10-FY07NBA160RV-M506L78 [VINCOTECH]
High efficiency in hard switching and resonant topologies;High speed switching;Low gate charge;![10-FY07NBA160RV-M506L78](http://pdffile.icpdf.com/pdf2/p00361/img/icpdf/10-FY07NBA16_2212765_icpdf.jpg)
型号: | 10-FY07NBA160RV-M506L78 |
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描述: | High efficiency in hard switching and resonant topologies;High speed switching;Low gate charge |
文件: | 总18页 (文件大小:1614K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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10-FY07NBA160RV-M506L78
datasheet
flowBOOST 1 symmetric
650 V / 160 A
Features
flow 1 12 mm housing
● High efficient and compact symmetric booster
● High switching frequency and low inductive design
● Low losses due to latest IGBT technology
● Integrated temperature sensor
Schematic
Target applications
● Solar Inverters
● UPS
Types
● 10-FY07NBA160RV-M506L78
Maximum Ratings
T
j
= 25 °C, unless otherwise specified
Parameter
Symbol
Condition
Value
Unit
Boost Switch
VCES
IC
Collector-emitter voltage
650
110
640
171
±30
2
V
A
Collector current
Tj = Tjmax
Ts = 80 °C
Ts = 80 °C
Tj = 25 °C
ICRM
Ptot
VGES
tSC
Repetitive peak collector current
Total power dissipation
Gate-emitter voltage
tp limited by Tjmax
Tj = Tjmax
A
W
V
Short circuit ratings
VGE = 15 V
Vcc = 360 V
µs
°C
Tjmax
Maximum junction temperature
175
Copyright Vincotech
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18 May. 2018 / Revision 1
10-FY07NBA160RV-M506L78
datasheet
Maximum Ratings
Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Condition
Value
Unit
Boost Diode
VRRM
IF
IFRM
Ptot
Peak repetitive reverse voltage
650
102
300
127
175
V
A
Continuous (direct) forward current
Repetitive peak forward current
Total power dissipation
Tj = Tjmax
Ts = 80 °C
Ts = 80 °C
A
Tj = Tjmax
W
°C
Tjmax
Maximum junction temperature
Boost Sw. Protection Diode
VRRM
Peak repetitive reverse voltage
Continuous (direct) forward current
Repetitive peak forward current
Total power dissipation
650
30
V
A
IF
Tj = Tjmax
Ts = 80 °C
Ts = 80 °C
IFRM
Ptot
60
A
Tj = Tjmax
53
W
°C
Tjmax
Maximum junction temperature
175
Module Properties
Thermal Properties
Tstg
Tjop
Storage temperature
-40…+125
°C
°C
Operation temperature under switching condition
Isolation Properties
-40…(Tjmax - 25)
DC Test Voltage*
AC Voltage
tp = 2 s
6000
2500
V
Visol
Isolation voltage
tp = 1 min
V
Creepage distance
min. 12,7
8,44
mm
mm
Clearance
Comparative Tracking Index
*100 % tested in production
CTI
> 200
Copyright Vincotech
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18 May. 2018 / Revision 1
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datasheet
Characteristic Values
Parameter
Symbol
Conditions
Value
Typ
Unit
VCE [V] IC [A]
VGE [V]
VGS [V]
VDS [V] ID [A] Tj [°C]
VF [V] IF [A]
Min
Max
Boost Switch
Static
VGE(th)
Gate-emitter threshold voltage
5
0,1142 25
25
5
6
7
V
V
1,65
1,69
1,75
1,9
VCEsat
Collector-emitter saturation voltage
15
160
