VS-HFA08TA60CSTRLPBF [VISHAY]

Rectifier Diode, 1 Phase, 2 Element, 4A, Silicon, HALOGEN FREE AND ROHS COMPLIANT, D2PAK-3;
VS-HFA08TA60CSTRLPBF
型号: VS-HFA08TA60CSTRLPBF
厂家: VISHAY    VISHAY
描述:

Rectifier Diode, 1 Phase, 2 Element, 4A, Silicon, HALOGEN FREE AND ROHS COMPLIANT, D2PAK-3

功效 二极管
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VS-HFA08TA60CSPbF  
Vishay High Power Products  
HEXFRED®  
Ultrafast Soft Recovery Diode, 2 x 4 A  
FEATURES  
• Ultrafast recovery  
• Ultrasoft recovery  
• Very low IRRM  
• Very low Qrr  
Base  
common  
cathode  
2
• Specified at operating conditions  
• Meets MSL level 1, per J-STD-020, LF maximum  
peak of 260 °C  
• Halogen-free according to IEC 61249-2-21  
definition  
• Compliant to RoHS directive 2002/95/EC  
• AEC-Q101 qualified  
2
1
3
D2PAK  
Common  
cathode  
Anode  
Anode  
BENEFITS  
• Reduced RFI and EMI  
• Reduced power loss in diode and switching transistor  
• Higher frequency operation  
• Reduced snubbing  
• Reduced parts count  
DESCRIPTION  
VS-HFA08TA60CSPbF is a state of the art center tap  
ultrafast recovery diode. Employing the latest in epitaxial  
construction and advanced processing techniques it  
features a superb combination of characteristics which  
result in performance which is unsurpassed by any rectifier  
previously available. With basic ratings of 600 V and 4 A per  
leg continuous current, the VS-HFA08TA60CSPbF is  
especially well suited for use as the companion diode for  
IGBTs and MOSFETs. In addition to ultrafast recovery time,  
the HEXFRED® product line features extremely low values of  
peak recovery current (IRRM) and does not exhibit any  
tendency to “snap-off” during the tb portion of recovery. The  
HEXFRED features combine to offer designers a rectifier  
with lower noise and significantly lower switching losses in  
both the diode and the switching transistor. These  
HEXFRED advantages can help to significantly reduce  
snubbing, component count and heatsink sizes. The  
HEXFRED VS-HFA08TA60CSPbF is ideally suited for  
applications in power supplies and power conversion  
systems (such as inverters), motor drives, and many other  
similar applications where high speed, high efficiency is  
needed.  
PRODUCT SUMMARY  
VR  
VF at 4 A at 25 °C  
IF(AV)  
600 V  
1.8 V  
2 x 4 A  
17 ns  
t
rr (typical)  
TJ (maximum)  
Qrr  
150 °C  
40 nC  
dI(rec)M/dt  
280 A/μs  
ABSOLUTE MAXIMUM RATINGS  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
VALUES  
UNITS  
Cathode to anode voltage  
VR  
600  
V
per leg  
per device  
4
Maximum continuous forward current  
IF  
TC = 100 °C  
8
A
Single pulse forward current  
IFSM  
IFRM  
25  
Maximum repetitive forward current  
16  
TC = 25 °C  
25  
10  
Maximum power dissipation  
PD  
W
T
C = 100 °C  
Operating junction and storage temperature range  
TJ, TStg  
- 55 to + 150  
°C  
Document Number: 94596  
Revision: 24-Feb-10  
For technical questions, contact: diodestech@vishay.com  
www.vishay.com  
1
VS-HFA08TA60CSPbF  
Vishay High Power Products  
HEXFRED®  
Ultrafast Soft Recovery Diode, 2 x 4 A  
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN.  
TYP.  
MAX.  
