US5681KSEAAA-000RE [MELEXIS]
Unipolar Hall Switch â High Sensitivity;
| 型号： | US5681KSEAAA-000RE |
| 厂家： | 
Melexis Microelectronic Systems |
| 描述： | Unipolar Hall Switch â High Sensitivity |
| 文件： | 总11页 (文件大小：719K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
US5681
Unipolar Hall Switch – High Sensitivity
Features and Benefits
Application Examples
Wide operating voltage range from 3.5V to 24V
High sensitivity
Automotive, Consumer and Industrial
Solid-state switch
CMOS technology
Interrupter
Chopper-stabilized amplifier stage
Low current consumption
Current detector
Proximity detection
Open drain output
Thin SOT23 3L RoHS Compliant package
Ordering Information
Product Code
US5681
Temperature
Code
E, K
Package Code
Option Code
Packing Form
Code
RE
SE
AAA-000
Legend:
Temperature Code:
Package Code:
Option Code:
E(-40°C to 85°C) K(-40°C to 125°C)
SE =TSOT-23L
AAA-000
Packing Form:
Ordering example:
RE=Reel
US5681ESE-AAA-000-RE
1 Functional Diagram
2 General Description
The Melexis US5681 is a unipolar Hall-effect
switch designed in mixed signal CMOS
technology.
VDD
OUT
Voltage
Regulator
Oscillator and
ESD protection
ESD protection
Bias
The device integrates a voltage regulator, Hall
sensor with advanced Correlated Double
Sampling (CDS) offset cancellation system and an
open-drain output driver, all in a single package.
DIG
Temperature
compensation
reference
POR
DAMP
DIDO
COMP
Thanks to its wide operating voltage range and
temperature range, it is suitable for use in
automotive and solid state switch applications.
Hall
Plate
The device is delivered in a Thin Small Outline
Transistor (TSOT) 3-lead RoHS compliant
package.
GND
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Unipolar Hall Switch – High Sensitivity
Table of Contents
1 Functional Diagram ........................................................................................................ 1
2 General Description........................................................................................................ 1
3 Glossary of Terms .......................................................................................................... 3
4 Absolute Maximum Ratings........................................................................................... 3
5 Pin Definitions and Descriptions................................................................................... 3
6 General Electrical Specifications .................................................................................. 4
7 Magnetic Specifications ................................................................................................. 4
8 Output Behaviour versus Magnetic Pole ...................................................................... 5
9 Detailed General Description......................................................................................... 5
10 Unique Features............................................................................................................ 5
11 Performance Graphs .................................................................................................... 6
12 Test Conditions............................................................................................................. 7
13 Application Information................................................................................................ 8
13.1 Typical Three-Wire Application Circuit ...................................................................... 8
13.2 Two-Wire Circuit ....................................................................................................... 8
13.3 Automotive and Harsh, Noisy Environments Three-Wire Circuit............................... 8
14 Application Comments................................................................................................. 8
15 Standard information regarding manufacturability of Melexis products with
different soldering processes........................................................................................... 9
16 ESD Precautions........................................................................................................... 9
17 SE Package Information (TSOT-3L)........................................................................... 10
18 Disclaimer.................................................................................................................... 11
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Unipolar Hall Switch – High Sensitivity
3 Glossary of Terms
MilliTesla (mT), Gauss
Units of magnetic flux density:
1mT = 10 Gauss
RoHS
TSOT
Restriction of Hazardous Substances
Thin Small Outline Transistor (TSOT package) – also referred with the Melexis
package code “SE”
ESD
Electro-Static Discharge
4 Absolute Maximum Ratings
Parameter
Symbol
VDD
IDD
Value
28
Units
V
Supply Voltage
Supply Current
50
mA
V
Output Voltage
VOUT
IOUT
TA
28
Output Current
50
mA
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature
Table 1: Absolute maximum ratings
-40 to 125
-50 to 150
165
C
C
C
TS
TJ
Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute-maximum-
rated conditions for extended periods may affect device reliability.
