SIE812DF-T1-E3 [VISHAY]
Trans MOSFET N-CH 40V 33A 10-Pin PolarPAK T/R;
| 型号： | SIE812DF-T1-E3 |
| 厂家： | 
VISHAY |
| 描述： | Trans MOSFET N-CH 40V 33A 10-Pin PolarPAK T/R 开关 脉冲 晶体管 |
| 文件： | 总10页 (文件大小：196K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SiE812DF
Vishay Siliconix
N-Channel 40-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
•
Halogen-free According to IEC 61249-2-21
ID (A)a
Definition
•
•
TrenchFET® Gen II Power MOSFET
Ultra Low Thermal Resistance Using Top-
Exposed PolarPAK® Package for Double-Sided
Cooling
Silicon Package
VDS (V)
RDS(on) (Ω)e
Qg (Typ.)
Limit
Limit
0.0026 at V = 10 V
GS
163
60
40
52 nC
•
Leadframe-Based New Encapsulated Package
- Die Not Exposed
0.0034 at V = 4.5 V
GS
143
60
- Same Layout Regardless of Die Size
Low Qgd/Qgs Ratio Helps Prevent Shoot-Through
100 % Rg and UIS Tested
Package Drawing
www.vishay.com/doc?72945
•
•
•
PolarPAK
Compliant to RoHS directive 2002/95/EC
10
D
9
G
8
S
7
S
6
D
6
7
8
9
10
D
APPLICATIONS
•
•
•
VRM
DC/DC Conversion: Low-Side
Synchronous Rectification
D
D
D
S
G
G
D
1
G
2
S
3
S
4
D
5
5
4
3
2
1
Top View
Top surface is connected to pins 1, 5, 6, and 10
Ordering Information: SiE812DF-T1-E3 (Lead (Pb)-free)
SiE812DF-T1-GE3 (Lead (Pb)-free and Halogen-free)
Bottom View
S
N-Channel MOSFET
For Related Documents
www.vishay.com/ppg?74337
ABSOLUTE MAXIMUM RATINGS T = 25 °C, unless otherwise noted
A
Parameter
Symbol
Limit
40
20
Unit
VDS
VGS
Drain-Source Voltage
Gate-Source Voltage
V
163 (Silicon Limit)
60a (Package Limit)
TC = 25 °C
60a
33b, c
27b, c
100
60a
4.3b, c
50
125
125
80
5.2b, c
3.3b, c
Continuous Drain Current (TJ = 150 °C)
ID
TC = 70 °C
TA = 25 °C
TA = 70 °C
A
Pulsed Drain Current
IDM
IS
T
C = 25 °C
Continuous Source-Drain Diode Current
TA = 25 °C
IAS
EAS
Single Pulse Avalanche Current
Avalanche Energy
L = 0.1 mH
mJ
W
T
T
C = 25 °C
C = 70 °C
PD
Maximum Power Dissipation
TA = 25 °C
TA = 70 °C
TJ, Tstg
- 55 to 150
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)d, e
°C
260
Notes:
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. See Solder Profile (www.vishay.com/doc?73257). The PolarPAK is a leadless package. The end of the lead terminal is exposed copper (not
plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not
required to ensure adequate bottom side solder interconnection.
e. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.
Document Number: 74337
S09-1337-Rev. B, 13-Jul-09
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1
SiE812DF
Vishay Siliconix
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambienta, b
Symbol
RthJA
Typical
20
Maximum
Unit
t ≤ 10 s
24
1
RthJC (Drain)
0.8
°C/W
Maximum Junction-to-Case (Drain Top)
Steady State
Maximum Junction-to-Case (Source)a, c
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
RthJC (Source)
2.2
2.7
b. Maximum under Steady State conditions is 68 °C/W.
c. Measured at source pin (on the side of the package).
