register
Select
I3
I2
I1
I0
R1 R0
P1 P0
Wiper Counter
Register Select
Instructions
Flow 1. ACK Polling Sequence
The four high order bits define the instruction. The next
two bits (R1 and R0) select one of the four registers
that is to be acted upon when a register oriented
instruction is issued. The last bits (P1, P0) select which
one of the four potentiometers is to be affected by the
instruction.
Nonvolatile Write
Command Completed
Enter ACK Polling
Four of the nine instructions end with the transmission
of the instruction byte. The basic sequence is
illustrated in Figure 3. These two-byte instructions
exchange data between the Wiper Counter Register
and one of the Data Registers. A transfer from a Data
Register to a Wiper Counter Register is essentially a
write to a static RAM. The response of the wiper to this
Issue
START
Issue Slave
Issue STOP
Address
action will be delayed t
Counter Register (current wiper position), to a data
register is a write to nonvolatile memory and takes a
. A transfer from the Wiper
WRL
NO
ACK
Returned?
minimum of t
to complete. The transfer can occur
YES
WR
between one of the four potentiometers and one of its
associated registers; or it may occur globally, wherein
the transfer occurs between all of the potentiometers
and one of their associated registers.
NO
Further
Operation?
YES
Four instructions require a three-byte sequence to
complete. These instructions transfer data between the
host and the X9408; either between the host and one
of the data registers or directly between the host and
the Wiper Counter Register. These instructions are:
Read Wiper Counter Register (read the current wiper
position of the selected pot), Write Wiper Counter
Register (change current wiper position of the selected
pot), Read Data Register (read the contents of the
selected nonvolatile register) and Write Data Register
(write a new value to the selected Data Register). The
sequence of operations is shown in Figure 4.
Issue
Instruction
Issue STOP
Proceed
Proceed
Instruction Structure
The next byte sent to the X9408 contains the instruction
and register pointer information. The four most
significant bits are the instruction. The next four bits
Characteristics subject to change without notice. 4 of 20
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X9408
Figure 3. Two-Byte Instruction Sequence
SCL
SDA
S
T
A
R
T
0
1
0
1
A3 A2 A1 A0
A
C
K
I3 I2
I1 I0 R1 R0 P1 P0
A
C
K
S
T
O
P
The Increment/Decrement command is different from
the other commands. Once the command is issued and
the X9408 has responded with an acknowledge, the
master can clock the selected wiper up and/or down in
one segment steps; thereby, providing a fine tuning
resistor segment towards the V terminal. Similarly, for
each SCL clock pulse while SDA is LOW, the selected
H
wiper will move one resistor segment towards the V
L
terminal. A detailed illustration of the sequence and
timing for this operation are shown in Figures 5 and 6
respectively.
capability to the host. For each SCL clock pulse (t
)
HIGH
while SDA is HIGH, the selected wiper will move one
Table 1. Instruction Set
Instruction Set
Instruction
I
I
I
I
R
R
P
P
Operation
1/0 1/0 Read the contents of the Wiper Counter Register
pointed to by P –P
3
2
1
0
1
0
1
0
Read Wiper Counter
Register
1
1
1
1
1
0
0
0
1
1
0
1
1
0
0
1
0
1
0
1
0
0
1
0
Write Wiper Counter
Register
0
0
1/0 1/0 Write new value to the Wiper Counter Register pointed
to by P –P
1
0
Read Data Register
1/0 1/0 1/0 1/0 Read the contents of the Data Register pointed to by
P –P and R –R
1
0
1
0
Write Data Register
1/0 1/0 1/0 1/0 Write new value to the Data Register pointed to by
P –P and R –R
1
0
1
0
XFR Data Register to
Wiper Counter Register
1/0 1/0 1/0 1/0 Transfer the contents of the Data Register pointed to
by P –P and R –R to its associated Wiper Counter
1
0
1
0
Register
XFR Wiper Counter
Register to Data
Register
1
0
1
0
1
0
0
0
1
0
0
1
0
1
0
0
1/0 1/0
1/0 1/0
1/0 1/0
0
0
0
1/0 Transfer the contents of the Wiper Counter Register
pointed to by P –P to the Data Register pointed to
1
0
by R –R
1
0
Global XFR Data Reg-
isters to Wiper Counter
Registers
0
0
Transfer the contents of the Data Registers pointed to
by R –R of all four pots to their respective Wiper
Counter Registers
1
0
Global XFR Wiper
Counter Registers to
Data Register
Transfer the contents of both Wiper Counter Regis-
ters to their respective Data Registers pointed to by
R –R of all four pots
1
0
Increment/Decrement
Wiper Counter Register
0
0
1/0 1/0 Enable Increment/decrement of the Wiper Counter
Register pointed to by P –P
1
0
Note: (7) 1/0 = data is one or zero
Characteristics subject to change without notice. 5 of 20
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X9408
Figure 4. Three-Byte Instruction Sequence
SCL
SDA
S
T
A
R
T
0
1
0
1
A3 A2 A1 A0
A
C
K
I3 I2
I1 I0 R1 R0 P1 P0
A
C
K
0
0
D5 D4 D3 D2 D1 D0
A
C
K
S
T
O
P
Figure 5. Increment/Decrement Instruction Sequence
SCL
SDA
S
T
A
R
T
0
1
0
1
A3 A2 A1 A0
A
C
K
I3 I2
I1 I0 R1 R0 P1 P0
A
C
K
I
I
D
E
C
1
S
T
O
P
I
D
N
C
1
N
C
2
N
C
n
E
C
n
Figure 6. Increment/Decrement Timing Limits
INC/DEC
CMD
Issued
t
WRID
SCL
SDA
Voltage Out
V
/R
W
W
Characteristics subject to change without notice. 6 of 20
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X9408
Figure 7. Acknowledge Response from Receiver
SCL from
Master
1
8
9
Data Output
from Transmitter
Data Output
from Receiver
START
Acknowledge
Figure 8. Detailed Potentiometer Block Diagram
Serial Data Path
Serial
Bus
Input
R
H
From Interface
Circuitry
C
o
u
n
t
Register 0
Register 2
Register 1
8
6
Parallel
Bus
Input
e
r
Wiper
D
e
c
o
d
e
Register 3
Counter
Register
(WCR)
INC/DEC
Logic
If WCR = 00[H] then R = R
W
L
UP/DN
UP/DN
If WCR = 3F[H] then R = R
W
H
R
Modified SCL
L
CLK
R
W
Characteristics subject to change without notice. 7 of 20
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X9408
DETAILED OPERATION
If the application does not require storage of multiple
settings for the potentiometer, these registers can be
used as regular memory locations that could possibly
store system parameters or user preference data.