UNITS  
Cathode to anode  
breakdown voltage  
VBR  
IR = 100 μA  
600  
-
-
IF = 4.0 A  
IF = 8.0 A  
-
-
-
-
-
-
-
1.5  
1.8  
1.4  
0.17  
44  
1.8  
2.2  
1.7  
3.0  
300  
8.0  
-
V
Maximum forward voltage  
VFM  
See fig. 1  
IF = 4.0 A, TJ = 125 °C  
VR = VR rated  
Maximum reverse  
leakage current  
IRM  
See fig. 2  
See fig. 3  
μA  
TJ = 125 °C, VR = 0.8 x VR rated  
VR = 200 V  
Junction capacitance  
Series inductance  
CT  
LS  
4.0  
8.0  
pF  
nH  
Measured lead to lead 5 mm from package body  
DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
IF = 1.0 A, dIF/dt = 200 A/μs, VR = 30 V  
TJ = 25 °C  
MIN.  
TYP.  
17  
MAX.  
-
UNITS  
trr  
-
-
-
-
-
-
-
Reverse recovery time  
See fig. 5, 6 and 16  
trr1  
28  
42  
ns  
trr2  
TJ = 125 °C  
38  
57  
IRRM1  
IRRM2  
Qrr1  
TJ = 25 °C  
2.9  
3.7  
40  
5.2  
6.7  
60  
Peak recovery current  
See fig. 7 and 8  
A
TJ = 125 °C  
TJ = 25 °C  
TJ = 125 °C  
IF = 4.0 A  
dIF/dt = 200 A/μs  
Reverse recovery charge  
See fig. 9 and 10  
nC  
VR = 200 V  
Qrr2  
70  
105  
Peak rate of fall of recovery  
current during tb  
See fig. 11 and 12  
dI(rec)M/dt1 TJ = 25 °C  
dI(rec)M/dt2 TJ = 125 °C  
-
-
280  
235  
-
-
A/μs  
THERMAL - MECHANICAL SPECIFICATIONS  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN.  
TYP.  
MAX.  
UNITS  
Lead temperature  
Tlead  
0.063" from case (1.6 mm) for 10 s  
-
-
300  
°C  
Thermal resistance,  
junction to case  
RthJC  
RthJA  
-
-
-
-
5.0  
80  
K/W  
Thermal resistance,  
junction to ambient  
Typical socket mount  
-
-
2.0  
-
-
g
Weight  
0.07  
oz.  
6.0  
(5.0)  
12  
(10)  
kgf · cm  
(lbf · in)  
Mounting torque  
Marking device  
-
Case style D2PAK  
HFA08TA60CS  
www.vishay.com  
2
For technical questions, contact: diodestech@vishay.com  
Document Number: 94596  
Revision: 24-Feb-10  
VS-HFA08TA60CSPbF  
Vishay High Power Products  
HEXFRED®  
Ultrafast Soft Recovery Diode, 2 x 4 A  
100  
10  
1000  
100  
10  
TJ = 150 °C  
TJ = 125 °C  
1
TJ = 150 °C  
TJ = 125 °C  
TJ = 25 °C  
1
0.1  
TJ = 25 °C  
0.01  
0.1  
0.001  
0
100  
200  
300  
400  
500  
0
1
2
3
4
5
6
VFM - Forward Voltage Drop (V)  
94596_02  
VR - Reverse Voltage (V)  
94596_01  
Fig. 1 - Maximum Forward Voltage Drop vs.  
Instantaneous Forward Current  
Fig. 2 - Typical Reverse Current vs.  