SPECIFICATIONS T = 25 °C, unless otherwise noted
J
Parameter
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Static
VGS = 0 V, ID = 250 µA
ID = 250 µA
Drain-Source Breakdown Voltage
VDS
ΔVDS/TJ
ΔVGS(th)/TJ
VGS(th)
40
V
V
DS Temperature Coefficient
45.5
- 7.1
2.3
mV/°C
VGS(th) Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
VDS = VGS , ID = 250 µA
1.5
25
3
V
IGSS
VDS = 0 V, VGS
=
20 V
100
1
nA
VDS = 40 V, VGS = 0 V
IDSS
ID(on)
RDS(on)
gfs
Zero Gate Voltage Drain Current
On-State Drain Currenta
µA
A
V
DS = 40 V, VGS = 0 V, TJ = 55 °C
VDS ≥ 5 V, VGS = 10 V
VGS = 10 V, ID = 25 A
10
0.0022
0.0028
154
0.0026
0.0034
Drain-Source On-State Resistancea
Ω
S
VGS = 4.5 V, ID = 25 A
VDS = 20 V, ID = 25 A
Forward Transconductancea
Dynamicb
Ciss
Coss
Crss
Input Capacitance
8300
800
360
111
52
VDS = 20 V, VGS = 0 V, f = 1 MHz
VDS = 20 V, VGS = 10 V, ID = 25 A
Output Capacitance
Reverse Transfer Capacitance
pF
170
Qg
Total Gate Charge
80
nC
Qgs
Qgd
Rg
V
DS = 10 V, VGS = 4.5 V, ID = 20 A
Gate-Source Charge
25
Gate-Drain Charge
15
Gate Resistance
f = 1 MHz
1.15
50
1.7
75
400
75
15
30
25
90
15
Ω
td(on)
tr
td(off)
tf
td(on)
tr
td(off)
tf
Turn-On Delay Time
VDD = 20 V, RL = 2 Ω
ID ≅ 10 A, VGEN = 4.5 V, Rg = 1 Ω
Rise Time
265
50
Turn-Off Delay Time
Fall Time
10
ns
Turn-On Delay Time
20
VDD = 20 V, RL = 2 Ω
ID ≅ 10 A, VGEN = 10 V, Rg = 1 Ω
Rise Time
15
Turn-Off Delay Time
60
Fall Time
10
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Currenta
Body Diode Voltage
IS
ISM
VSD
trr
TC = 25 °C
IS = 10 A
60
100
1.2
75
A
0.8
50
65
27
23
V
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
ns
nC
Qrr
ta
100
IF = 10 A, dI/dt = 100 A/µs, TJ = 25 °C
ns
tb
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 74337
S09-1337-Rev. B, 13-Jul-09
SiE812DF
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
20
16
12
8
100
5 V
V
GS
= 10 V thru 6 V
4 V
80
60
40
20
0
T
C
= 125 °C
4
25 °C
2
3 V
- 55 °C
0
0
1
3
4
0.0
0.1
0.2
0.3
0.4
0.5
V
GS
- Gate-to-Source Voltage (V)
V
DS
- Drain-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
0.0030
0.0028
0.0026
0.0024
0.0022
0.0020
10 000
8000
6000
4000
2000
0
C
iss
V
GS
= 4.5 V
V
= 10 V
GS
C
oss
C
rss
0
20
40
60
80
100
0
5
10
DS
15
20
25
30
35
40
I
D
- Drain Current (A)
V
- Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current and Gate Voltage
Capacitance
1.8
1.6
1.4
1.2
1.0
0.8
0.6
10
V
= 10 V, 4.5 V
= 25 A
GS
I
D
I
D
= 25 A
8
V
DS
= 20 V
6
V
DS
= 32 V
4
2
0
- 50 - 25
0
25
50
75
100 125 150
0
20
40
60
80
100
120
Q
g
- Total Gate Charge (nC)
T - Junction Temperature (°C)
J
Gate Charge
On-Resistance vs. Junction Temperature
Document Number: 74337
S09-1337-Rev. B, 13-Jul-09
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3
SiE812DF
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
100
10
1
0.0050
0.0045
0.0040
0.0035
0.0030
0.0025
0.0020
I
D
= 25 A
T
J
= 150 °C
T
A
= 125 °C
T
J
= 25 °C
T
A
= 25 °C
0.0
0.2
0.4
0.6
0.8
1.0
2
4
6
8
10
V
GS
- Gate-to-Source Voltage (V)
V
SD
- Source-to-Drain Voltage (V)
On-Resistance vs. Gate-to-Source Voltage
Source-Drain Diode Forward Voltage
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
50
40
I
D
= 250 µA
30
20
10
0
- 50 - 25
0
25
50
75
100 125 150
0.01
0.1
1
10
100
1000
T
J
- Temperature (°C)
Time (s)
Single Pulse Power, Junction-to-Ambient
Threshold Voltage
100
Limited by R
*
DS(on)
1 ms
10
1
10 ms
100 ms
1 s
10 s
0.1
0.01
DC
T
= 25 °C
A
Single Pulse
BVDSS Limited
10
0.01
0.1
1
100
VDS - Drain-to-Source Voltage (V)
* VDS > minimum VGS at which RDS(on) is specified
Safe Operating Area, Junction-to-Ambient
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Document Number: 74337
S09-1337-Rev. B, 13-Jul-09
SiE812DF
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
180
160
140
120
100
80
140
120
100
80
60
40
20
0
60
40
Package Limited
20
0
0
25
50
75
100
125
150
25
50
75
T - Case Temperature (°C)
C
100
125
150
T
C
- Case Temperature (°C)
Power Derating, Junction-to-Case
Current Derating*
* The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
Document Number: 74337
S09-1337-Rev. B, 13-Jul-09
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5
SiE812DF
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
2
1
Duty Cycle = 0.5
0.2
Notes:
0.1
0.1
P
DM
0.05
t
1
t
2
t
t
1
1. Duty Cycle, D =
2
0.02
2. Per Unit Base = R
= 55 °C/W
thJA
(t)
3. T - T = P
Z
JM DM thJA
A
Single Pulse
4. Surface Mounted
0.01
-4
-3
-2
-1
10
10
10
10
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
1
10
100
600
2
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
-4
-3
-2
-1
10
10
10
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Case (Drain Top)
10
1
2
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
-4
-3
-2
-1
10
10
10
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Source
10
1
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?74337.