All XDCP potentiometers share the serial interface
and share a common architecture. Each potentiometer
has a Wiper Counter Register and four Data Registers.
A detailed discussion of the register organization and
array operation follows.
Register Descriptions
Data Registers, (6-Bit), Nonvolatile
Wiper Counter Register
D5
NV
D4
NV
D3
NV
D2
NV
D1
NV
D0
NV
The X9408 contains four Wiper Counter Registers,
one for each XDCP potentiometer. The Wiper Counter
Register can be envisioned as a 6-bit parallel and
serial load counter with its outputs decoded to select
one of sixty-four switches along its resistor array. The
contents of the WCR can be altered in four ways: it
may be written directly by the host via the Write Wiper
Counter Register instruction (serial load); it may be
written indirectly by transferring the contents of one of
four associated data registers via the XFR Data
Register instruction (parallel load); it can be modified
one step at a time by the Increment/ Decrement
instruction. Finally, it is loaded with the contents of its
data register zero (DR0) upon power-up.
(MSB)
(LSB)
Four 6-bit Data Registers for each XDCP. (sixteen 6-bit
registers in total).
– {D5~D0}: These bits are for general purpose not vol-
atile data storage or for storage of up to four different
wiper values. The contents of Data Register 0 are
automatically moved to the wiper counter register on
power-up.
Wiper Counter Register, (6-Bit), Volatile
WP5
V
WP4
V
WP3
V
WP2
V
WP1
V
WP0
V
The WCR is a volatile register; that is, its contents are
lost when the X9408 is powered-down. Although the
register is automatically loaded with the value in R0
upon power-up, it should be noted this may be
different from the value present at power-down.
(MSB)
(LSB)
One 6-bit Wiper Counter Register for each XDCP.
(Four 6-bit registers in total.)
Data Registers
– {D5~D0}:These bits specify the wiper position of the
respective XDCP. The Wiper Counter Register is
loaded on power-up by the value in Data Register 0.
The contents of the WCR can be loaded from any of
the other Data Register or directly. The contents of
the WCR can be saved in a DR.
Each potentiometer has four nonvolatile Data
Registers. These can be read or written directly by the
host and data can be transferred between any of the
four data registers and the WCR. It should be noted all
operations changing data in one of these registers is a
nonvolatile operation and will take a maximum of
10ms.
Characteristics subject to change without notice. 8 of 20
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X9408
Instruction Format
Notes: (1) “MACK”/”SACK”: stands for the acknowledge sent by the master/slave.
(2) “A3 ~ A0”: stands for the device addresses sent by the master.
(3) “X”: indicates that it is a “0” for testing purpose but physically it is a “don’t care” condition.
(4) “I”: stands for the increment operation, SDA held high during active SCL phase (high).
(5) “D”: stands for the decrement operation, SDA held low during active SCL phase (high).
Read Wiper Counter Register
S device type
device
addresses
instruction
opcode
wiper
addresses
wiper position
(sent by slave on SDA)
S
A
C
K
S
A
C
K
M S
A T
C O
K P
T
A
R
T
identifier
W W W W W W
0 0 P P P P P P
A A A A
P P
1 0
0
1
0
1
1
0
0
1
0
0
3
2
1
0
5
4 3 2 1 0
Write Wiper Counter Register
S device type
device
addresses
instruction
opcode
wiper
addresses
wiper position
(sent by master on SDA)
S
A
C
K
S
A
C
K
S S
A T
C O
K P
T
A
R
T
identifier
W W W W W W
0 0 P P P P P P
A A A A
P P
1 0
0
1
0
1
1
0
1
0
0
0
3
2
1
0
5
4 3 2 1 0
Read Data Register
S device type device
instruction
opcode
wiper
addresses
wiper position
(sent by slave on SDA)
S
A
C
K
S
A
C
K
M S
A T
C O
K P
T
A
R
T
identifier
addresses
W W W W W W
0 0 P P P P P P
A A A A
R R P P
0
1
0
1
1
0
1
1
3
2
1
0
1
0
1 0
5
4 3 2 1 0
Write Data Register
S device type
device
addresses
instruction
opcode
wiper
addresses
wiper position
(sent by master on SDA)
S
S
A
C
K
S S
T
A
R
T
identifier
A
C
K
A T HIGH-VOLTAGE
C O WRITE CYCLE
K P
W W W W W W
0 0 P P P P P P
5 4 3 2 1 0
A A A A
3 2 1 0
R R P P
1 0 1 0
0 1 0 1
1 1 0 0
XFR Data Register to Wiper Counter Register
S device type
device
addresses
instruction
opcode
wiper
addresses
S
A
C
K
S S
T
A
R
T
identifier
A T
C O
K P
A A A A
3 2 1 0
R R P P
1 0 1 0
0 1 0 1
1 1 0 1
Write Wiper Counter Register to Data Register
S device type
device
addresses
instruction
opcode
wiper
addresses
S
A
C
K
S S
T
A
R
T
identifier
A T HIGH-VOLTAGE
C O WRITE CYCLE
K P
A A A A
3 2 1 0
R R P P
1 0 1 0
0 1 0 1
1 1 1 0
Characteristics subject to change without notice. 9 of 20
REV 1.0 6/20/00
www.xicor.com
X9408
Increment/Decrement Wiper Counter Register
S
T
A
R
T
device type
identifier
device
addresses
instruction
opcode
wiper
addresses
increment/decrement
(sent by master on SDA)
S
A
C
K
S
A
C
K
S
T
O
P
A A A A
P P
1 0
I/ I/
D D
I/ I/
D D
0
1
0
1
0
0
1
0
0
0
.
