WCFS0808C1E [WEIDA]

32K x 8 Static RAM; 32K x 8静态RAM
WCFS0808C1E
型号: WCFS0808C1E
厂家: WEIDA SEMICONDUCTOR, INC.    WEIDA SEMICONDUCTOR, INC.
描述:

32K x 8 Static RAM
32K x 8静态RAM

文件: 总10页 (文件大小:191K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
0808C1E  
WCFS0808C1E  
32K x 8 Static RAM  
an automatic power-down feature, reducing the power con-  
sumption by 81% when deselected. The WCFS0808C1E is in  
the standard SOJ package.  
Features  
• High speed  
— 12 ns  
An active LOW Write Enable signal (WE) controls the writ-  
ing/reading operation of the memory. When CE and WE inputs  
are both LOW, data on the eight data input/output pins (I/O0  
through I/O7) is written into the memory location addressed by  
the address present on the address pins (A0 through A14).  
Reading the device is accomplished by selecting the device  
and enabling the outputs, CE and OE active LOW, while WE  
remains inactive or HIGH. Under these conditions, the con-  
tents of the location addressed by the information on address  
pins are present on the eight data input/output pins.  
• Fast tDOE  
• CMOS for optimum speed/power  
• Easy memory expansion with CE and OE features  
• TTL-compatible inputs and outputs  
• Automatic power-down when deselected  
Functional Description  
The WCFS0808C1E is a high-performance CMOS static RAM  
organized as 32K words by 8 bits. Easy memory expansion is  
provided by an active LOW Chip Enable (CE) and active LOW  
Output Enable (OE) and three-state drivers. This device has  
The input/output pins remain in a high-impedance state unless  
the chip is selected, outputs are enabled, and Write Enable  
(WE) is HIGH. A die coat is used to improve alpha immunity.  
Logic Block Diagram  
Pin Configurations  
SOJ  
Top View  
A
A
V
CC  
28  
27  
26  
1
2
3
4
5
6
5
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
WE  
A
4
6
0
1
2
3
4
5
6
INPUT BUFFER  
A
A
7
8
A
3
25  
24  
A
0
A
A
9
1
A
2
A
1
A
2
A
10  
A
11  
23  
22  
A
3
A
7
OE  
4
1024 x 32 x 8  
ARRAY  
A
A
A
A
5
A
21  
20  
19  
18  
17  
16  
15  
A
12  
13  
14  
8
9
10  
11  
12  
13  
0
6
A
CE  
I/O  
I/O  
6
7
A
8
A
7
9
I/O  
0
I/O  
I/O  
5
1
CE  
WE  
POWER  
DOWN  
I/O  
GND  
I/O  
I/O  
COLUMN  
DECODER  
2
4
14  
3
I/O  
7
OE  
Selection Guide  
WCFS0808C1E 12ns  
WCFS0808C1E 15ns  
Maximum Access Time (ns)  
12  
160  
10  
15  
155  
10  
Maximum Operating Current (mA)  
Maximum CMOS Standby Current (mA)  
Revised February 18, 2002  
WCFS0808C1E  
DC Voltage Applied to Outputs  
in High Z State[1].................................... –0.5V to VCC + 0.5V  
DC Input Voltage[1] ................................ –0.5V to VCC + 0.5V  
Output Current into Outputs (LOW)............................. 20 mA  
Maximum Ratings  
(Above which the useful life may be impaired. For user guide-  
lines, not tested.)  
Storage Temperature .................................65°C to +150°C  
Static Discharge Voltage........................................... >2001V  
(per MIL-STD-883, Method 3015)  
Ambient Temperature with  
Power Applied.............................................55°C to +125°C  
Latch-Up Current.................................................... >200 mA  
Supply Voltage to Ground Potential  
(Pin 28 to Pin 14) ........................................... –0.5V to +7.0V  
Operating Range  
Range  
Ambient Temperature[2]  
VCC  
Commercial  
0°C to +70°C  
5V 10%  
Electrical Characteristics Over the Operating Range[3]  
WCFS0808C1E 12ns  
WCFS0808C1E 15ns  
Parameter  
VOH  
Description  
Test Conditions  
Min.  