125
150
ICES
IGES
rg
Collector-emitter cut-off current
Gate-emitter leakage current
Internal gate resistance
Input capacitance
0
650
0
25
20
µA
nA
Ω
30
25
400
none
9620
368
Cies
Coes
Cres
Qg
Output capacitance
f = 1 Mhz
0
30
25
25
pF
Reverse transfer capacitance
Gate charge
158
15
400
160
342
nC
Thermal
λpaste = 3,4 W/mK
(PSX)
Rth(j-s)
Thermal resistance junction to sink
0,56
K/W
Dynamic
25
54
51
51
Turn-on delay time
td(on)
125
150
25
21
Rise time
tr
125
150
25
125
150
25
125
150
25
125
150
25
24
23
171
183
186
33
Rgon = 4 Ω
Rgoff = 4 Ω
ns
Turn-off delay time
Fall time
td(off)
0 / 15
400
160
tf
43
45
3,48
5,29
5,62
2,76
3,70
Qr
FWD
Qr
FWD
Qr
FWD
= 4,1 μC
= 8,3 μC
= 9,6 μC
Turn-on energy (per pulse)
Eon
mWs
125
Eoff
Turn-off energy (per pulse)
150
3,91
Copyright Vincotech
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18 May. 2018 / Revision 1
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datasheet
Characteristic Values
Parameter
Symbol
Conditions
Value
Typ
Unit
VCE [V] IC [A]
VGE [V]
VGS [V]
VDS [V] ID [A] Tj [°C]
VF [V] IF [A]
Min
Max
Boost Diode
Static
25
125
150
1,53
1,49
1,47
1,92
7,6
Forward voltage
VF
IR
150
V
Reverse leakage current
650
25
µA
Thermal
λpaste = 3,4 W/mK
(PSX)
Rth(j-s)
Thermal resistance junction to sink
0,75
K/W
Dynamic
25
70
103
110
IRRM
125
150
25
Peak recovery current
A
76
trr
Qr
Reverse recovery time
125
150
25
125
150
25
125
150
25
125
150
104
116
ns
di/dt = 5969 A/μs
di/dt = 5231 A/μs 0 / 15
di/dt = 5177 A/μs
4,07
8,28
9,65
0,976
1,93
2,29
5263
5407
4815
400
160
Recovered charge
μC
Erec
Reverse recovered energy
Peak rate of fall of recovery current
mWs
A/µs
(dirf/dt)max
Boost Sw. Protection Diode
Static
25
150
1,64
1,56
1,87
0,36
VF
IR
Forward voltage
Reverse leakage current
Thermal
30
V
650
25
µA
λpaste = 3,4 W/mK
(PSX)
Rth(j-s)
Thermal resistance junction to sink
1,80
K/W
Copyright Vincotech
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18 May. 2018 / Revision 1
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datasheet
Characteristic Values
Parameter
Symbol
Conditions
Value
Typ
Unit
VCE [V] IC [A]
VGE [V]
VGS [V]
VDS [V] ID [A] Tj [°C]
VF [V] IF [A]
Min
Max
Thermistor
Rated resistance
R
ΔR/R
P
25
100
25
25
25
25
22
kΩ
%
Deviation of R100
Power dissipation
Power dissipation constant
B-value
R100 = 1486 Ω
-12
+14
200
2
mW
mW/K
K
B(25/50) Tol. ±3%
B(25/100) Tol. ±3%
3950
3998
B-value
K
Vincotech NTC Reference
B
Copyright Vincotech
5
18 May. 2018 / Revision 1
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datasheet
Boost Switch Characteristics
figure 1.
IGBT
figure 2.
IGBT
Typical output characteristics
Typical output characteristics
I C = f(VCE
)
I C = f(VCE
)
500
500
VGE
:
7
8
9
V
V
V
I
I
I
I
I
I
I
I
400
300
200
100
10
11
12
13
14
15
16
17
V
V
V
V
V
V
V
V
400
300
200
100
0
0
0
1
2
3
4
5
0
1
2
3
4
VC E (V)
VC E (V)
tp
=
250
15
μs
V
25 °C
125 °C
150 °C
tp
Tj
=
250
150
μs
°C
VGE
=
Tj:
=
VGE from
7 V to 17 V in steps of 1 V
figure 3.
IGBT
figure 4.
