US5501BMA8 [UPI]
Dual Operational Amplifiers;
| 型号： | US5501BMA8 |
| 厂家： | 
uPI Semiconductor Corp. |
| 描述： | Dual Operational Amplifiers |
| 文件： | 总10页 (文件大小：154K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
uS5501
Dual Operational Amplifiers
with Rail-to-Rail Outputs
Features
General Description
The uS5501 contains two independent, high gain, internally Wide Input Voltage Rage ~ 13.2V
frequency compensated operational amplifiers with rail-to-
rail output swing. The uS5501 operates with single power
Low Operation Current :
supply over a wide range of voltage (2.7V ~ 13.2V) with
very low bias current.
600uA Typical for FN2x2-8L & SOT23-8L
1200uA Typfor SOP-14L
Other features include a common-mode input voltage range,
1MHz unity-gain bandwidth, and 1V/us slew rate. The
uS5501 is available in WDFN2x2-8L, SOT23-8L and SOP-
14L packages.
Large DC Voltage Gain: 100dB
Rail-to-Rail utput wing
150mV ~ VC- 150mV @ 10kΩ
Space-saving packages and low operation current make
the uS5501 ideal for portable electronic devices. It also
allows the designer to place the device close to the signal
source to reduce noise pickup and increase signal integrity.
No Cror Distortion
Short uit rotected Outputs
Trifferential Input Stage
Ordering Information
w Input Bias Currents
Industrial Temperature Range
WN2x2-8L, SOT23-8L, or SOP-14L Packages
RoHS Compliant and Halogen Free
Order Number Package Type
uS5501PDN8 WDFN2x2-8L
Top Marking
DL
uS5501BMA8
uS5501ASAC
SOT23-8L
SOP-14L
N23B
uS5501AC
Applications
Note: uPI products are compatible with the current PC/
JEDEC J-STD-020 requirement. They are halogen-e,
Active Filters
RoHS compliant and 100% matte tin (Sn) plating that are General Purpose Low Voltage Applications
suitable for use in SnPb or Pb-free soldering ps.
General Purpose Portable Devices
Low-Voltage Distributed Power Supplies
Pin Configuration
OUT1
IN1-
VCC
OUT2
IN2-
1
2
3
4
7
6
5
OUT1
IN1-
1
2
3
4
5
6
7
14
13
12
11
10
9
OUT4
IN4-
GND
IN
IN1+
VCC
IN2+
IN2-
IN4+
GND
IN3+
IN3-
IN2+
uS5501BMA8
UT1 1
- 2
8 VCC
7 OUT2
6 IN2-
5 IN2+
OUT2
8
OUT3
GND
IN1+ 3
ND 4
uS5501ASAC
uS5501PDN8
uS5501-DS-F0003, Apr. 2012
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1
uS5501
Typical Application Circuit
VIN
VCC
1/2 of
VREF
uS5501
VREF
VIN
VOUT
VOUT
1/2 of
uS5501
Comparator with Hysteresis
5501 for LDO
unctional Block Diagram
OUT1
OUT4
IN4-
IN1-
CH2
CH4
CH3
OUT1
IN1-
VCC
1+
IN4+
OUT2
IN2-
GND
IN1+
GND
IN2+
IN2-
IN3+
IN3-
WDFN2x2-8L/SOT23-8L
T2
OUT3
SOP-14L
VCC
36uA
IN(-)
)
OUTPUT
30uA
GND
30u
30uA
30uA
Functional Pin Description
Pin Name
tion
Output Channel 1/2/3/4.
OUT1/2/3/4
IN1/2/3/4 -
IN1/2/3/4+
GND
Negve Input for Channel 1/2/3/4.
ositive Input for Channel 1/2/3/4.
Ground.
Supply Input Voltage.