Reverse Voltage  
100  
TJ = 25 °C  
10  
1
1
10  
100  
1000  
94596_03  
VR - Reverse Voltage (V)  
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage  
10  
1
PDM  
D = 0.50  
D = 0.20  
D = 0.10  
D = 0.05  
D = 0.02  
t1  
t2  
0.1  
Single pulse  
(thermal resistance)  
Notes:  
D = 0.01  
1. Duty factor D = t1/t2  
2. Peak TJ = PDM x ZthJC + TC  
0.01  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
94596_04  
t1 - Rectangular Pulse Duration (s)  
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics  
Document Number: 94596  
Revision: 24-Feb-10  
For technical questions, contact: diodestech@vishay.com  
www.vishay.com  
3
VS-HFA08TA60CSPbF  
Vishay High Power Products  
HEXFRED®  
Ultrafast Soft Recovery Diode, 2 x 4 A  
200  
50  
VR = 200 V  
TJ = 125 °C  
TJ = 25 °C  
IF = 8 A  
IF = 4 A  
45  
160  
IF = 8 A  
IF = 4 A  
40  
35  
30  
120  
80  
40  
0
VR = 200 V  
TJ = 125 °C  
TJ = 25 °C  
25  
20  
100  
100  
1000  
1000  
94596_07  
dIF/dt (A/μs)  
94596_05  
dIF/dt (A/μs)  
Fig. 5 - Typical Reverse Recovery Time vs. dIF/dt  
Fig. 7 - Typical Stored Charge vs. dIF/dt  
14  
1000  
VR = 200 V  
TJ = 125 °C  
TJ = 25 °C  
12  
10  
8
IF = 8 A  
IF = 4 A  
IF = 8 A  
IF = 4 A  
6
4
VR = 200 V  
TJ = 125 °C  
TJ = 25 °C  
2
0
100  
100  
100  
1000  
1000  
94596_06  
dIF/dt (A/μs)  
Fig. 6 - Typical Recovery Current vs. dIF/dt  
94596_08  
dIF/dt (A/μs)  
Fig. 8 - Typical dI(rec)M/dt vs. dIF/dt  
www.vishay.com  
4
For technical questions, contact: diodestech@vishay.com  
Document Number: 94596  
Revision: 24-Feb-10  
VS-HFA08TA60CSPbF  
Vishay High Power Products  
HEXFRED®  
Ultrafast Soft Recovery Diode, 2 x 4 A  
VR = 200 V  
0.01 Ω  
L = 70 μH  
D.U.T.  
D
dIF/dt  
adjust  
IRFP250  
G
S
Fig. 9 - Reverse Recovery Parameter Test Circuit  
(3)  
trr  
IF  
ta  
tb  
0
(4)  
Qrr  
(2)  
IRRM  
0.5 IRRM  
(5)  
dI(rec)M/dt  
0.75 IRRM  
dIF/dt  
(1)  
(4) Qrr - area under curve defined by trr  
(1) dIF/dt - rate of change of current  
and IRRM  
through zero crossing  
trr x IRRM  
(2) IRRM - peak reverse recovery current  
Qrr  
=
2
(3) trr - reverse recovery time measured  
from zero crossing point of negative  
going IF to point where a line passing  
through 0.75 IRRM and 0.50 IRRM  
extrapolated to zero current.  
(5) dI(rec)M/dt - peak rate of change of  
current during tb portion of trr  
Fig. 10 - Reverse Recovery Waveform and Definitions  
Document Number: 94596  
Revision: 24-Feb-10  
For technical questions, contact: diodestech@vishay.com  
www.vishay.com  
5
VS-HFA08TA60CSPbF  
Vishay High Power Products  
HEXFRED®  
Ultrafast Soft Recovery Diode, 2 x 4 A  
ORDERING INFORMATION TABLE  
Device code  
VS- HF  
A
08  
TA  
60  
C
S
TRL PbF  
1
2
3
4
5
6
7
8
9
10  
1
2
3
4
5
6
7
8
9
-
-
-
-
-
-
-
-
-
HPP product suffix  
HEXFRED® family  
Process designator: A = Electron irradiated  
Current rating (08 = 8 A)  
Package outline (TA = TO-220, 3 leads)  
Voltage rating (60 = 600 V)  
Circuit configuration (C = Common cathode)  
S = D2PAK  
None = Tube (50 pieces)  
TRL = Tape and reel (left oriented)  
TRR = Tape and reel (right oriented)  
PbF = Lead (Pb)-free  
-
10  
LINKS TO RELATED DOCUMENTS  
Dimensions  
www.vishay.com/doc?95046  
www.vishay.com/doc?95054  
www.vishay.com/doc?95032  
Part marking information  
Packaging information  
www.vishay.com  
6
For technical questions, contact: diodestech@vishay.com  
Document Number: 94596  
Revision: 24-Feb-10  
Outline Dimensions  
Vishay Semiconductors  
D2PAK  
DIMENSIONS in millimeters and inches  
Conforms to JEDEC outline D2PAK (SMD-220)  
B
A
Pad layout  
A
(2)(3)  
E
A
(E)  
c2  
11.00  
MIN.  