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Document Number: 74337
S09-1337-Rev. B, 13-Jul-09
Package Information
Vishay Siliconix
POLARPAK™ OPTION L
Product datasheet/information page contain
links to applicable package drawing.
M4
M4
10
D
9
8
7
6
G
S
S
D
View A
M2
M1
M3
M3
c
D
1
G
2
S
S
4
D
5
3
A
(Top View)
H4
b1
b2
H1
H3
H2 b1
H1
b3
6
D
7
S
8
S
9
G
10
D
θ
θ
P1
Z
D1
D
P1
A
b4
b4
D
5
S
4
S
3
G
2
D
1
0.26
b5
b5
b5
DETAIL Z
View A
(Bottom View)
A
0.20
0.33
0.58
Document Number: 72945
Revision: 11-Aug-08
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1
Package Information
Vishay Siliconix
MILLIMETERS
INCHES
DIM
A
MIN.
0.75
0.00
0.48
0.41
2.19
0.89
0.23
0.20
6.00
5.74
5.01
4.75
0.23
0.45
0.31
0.45
4.22
1.08
1.37
0.24
4.30
3.43
0.22
0.05
0.15
3.48
0.56
1.20
3.90
0
NOM.
0.80
-
MAX.
0.85
0.05
0.68
0.61
2.39
1.19
0.43
0.30
6.30
6.04
5.31
5.05
-
MIN.
0.030
0.000
0.019
0.016
0.086
0.035
0.009
0.008
0.236
0.226
0.197
0.187
0.009
0.018
0.012
0.018
0.166
0.043
0.054
0.009
0.169
0.135
0.009
0.002
0.006
0.137
0.022
0.047
0.153
0.000
0°
NOM.
0.031
-
MAX.
0.033
0.002
0.027
0.024
0.094
0.047
0.017
0.012
0.248
0.238
0.209
0.199
-
A1
b1
b2
b3
b4
b5
c
0.58
0.51
2.29
1.04
0.33
0.25
6.15
5.89
5.16
4.90
-
0.023
0.020
0.090
0.041
0.013
0.010
0.242
0.232
0.203
0.193
-
D
D1
E
E1
H1
H2
H3
H4
K1
K2
K3
K4
M1
M2
M3
M4
P1
T1
T2
T3
T4
T5
θ
-
0.56
0.51
0.56
4.52
1.18
-
-
0.022
0.020
0.022
0.178
0.046
-
0.41
-
0.016
-
4.37
1.13
-
0.172
0.044
-
-
-
-
-
4.50
3.58
-
4.70
3.73
-
0.177
0.141
-
0.185
0.147
-
-
-
-
-
0.20
3.64
0.76
-
0.25
4.10
0.95
-
0.008
0.143
0.030
-
0.010
0.161
0.037
-
-
-
-
-
0.18
10°
0.36
12°
0.007
10°
0.014
12°
0°
ECN: T-08441-Rev. C, 11-Aug-08
DWG: 5946
Notes
Millimeters govern over inches.
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2
Document Number: 72945
Revision: 11-Aug-08
Application Note 826
Vishay Siliconix
RECOMMENDED MINIMUM PADS FOR PolarPAK® Option L and S
7.300
(0.287)
0.510
0.510
(0.020)
(0.020)
0.410
(0.016)
0.955
(0.038)
0.955
(0.038)
0.895
(0.035)
+
0.895
(0.035)
0.580
(0.023)
0.580
(0.023)
2.290
(0.090)
0.510
(0.020)
Recommended Minimum for PolarPAK Option L and S
Dimensions in mm/(Inches)
No External Traces within Broken Lines
Dot indicates Gate Pin (Part Marking)
Return to Index
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Document Number: 73491
Revision: 21-Jan-08
Legal Disclaimer Notice
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Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of
typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding
statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a
particular product with the properties described in the product specification is suitable for use in a particular application.
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
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Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk.
Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for
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© 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED
Revision: 08-Feb-17
Document Number: 91000
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