VCC
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uS5501-DS-F0003, Apr. 2012
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uS5501
Absolute Maximum Rating
(Note 1)
Supply Input Voltage, VCC ----------------------------------------------------------------------------------------- -0.3V to +15V
Other Pins to GND ------------------------------------------------------------------------------------------------------------.3V to (VCC + 0.3V)
StorageTemperature Range ------------------------------------------------------------------------------------------------------------65OC to +150OC
JunctionTemperature -------------------------------------------------------------------------------------------------------------------------- 150OC
LeadTemperature (Soldering, 10 sec) --------------------------------------------------------------------------------------------------- 260OC
ESD Rating (Note 2)
HBM (Human Body Mode) ----------------------------------------------------------------------------------------------------------------- 2kV
MM (Machine Mode) ----------------------------------------------------------------------------------------------------------------------- 200V
Thermal Information
Package Thermal Resistance (Note 3)
WDFN2x2-8LθJA ---------------------------------------------------------------------------------------------------------------- 155°C/W
WDFN2x2-8LθJC ----------------------------------------------------------------------------------------------------------------- 20°C/W
SOT23-8L θJA ----------------------------------------------------------------------------------------------------------- 250°C/W
SOT23-8L θJC ------------------------------------------------------------------------------------------------------------ 140°C/W
SOP-14L θJA -------------------------------------------------------------------------------------------------------- 120°C/W
SOP-14L θJC -------------------------------------------------------------------------------------------------------------- 32°C/W
PowerDissipation, PD @ TA = 25°C
WDFN2x2-8L------------------------------------------------------------------------------------------------------------------- 0.65W
SOT23-8L ------------------------------------------------------------------------------------------------------------------- 0.4W
SOP-14L ------------------------------------------------------------------------------------------------------------- 0.83W
ecommended Operation Conditions
(Note 4)
Operating JunctionTemperature Range ------------------------------------------------------------------------------- -40°C to +125°C
OperatingAmbient Temperature Range --------------------------------------------------------------------------------- -40°C to +85°C
Power InputVoltage, VIN ------------------------------------------------------------------------------------------------------- +2.7 to +13.2V
Note 1. Stresses listed as the above “ Absoluum Ratings” may cause permanent damage to the device.
These are for stress ratings. Functionn of the device at these or any other conditions beyond those
indicated in the operational sectons of tecifications is not implied. Exposure to absolute maximum
rating conditions for extendeperiods may remain possibility to affect device reliability.
Note 2. Devices are ESDsensitiveandling praution recommended.
Note 3. θJA is measured in the naturaonvectn at TA = 25°C on a low effective thermal conductivity test board of
JEDEC 51-3 thermal measurement standard.
Note 4. The device is not guaranteed to function outside its operating conditions.
uS5501-DS-F0003, Apr. 2012
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uS5501
Electrical Characteristics
(PVCC = VCC = 12.0V, TA = 25OC, unless otherwise specified)
Parameter
Symbol
Test Conditions
Min
p Max Units
Supply Input
Input Offset Voltage
VIO
-
--
5
6
mV
Averaged Temperature
Coefficient of Input Offset Voltage
--
uV/OC
Input Bias Current
I
--
--
15
5
250
50
--
nA
nA
dB
IB
Input Offset Current
I
IO
Common Mode Rejection Ratio
CMRR
PSRR
V
CM = 0 to 4V
50
85
VCC = 2.7V to 13.2V, VOUT = 1V,
V
Power Supply Rejection Ratio
Output Swing
50
80
--
dB
CM = 1V
High level, VCC - VOUT, 22.5
Low level, 2kΩ to V
--
--
--
--
500
120
150
150
600
300
200
180
VOUT
mV
High level, VCC - Vto 2.5V
Low level, 10kΩ to
Large Signal Differential Voltage
Gain
AVD
RL = 2k
15
100
--
V/mV
mA
Sourcing, VOUT 0V
Sinking= VCC
10
30
20
40
--
--
Output Short Circuit Current
Supply Current
IOUT_S
for pakages WDFN2x2-8L and
SOT23
--
600
800
ICC
uA
fkage SOP-14L
pF
--
--
--
1200 1600
Unity Gain Bandwidth
Slew Rate
B1
1
1
--
--
MHz
V/us
R
4
uS5501-DS-F0003, Apr. 2012
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uS5501
Typical Operation Characteristics
Voltage Follower Pulse Response
Voltage Follwer Pulse Response
OUT (1V/Div)
OUT (10mV
IN (1V/Div)
IN (2V/Div)
Time (4us/Div)
Time (2us/Div)
(Small Signal)
Open Loop Frequency Response
Supply Current
100
90
80
70
60
50
40
30
20
10
0
1.
0.