Max.  
Min.  
Max.  
Unit  
Output HIGH  
Voltage  
VCC = Min., IOH=–4.0 mA  
2.4  
2.4  
V
VOL  
VIH  
VIL  
IIX  
Output LOW  
Voltage  
VCC = Min., IOL=8.0 mA  
0.4  
0.4  
V
V
Input HIGH  
Voltage  
2.2  
–0.5  
–5  
VCC  
+0.3V  
2.2  
–0.5  
–5  
VCC  
+0.3V  
Input LOW  
Voltage  
0.8  
+5  
0.8  
+5  
V
Input Load  
Current  
GND < VI < VCC  
µA  
µA  
mA  
IOZ  
ICC  
Output Leakage GND < VO < VCC  
Current  
,
–5  
+5  
–5  
+5  
Output Disabled  
VCC Operating  
Supply Current IOUT = 0 mA,  
f = fMAX = 1/tRC  
VCC = Max.,  
Com’l  
Com’l  
160  
155  
ISB1  
Automatic CE  
Power-Down  
Current— TTL  
Inputs  
Max. VCC  
,
30  
10  
30  
10  
mA  
mA  
CE > VIH,  
VIN > VIH or  
VIN < VIL, f = fMAX  
Max. VCC  
CE > VCC – 0.3V  
ISB2  
Automatic CE  
Power-Down  
,
Com’l  
CurrentCMOS VIN > VCC – 0.3V  
Inputs  
or VIN < 0.3V, f = 0  
]
Capacitance[1]  
Parameter  
Description  
Test Conditions  
TA = 25°C, f = 1 MHz,  
VCC = 5.0V  
Max.  
Unit  
pF  
CIN  
Input Capacitance  
Output Capacitance  
8
8
COUT  
Notes:  
pF  
1. VIL (min.)= 2.0V for pulse durations of less than 20 ns.  
2. TA is the “instant on” case temperature.  
3. See the last page of this specification for Group A subgroup testing information.  
4. Tested initially and after any design or process changes that may affect these parameters.  
Page 2 of 10  
WCFS0808C1E  
AC Test Loads and Waveforms[5]  
R1 481  
R1 481Ω  
5V  
5V  
ALL INPUT PULSES  
OUTPUT  
OUTPUT  
3.0V  
GND  
90%  
10%  
90%  
10%  
R2  
255 Ω  
R2  
255Ω  
30 pF  
5 pF  
t  
t  
r
r
INCLUDING  
JIG AND  
SCOPE  
INCLUDING  
JIG AND  
SCOPE  
C199–5  
(a)  
(b)  
Equivalent to:  
THÉVENIN EQUIVALENT  
167 Ω  
OUTPUT  
1.73V  
Data Retention Characteristics (Over the Operating Range)  
Parameter  
VDR  
Description  
VCC for Data Retention  
Conditions[6]  
Min.  
Max.  
Unit  
V
2.0  
0
[1]  
tCDR  
Chip Deselect to Data Retention Time VCC = VDR = 2.0V,  
CE > VCC – 0.3V,  
ns  
[5]  
tR  
Operation Recovery Time  
VIN > VCC – 0.3V or  
200  
µs  
VIN < 0.3V  
Data Retention Waveform  
DATA RETENTION MODE  
3.0V  
3.0V  
V
DR  
> 2V  
V
CC  
t
t
R
CDR  
CE  
Note:  
5. tR< 3 ns for the -12 and the -15 speeds. tR< 5 ns for the -20 and slower speeds  
6. No input may exceed VCC + 0.5V.  
Page 3 of 10  
WCFS0808C1E  
Switching Characteristics Over the Operating Range[3, 7]  
WCFS0808C1E 12ns  
WCFS0808C1E 15ns  
Parameter  
READ CYCLE  
tRC  
Description  
Min.  
12  
3
Max.  
Min.  
Max.  
