5962-9690201HTC [WEDC]
Standard SRAM, 256KX16, 35ns, CMOS, CQFP44, CERAMIC, QFP-44;
| 型号： | 5962-9690201HTC |
| 厂家： | 
WHITE ELECTRONIC DESIGNS CORPORATION |
| 描述： | Standard SRAM, 256KX16, 35ns, CMOS, CQFP44, CERAMIC, QFP-44 静态存储器 内存集成电路 |
| 文件： | 总20页 (文件大小：147K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
A
B
Add case outlines N and T.
98-06-01
98-12-09
K. A. Cottongim
K. A. Cottongim
Changed figure 1 for case outlines N and T to allow for pedestal or
non-pedestal version of these case outlines. -sld
C
D
Added device type 04. -sld
99-04-02
00-11-03
K. A. Cottongim
Add note to paragraph 1.2.2 and table I. Table I, add note 3 to CIN
and COUT tests.
Raymond Monnin
E
F
Made corrections to table I in the conditions for the standby current
and output leakage current tests. Made corrections to figures 5 and 6.
Updated drawing to reflect the latest requirements of MIL-PRF-38534.
-sld
03-12-22
04-10-25
Raymond Monnin
Raymond Monnin
Table I; Changed the IOL from 8 mA to 6 mA VOL test. Editorial
changes throughout. -sld
REV
SHEET
REV
F
F
F
F
F
SHEET
15
16
17
18
19
REV STATUS
OF SHEETS
REV
F
1
F
2
F
3
F
4
F
5
F
F
7
F
8
F
9
F
F
F
F
F
SHEET
6
10
11
12
13
14
PMIC N/A
PREPARED BY
Steve L. Duncan
DEFENSE SUPPLY CENTER COLUMBUS
STANDARD
MICROCIRCUIT
DRAWING
CHECKED BY
Michael C. Jones
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil/
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
APPROVED BY
Kendall A. Cottongim
MICROCIRCUIT, HYBRID, MEMORY, STATIC
RANDOM ACCESS MEMORY (SRAM) 256K x
16-BIT
DRAWING APPROVAL DATE
97-12-23
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
REVISION LEVEL
SIZE
A
CAGE CODE
67268
F
5962-96902
SHEET
1 OF 19
DSCC FORM 2233
APR 97
5962-E012-05
1. SCOPE
1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A
choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When
available, a choice of radiation hardness assurance levels are reflected in the PIN.
1.2 PIN. The PIN shall be as shown in the following example:
5962
-
96902
01
H
M
X
⏐
⏐
⏐
⏐
⏐
⏐
⏐
⏐
⏐
⏐
⏐
⏐
⏐
⏐
⏐
⏐
⏐
⏐
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
/
\/
Drawing number
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices shall meet the MIL-PRF-38534 specified RHA
levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type 1/
Generic number
Circuit function
Access time
01
02
03
04
WMS256K16-35DL
WMS256K16-25DL
WMS256K16-20DL
WMS256K16-17DL
SRAM, 256K x 16-bit
SRAM, 256K x 16-bit
SRAM, 256K x 16-bit
SRAM, 256K x 16-bit
35 ns
25 ns
20 ns
17 ns
1.2.3 Device class designator. This device class designator shall be a single letter identifying the product assurance level. All
levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and
E) or QML Listing (Class G and D). The product assurance levels are as follows:
Device class
K
Device performance documentation
Highest reliability class available. This level is intended for use in space
applications.
H
G
Standard military quality class level. This level is intended for use in applications
where non-space high reliability devices are required.
Reduced testing version of the standard military quality class. This level uses the
Class H screening and In-Process Inspections with a possible limited temperature
range, manufacturer specified incoming flow, and the manufacturer guarantees (but
may not test) periodic and conformance inspections (Group A, B, C and D).
E
Designates devices which are based upon one of the other classes (K, H, or G)
with exception(s) taken to the requirements of that class. These exception(s) must
be specified in the device acquisition document; therefore the acquisition document
should be reviewed to ensure that the exception(s) taken will not adversely affect
system performance.
1/ Due to the nature of the 4 transistor design of the die used in these device types, topologically pure testing is important,
particularly for high reliability applications. The device manufacturer should be consulted concerning their testing
methods and algorithms.
SIZE
STANDARD
5962-96902
A
MICROCIRCUIT DRAWING
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
F
2
DSCC FORM 2234
APR 97
D
Manufacturer specified quality class. Quality level is defined by the manufacturers
internal, QML certified flow. This product may have a limited temperature range.