(0.43)  
(3)  
D
L1  
4
2
9.65  
MIN.  
(0.38)  
(D1) (3)  
Detail A  
17.90 (0.70)  
15.00 (0.625)  
H
(2)  
1
3
3.81  
MIN.  
L2  
(0.15)  
B
B
2.32  
MIN.  
(0.08)  
A
B
2.64 (0.103)  
2.41 (0.096)  
(3)  
E1  
2 x b2  
2 x b  
C
c
View A - A  
0.004 M  
Base  
Metal  
0.010 M  
M
B
A
Plating  
(4)  
b1, b3  
2 x  
e
H
Gauge  
plane  
(4)  
c1  
(c)  
B
0° to 8°  
Seating  
plane  
Lead assignments  
L3  
A1  
Lead tip  
(b, b2)  
L
Diodes  
L4  
Section B - B and C - C  
Scale: None  
1. - Anode (two die)/open (one die)  
2., 4. - Cathode  
3. - Anode  
Detail “A”  
Rotated 90 °CW  
Scale: 8:1  
MILLIMETERS  
SYMBOL  
INCHES  
MILLIMETERS  
INCHES  
NOTES  
SYMBOL  
NOTES  
MIN.  
4.06  
0.00  
0.51  
0.51  
1.14  
1.14  
0.38  
0.38  
1.14  
8.51  
MAX.  
4.83  
0.254  
0.99  
0.89  
1.78  
1.73  
0.74  
0.58  
1.65  
9.65  
MIN.  
0.160  
0.000  
0.020  
0.020  
0.045  
0.045  
0.015  
0.015  
0.045  
0.335  
MAX.  
0.190  
0.010  
0.039  
0.035  
0.070  
0.068  
0.029  
0.023  
0.065  
0.380  
MIN.  
6.86  
9.65  
7.90  
MAX.  
8.00  
MIN.  
MAX.  
0.315  
0.420  
0.346  
A
A1  
b
D1  
E
0.270  
0.380  
0.311  
3
2, 3  
3
10.67  
8.80  
E1  
e
b1  
b2  
b3  
c
4
4
4
2
2.54 BSC  
0.100 BSC  
H
14.61  
1.78  
-
15.88  
2.79  
1.65  
1.78  
0.575  
0.070  
-
0.625  
0.110  
0.066  
0.070  
L
L1  
L2  
L3  
L4  
3
c1  
c2  
D
1.27  
0.050  
0.25 BSC  
0.010 BSC  
4.78  
5.28  
0.188  
0.208  
Notes  
(1)  
Dimensioning and tolerancing per ASME Y14.5 M-1994  
Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at  
the outmost extremes of the plastic body  
(2)  
(3)  
(4)  
(5)  
(6)  
(7)  
Thermal pad contour optional within dimension E, L1, D1 and E1  
Dimension b1 and c1 apply to base metal only  
Datum A and B to be determined at datum plane H  
Controlling dimension: inch  
Outline conforms to JEDEC outline TO-263AB  
Document Number: 95046  
Revision: 31-Mar-11  
For technical questions within your region, please contact one of the following:  
DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com  
www.vishay.com  
1
This document is subject to change without notice.  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
Legal Disclaimer Notice  
www.vishay.com  
Vishay  
Disclaimer  
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE  
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.  
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,  
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other  
disclosure relating to any product.  
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or  
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all  
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,  
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular  
purpose, non-infringement and merchantability.  
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical  
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements  
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular  
product with the properties described in the product specification is suitable for use in a particular application. Parameters  
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All  
operating parameters, including typical parameters, must be validated for each customer application by the customer’s  
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,  
including but not limited to the warranty expressed therein.  
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining  
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.  
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree  
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damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay  
or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to  
obtain written terms and conditions regarding products designed for such applications.  
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any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.  
Material Category Policy  
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the  
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council  
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment  
(EEE) - recast, unless otherwise specified as non-compliant.  
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that  
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.  
Revision: 12-Mar-12  
Document Number: 91000  
1

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