IRFRC20TRL [VISHAY]
Power MOSFET; 功率MOSFET
| 型号： | IRFRC20TRL |
| 厂家： | 
VISHAY |
| 描述： | Power MOSFET |
| 文件： | 总8页 (文件大小：1824K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IRFRC20, IRFUC20, SiHFRC20, SiHFUC20
Vishay Siliconix
Power MOSFET
FEATURES
• Dynamic dV/dt Rating
PRODUCT SUMMARY
VDS (V)
600
Available
• Repetitive Avalanche Rated
RoHS*
• Surface Mount (IRFRC20/SiHFRC20)
COMPLIANT
R
DS(on) (Ω)
VGS = 10 V
4.4
Qg (Max.) (nC)
18
3.0
• Straight Lead (IRFUC20/SiHFUC20)
• Available in Tape and Reel
• Fast Switching
Q
Q
gs (nC)
gd (nC)
8.9
Configuration
Single
• Ease of Paralleling
• Lead (Pb)-free Available
D
DPAK
(TO-252)
IPAK
(TO-251)
DESCRIPTION
Third generation Power MOSFETs from Vishay provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and
cost-effectiveness.
G
The D PAK is designed for surface mounting using vapor
phase, infrared, or wave soldering techniques. The straight
lead version (IRFUC/SiHFUC series) is for through-hole
mounting applications. Power dissipation levels up to 1.5 W
are possible in typical surcace mount applications.
S
N-Channel MOSFET
ORDERING INFORMATION
Package
DPAK (TO-252)
IRFRC20PbF
SiHFRC20-E3
IRFRC20
DPAK (TO-252)
IRFRC20TRLPbFa
SiHFRC20TL-E3a
IRFRC20TRLa
DPAK (TO-252)
IRFRC20TRPbFa
SiHFRC20T-E3a
IRFRC20TRa
DPAK (TO-252)
IRFRC20TRRPbFa
SiHFRC20TR-E3a
IRFRC20TRRa
IPAK (TO-251)
IRFUC20PbF
SiHFUC20-E3
IRFUC20
Lead (Pb)-free
SnPb
SiHFRC20
SiHFRC20TLa
SiHFRC20Ta
SiHFRC20TRa
SiHFUC20
Note
a. See device orientation.
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
LIMIT
600
20
UNIT
Drain-Source Voltage
Gate-Source Voltage
VDS
V
VGS
T
C = 25 °C
2.0
Continuous Drain Current
V
GS at 10 V
ID
TC =100°C
1.3
A
Pulsed Drain Currenta
IDM
8.0
Linear Derating Factor
0.33
0.020
450
2.0
W/°C
Linear Derating Factor (PCB Mount)e
Single Pulse Avalanche Energyb
Repetitive Avalanche Currenta
EAS
IAR
mJ
A
Repetitive Avalanche Energya
EAR
4.2
mJ
Maximum Power Dissipation
Maximum Power Dissipation (PCB Mount)e
Peak Diode Recovery dV/dtc
TC = 25 °C
42
PD
W
V/ns
°C
TA = 25 °C
2.5
dV/dt
3.0
Operating Junction and Storage Temperature Range
Soldering Recommendations (Peak Temperature)
TJ, Tstg
- 55 to + 150
260d
for 10 s
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. VDD = 50 V, starting TJ = 25 °C, L = 206 mH, RG = 25 Ω, IAS = 2.0 A (see fig. 12).
c. ISD ≤ 2.0 A, dI/dt ≤ 40 A/µs, VDD ≤ VDS, TJ ≤ 150 °C.
d. 1.6 mm from case.
e. When mounted on 1" square PCB (FR-4 or G-10 material).
* Pb containing terminations are not RoHS compliant, exemptions may apply
Document Number: 91285
S-81392-Rev. A, 07-Jul-08
www.vishay.com
1
IRFRC20, IRFUC20, SiHFRC20, SiHFUC20
Vishay Siliconix
THERMAL RESISTANCE RATINGS
PARAMETER
SYMBOL
MIN.
TYP.
MAX.
UNIT
Maximum Junction-to-Ambient
RthJA
-
-
110
Maximum Junction-to-Ambient
(PCB Mount)a
RthJA
RthJC
-
-
-
-
50
°C/W
Maximum Junction-to-Case (Drain)
3.0
Note
a. When mounted on 1" square PCB (FR-4 or G-10 material).
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
PARAMETER
SYMBOL
TEST CONDITIONS
MIN.
TYP.
MAX.