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
M
N
T
See figure 1
See figure 1
See figure 1
44
44
44
Ceramic SOJ
Ceramic flat pack
Ceramic flat pack, lead formed
1.2.5 Lead finish. The lead finish shall be as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 1/
Supply voltage range (VCC)..................................................................
Input voltage range .............................................................................
Power dissipation(PD)..........................................................................
Storage temperature range .................................................................
Lead temperature (soldering, 10 seconds)..........................................
-0.5 V to +7.0 V
-0.5 V to +7.0 V
1.6 W
-65°C to +150°C
+300°C
1.4 Recommended operating conditions.
Supply voltage range (VCC)..................................................................
Input low voltage range (VIL)................................................................
Input high voltage range(VIH)...............................................................
Output voltage, high minimum (VOH) ...................................................
Output voltage, low maximum (VOL ) ...................................................
Case operating temperature range (TC) ..............................................
+4.5 V dc to +5.5 V dc
-0.3 V dc to +0.8 V dc
+2.2 V dc to VCC + 0.5 V dc
+2.4 V dc
-0.5 V to +7.0 V
-55°C to +125°C
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard for Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or www.dodssp.daps.mil or from the
Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
1/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
SIZE
STANDARD
5962-96902
A
MICROCIRCUIT DRAWING
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
F
3
DSCC FORM 2234
APR 97
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include the performance of all tests herein or as
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The
manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as
defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not
affect the form, fit, or function of the device for the applicable device class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38534 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Truth table(s). The truth table(s) shall be as specified on figure 3.
3.2.4 Timing diagram(s). The timing diagram(s) shall be as specified on figures 4 and 5.
3.2.5 Output load circuit. The output load circuit shall be as specified in figure 6.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with
the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.
3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample,
for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those
which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be
made available to the preparing activity (DSCC-VA) upon request.
3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DSCC-VA shall affirm that the manufacturer's product meets
the performance requirements of MIL-PRF-38534 and herein.
3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
SIZE
STANDARD
5962-96902
A
MICROCIRCUIT DRAWING
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
F
4
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions 1/ 2/
-55°C ≤ TC ≤ +125°C
4.5 V dc ≤ VCC ≤ 5.5 V dc,
Group A
subgroups
Device
types
Limits
Unit
Min
Max
VSS = 0 V
unless otherwise specified
DC parameters
Operating supply current
ICC
ISB
ILI
CS = VIL, OE = VIH,
f = 5 MHz, VCC = 5.5 V dc
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
All
All
All
All
275
mA
Standby current
CS = VIH, OE = VIH,
f = 5 MHz, VCC = 5.5 V dc
17
mA
µA
µA
Input leakage current
Output leakage current
VCC = 5.5 V dc, VIN = GND
to VCC
10
10
ILO
CS = VIH, OE = VIH,
VOUT = GND to VCC
Output low voltage
Output high voltage
VOL
VOH
IOL = 6 mA, VCC = 4.5 V
1, 2, 3
1, 2, 3
All
All
0.4
V
V
IOH = -4.0 mA, VCC = 4.5 V
2.4
Dynamic characteristics
Input capacitance 3/
CIN
VIN = 0 V, f = 1.0 MHz
VOUT = 0 V, f = 1.0 MHz
4
4
All
All
20
20
pF
pF
Output capacitance 3/
COUT
Data retention characteristics
Data retention supply voltage
VDR
1, 2, 3
1, 2, 3
All
All
2.0
5.5
V
CS ≥ VCC - 0.2 V
Data retention current
ICCDR1
VCC = 3.0 V
8.0 mA
See footnotes at end of table.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-96902
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
F
5
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/ 2/
-55°C ≤ TC ≤ +125°C
4.5 V dc ≤ VCC ≤ 5.5 V dc,
Group A
subgroups
Device
types
Limits
Unit
Min
Max
VSS = 0 V
Unless otherwise specified
Functional testing
Functional tests
See 4.3.1c
7, 8A, 8B
9, 10, 11
All
Read cycle AC timing characteristics
Read cycle time
tRC
See figure 4
01
02
03
04
35
25
20
17
ns
Address access time
tAA
See figure 4
9, 10, 11
01
02
03
04
35
25
20
17
ns
Output hold from
address change
tOH
See figure 4
See figure 4
9, 10, 11
9, 10, 11
All
0
ns
ns
Chip select access
time
tACS
01
02
03
04
35
25
20
17
Output enable to
output valid
tOE
See figure 4
9, 10, 11
01
02
03
04
20
15
12
10
ns
Chip select to output
enable in low Z
tCLZ
See figure 4
See figure 4
9, 10, 11
9, 10 ,11
01,02,03
5
ns
ns
3/
3/
04
All
2
0
Output enable to
output in low Z
tOLZ
See footnotes at end of table.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-96902
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
F
6
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/ 2/
-55°C ≤ TC ≤ +125°C
4.5 V dc ≤ VCC ≤ 5.5 V dc,
Group A
subgroups
Device
types
Limits
Unit
Min
Max
VSS = 0 V
unless otherwise specified
Read cycle AC timing characteristics – Continued.