5 Pin Definitions and Descriptions
Pin №
Name
VDD
Type
Function
1
2
3
Supply
Output
Ground
Supply Voltage pin
Open Drain Output pin
Ground pin
OUT
GND
Table 2: Pin definitions and descriptions
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Unipolar Hall Switch – High Sensitivity
6 General Electrical Specifications
DC Operating Parameters TA = 25oC, VDD = 12V (unless otherwise specified)
Parameter
Supply Voltage
Symbol
VDD
IDD
Test Conditions
Operating
Min
3.5
Typ
Max
24
Units
V
Supply Current
B < BRP
0.5
2.5
0.3
5
mA
V
Output Saturation Voltage
Output Leakage Current
Output Rise Time
VDSon
IOFF
tr
IOUT = 20mA, B > BOP
B < BRP, VOUT = 24V
RL = 1k, CL = 20pF
RL = 1k, CL = 20pF
0.5
10
0.01
0.25
0.25
25
A
s
s
Output Fall Time
tf
Output Update Frequency
Power-On Time1
FOUT
tON
KHz
100
s
Package Thermal Resistance
Table 3: Electrical specifications
RTH
Single layer (1S) Jedec board
301
°C/W
1 The Power-On Time represents the time from reaching the power-on reset level to the first refresh of the
output (first valid output state).Value according simulation only, not subject to production test.
7 Magnetic Specifications
DC Operating Parameters TA = 25oC, VDD = 12V (unless otherwise specified)
Parameter
Operating Point
Release Point
Hysteresis
Symbol
BOP
BRP
Test Conditions
Min
3.8
2
Typ
5.5
3.5
2
Max
7.2
5
Units
mT
mT
BHYST
1.5
2.7
mT
Table 4: Magnetic specifications
DC Operating Parameters TA = -40oC to 125oC (K-version), TA = -40 oC to 85 oC (E-version), VDD = 12V
Parameter
Operating Point
Release Point
Hysteresis
Symbol
BOP
BRP
Test Conditions
Min
3.4
1.8
1
Typ
Max
7.7
5.4
Units
mT
mT
BHYST
2.8
mT
Table 5: Magnetic specifications
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Unipolar Hall Switch – High Sensitivity
8 Output Behaviour versus Magnetic Pole
DC Operating Parameters TA = -40oC to 125oC, VDD = 3.5V to 24V (unless otherwise specified)
Parameter
South pole
Test Conditions
B > BOP
OUT
Low
Null or weak magnetic field
North pole
B 0 or B < BRP
B > BOP
High
High
Table 6: Output behaviour versus magnetic pole
OUT = low (VDSon
)
9 Detailed General Description
Based on mixed signal CMOS technology, Melexis US5681 is a Hall-effect device with high magnetic
sensitivity. Its sensitivity enables high accuracy in position sensing by the use of small air gap.
The Correlated Double Sampling (CDS) technique suppresses the offset generally observed with Hall
sensors and amplifiers. The CMOS technology makes this advanced technique possible and contributes to
smaller chip size and lower current consumption than bipolar technology. The small chip size is also an
important factor to minimize the effect of physical stress.
This combination results in more accurate and stable magnetic characteristics, and enables faster and more
precise design.
The wide operating voltage from 3.5V to 24V and low current consumption make this device especially
suitable for solid state switch applications.
The output signal is open-drain type. Such output allows simple connectivity with TTL or CMOS logic by using
a pull-up resistor tied between a pull-up voltage and the device output.
10 Unique Features
The US5681 exhibits unipolar magnetic switching characteristics. Therefore, it operates only with one
magnetic pole.
Output level
The US5681 device is south pole active:
Applying a south magnetic pole greater than BOP facing the
OUT = High
branded side of the package switches the output low.