120OC
0.6
0.4
25OC
-40OC
0.2
0.0
0.1
1.0
10.0
100.0
1000.0 .0
0
3
6
9
12
15
Frequency (z)
VCC = 1
Supply Voltage (V)
Output Characteristics rrent Srcing
Output Characteristics Current Sinking
12
10
8
12
10
8
6
6
4
4
2
2
0
0
0.001
0.01
0.1
1
10
100
0.01
0.1
1
10
100
Sourceing Currrent (mA)
VCC = 12V
Sinking Currrent (mA)
VCC = 12V
uS5501-DS-F0003, Apr. 2012
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uS5501
Typical Operation Characteristics
PSRR VS Frequency
Large Signal Frequency Response
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
14
12
10
8
6
4
2
0
0
1
10
100
1000
1
10
100
1000
Frequency (kHz)
Frequency (KHz)
VCC = 12V
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uS5501-DS-F0003, Apr. 2012
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uS5501
Package Information
WDFN2x2-8L Package
1.90 - 2.10
1.10 - 1.40
0.20 - 0.50
5
8
4
1
0.50 BSC
0.18 - 0.30
0 - 1.40
0.70 - 0.80
0.20 REF
0.00 - 0.0
0SC
0.18 - 0.30
Recommended Solder Pitch and Dimensions
Note
1.Package Outline UnitDescription:
BSC: Basic. Represents theoretical eact dimen or dimension target
MIN: Minimum dimension specifie
MAX: Maximum dimension specd.
REF: Reference. Represents dimsion for rerence use only. This value is not a device specification.
TYP. Typical. Provided as a general e. is value is not a device specification.
2.Dimensions in Millimeters.
3.Drawing not to scale.
4.These dimensions do not ince mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm.
uS5501-DS-F0003, Apr. 2012
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uS5501
Package Information
SOT23-8L Package
0.45 ± 0.05
0.65
±
0.05
2.80 - 3.00
0.65 BSC
0.22 - 0.38
Recommended Solder Pad Layout
1.4AX
0.08 - 0.22
0.00 - 0.15
1.95 BSC
0.30 - 0.60
Note
1.Package Outline UnitDescription:
BSC: Basic. Represents theoretical eact dimeon or dimension target
MIN: Minimum dimension specifie
MAX: Maximum dimension specd.
REF: Reference. Represents dimsion for rerence use only. This value is not a device specification.
TYP. Typical. Provided as a general e. is value is not a device specification.
2.Dimensions in Millimeters.
3.Drawing not to scale.
4.These dimensions do not ince mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm.
8
uS5501-DS-F0003, Apr. 2012
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uS5501
Package Information
SOP-14L Package
0.70 ± 0.10
1.27 ± 0.10
8.53 - 8.75
1.27 BSC
0.33 - 0.51
Recommended Solder Pad Layout
0.19 - 0.25
1.35 - 1.75
0.10 - 0.25
0.40 - 1.27
7.62 BSC
Note
1.Package Outline UnitDescription:
BSC: Basic. Represents theoretical eact dimen or dimension target
MIN: Minimum dimension specifie
MAX: Maximum dimension specd.
REF: Reference. Represents dimsion for rerence use only. This value is not a device specification.
TYP. Typical. Provided as a general e. is value is not a device specification.
2.Dimensions in Millimeters.
3.Drawing not to scale.
4.These dimensions do not ince mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm.
uS5501-DS-F0003, Apr. 2012
www.upi-semi.com
9
uS5501
ImportantNotice
uPI and its subsidiaries reserve the right to make corrections, modifications, enhancements, improvements, and other cges to its products
and services at any time and to discontinue any product or service without notice. Customers should obtailatest relevant information
before placing orders and should verify that such information is current and complete.
uPI products are sold subject to the terms and conditions of sale supplied at the time of order acknowledmeever, no responsibility
is assumed by uPI or its subsidiaries for its use; nor for any infringements of patents or other righof third paich may result from its
use. No license is granted by implication or otherwise under any patent or patent rights of uPI or its bsidiarie
COPYRIGHT (C) 2009, UPI SEMICONDUCTOR CORP.
uPI Semiconductor Corp.
Sales Branch Office
uPI Semiconductor Cor
Headquarter
12F-5,No. 408, Ruiguang Rd. NeihuDistrict,
Taipei Taiwan, R.O.C.
TEL : 886.2.8751.2062 FAX : 886.2.8751.5064
9F.,No.5, Taiyuan 1st St. Zbei City,
Hsinchu Taiwan, R..
TEL : 886.3.560.1666 FAX : 886.3.560.1888
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uS5501-DS-F0003, Apr. 2012
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