.
.
.
3
2
1
0
Global XFR Data Register to Wiper Counter Register
S
T
A
R
T
device type
identifier
device
addresses
instruction
opcode
wiper
addresses
S
A
C
K
S S
A T
C O
K P
A A A A
R R
1 0
0
1
0
1
0
0
0
1
0 0
3
2
1
0
Global XFR Wiper Counter Register to Data Register
S device type
device
addresses
instruction
opcode
wiper
addresses
S
A
C
K
S S
A T
C O
K P
T
A
R
T
identifier
HIGH-VOLTAGE
WRITE CYCLE
A A A A
3 2 1 0
R R
0 0
1 0
0 1 0 1
1 0 0 0
SYMBOL TABLE
Guidelines for Calculating Typical Values of Bus
Pull-Up Resistors
WAVEFORM
INPUTS
OUTPUTS
120
V
CC MAX
OL MIN
R
=
=1.8KΩ
Must be
steady
Will be
steady
MIN
I
100
80
t
R
R
=
MAX
May change
from Low to
High
Will change
from Low to
High
C
BUS
Max.
Resistance
60
40
20
0
May change
from High to
Low
Will change
from High to
Low
Min.
Resistance
Don’t Care:
Changes
Allowed
Changing:
State Not
Known
0
20 40 60 80 100 120
N/A
Center Line
is High
Impedance
Bus Capacitance (pF)
Characteristics subject to change without notice. 10 of 20
REV 1.0 6/20/00
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X9408
ABSOLUTE MAXIMUM RATINGS
COMMENT
Temperature under bias....................–65°C to +135°C
Storage temperature.........................–65°C to +150°C
Voltage on SDA, SCL or any address
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only; the functional operation of
the device (at these or any other conditions above
those listed in the operational sections of this
specification) is not implied. Exposure to absolute
maximum rating conditions for extended periods may
affect device reliability.
input with respect to V ......................... –1V to +7V
SS
Voltage on V+ (referenced to V ) ........................ 10V
SS
Voltage on V- (referenced to V ) ........................ -10V
SS
(V+) – (V-) ............................................................. 12V
Any V .................................................................... V+
H
Any V ...................................................................... V-
L
Lead temperature (soldering, 10 seconds) ........300°C
I
(10 seconds) ............................................... ±12mA
W
RECOMMENDED OPERATING CONDITIONS
Temperature
Commercial
Industrial
Min.
0°C
Max.
+70°C
+85°C
Device
X9408
Supply Voltage (V ) Limits
CC
5V ±10%
–40°C
X9408-2.7
2.7V to 5.5V
ANALOG CHARACTERISTICS (Over recommended operating conditions unless otherwise stated.)
Limits
Symbol
Parameter
End to end resistance tolerance
Power rating
Min.
Typ.
Max.
±20
50
Unit
%
Test Condition
mW
mA
Ω
25°C, each pot
I
Wiper current
±6
W
R
Wiper resistance
150
500
+5.5
+5.5
-4.5
-2.7
V+
Wiper Current = ± 3mA
X9118
W
V +
Voltage on V+ pin
+4.5
+2.7
-5.5
-5.5
V-
V
V
X9118-2.7
X9118
V -
V
Voltage on V- pin
V
V
X9118-2.7
V
Voltage on any R or R pin
V
= 0V
SS
TERM
H
L
Noise
Resolution (4)
-120
0.1
dBV/√Hz Ref: 1V
%
(5)
Absolute linearity (1)
Relative linearity (2)
±1
MI(3)
MI(3)
R
R
–R
w(n)(actual) w(n)(expected)
(5)
±0.2
–[R
]
w(n + 1)
w(n) + MI
Temperature coefficient of R
±300
ppm/°C
ppm/°C
pF
TOTAL
Ratiometric Temperature Coefficient
Potentiometer Capacitances
20
C /C /C
W
10/10/25
See Macro model
H
L
Characteristics subject to change without notice. 11 of 20
REV 1.0 6/20/00
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X9408
D.C. OPERATING CHARACTERISTICS (Over the recommended operating conditions unless otherwise specified.)
Limits
Symbol
Parameter
Min.
Typ.
Max.