Removing the magnetic field (B0) switches the output high.
The use of the opposite magnetic pole facing the branded side
does not affect the output state.
OUT = Low
0mT
Flux density
BRP
BOP
Unipolar switch characteristic
A magnetic hysteresis BHYST keeps BOP and BRP separated by a minimal value. This hysteresis prevents
output oscillation near the switching point.
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Unipolar Hall Switch – High Sensitivity
11 Performance Graphs
11.1 Magnetic parameters vs. TA
11.2 Magnetic parameters vs. VDD
11.3 VDSon vs. TA
11.4 VDSon vs. VDD
11.5 IDD vs. TA
11.6 IDD vs. VDD
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Unipolar Hall Switch – High Sensitivity
12 Test Conditions
Note : DUT = Device Under Test
12.1 Supply Current
12.2 Output Saturation Voltage
IDD
OUT
OUT
VDD
VDD
A
DUT
DUT
VDD
VDD
VDSon
V
20mA
3.5 / 24V
GND
GND
Note 1 - The output saturation voltage VDSon is measured
at VDD = 3.5V and VDD = 24V.
Note 1 - The supply current IDD represents the static supply current.
OUT is left open during measurement.
Note 2 - The device is put under magnetic field with B>BOP
.
Note 2 - The device is put under magnetic field with B<BRP
.
12.3 Output Leakage Current
12.4 Magnetic Thresholds
10Kohms
IOFF
VDD
OUT
OUT
VDD
A
DUT
DUT
V
VDD
24V
VDD
GND
GND
Note 1 - BOP is determined by putting the device under magnetic field swept from
BRPmin up to BOPmax until the output is switched on.
Note 1 - The device is put under magnetic field with B<BRP
Note 2 - BRPis determined by putting the device under magnetic field swept from
BOPmax down to BRPmin until the output is switched off.
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Unipolar Hall Switch – High Sensitivity
13 Application Information
13.1 Typical Three-Wire Application Circuit
13.2 Two-Wire Circuit
VDD
IIN
RPU
IOUT
IR
10k
VDD
C1
100nF
VCC
VOUT
OUT
IDD
*
RL
VDD
VSS
VSS
C2
4.7nF
Rb
OUT
13.3 Automotive and Harsh, Noisy Environments
Three-Wire Circuit
Note:
With this circuit, precise ON and OFF
currents can be detected using only
two connecting wires.
R1
D1
100 Ohms
RPU
10k
VDD
VCC
Z1
The resistors RL and Rb can be used
to bias the input current. Refer to the
part specifications for limiting values.
C1
100nF
VOUT
OUT
VSS
C2
4.7nF
BRP
BOP
:
:
IOFF = IR + IDD = VDD/Rb + IDD
ION = IOFF + IOUT = IOFF + VDD/RL
14 Application Comments
For proper operation, a 100nF bypass capacitor should be placed as close as possible to the device between
the VDD and ground pin.
For reverse voltage protection, it is recommended to connect a resistor or a diode in series with the VDD pin.
When using a resistor, three points are important:
- the resistor has to limit the reverse current to 50mA maximum (VCC / R1 50mA)
- the resulting device supply voltage VDD has to be higher than VDD min (VDD = VCC – R1.IDD)
- the resistor has to withstand the power dissipated in reverse voltage condition (PD = VCC2 / R1)
When using a diode, a reverse current cannot flow and the voltage drop is almost constant (0.7V).
Therefore, a 100/0.25W resistor for 5V application and a diode for higher supply voltage are recommended.
Both solutions provide the required reverse voltage protection.
When a weak power supply is used or when the device is intended to be used in noisy environment, it is
recommended that figure 13.3 from the Application Information section is used.
The low-pass filter formed by R1 and C1 and the zener diode Z1 bypass the disturbances or voltage spikes
occurring on the device supply voltage VDD. The diode D1 provides additional reverse voltage protection.