IGBT
Typical transfer characteristics
Transient thermal impedance as function of pulse duration
I C = f(VGE
)
Z th(j-s) = f(t p)
100
160
I
I
I
I
Z
Z
Z
Z
120
80
10-1
10-2
10-3
0,5
0,2
0,1
40
0,05
0,02
0,01
0,005
0
0
10-5
10-4
10-3
10-2
10-1
100
101
tp(s)
102
0
2
4
6
8
10
VG E (V)
tp
=
100
10
μs
V
25 °C
125 °C
150 °C
D =
R th(j-s)
tp / T
VCE
=
Tj:
=
0,56
K/W
IGBT thermal model values
(K/W)
R
τ
(s)
3,72E-02
7,76E-02
1,95E-01
1,82E-01
4,71E-02
1,64E-02
4,49E+00
1,06E+00
1,62E-01
4,81E-02
7,51E-03
7,15E-04
Copyright Vincotech
6
18 May. 2018 / Revision 1
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datasheet
Boost Switch Characteristics
figure 5.
IGBT
Safe operating area
I C = f(VCE
)
1000
1ms
10µs
100µs
10ms
I
I
I
I
100ms
DC
100
10
1
0,1
0,01
1
10
100
1000
VC E (V)
D =
single pulse
80 ºC
Ts
=
VGE
=
±15
V
Tj =
Tjmax
Copyright Vincotech
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18 May. 2018 / Revision 1
10-FY07NBA160RV-M506L78
datasheet
Boost Diode Characteristics
figure 1.
FWD
figure 2.
FWD
Typical forward characteristics
Transient thermal impedance as a function of pulse width
IF = f(VF)
Z th(j-s) = f(tp)
100
500
400
300
200
100
0
Z
Z
Z
Z
10-1
0.5
0.2
0.1
0.05
0.02
0.01
0.005
0
10-2
10-4
=
10-3
10-2
10-1
100
101
102
tp (s)
0
1
2
3
4
5
VF (V)
tp
=
250
μs
25 °C
125 °C
150 °C
D =
R th(j-s)
tp / T
0,75
Tj:
K/W
FWD thermal model values
R (K/W)
τ
(s)
2,88E-02
7,02E-02
1,95E-01
2,65E-01
1,21E-01
3,39E-02
3,36E-02
7,46E+00
1,27E+00
2,04E-01
6,33E-02
1,27E-02
3,05E-03
3,74E-04
Copyright Vincotech
8
18 May. 2018 / Revision 1
10-FY07NBA160RV-M506L78
datasheet
Boost Sw. Protection Diode Characteristics
figure 1.
FWD
figure 2.
FWD
Typical forward characteristics
Transient thermal impedance as a function of pulse width
I F = f(VF)
Z th(j-s) = f(tp)
101
Z
Z
Z
Z
100
10-1
10-2
10-4
=
10-3
10-2
10-1
100
101
102
tp
=
250
μs
25 °C
150 °C
D =
R th(j-s)
tp / T
1,80
Tj:
K/W
FWD thermal model values
R (K/W)
τ
(s)
5,88E-02
1,26E-01
5,91E-01
5,13E-01
2,57E-01
1,01E-01
1,52E-01
5,09E+00
6,40E-01
8,94E-02
2,64E-02
6,46E-03
1,53E-03
2,46E-04
Thermistor Characteristics
Typical Thermistor resistance values
figure 1.
Typical NTC characteristic
Thermistor
as a function of temperature
R = f(T)
NTC-typical temperature characteristic
25000
20000
15000
10000
5000
0
25
50
75
100
125
T (°C)
Copyright Vincotech
9
18 May. 2018 / Revision 1
10-FY07NBA160RV-M506L78
datasheet
Boost Switching Characteristics
figure 1.
IGBT
figure 2.