Unit
Test Conditions
I
V
write)
supply current (nonvolatile
1
mA
f = 400kHz, SDA = Open,
SCL
CC1
CC
Other Inputs = V
SS
I
V
supplycurrent(movewiper,
100
µA
f
= 400kHz, SDA = Open,
SCL
CC2
CC
write, read)
Other Inputs = V
SS
I
V
current (standby)
1
µA
µA
µA
V
SCL = SDA = V , Addr. = V
CC SS
SB
CC
I
Input leakage current
Output leakage current
Input HIGH voltage
Input LOW voltage
Output LOW voltage
10
10
V
V
= V to V
SS CC
LI
IN
I
= V to V
SS CC
LO
OUT
V
V
x 0.7
V
V
x 0.5
IH
CC
CC
V
–0.5
x 0.1
V
IL
CC
V
0.4
V
I
= 3mA
OL
OL
Notes: (1) Absolute linearity is utilized to determine actual wiper voltage versus expected voltage as determined by wiper position when used
as a potentiometer.
(2) Relative linearity is utilized to determine the actual change in voltage between two successive tap positions when used as a potenti-
ometer. It is a measure of the error in step size.
(3) MI = RTOT/63 or (V –V )/63, single pot
H
L
(4) Max. = all four arrays cascaded together, Typical = individual array resolutions.
ENDURANCE AND DATA RETENTION
Parameter
Minimum endurance
Data retention
Min.
100,000
100
Unit
Data changes per bit per register
years
CAPACITANCE
Symbol
Test
Max.
Unit
pF
Test Condition
(5)
I/O
C
Input/output capacitance (SDA)
8
6
V
= 0V
= 0V
I/O
(5)
IN
C
Input capacitance (A0, A1, A2, A3, and SCL)
pF
V
IN
POWER-UP TIMING
Symbol
Parameter
Min.
Max.
1
Unit
ms
(6)
PUR
t
Power-up to initiation of read operation
Power-up to initiation of write operation
(6)
PUW
t
5
ms
(7)
CC
t V
V Power Up Ramp
CC
0.2
50
V/msec
R
POWER-UP AND POWER-DOWN
There are no restrictions on the power-up or power-down sequencing of the bias supplies V , V+, and V- provided
CC
that all three supplies reach their final values within 1msec of each other. However, at all times, the voltages on the
potentiometer pins must be less than V+ and more than V–. The recall of the wiper position from nonvolatile
memory is not in effect until all supplies reach their final value.
Notes: (5) This parameter is periodically sampled and not 100% tested
(6) t
and t
are the delays required from the time the third (last) power supply (V , V+ or V-) is stable until the specific
PUR
PUW CC
instruction can be issued.These parameters are periodically sampled and not 100% tested.
(7) This is not a tested or guaranteed parameter and should only be used as a guidance.
Characteristics subject to change without notice. 12 of 20
REV 1.0 6/20/00
www.xicor.com
X9408
A.C. TEST CONDITIONS
Test Circuit #3 SPICE Macro Model
Input pulse levels
V
x 0.1 to V x 0.9
CC
CC
R
TOTAL
Input rise and fall times
Input and output timing level
10ns
R
R
L
H
C
V
x 0.5
L
CC
C
H
C
W
10pF
EQUIVALENT A.C. LOAD CIRCUIT
10pF
25pF
5V
2.7V
R
W
1533Ω
SDA Output
100pF
100pF
AC TIMING (over recommended operating condition)
Symbol Parameter
Min.
Max.
Unit
kHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
f
Clock frequency
400
SCL
t
Clock cycle time
2500
600
1300
600
600
600
100
30
CYC
t
Clock high time
HIGH
t
Clock low time
LOW
t
Start setup time
SU:STA
HD:STA
SU:STO
t
Start hold time
t
Stop setup time
t
SDA data input setup time
SDA data input hold time
SCL and SDA rise time
SCL and SDA fall time
SCL low to SDA data output valid time
SDA Data output hold time
SU:DAT
HD:DAT
t
t
300
300
900
R
t
F
t
AA
DH
t
50
50
1300
0
T
Noise suppression time constant at SCL and SDA inputs
Bus free time (prior to any transmission)
WP, A0, A1, A2 and A3 setup time
I
t
BUF
t
SU:WPA
t
WP, A0, A1, A2 and A3 hold time
0
HD:WPA
HIGH-VOLTAGE WRITE CYCLE TIMING
Symbol
Parameter
Typ.
Max.
Unit
t
High-voltage write cycle time (store instructions)
5
10
ms
WR
Characteristics subject to change without notice. 13 of 20
REV 1.0 6/20/00
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X9408
XDCP TIMING
Symbol
Parameter
Min. Max. Unit
t
Wiper response time after the third (last) power supply is stable
10
10
10
µs
µs
µs
WRPO
t
Wiper response time after instruction issued (all load instructions)
Wiper response time from an active SCL/SCK edge (increment/decrement instruction)
WRL
t
WRID
Notes: (9) A device must internally provide a hold time of at least 300ns for the SDA signal in order to bridge the undefined region of the falling
edge of SCL.
TIMING DIAGRAMS
START and STOP Timing
g
(START)
(STOP)
t
t
F
R
SCL
SDA
t
t
t
SU:STO
SU:STA
HD:STA
t
t
F
R
Input Timing
t
t
CYC
HIGH
SCL
SDA
t
LOW
t
t
t
BUF
SU:DAT
HD:DAT
Output Timing
SCL
SDA
t
t
DH
AA
Characteristics subject to change without notice. 14 of 20
REV 1.0 6/20/00
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X9408
XDCP Timing (for All Load Instructions)
(STOP)
SCL
SDA
VWx
LSB
t
WRL
XDCP Timing (for Increment/Decrement Instruction)
SCL
Wiper Register Address
Inc/Dec
Inc/Dec
SDA
VWx
t
WRID
Write Protect and Device Address Pins Timing
(START)
(STOP)
SCL
...