Chip enable to output in tCHZ
high Z 3/
See figure 4
See figure 4
See figure 4
9, 10, 11
9, 10, 11
9, 10, 11
01
02
03
04
15
12
10
9
ns
Output enable to output
tOHZ
01
02
03
04
15
12
10
9
ns
ns
in high Z
3/
LB, UB, access time
tBA
01
02
03
04
17
14
12
10
LB, UB, enable to low Z
output 3/
tBLZ
See figure 4
See figure 4
9, 10, 11
9, 10, 11
All
0
ns
ns
LB, UB, disable to high
Z output 3/
tBHZ
01
02
03
04
15
12
10
9
Write cycle AC timing characteristics.
tWC
tCW
tAW
Write cycle time
See figure 5
See figure 5
See figure 5
9, 10, 11
9, 10, 11
9, 10, 11
01
02
03
04
35
25
20
17
ns
ns
ns
Chip select to end of
write
01
02
03
04
25
20
17
14
Address valid to end
of write
01
02
03
04
25
20
17
14
See footnotes at end of table.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-96902
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
F
7
DSCC FORM 2234
APR 97
TABLE I. Electrical performance characteristics - Continued.
Test
Symbol
Conditions 1/ 2/
-55°C ≤ TC ≤ +125°C
4.5 V dc ≤ VCC ≤ 5.5 V dc,
Group A
subgroups
Device
types
Limits
Unit
Min
Max
VSS = 0 V
Unless otherwise specified
Write cycle AC timing characteristics - Continued.
Data valid to end of
write
tDW
See figure 5
9, 10, 11
9, 10, 11
01
02
03
04
20
15
12
10
ns
Write pulse width
tWP
See figure 5
01
02
03
04
25
20
17
14
ns
Address setup time
Address hold time
tAS
tAH
See figure 5
See figure 5
9, 10, 11
9, 10, 11
All
All
0
2
ns
ns
Output active from end
of write
tOW
See figure 5
See figure 5
9, 10, 11
9, 10, 11
All
0
ns
ns
Write enable to output
tWHZ
01
02
03
04
15
10
10
9
in high Z
3/
Data hold time
tDH
tBW
See figure 5
See figure 5
9, 10, 11
9, 10, 11
All
0
ns
ns
LB, UB, valid to end of
write
01
02
03
04
25
20
17
14
1/ Unless otherwise specified, the DC test conditions are as follows:
Input pulse levels; VIH = VCC - 0.3 V and VIL = 0.3 V.
Unless otherwise specified, the AC test conditions are as follows:
Input pulse levels; VIH = 3.0 V and VIL = 0.0 V.
Input rise and fall times; 5 ns.
Input to output timing reference levels; 1.5 V.
2/ Due to the nature of the 4 transistor design of the die used in these device types, topologically pure testing is important,
particularly for high reliability applications. The device manufacturer should be consulted concerning their testing
methods and algorithms.
3/ Parameters shall be tested as part of device characterization and after design and process changes. Parameters
shall be guaranteed to the limits specified in table I for all lots not specifically tested.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-96902
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
F
8
DSCC FORM 2234
APR 97
Case outline M.
Symbol
Millimeters
Inches
Min
.106
.040
.015
.006
1.120
1.045
.425
Min
2.69
Max
3.96
Max
.156
.060
.019
.010
1.140
1.055
.435
A
A1
b
C
D
1.01
1.52
0.38
0.48
0.15
0.25
28.44
26.54
10.79
28.95
26.79
11.04
D1
E
e
1.27 TYP
.050 TYP
eA
R
9.29
9.80
.366
.386
0.88 TYP
.035 TYP
NOTES:
1. The U.S preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units
shall rule.
2. For solder lead finish, dimensions b and C will increase by +.003 inches (+0.08 mm).
3. Pin numbers are for reference only.
FIGURE 1. Case outline(s).
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-96902
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
F
9
DSCC FORM 2234
APR 97
Case outline N.