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Unipolar Hall Switch – High Sensitivity
15 Standard information regarding manufacturability of Melexis
products with different soldering processes
Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity
level according to following test methods:
Reflow Soldering SMD’s (Surface Mount Devices)
IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
EN60749-20
Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat
EIA/JEDEC JESD22-B106 and EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Iron Soldering THD’s (Through Hole Devices)
EN60749-15
Resistance to soldering temperature for through-hole mounted devices
Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)
EIA/JEDEC JESD22-B102 and EN60749-21
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification tests
have to be agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of
adhesive strength between device and board.
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more
information on qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of
the use of certain Hazardous Substances) please visit the quality page on our website:
http://www.melexis.com/quality.aspx
16 ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
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Unipolar Hall Switch – High Sensitivity
17 SE Package Information (TSOT-3L)
2.75 BSC
1.10 MAX
0.88+-0.023
SEATING PLANE
0.075 +-0.05250
1.60 BSC
Notes:
see note 2
1. All dimensions are in millimeters
2. Outermost plastic extreme width does not include mold flash or
protrusions. Mold flash and protrusions shall not exceed
0.15mm per side.
3. Outermost plastic extreme length does not include mold flash
or protrusions. Mold flash and protrusions shall not exceed
0.25mm per side.
4. The lead width dimension does not include dambar protrusion.
Allowable dambar protrusion shall be 0.07mm total in excess
of the lead width dimension at maximum material condition.
5. Dimension is the length of terminal for soldering to a substrate.
6. Dimension on SECTION B-B’ applies to the flat section of the
lead between 0.08mm and 0.15mm from the lead tip.
0.50 BSC
TOP VIEW
7. Formed lead shall be planar with respect to one another with
0.076mm at seating plane.
SIDE VIEW
Marking:
12° REF.
TYP.
BASE METAL
WITH PLATING
Top side : 6yww
6 = part number (US5681)
y = last digit of year
ww = calendar week
0.10 R.
MIN.
~
0.10 R.
MIN.
B’
0.35 +-0.1050
B
4°+/-4
SEATING PLANE
0.40+/-0.10
0.30
0.45
see note 5
0.575 REF.
SECTION B-B’
see note 6
END VIEW
Hall plate location
1.417+/-0.05
Notes:
1. All dimensions are in millimeters
0.275 TYP
END VIEW
Package line
TOP VIEW
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Unipolar Hall Switch – High Sensitivity
18 Disclaimer
Devices sold by Melexis are covered by the warranty and patent indemnification provisions appearing in its
Term of Sale. Melexis makes no warranty, express, statutory, implied, or by description regarding the
information set forth herein or regarding the freedom of the described devices from patent infringement.
Melexis reserves the right to change specifications and prices at any time and without notice. Therefore, prior
to designing this product into a system, it is necessary to check with Melexis for current information. This
product is intended for use in normal commercial applications. Applications requiring extended temperature
range, unusual environmental requirements, or high reliability applications, such as military, medical life-
support or life-sustaining equipment are specifically not recommended without additional processing by
Melexis for each application.
The information furnished by Melexis is believed to be correct and accurate. However, Melexis shall not be
liable to recipient or any third party for any damages, including but not limited to personal injury, property
damage, loss of profits, loss of use, interrupt of business or indirect, special incidental or consequential
damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical
data herein. No obligation or liability to recipient or any third party shall arise or flow out of Melexis’ rendering
of technical or other services.
© 2014 Melexis NV. All rights reserved.
For the latest version of this document, go to our website at
www.melexis.com
Or for additional information contact Melexis Direct:
Europe, Africa:
Phone: +32 1367 0495
Americas:
Asia:
Phone: +1 248-306-5400
E-mail: sales_usa@melexis.com
Phone: +32 1367 0495
E-mail: sales_asia@melexis.com
E-mail: sales_europe@melexis.com
ISO/TS 16949 and ISO14001 Certified
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