(Any Instruction)
...
SDA
...
t
t
SU:WPA
HD:WPA
WP
A0, A1
A2, A3
Characteristics subject to change without notice. 15 of 20
REV 1.0 6/20/00
www.xicor.com
X9408
PACKAGING INFORMATION
24-Lead Plastic Dual In-Line Package Type P
1.265 (32.13)
1.230 (31.24)
0.557 (14.15)
0.530 (13.46)
Pin 1 Index
Pin 1
0.080 (2.03)
0.065 (1.65)
1.100 (27.94)
Ref.
0.162 (4.11)
0.140 (3.56)
Seating
Plane
0.030 (0.76)
0.015 (0.38)
0.150 (3.81)
0.125 (3.18)
0.110 (2.79)
0.090 (2.29)
0.065 (1.65)
0.040 (1.02)
0.022 (0.56)
0.014 (0.36)
0.625 (15.87)
0.600 (15.24)
0°
Typ. 0.010 (0.25)
15°
NOTE:
1. ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
2. PACKAGE DIMENSIONS EXCLUDE MOLDING FLASH
Characteristics subject to change without notice. 16 of 20
REV 1.0 6/20/00
www.xicor.com
X9408
PACKAGING INFORMATION
24-Lead Plastic Small Outline Gull Wing Package Type S
0.393 (10.00)
0.290 (7.37)
0.299 (7.60)
0.420 (10.65)
Pin 1 Index
Pin 1
0.014 (0.35)
0.020 (0.50)
0.598 (15.20)
0.610 (15.49)
(4X) 7°
0.092 (2.35)
0.105 (2.65)
0.003 (0.10)
0.012 (0.30)
0.050 (1.27)
0.050"Typical
0.010 (0.25)
0.020 (0.50)
X 45°
0.050"
Typical
0° – 8°
0.009 (0.22)
0.013 (0.33)
0.420"
0.015 (0.40)
0.050 (1.27)
0.030" Typical
24 Places
FOOTPRINT
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
Characteristics subject to change without notice. 17 of 20
REV 1.0 6/20/00
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X9408
PACKAGING INFORMATION
24-Lead Plastic, TSSOP Package Type V
.026 (.65) BSC
.169 (4.3)
.177 (4.5)
.252 (6.4) BSC
.303 (7.70)
.311 (7.90)
.047 (1.20)
.0075 (.19)
.0118 (.30)
.002 (.06)
.005 (.15)
.010 (.25)
Gage Plane
(7.72)
(4.16)
0°–8°
Seating Plane
.020 (.50)
.030 (.75)
(1.78)
(0.42)
Detail A (20X)
(0.65)
ALL MEASUREMENTS ARE TYPICAL
.031 (.80)
.041 (1.05)
See Detail “A”
NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
Characteristics subject to change without notice. 18 of 20
REV 1.0 6/20/00
www.xicor.com
X9408
PACKAGING INFORMATION
24-Ball BGA (X9408WC)
a
a
l
j
m
1
2
3
4
4
3
2
1
A
B
C
D
E
F
A
B
C
D
E
F
k
b
b
f
Top View (Bump Side Down)
Bottom View (Bump Side Up)
Note: Drawing not to scale
d
= Die Orientation mark
c
e
Side View (Bump Side Down)
Millimeters
Inches
Symbol Min
Nom.
Max
Min
Nom
Max
Package Body Dimension X
Package Body Dimension Y
Package Height
a
b
c
d
e
f
2.575 2.605 2.635 0.10138 0.10258 0.10374
3.794 3.824 3.854 0.14937 0.15055 0.15173
0.697 0.750 0.763 0.02744 0.02874 0.03004
Package Body Thickness
Ball Height
0.444 0.457 0.470 0.01748 0.01799 0.01850
0.253 0.273 0.293 0.00996 0.01075 0.01154
Ball Diameter
0.360 0.374 0.388 0.01417 0.01472 0.01528
Total Ball Count
g
h
i
24
Ball Count X Axis
Ball Count Y Axis
Pins Pitch XAxis
4
6
j
0.5
Pins Pitch Y Axis
k
l
0.5
Edge to Ball Center (Corner) Distance Along X
Edge to Ball Center (Corner) Distance Along Y
0.523 0.553 0.583 0.02057 0.02175 0.02293
0.632 0.662 0.692 0.02488 0.02606 0.02724
m
Characteristics subject to change without notice. 19 of 20
REV 1.0 6/20/00
www.xicor.com
X9408
Ordering Information
X9408
Y
P
T
V
V
Limits
CC
Device
Blank = 5V ±10%
–2.7 = 2.7 to 5.5V
Temperature Range
Blank = Commercial = 0°C to +70°C
I = Industrial = –40°C to +85°C
Package
S24 = 24-Lead SOIC
V24 = 24-Lead TSSOP
Z24 = 24-Lead XBGA
Potentiometer Organization
Pot 0 Pot 1 Pot 3 Pot 4
W =
Y =
10KΩ 10KΩ 10KΩ 10KΩ
2.5KΩ 2.5KΩ 2.5KΩ 2.5KΩ
Part Mark Convention
24 Lead XBGA
X9408WZ24I-2.7
X9408WZ24
Top Mark
XABO
XABP
XACB
XACA
X9408YZ24
X9408YZ24I-2.7
©Xicor, Inc. 2000 Patents Pending
LIMITED WARRANTY
Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc. makes no warranty,
express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement.