Symbol
Millimeters
Inches
Min
.091
.015
Min
2.31
0.38
Max
3.18
Max
.125
.019
.007
1.130
1.055
.515
.395
A
b
0.48
C
D
0.10
0.18
.004
28.19
26.54
12.83
9.78
28.70
26.80
13.80
10.03
1.110
1.045
.505
D1
E
E1
E2
e
.385
1.52 TYP
1.27 TYP
.060 TYP
.050 TYP
L
Q
9.65
0.56
10.67
0.71
.380
.022
.420
.028
NOTES:
1. The U.S preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units
shall rule.
2. For solder lead finish, dimensions b and C will increase by +.003 inches (+0.08 mm).
3. Pin numbers are for reference only.
4. The case outline N is available in either a pedestal or non-pedestal package. The Q dimension only applies to the
pedestal version of case outline N.
FIGURE 1. Case outline(s) - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-96902
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
F
10
DSCC FORM 2234
APR 97
Case outline T.
Symbol
Millimeters
Inches
Min
Max
3.81
3.18
0.64
0.48
0.18
Min
.101
.091
.010
.015
.004
Max
.150
.125
.025
.019
.007
A
A1
A2
b
2.57
2.31
0.25
0.38
0.10
C
C2
D
D1
E
E1
E2
E3
eA
e
0.76 TYP
.030 TYP
1.110 1.130
1.050 TYP
28.19
28.70
26.67 TYP
12.83
16.64
9.78
13.08
16.89
10.03
.505
.655
.385
.515
.665
.395
1.52 TYP
.060 TYP
11.07 TYP
1.27 TYP
1.91 TYP
.436 TYP
.050 TYP
.075 TYP
L
Q
0.38
0.64
.015
.025
R
0.18 TYP
.007 TYP
NOTES:
1. The U.S preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units
shall rule.
2. For solder lead finish, dimensions b and C will increase by +.003 inches (+0.08 mm).
3. Pin numbers are for reference only.
4. The case outline T is available in either a pedestal or non-pedestal package. The Q dimension only applies to the
pedestal version of case outline T.
FIGURE 1. Case outline(s) - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-96902
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
F
11
DSCC FORM 2234
APR 97
Device types
All
Device types
All
M, N, T
Terminal symbol
A10
Case outlines
M, N, T
Case outlines
Terminal number
Terminal symbol
Terminal number
1
2
A0
A1
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
A11
3
A2
A12
4
A3
A13
5
A4
A14
6
CS
NC
7
I/O1
I/O2
I/O3
I/O4
VCC
VSS
I/O5
I/O6
I/O7
I/O8
WE
A5
I/O9
8
I/O10
I/O11
I/O12
VCC
9
10
11
12
13
14
15
16
17
18
19
20
21
22
VSS
I/O13
I/O14
I/O15
I/O16
LB
UB
A6
OE
A7
A15
A8
A16
A9
A17
FIGURE 2. Terminal Connections.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-96902
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
F
12
DSCC FORM 2234
APR 97
CS WE OE
LB
UB
Mode
Data I/O
I/O 1-8
Power
I/O 9-16
High Z
High Z
High Z
High Z
Data out
H
L
L
L
L
L
L
L
L
X
H
X
H
H
H
L
X
H
X
L
L
L
X
X
X
X
X
H
L
H
L
L
H
L
X
X
H
H
L
L
H
L
Not select
Output disable
Output disable
Read
High Z
High Z
High Z
Data out
High Z
Standby
Active
Active
Active
Data out Data out
Write
Data in
High Z
Data in
High Z
Data in
Data in
Active
L
L
L
NOTES:
1. H = VIH = high logic state.
2. L = VIL = low logic level.
3. X = don’t care (either high or low).
4. High Z = high impedance state.
FIGURE 3. Truth table.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-96902
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
F
13
DSCC FORM 2234
APR 97
FIGURE 4. Read cycle timing diagram.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-96902
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
F
14
DSCC FORM 2234
APR 97
FIGURE 5. Write cycle timing diagram.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-96902
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
F
15
DSCC FORM 2234
APR 97
FIGURE 5. Write cycle timing diagram - Continued.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-96902
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
F
16
DSCC FORM 2234
APR 97
Parameter
Typical
0 - 3.0
5
Unit
V
Input pulse level
Input rise and fall
ns
V
Input and output reference level
Output load capacitance
1.5
50
pF
NOTES:
1. VZ is programmable from -2 V to +7 V.
2. IOL and IOH programmable from 0 to 16 mA.
3. Tester impedance ZO = 75Ω.
4. VZ is typically the midpoint of VOH and VOL
.