UNIT
Static
Drain-Source Breakdown Voltage
VDS
ΔVDS/TJ
VGS(th)
IGSS
VGS = 0 V, ID = 250 µA
Reference to 25 °C, ID = 1 mA
VDS = VGS, ID = 250 µA
600
-
-
V
V/°C
V
V
DS Temperature Coefficient
-
0.88
-
Gate-Source Threshold Voltage
Gate-Source Leakage
2.0
-
-
-
-
-
-
4.0
100
100
500
4.4
-
VGS
=
20 V
-
nA
VDS = 600 V, VGS = 0 V
-
-
Zero Gate Voltage Drain Current
IDSS
µA
V
DS = 480 V, VGS = 0 V, TJ = 125 °C
Drain-Source On-State Resistance
Forward Transconductance
Dynamic
RDS(on)
gfs
VGS = 10 V
ID = 1.2 Ab
-
Ω
VDS = 50 V, ID = 1.2 A
1.4
S
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Ciss
Coss
Crss
Qg
-
-
-
-
-
-
-
-
-
-
350
48
8.6
-
-
VGS = 0 V,
DS = - 25 V,
f = 1.0 MHz, see fig. 5
V
-
-
pF
nC
18
3.0
8.9
-
ID = 2.0 A, VDS = 360 V,
Qgs
Qgd
td(on)
tr
VGS = 10 V
-
see fig. 6 and 13b
-
10
23
30
25
-
VDD = 300 V, ID = 2.0 A,
ns
R
G = 18 Ω, RD = 135 Ω, see fig. 10b
Turn-Off Delay Time
Fall Time
td(off)
tf
-
-
D
Between lead,
Internal Drain Inductance
LD
LS
-
-
4.5
7.5
-
-
6 mm (0.25") from
package and center of
die contact
nH
G
Internal Source Inductance
S
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
D
MOSFET symbol
showing the
integral reverse
p - n junction diode
IS
-
-
-
-
2.0
8.0
A
G
Pulsed Diode Forward Currenta
ISM
S
Body Diode Voltage
VSD
trr
TJ = 25 °C, IS = 2.0 A, VGS = 0 Vb
-
-
-
-
1.6
580
1.3
V
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Forward Turn-On Time
290
0.67
ns
µC
TJ = 25 °C, IF = 2.0 A, dI/dt = 100 A/µsb
Qrr
ton
Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).
b. Pulse width ≤ 300 µs; duty cycle ≤ 2 %.
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Document Number: 91285
S-81392-Rev. A, 07-Jul-08
IRFRC20, IRFUC20, SiHFRC20, SiHFUC20
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Fig. 1 - Typical Output Characteristics, TC = 25 °C
Fig. 3 - Typical Transfer Characteristics
Fig. 2 - Typical Output Characteristics, TC = 150 °C
Fig. 4 - Normalized On-Resistance vs. Temperature
Document Number: 91285
S-81392-Rev. A, 07-Jul-08
www.vishay.com
3
IRFRC20, IRFUC20, SiHFRC20, SiHFUC20
Vishay Siliconix
Fig. 7 - Typical Source-Drain Diode Forward Voltage
Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage
Fig. 8 - Maximum Safe Operating Area
Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage
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Document Number: 91285
S-81392-Rev. A, 07-Jul-08
IRFRC20, IRFUC20, SiHFRC20, SiHFUC20
Vishay Siliconix
RD
VDS
VGS
D.U.T.
RG
+
V
-
DD
10 V
Pulse width ≤ 1 µs
Duty factor ≤ 0.1 %
Fig. 10a - Switching Time Test Circuit
VDS
90 %
10 %
VGS
td(on) tr
td(off) tf
Fig. 9 - Maximum Drain Current vs. Case Temperature
Fig. 10b - Switching Time Waveforms
Fig. 11 - Maximum Effective Transient Thermal Impedance, Junction-to-Case
Document Number: 91285
S-81392-Rev. A, 07-Jul-08
www.vishay.com
5
IRFRC20, IRFUC20, SiHFRC20, SiHFUC20
Vishay Siliconix
L
VDS
VDS
Vary tp to obtain
required IAS
tp
VDD
D.U.T
IAS
RG
+
-
VDD
VDS
10 V
0.01 Ω
tp
IAS
Fig. 12b - Unclamped Inductive Waveforms
Fig. 12a - Unclamped Inductive Test Circuit
Fig. 12c - Maximum Avalanche Energy vs. Drain Current
Current regulator
Same type as D.U.T.
50 kΩ
QG
VGS
12 V
0.2 µF
0.3 µF
QGS
QGD
+
-
VDS
D.U.T.
VG
VGS
3 mA
Charge
IG
ID
Current sampling resistors
Fig. 13a - Basic Gate Charge Waveform
Fig. 13b - Gate Charge Test Circuit
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Document Number: 91285
S-81392-Rev. A, 07-Jul-08
IRFRC20, IRFUC20, SiHFRC20, SiHFUC20
Vishay Siliconix
Peak Diode Recovery dV/dt Test Circuit
+
Circuit layout considerations
• Low stray inductance
• Ground plane
D.U.T
• Low leakage inductance
current transformer
-
+
-
-
+
RG
• dV/dt controlled by RG
+
-
• Driver same type as D.U.T.
• ISD controlled by duty factor "D"
• D.U.T. - device under test
VDD
Driver gate drive
P.W.
P.W.
Period
Period
D =
V
= 10 V*
GS
D.U.T. I waveform
SD
Reverse
recovery
current
Body diode forward
current
dI/dt
D.U.T. V waveform
DS
Diode recovery
dV/dt
V
DD
Re-applied
voltage
Body diode forward drop
Ripple ≤ 5 %
Inductor current
I
SD
* VGS = 5 V for logic level devices
Fig. 14 - For N-Channel
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?91285.
Document Number: 91285
S-81392-Rev. A, 07-Jul-08
www.vishay.com
7
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
www.vishay.com
1
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