Xicor, Inc. makes no warranty of merchantability or fitness for any purpose. Xicor, Inc. reserves the right to discontinue production and change specifications and prices
at any time and without notice.
Xicor, Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No other circuits, patents, or licenses are implied.
TRADEMARK DISCLAIMER:
Xicor and the Xicor logo are registered trademarks of Xicor, Inc. AutoStore, Direct Write, Block Lock, SerialFlash, MPS, and XDCP are also trademarks of Xicor, Inc. All
others belong to their respective owners.
U.S. PATENTS
Xicor products are covered by one or more of the following U.S. Patents: 4,326,134; 4,393,481; 4,404,475; 4,450,402; 4,486,769; 4,488,060; 4,520,461; 4,533,846;
4,599,706; 4,617,652; 4,668,932; 4,752,912; 4,829,482; 4,874,967; 4,883,976; 4,980,859; 5,012,132; 5,003,197; 5,023,694; 5,084,667; 5,153,880; 5,153,691;
5,161,137; 5,219,774; 5,270,927; 5,324,676; 5,434,396; 5,544,103; 5,587,573; 5,835,409; 5,977,585. Foreign patents and additional patents pending.
LIFE RELATED POLICY
In situations where semiconductor component failure may endanger life, system designers using this product should design the system with appropriate error detection
and correction, redundancy and back-up features to prevent such an occurrence.
Xicor’s products are not authorized for use in critical components in life support devices or systems.
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to
perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or effectiveness.
Characteristics subject to change without notice. 20 of 20
REV 1.0 6/20/00
www.xicor.com
Xicor Product Change Notice 02/04/00
Page 1 of 9
Product Change Notice : PCN February 4, 2000
February 4, 2000
Ref: PCN-00-01
Dear Xicor Customer,
At Xicor, we continuously strive to improve the performance and efficiency of our operations, and
the quality of our products. Consistent with this effort, we are currently adding additional wafer
fabrication capacity for various IIC and SPI serial products.
This added wafer fabrication capacity will complement current operations and will expand Xicor’s
capabilities to accommodate future growth.
In addition, several of the IIC and SPI serial products are undergoing a die revision change. The
new die revision is functionally and pin to pin compatable with the existing die revision.
See the detailed product number list below for the implementation date and description of the
change. Samples for qualification will be available approximately 4 weeks before the
implementation date. Qualification data is available upon request.
If you have any further questions, please contact your regional Xicor sales office.
Sincerely,
Xicor Marketing Department
Xicor Part Number
IIC Serial Products
X24164P
Implement Date
Description of Change
2/28/00
2/28/00
2/28/00
2/28/00
2/28/00
2/28/00
2/28/00
2/28/00
2/28/00
5/31/00
5/31/00
5/31/00
5/31/00
5/31/00
5/31/00
Foundry Change
X24164P-3
Foundry Change
X24164PI
Foundry Change
X24164PI-3
X24164S
Foundry Change
Foundry Change
X24164S-2.7
X24164S-3
Foundry Change
Foundry Change
X24164SI
Foundry Change
X24164SI-2.7
X24C04P
Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
X24C04P-2.7
X24C04P-3
X24C04P-3.5
X24C04PI
X24C04PI-2.7
file://F:\export\projects\bitting2\imaging\BITTING\mail_pdf\recode\pcn_000204.html
1/15/01
Xicor Product Change Notice 02/04/00
Page 2 of 9
X24C04PI-3
5/31/00
5/31/00
5/31/00
5/31/00
5/31/00
5/31/00
5/31/00
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5/31/00
5/31/00
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5/31/00
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5/31/00
5/31/00
5/31/00
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5/31/00
5/31/00
5/31/00
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5/31/00
5/31/00
8/31/00
8/31/00
8/31/00
8/31/00
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8/31/00
8/31/00
8/31/00
8/31/00
8/31/00
8/31/00
8/31/00
8/31/00
8/31/00
8/31/00
8/31/00
8/31/00
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
X24C04PI-3.5
X24C04PM
X24C04PM-3
X24C04PM-3.5
X24C04S14
X24C04S14-3
X24C04S14-3.5
X24C04S14I
X24C04S14I-3
X24C04S14I-3.5
X24C04S14M
X24C04S14M-3
X24C04S14M-3.5
X24C04S8
X24C04S8-2.7
X24C04S8-3
X24C04S8-3.5
X24C04S8I
X24C04S8I-2.7
X24C04S8I-3
X24C04S8I-3.5
X24C04S8M
X24C04S8M-3
X24C04S8M-3.5
X24C08P
X24C08P-2.7
X24C08P-3
X24C08P-3.5
X24C08PI
X24C08PI-2.7
X24C08PI-3
X24C08PI-3.5
X24C08PM
X24C08PM-3
X24C08PM-3.5
X24C08S
X24C08S-3
X24C08S-3.5
X24C08S8
X24C08S8-2.7
X24C08S8-3
X24C08S8I
X24C08S8I-2.7
file://F:\export\projects\bitting2\imaging\BITTING\mail_pdf\recode\pcn_000204.html
1/15/01
Xicor Product Change Notice 02/04/00
Page 3 of 9
X24C08S8I-3
X24C08S8M
X24C08SI
8/31/00
8/31/00
8/31/00
8/31/00
8/31/00
8/31/00
8/31/00
8/31/00
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
X24C08SI-3
X24C08SI-3.5
X24C08SM
X24C08SM-3
X24C08SM-3.5
SPI Serial Products
X25020P
7/31/00
7/31/00
7/31/00
7/31/00
7/31/00
7/31/00
7/31/00
7/31/00
7/31/00
7/31/00
7/31/00
7/31/00
7/31/00
7/31/00
7/31/00
7/31/00
7/31/00
7/31/00
7/31/00
8/31/00
8/31/00
8/31/00
8/31/00
8/31/00
8/31/00
8/31/00
8/31/00
8/31/00
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Die Rev / Foundry Change
Foundry Change
X25020P-2.7
X25020PI
X25020PI-2.7
X25020S
X25020S-2.7
X25020S-3
X25020SI
X25020SI-2.7
X25020SI-3
X25040P
X25040P-2.7
X25040PI
X25040PI-2.7
X25040S
X25040S-2.7
X25040SI
X25040SI-2.7
X25040SM
X25160S
X25160S-2.7
X25160SI
Foundry Change
Foundry Change
X25160SI-2.7
X25320P
Foundry Change
Foundry Change
X25320S
Foundry Change
X25320S-2.7
X25320SI
Foundry Change
Foundry Change
X25320SI-2.7
Foundry Change
file://F:\export\projects\bitting2\imaging\BITTING\mail_pdf\recode\pcn_000204.html
1/15/01
Xicor Product Change Notice 02/04/00
Page 4 of 9
February 4, 2000
Dear Xicor Customer,
At Xicor, we continuously strive to improve the performance and efficiency of our operations, and
the quality of our products. Consistent with this effort, we are revising the tape and reel "T" codes
to eliminate partial reel quantities.