IGBT
Typical switching energy losses as a function of collector current
Typical switching energy losses as a function of gate resistor
E = f(R g)
E = f(I C
)
16
12
E
E
E
E
E
E
E
E
Eon
Eon
Eon
Eon
12
8
9
6
3
0
Eon
Eon
Eoff
Eoff
Eoff
Eoff
Eoff
Eoff
4
0
0
50
100
150
200
250
300
350
IC (A)
0
2
4
6
8
10
12
25 °C
14
16
Rg (Ω)
18
With an inductive load at
25 °C
With an inductive load at
VCE
VGE
=
=
=
=
400
0 / 15
4
V
V
Ω
Ω
Tj:
VCE
VGE
I C
=
=
=
400
0 / 15
160
V
V
A
Tj:
125 °C
150 °C
125 °C
150 °C
R gon
R goff
4
figure 3.
FWD
figure 4.
FWD
Typical reverse recovered energy loss as a function of collector current
Typical reverse recovered energy loss as a function of gate resistor
Erec = f(I c)
Erec = f(R g)
3
3
Erec
Erec
E
E
E
E
E
E
E
E
2,5
2
2,5
2
Erec
Erec
1,5
1
1,5
1
Erec
Erec
0,5
0
0,5
0
0
2
4
6
8
10
12
14
16
18
0
50
100
150
200
250
300
350
IC (A)
Rg (Ω)
With an inductive load at
25 °C
With an inductive load at
25 °C
400
0 / 15
4
V
V
Ω
400
0 / 15
160
V
V
A
VCE
VGE
=
=
=
Tj:
VCE
VGE
I C
=
=
=
Tj:
125 °C
150 °C
125 °C
150 °C
R gon
Copyright Vincotech
10
18 May. 2018 / Revision 1
10-FY07NBA160RV-M506L78
datasheet
Boost Switching Characteristics
figure 5.
IGBT
figure 6.
IGBT
Typical switching times as a function of collector current
Typical switching times as a function of gate resistor
t = f(I C
)
t = f(R g)
1
1
td(off )
t
t
t
t
t
t
t
t
td(off )
0,1
0,1
td(on)
tr
td(on)
tf
tf
0,01
0,01
tr
0,001
0,001
0
2
4
6
8
10
12
14
16
18
0
50
100
150
200
250
300
350
Rg (Ω)
IC (A)
With an inductive load at
With an inductive load at
150
400
0 / 15
4
°C
V
150
400
°C
V
Tj =
Tj =
VCE
=
=
=
=
VCE
=
=
=
VGE
R gon
R goff
V
VGE
I C
0 / 15
160
V
Ω
Ω
A
4
figure 7.
FWD
figure 8.
FWD
Typical reverse recovery time as a function of collector current
Typical reverse recovery time as a function of IGBT turn on gate resistor
t rr = f(I C
)
trr = f(R gon
)
0,16
0,16
trr
trr
t
t
t
t
t
t
t
t
trr
trr
0,12
0,08
0,04
0
0,12
0,08
0,04
0
trr
trr
0
50
400
100
150
200
250
300
350
0
2
4
6
8
10
12
25 °C
14
16
18
IC (A)
Rg on (Ω)
At
VCE
=
V
V
Ω
At
VCE
=
400
V
V
A
25 °C
VGE
R gon
=
=
0 / 15
4
Tj:
VGE
I C
=
0 / 15
160
Tj:
125 °C
150 °C
125 °C
150 °C
=
Copyright Vincotech
11
18 May. 2018 / Revision 1
10-FY07NBA160RV-M506L78
datasheet
Boost Switching Characteristics
figure 9.
FWD
figure 10.
FWD
Typical recovered charge as a function of collector current
Typical recovered charge as a function of IGBT turn on gate resistor
Q r = f(I C
)
Q r = f(R gon)
15
12
Q
Q
Q
Q
Q
Q
Q
Q
Qr
Qr
12
9
9
6
3
0
Qr
Qr
6
Qr
Qr
3
0
0
50
100
150
200
250
300
350
0
2
4
6
8
10
12
14
16
18
Rg on (Ω)
IC (A)
400
V
V
Ω
400
V
V
A
At
VCE
VGE
R gon
=
At
VCE
VGE
I C
=
25 °C
25 °C
0 / 15
4
0 / 15
160
=
Tj:
=
Tj:
125 °C
150 °C
125 °C
150 °C
=
=
figure 11.
FWD
figure 12.