Unit  
Read Cycle Time  
15  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
tAA  
Address to Data Valid  
Data Hold from Address Change  
CE LOW to Data Valid  
OE LOW to Data Valid  
OE LOW to Low Z[8]  
OE HIGH to High Z[8, 9]  
CE LOW to Low Z[8]  
CE HIGH to High Z[8,9]  
CE LOW to Power-Up  
CE HIGH to Power-Down  
12  
15  
tOHA  
3
tACE  
12  
5
15  
7
tDOE  
tLZOE  
0
3
0
0
3
0
tHZOE  
tLZCE  
tHZCE  
tPU  
5
5
7
7
tPD  
12  
15  
WRITE CYCLE[10, 11]  
tWC  
tSCE  
tAW  
Write Cycle Time  
12  
9
15  
10  
10  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
CE LOW to Write End  
Address Set-Up to Write End  
Address Hold from Write End  
Address Set-Up to Write Start  
WE Pulse Width  
9
tHA  
0
tSA  
0
0
tPWE  
tSD  
8
9
Data Set-Up to Write End  
Data Hold from Write End  
WE LOW to High Z[9]  
8
9
tHD  
0
0
tHZWE  
7
7
tLZWE  
WE HIGH to Low Z[8]  
3
3
Notes:  
7. Test conditions assume signal transition time of 3 ns or less for -12 and -15 speeds and 5 ns or less for -20 and slower speeds, timing reference levels  
of 1.5V, input pulse levels of 0 to 3.0V, and output loading of the specified IOL/IOH and 30-pF load capacitance.  
8. At any given temperature and voltage condition, tHZCE is less than tLZCE, tHZOE is less than tLZOE, and tHZWE is less than tLZWE for any given device.  
9. tHZOE, tHZCE, and tHZWE are specified with CL = 5 pF as in part (b) of AC Test Loads. Transition is measured 500 mV from steady-state voltage.  
10. The internal write time of the memory is defined by the overlap of CE LOW and WE LOW. Both signals must be LOW to initiate a write and either signal can  
terminate a write by going HIGH. The data input set-up and hold timing should be referenced to the rising edge of the signal that terminates the write.  
11. The minimum write cycle time for write cycle #3 (WE controlled, OE LOW) is the sum of tHZWE and tSD  
.
Page 4 of 10  
WCFS0808C1E  
Read Cycle No. 1[12, 13]  
t
RC  
ADDRESS  
DATA OUT  
t
AA  
t
OHA  
PREVIOUS DATA VALID  
DATA VALID  
Read Cycle No. 2 [13, 14]  
t
RC  
CE  
t
ACE  
OE  
t
t
HZOE  
t
DOE  
HZCE  
t
LZOE  
HIGH  
IMPEDANCE  
HIGH IMPEDANCE  
DATA OUT  
DATA VALID  
t
LZCE  
t
PD  
t
PU  
V
ICC  
CC  
SUPPLY  
CURRENT  
50%  
50%  
ISB  
Notes:  
12. Device is continuously selected. OE, CE = VIL  
13. .WE is HIGH for read cycle  
Page 5 of 10  
WCFS0808C1E  
Write Cycle No. 1 (WE Controlled)[10, 15, 16]  
t
WC  
ADDRESS  
CE  
t
t
AW  
HA  
t
SA  
t
PWE  
WE  
OE  
t
SD  
t
HD  
DATA VALID  
IN  
DATA I/O  
t
HZOE  
Write Cycle No. 2 (CE Controlled)[10, 15, 16]  
t
WC  
ADDRESS  
CE  
t
SCE  
t
SA  
t
t
HA  
AW  
WE  
t
t
HD  
SD  
DATA I/O  
DATA VALID  
IN  
Notes:  
14. Address valid prior to or coincident with CE transition LOW.  
15. Data I/O is high impedance if OE = VIH  
16. If CE goes HIGH simultaneously with WE HIGH, the output remains in a high-impedance state.  
.