See the detailed tape and reel "T" codes definitions list and definitions matrix below . The
implementation date for the new tape and reel "T" codes is March 1, 2000. All existing orders with
shipment dates on or after March 1, 2000 will be converted to the new tape and reel "T" codes. All
new orders on or after March 1, 2000 must use the new tape and reel "T" codes.
If you have any further questions, please contact your regional Xicor sales office.
Sincerely,
Xicor Marketing Department
Tape and Reel "T" Code Definitions
CODE
T1
PACKAGE
QTY
REQUIREMENTS
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
REEL SIZE
13"
SOIC (150 MIL SOIC) "S"
SOIC (300 MIL SOIC) "S"
EIAJ (WIDE SOIC) "A"
TSOP (THIN SOIC) "T"
PLCC "J"
=2500
=1000
=2000
=1000
=750
13"
T1
13"
T1
13"
T1
13"
T1
MSOP "M"
=2500
=500
13"
T1
GULL WING "R"
TSSOP "V"
13"
T1
=2500
=10000
13"
T1
XBGA "B" or "Z"
13"
T1
SOIC (150 MIL SOIC) "S"
SOIC (300 MIL SOIC) "S"
EIAJ (WIDE SOIC) "A"
=1000
=500
Tape and Reel
Tape and Reel
Tape and Reel
7"
T2
13"
7"
T2
=1000
T2
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1/15/01
Xicor Product Change Notice 02/04/00
Page 5 of 9
TSOP (THIN SOIC) "T"
PLCC "J"
=500
Tape and Reel
13"
13"
7"
T2
T2
T2
T2
T2
T2
T3
T3
T3
T3
T3
T3
T3
T3
T3
T4
T4
T4
T4
T4
T4
T4
T4
T4
T5
T5
T5
T6
T6
=500
Tape and Reel
MSOP "M"
=1000
=250
Tape and Reel
GULL WING "R"
TSSOP "V"
Tape and Reel
13"
7"
=1000
=5000
=2500
=1000
=2000
=1000
=750
Tape and Reel
XBGA "B" or "Z"
SOIC (150 MIL SOIC) "S"
SOIC (300 MIL SOIC) "S"
EIAJ (WIDE SOIC) "A"
TSOP (THIN SOIC) "T"
PLCC "J"
Tape and Reel
13"
13"
13"
13"
13"
13"
13"
13"
13"
13"
7"
Tape and Reel & Dry Pack
Tape and Reel & Dry Pack
Tape and Reel & Dry Pack
Tape and Reel & Dry Pack
Tape and Reel & Dry Pack
Tape and Reel & Dry Pack
Tape and Reel & Dry Pack
Tape and Reel & Dry Pack
Tape and Reel & Dry Pack
Tape and Reel & Dry Pack
Tape and Reel & Dry Pack
Tape and Reel & Dry Pack
Tape and Reel & Dry Pack
Tape and Reel & Dry Pack
Tape and Reel & Dry Pack
Tape and Reel & Dry Pack
Tape and Reel & Dry Pack
Tape and Reel & Dry Pack
Tape and Reel
MSOP "M"
=2500
=500
GULL WING "R"
TSSOP "V"
=2500
=10000
=1000
=500
XBGA "B" or "Z"
SOIC (150 MIL SOIC) "S"
SOIC (300 MIL SOIC) "S"
EIAJ (WIDE SOIC) "A"
TSOP (THIN SOIC) "T"
PLCC "J"
13"
7"
=1000
=500
13"
13"
7"
=500
MSOP "M"
=1000
=250
GULL WING "R"
TSSOP "V"
13"
7"
=1000
=5000
=3500
=3500
=2500
=3500
=3500
XBGA "B" or "Z"
MSOP "M"
13"
13"
13"
13"
13"
13"
TSSOP "V"
Tape and Reel
XBGA "B" or "Z"
MSOP "M"
Tape and Reel
Tape and Reel & Dry Pack
Tape and Reel & Dry Pack
TSSOP "V"
file://F:\export\projects\bitting2\imaging\BITTING\mail_pdf\recode\pcn_000204.html
1/15/01
Xicor Product Change Notice 02/04/00
Page 6 of 9
XBGA "B" or "Z"
ALL PACKAGES
=2500
Tape and Reel & Dry Pack
Dry Pack
13"
T6
T7
ALL QTYS.