FWD
Typical peak reverse recovery current current as a function of collector current
Typical peak reverse recovery current as a function of IGBT turn on gate resistor
I RM = f(I C
)
I RM = f(R gon
)
120
160
IRM
IRM
I
I
I I
I I
I
I
90
60
30
0
120
80
40
0
IRM
IRM
IRM
IRM
0
2
4
6
8
10
12
25 °C
14
16
18
Rgo n (Ω)
0
50
100
150
200
250
300
350
IC (A)
400
V
V
Ω
400
V
V
A
At
VCE
=
At
VCE =
25 °C
0 / 15
4
0 / 15
160
VGE
=
=
Tj:
VGE
I C
=
Tj:
125 °C
150 °C
125 °C
150 °C
R gon
=
Copyright Vincotech
12
18 May. 2018 / Revision 1
10-FY07NBA160RV-M506L78
datasheet
Boost Switching Characteristics
figure 13.
FWD
figure 14.
FWD
Typical rate of fall of forward and reverse recovery current as a function of collector current
Typical rate of fall of forward and reverse recovery current as a function of IGBT turn on gate resistor
di F/dt, di rr/dt = f(I C
)
di F/dt, di rr/dt = f(R gon
)
diF/dt
dirr/dt
d
iF
/
/
dt
dt
t
t
t t
t t
t
t
dirr
i
i
i i
i i
i
i
At
VCE
=
400
V
V
Ω
25 °C
125 °C
150 °C
At
VCE
VGE
I C
=
400
0 / 15
160
V
V
A
25 °C
125 °C
150 °C
0 / 15
4
:
Tj
:
Tj
VGE
=
=
=
R gon
=
figure 15.
IGBT
Reverse bias safe operating area
I C = f(VCE
)
IC MAX
I
I
I
I
I
I
I
I
I
I
I
I
V
V
V
V
At
Tj
=
=
=
150
°C
Ω
4
4
R gon
R goff
Ω
Copyright Vincotech
13
18 May. 2018 / Revision 1
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datasheet
Boost Switching Definitions
General conditions
=
=
=
125 °C
4 Ω
4 Ω
T j
Rgon
R goff
figure 1.
IGBT
figure 2.
IGBT
Turn-off Switching Waveforms & definition of tdoff, tEoff (tEoff = integrating time for Eoff
)
Turn-on Switching Waveforms & definition of tdon, tEon (tEon = integrating time for Eon)
tdoff
%
%
VGE 90%
VCE 90%
IC
IC
VGE
VGE
VCE
tdon
tEoff
IC 1%
VCE 3%
VCE
IC 10%
VGE 10%
tEon
t
(µs)
t (µs)
VGE (0%) =
0
V
VGE (0%) =
0
V
VGE (100%) =
VC (100%) =
I C (100%) =
15
V
VGE (100%) =
VC (100%) =
I C (100%) =
15
V
400
160
183
V
400
160
51
V
A
A
ns
ns
t doff
=
tdon
=
figure 3.
IGBT
figure 4.
IGBT
Turn-off Switching Waveforms & definition of tf
Turn-on Switching Waveforms & definition of tr
fitted
%
%
IC
IC
IC 90%
IC 60%
IC 40%
VCE
IC 90%
tr
IC10%
VCE
IC 10%
tf
t
(µs)
t
(µs)
VC (100%) =
I C (100%) =
t f =
400
160
43
V
VC (100%) =
I C (100%) =
400
160
24
V
A
A
ns
tr
=
ns
Copyright Vincotech
14
18 May. 2018 / Revision 1
10-FY07NBA160RV-M506L78
datasheet
Boost Switching Characteristics
figure 5.
FWD
figure 6.