5. IOL and IOH are adjusted to simulate a typical resistive load circuit.
6. ATE tester includes jig capacitance.
FIGURE 6. Output load circuit.
SIZE
STANDARD
MICROCIRCUIT DRAWING
5962-96902
A
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
F
17
DSCC FORM 2234
APR 97
TABLE II. Electrical test requirements.
MIL-PRF-38534 test requirements
Subgroups
(in accordance with
MIL-PRF-38534, group A
test table)
Interim electrical parameters
Final electrical parameters
Group A test requirements
1,4,7,9
1*,2 3 4 7,8A,8B,9,10,11
1,2,3,4,7,8A,8B,9,10,11
1,2,3,4,7,8A,8B,9,10,11
Not applicable
Group C end-point electrical
parameters
End-point electrical parameters
for radiation hardness assurance
(RHA) devices
* PDA applies to subgroup 1.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form,
fit, or function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply:
a. Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit
shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified
in method 1015 of MIL-STD-883.
(2)
T as specified in accordance with table I of method 1015 of MIL-STD-883.
A
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance
with MIL-PRF-38534 and as specified herein.
4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows:
a. Tests shall be as specified in table II herein.
b. Subgroups 5 and 6 shall be omitted.
c. Subgroups 7, 8A, and 8B shall include verification of the truth table on figure 3.
SIZE
STANDARD
5962-96902
A
MICROCIRCUIT DRAWING
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
F
18
DSCC FORM 2234
APR 97
4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534.
4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows:
a. End-point electrical parameters shall be as specified in table II herein.
b. Steady-state life test, method 1005 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to either DSCC-VA or the acquiring activity upon request. Also, the test circuit
shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified
in method 1005 of MIL-STD-883.
(2)
T as specified in accordance with table I of method 1005 of MIL-STD-883.
A
(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534.
4.3.5 Radiation Hardness Assurance (RHA) inspection. RHA inspection is not currently applicable to this drawing.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor-
prepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated as specified in MIL-PRF-
38534.
6.4 Record of users. Military and industrial users shall inform Defense Supply Center Columbus (DSCC) when a system
application requires configuration control and the applicable SMD. DSCC will maintain a record of users and this list will be used
for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962)
should contact DSCC-VA, telephone (614) 692-0544.
6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614)
692-1081.
6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK-103
and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DSCC-VA and have agreed to this drawing.
SIZE
STANDARD
5962-96902
A
MICROCIRCUIT DRAWING
REVISION LEVEL
SHEET
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
F
19
DSCC FORM 2234
APR 97
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 04-10-25
Approved sources of supply for SMD 5962-96902 are listed below for immediate acquisition information only and shall
be added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded
by the next dated revisions of MIL-HDBK-103 and QML-38534.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962-9690201HMA
5962-9690201HMC
5962-9690201HNA
5962-9690201HNC
5962-9690201HTA
5962-9690201HTC
54230
54230
54230
54230
54230
54230
WMS256K16-35DLQ
WMS256K16-35DLQ
WMS256K16-35FLQ
WMS256K16-35FLQ
WMS256K16-35FGQ
WMS256K16-35FGQ
5962-9690202HMA
5962-9690202HMC
5962-9690202HNA
5962-9690202HNC
5962-9690202HTA
5962-9690202HTC
54230
54230
54230
54230
54230
54230
WMS256K16-25DLQ
WMS256K16-25DLQ
WMS256K16-25FLQ
WMS256K16-25FLQ
WMS256K16-25FGQ
WMS256K16-25FGQ
5962-9690203HMA
5962-9690203HMC
5962-9690203HNA
5962-9690203HNC
5962-9690203HTA
5962-9690203HTC
54230
54230
54230
54230
54230
54230
WMS256K16-20DLQ
WMS256K16-20DLQ
WMS256K16-20FLQ
WMS256K16-20FLQ
WMS256K16-20FGQ
WMS256K16-20FGQ
5962-9690204HMA
5962-9690204HMC
5962-9690204HNA
5962-9690204HNC
5962-9690204HTA
5962-9690204HTC
54230
54230
54230
54230
54230
54230
WMS256K16-17DLQ
WMS256K16-17DLQ
WMS256K16-17FLQ
WMS256K16-17FLQ
WMS256K16-17FGQ
WMS256K16-17FGQ
1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the
manufacturer listed for that part. If the desired lead finish is not listed contact the Vendor to determine its
availability.
2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the
performance requirements of this drawing.
Vendor CAGE
number
Vendor name
and address
54230
White Electronic Designs Corporation
3601 East University Drive
Phoenix, AZ 85034
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
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