N/A
Tape and Reel "T" Code Definition Matrix
150 MIL SOIC "S" (8L, 14L,16L)
Code
T1
2500
1000
Dry Pack
x
x
x
x
x
x
x
T2
x
T3
T4
x
x
x
x
x
T7*
x
*NOTE: DRY PACK ONLY
TSOP THIN SOIC "T"
1000
500
Dry Pack
Code
T1
x
x
x
x
x
T2
x
x
T3
x
x
x
x
x
T4
x
x
x
T7*
*NOTE: DRY PACK ONLY
GULL WING "R"
Code
T1
500
x
250
Dry Pack
x
x
x
x
T2
x
x
T3
x
X
X
x
x
T4
x
x
x
T7*
file://F:\export\projects\bitting2\imaging\BITTING\mail_pdf\recode\pcn_000204.html
1/15/01
Xicor Product Change Notice 02/04/00
Page 7 of 9
*NOTE: DRY PACK ONLY
300 MIL SOIC "S" (20L, 24L, 28L)
Code 1000 500
Dry Pack
T1
T2
T3
T4
T7*
X
x
X
x
x
x
X
x
X
x
x
x
X
X
X
*NOTE: DRY PACK ONLY
XBGA "B" or "Z"
Code
T1
10000
5000 2500
Dry Pack
x
x
x
x
x
x
x
x
x
T2
x
x
T3
x
x
x
T4
x
x
x
x
x
x
x
T5
x
x
x
T6
x
x
x
x
T7*
*NOTE: DRY PACK ONLY
EIAJ "A"
Code
T1
2000
1000
Dry Pack
x
x
x
x
x
T2
x
x
T3
x
x
x
x
x
T4
x
x
x
T7*
*NOTE: DRY PACK ONLY
file://F:\export\projects\bitting2\imaging\BITTING\mail_pdf\recode\pcn_000204.html
1/15/01
Xicor Product Change Notice 02/04/00
Page 8 of 9
PLCC "J"
Code
T1
750
x
500
x
Dry Pack
x
T2
x
x
x
T3
x
X
X
X
x
T4
x
x
T7*
x
x
*NOTE: DRY PACK ONLY
TSSOP "V"
Code
T1
2500
1000
3500
Dry Pack
x
x
x
x
x
x
x
x
x
T2
x
x
T3
x
x
x
T4
x
x
x
x
x
x
x
T5
x
x
x
T6
x
x
x
x
T7*
*NOTE: DRY PACK ONLY
MSOP "M"
Code
T1
2500
1000
3500
Dry Pack
x
x
x
x
x
x
x
x
x
T2
x
x
T3
x
x
x
T4
x
x
x
x
x
x
T5
x
x
x
T6
x
file://F:\export\projects\bitting2\imaging\BITTING\mail_pdf\recode\pcn_000204.html
1/15/01
Xicor Product Change Notice 02/04/00
Page 9 of 9
x
x
x
T7*
x
*NOTE: DRY PACK ONLY
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file://F:\export\projects\bitting2\imaging\BITTING\mail_pdf\recode\pcn_000204.html
1/15/01
X9408YZ24I-2.7T4 相关器件
型号 | 制造商 | 描述 | 价格 | 文档 |
X9408YZ24I-2.7T5 | XICOR | Digital Potentiometer, 4 Func, 2500ohm, 2-wire Serial Control Interface, 64 Positions, CMOS, PBGA24, XBGA-24 | 获取价格 | |
X9408YZ24I-2.7T6 | XICOR | Digital Potentiometer, 4 Func, 2500ohm, 2-wire Serial Control Interface, 64 Positions, CMOS, PBGA24, XBGA-24 | 获取价格 | |
X9408YZ24I-2.7T7 | XICOR | Digital Potentiometer, 4 Func, 2500ohm, 2-wire Serial Control Interface, 64 Positions, CMOS, PBGA24, XBGA-24 | 获取价格 | |
X9408YZ24IT1 | XICOR | Digital Potentiometer, 4 Func, 2500ohm, 2-wire Serial Control Interface, 64 Positions, CMOS, PBGA24, XBGA-24 | 获取价格 | |
X9408YZ24IT2 | XICOR | Digital Potentiometer, 4 Func, 2500ohm, 2-wire Serial Control Interface, 64 Positions, CMOS, PBGA24, XBGA-24 | 获取价格 | |
X9408YZ24IT3 | XICOR | Digital Potentiometer, 4 Func, 2500ohm, 2-wire Serial Control Interface, 64 Positions, CMOS, PBGA24, XBGA-24 | 获取价格 | |
X9408YZ24IT4 | XICOR | Digital Potentiometer, 4 Func, 2500ohm, 2-wire Serial Control Interface, 64 Positions, CMOS, PBGA24, XBGA-24 | 获取价格 | |
X9408YZ24IT5 | XICOR | Digital Potentiometer, 4 Func, 2500ohm, 2-wire Serial Control Interface, 64 Positions, CMOS, PBGA24, XBGA-24 | 获取价格 | |
X9408YZ24IT6 | XICOR | Digital Potentiometer, 4 Func, 2500ohm, 2-wire Serial Control Interface, 64 Positions, CMOS, PBGA24, XBGA-24 | 获取价格 | |
X9408YZ24IT7 | XICOR | Digital Potentiometer, 4 Func, 2500ohm, 2-wire Serial Control Interface, 64 Positions, CMOS, PBGA24, XBGA-24 | 获取价格 |
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