FWD
Turn-off Switching Waveforms & definition of trr
Turn-on Switching Waveforms & definition of tQr (tQr
=
integrating time for Qr)
%
%
Qr
trr
tQr
IF
IF
fitted
IRRM 10%
VF
IRRM 90%
IRRM 100%
t
(µs)
t
(µs)
400
160
103
104
V
160
A
VF (100%) =
I F (100%) =
I RRM (100%) =
I F (100%) =
Q r (100%) =
A
8,28
μC
A
ns
t rr
=
Copyright Vincotech
15
18 May. 2018 / Revision 1
10-FY07NBA160RV-M506L78
datasheet
Ordering Code & Marking
Version
Ordering Code
without thermal paste 12 mm housing with solder pins
10-FY07NBA160RV-M506L78
Name
Date code
WWYY
Serial
UL & VIN
UL VIN
Lot
Serial
NN-NNNNNNNNNNNNNN
TTTTTTVV WWYY UL
VIN LLLLL SSSS
Text
NN-NNNNNNNNNNNNNN-TTTTTTVV
LLLLL
SSSS
Type&Ver
Lot number
Date code
WWYY
Datamatrix
TTTTTTTVV
LLLLL
SSSS
Outline
Pin table
Pin
X
0
Y
Function
N2
2,8
1
2
0
5,4
N2
3
0
8
N2
4
0
10,6
17,6
20,2
22,8
25,4
28,2
28,2
28,2
28,2
28,2
28,2
20,5
20,5
17,9
17,9
10,4
N2
5
0
N1
6
0
N1
7
0
N1
8
0
N1
9
16,6
19,2
21,8
24,4
44,2
52,2
49,6
52,2
49,6
52,2
49,6
DC-Boost
DC-Boost
DC-Boost
DC-Boost
Therm1
Therm2
Boost-
Boost-
Boost-
Boost-
Boost+
10
11
12
13
14
15
16
17
18
19
20
21
22
52,2
49,6
52,2
10,4
7,8
Boost+
Boost+
Boost+
7,8
23
24
25
26
27
28
29
30
24,4
21,8
19,2
16,6
21,8
21,8
8,4
0
0
DC+Boost
DC+Boost
DC+Boost
DC+Boost
S25
0
0
18,3
15,5
12,7
9,9
G25
G27
S27
8,4
Copyright Vincotech
16
18 May. 2018 / Revision 1
10-FY07NBA160RV-M506L78
datasheet
Pinout
Identification
ID
Component
MOSFET
FWD
Voltage
650 V
Current
Function
Comment
T25, T27
D25, D27
D45, D47
Rt
160 A
150 A
30 A
Boost Switch
Boost Diode
650 V
FWD
650 V
Boost Sw. Protection Diode
Thermistor
NTC
Copyright Vincotech
17
18 May. 2018 / Revision 1
10-FY07NBA160RV-M506L78
datasheet
Packaging instruction
Handling instruction
Standard packaging quantity (SPQ) 100
>SPQ
Standard
<SPQ
Sample
Handling instructions for flow 1 packages see vincotech.com website.
Package data
Package data for flow 1 packages see vincotech.com website.
UL recognition and file number
This device is certified according to UL 1557 standard, UL file number E192116. For more information see vincotech.com website.
Document No.:
Date:
Modification:
Pages
10-FY07NBA160RV-M506L78-D1-14
18 May. 2018
DISCLAIMER
The information, specifications, procedures, methods and recommendations herein (together “information”) are presented by Vincotech to
reader in good faith, are believed to be accurate and reliable, but may well be incomplete and/or not applicable to all conditions or situations
that may exist or occur. Vincotech reserves the right to make any changes without further notice to any products to improve reliability,
function or design. No representation, guarantee or warranty is made to reader as to the accuracy, reliability or completeness of said
information or that the application or use of any of the same will avoid hazards, accidents, losses, damages or injury of any kind to persons
or property or that the same will not infringe third parties rights or give desired results. It is reader’s sole responsibility to test and determine
the suitability of the information and the product for reader’s intended use.
LIFE SUPPORT POLICY
Vincotech products are not authorised for use as critical components in life support devices or systems without the express written approval
of Vincotech.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or
sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in labelling can be
reasonably expected to result in significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause
the failure of the life support device or system, or to affect its safety or effectiveness.
Copyright Vincotech
18
18 May. 2018 / Revision 1
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