Page 6 of 10  
WCFS0808C1E  
Write Cycle No. 3 (WE Controlled OE LOW)[11, 16]  
t
WC  
ADDRESS  
CE  
t
t
HA  
AW  
t
SA  
WE  
t
t
HD  
SD  
DATA I/O  
DATA VALID  
IN  
t
t
LZWE  
HZWE  
Typical DC and AC Characteristics  
NORMALIZED SUPPLY CURRENT  
vs. AMBIENT TEMPERATURE  
OUTPUT SOURCE CURRENT  
vs. OUTPUT VOLTAGE  
NORMALIZED SUPPLY CURRENT  
vs. SUPPLY  
VOLTAGE  
120  
100  
80  
1.4  
1.2  
1.4  
1.2  
1.0  
0.8  
0.6  
I
CC  
I
CC  
1.0  
0.8  
0.6  
V
CC  
=5.0V  
60  
T =25°C  
A
V
IN  
=5.0V  
T =25°C  
A
40  
V
V
IN  
=5.0V  
=5.0V  
0.4  
CC  
0.4  
20  
0
0.2  
0.0  
0.2  
0.0  
I
SB  
I
SB  
–55  
25  
125  
0.0  
1.0  
2.0  
3.0  
4.0  
4.0  
4.5  
5.0  
5.5  
6.0  
AMBIENT TEMPERATURE (°C)  
OUTPUT VOLTAGE (V)  
SUPPLY VOLTAGE (V)  
NORMALIZED ACCESS TIME  
vs. AMBIENT TEMPERATURE  
OUTPUT SINK CURRENT  
vs. OUTPUT VOLTAGE  
NORMALIZED ACCESS TIME  
vs. SUPPLY VOLTAGE  
140  
120  
1.6  
1.4  
1.4  
1.3  
1.2  
100  
80  
1.2  
1.0  
1.1  
1.0  
60  
T =25°C  
A
V
CC  
=5.0V  
T =25°C  
A
V
CC  
=5.0V  
40  
0.8  
20  
0
0.9  
0.8  
0.6  
–55  
0.0  
1.0  
2.0  
3.0  
4.0  
25  
125  
4.0  
4.5  
5.0  
5.5  
6.0  
AMBIENT TEMPERATURE (°C)  
OUTPUT VOLTAGE (V)  
SUPPLY VOLTAGE (V)  
Page 7 of 10  
WCFS0808C1E  
Typical DC and AC Characteristics (continued)  
TYPICALPOWER-ON CURRENT  
vs.SUPPLY VOLTAGE  
TYPICAL ACCESS TIMECHANGE  
vs. OUTPUT LOADING  
NORMALIZED I vs.CYCLETIME  
CC  
3.0  
2.5  
2.0  
1.5  
30.0  
25.0  
20.0  
15.0  
1.25  
1.00  
0.75  
0.50  
V
=5.0V  
CC  
T =25°C  
A
V
IN  
=0.5V  
V
=4.5V  
1.0  
0.5  
10.0  
5.0  
CC  
T =25°C  
A
0.0  
0.0  
0.0  
1.0  
2.0  
3.0  
4.0  
5.0  
0
200 400  
600 800 1000  
10  
20  
30  
40  
SUPPLY VOLTAGE (V)  
CAPACITANCE (pF)  
CYCLE FREQUENCY (MHz)  
Truth Table  
CE  
H
L
WE  
X
OE  
X
Inputs/Outputs  
High Z  
Mode  
Power  
Deselect/Power-Down  
Read  
Standby (ISB  
Active (ICC  
Active (ICC  
Active (ICC  
)
H
L
Data Out  
Data In  
High Z  
)
L
L
X
Write  
)
L
H
H
Deselect, Output Disabled  
)
Ordering Information  
Speed  
Package  
Name  
Operating  
Range  
(ns)  
Ordering Code  
WCFS0808C1E-JC12  
WCFS0808C1E-JC15  
Package Type  
28-Lead Molded SOJ  
28-Lead Molded SOJ  
12  
J
J
15  
Commercial  
Page 8 of 10  
WCFS0808C1E  
Package Diagrams  
28-Lead (300-Mil) Molded SOJ,J  
Page 9 of 10  
WCFS0808C1E  
Document Title: WCFS0808C1E 32K x 8 Static RAM  
REV.  
Issue Date  
Orig. of Change  
Description of Change  
**  
4/16/2002  
XFL  
New Datasheet  
Page 10 of 10  

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