TPCP8103-H [TOSHIBA]

TOSHIBA Field Effect Transistor Silicon P Channel MOS Type (Ultra High speed U-MOSIII); 东芝场效应晶体管的硅P沟道MOS型(超高速U- MOSIII )
TPCP8103-H
型号: TPCP8103-H
厂家: TOSHIBA    TOSHIBA
描述:

TOSHIBA Field Effect Transistor Silicon P Channel MOS Type (Ultra High speed U-MOSIII)
东芝场效应晶体管的硅P沟道MOS型(超高速U- MOSIII )

晶体 小信号场效应晶体管 开关 光电二极管 PC
文件: 总4页 (文件大小:213K)
中文:  中文翻译
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TPCP8103-H  
TOSHIBA Field Effect Transistor Silicon P Channel MOS Type (Ultra High speed U-MOSIII)  
TPCP8103-H  
High Efficiency DCDC Converter Applications  
Unit: mm  
Notebook PC Applications  
Portable Equipment Applications  
CCFL Inverter Applications  
0.33±0.05  
A
M
0.05  
5
8
0.475  
1
4
B
Small footprint due to a small and thin package  
High speed switching  
B
M
0.05  
0.65  
2.9±0.1  
A
Small gate charge: Q  
= 6.5 nC (typ.)  
SW  
0.8±0.05  
Low drain-source ON-resistance: R  
= 31 m(typ.)  
DS (ON)  
S
0.025  
+0.1  
S
0.28  
0.17±0.02  
-0.11  
High forward transfer admittance: |Y | = 10 S (typ.)  
fs  
Low leakage current: I  
= 10 μA (max) (V  
= -40V)  
+0.13  
-0.12  
DSS  
DS  
1.12  
1.12  
Enhancement mode: V = -0.8 to -2.0 V (V  
= -10 V, I = -1mA)  
D
th  
DS  
+0.13  
-0.12  
+0.1  
-0.11  
0.28  
1Source  
2Source  
3Source  
4Gate  
5Drain  
6Drain  
7Drain  
8Drain  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristic  
Drain-source voltage  
Symbol  
Rating  
Unit  
JEDEC  
JEITA  
V
-40  
-40  
V
V
V
DSS  
V
Drain-gate voltage (R  
Gate-source voltage  
= 20 kΩ)  
DGR  
GS  
V
±20  
-4.8  
-19.2  
GSS  
TOSHIBA  
2-3V1K  
DC  
(Note 1)  
I
D
Weight: 0.017 g (typ.)  
Drain current  
A
Pulsed (Note 1)  
I
DP  
Circuit Configuration  
Drain power dissipation  
Drain power dissipation  
(t = 5 s)  
(Note 2a)  
(t = 5 s)  
P
1.68  
0.84  
W
W
D
D
8
7
5
6
P
(Note 2b)  
Single-pulse avalanche energy  
(Note 3)  
E
10.7  
-4.8  
0.09  
mJ  
A
AS  
Avalanche current  
I
AR  
Repetitive avalanche energy  
E
mJ  
AR  
(Tc=25) (Note 4)  
T
T
150  
°C  
°C  
Channel temperature  
ch  
2
1
4
3
55 to 150  
Storage temperature range  
stg  
8
7
6
5
Note: For Notes 1 to 4, refer to the next page.  
Using continuously under heavy loads (e.g. the application of high  
temperature/current/voltage and the significant change in temperature,  
etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.)  
are within the absolute maximum ratings. Please design the appropriate  
reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/Derating Concept and Methods) and individual  
reliability data (i.e. reliability test report and estimated failure rate, etc).  
8103H  
1
2
3
4
This transistor is an electrostatic-sensitive device. Handle with care.  
Lot No.  
1
2007-06-22  
TPCP8103-H  
Thermal Characteristics  
Characteristic  
Symbol  
Max  
74.4  
Unit  
Thermal resistance, channel to ambient  
R
°C/W  
th (ch-a)  
th (ch-a)  
(t = 5 s)  
(Note 2a)  
Thermal resistance, channel to ambient  
R
148.8  
°C/W  
(t = 5 s)  
(Note 2b)  
Note 1: The channel temperature should not exceed 150°C during use.  
Note 2: (a) Device mounted on a glass-epoxy board (a)  
(b) Device mounted on a glass-epoxy board (b)  
FR-4  
FR-4  
25.4 × 25.4 × 0.8  
(Unit: mm)  
25.4 × 25.4 × 0.8  
(Unit: mm)  
(a)  
(b)  
Note 3:  
V
DD  
= -24 V, T = 25°C (initial), L = 0.5 mH, R = 25 Ω, I  
= -4.8A  
AR  
ch  
G
Note 4: Repetitive rating: pulse width limited by max channel temperature  
Note 5:  
* Weekly code: (Three digits)  
Week of manufacture  
(01 for first week of the year, continuing up to 52 or 53)  
Year of manufacture  
(The last digit of the calendar year)  
2
2007-06-22  
TPCP8103-H  
Electrical Characteristics (Ta = 25°C)  
Characteristic  
Gate leakage current  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
I
V
V
= ±16 V, V  
= 0 V  
= 0 V  
±10  
-10  
μA  
μA  
GSS  
GS  
DS  
DS  
Drain cutoff current  
I
= -40 V, V  
DSS  
GS  
V
V
I
I
= -10 mA, V  
= -10 mA, V  
= 0 V  
-40  
-20  
-0.8  
(BR) DSS  
(BR) DSX  
D
D
GS  
GS  
Drain-source breakdown voltage  
Gate threshold voltage  
V
V
= −20 V  
V
V
V
V
V
= -10 V, I = -1 mA  
-2.0  
54  
40  
th  
DS  
GS  
GS  
DS  
D
= -4.5 V, I = -2.4 A  
42  
D
Drain-source ON-resistance  
R
mΩ  
S
DS (ON)  
= -10 V, I = -2.4 A  
31  
D
Forward transfer admittance  
Input capacitance  
|Y |  
fs  
= -10 V, I = -2.4 A  
5
10  
D
C
C
800  
115  
165  
iss  
V
= -10 V, V  
= 0 V, f = 1 MHz  
GS  
pF  
Reverse transfer capacitance  
Output capacitance  
DS  
rss  
C
oss  
Rise time  
t
I
=−2.4A  
D
6.5  
12.5  
9
r
V
GS  
10 V  
出力  
Turn-on time  
Switching time  
t
on  
ns  
Fall time  
t
f
V
20 V  
DD  
<
Duty 1%, t = 10 μs  
=
w
Turn-off time  
t
37  
19  
11  
off  
V
-32 V, V  
= -10 V,  
= -5 V,  
DD  
GS  
GS  
I
= -4.8 A  
D
Total gate charge  
Q
g
(gate-source plus gate-drain)  
V
D
-32 V, V  
DD  
= -4.8 A  
I
nC  
Gate-source charge 1  
Gate-drain (“Miller”) charge  
Gate switch charge  
Q
Q
1.5  
5.5  
6.5  
gs1  
V
-32 V, V  
= -10 V,  
DD  
= -4.8 A  
GS  
Q
gd  
I
D
SW  
Source-Drain Ratings and Characteristics (Ta = 25°C)  
Characteristic  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
Drain reverse current  
Forward voltage (diode)  
Pulse (Note 1)  
I
-19.2  
1.2  
A
V
DRP  
V
I
= −4.8 A, V  
= 0 V  
GS  
DSF  
DR  
3
2007-06-22  
TPCP8103-H  
RESTRICTIONS ON PRODUCT USE  
20070701-EN  
The information contained herein is subject to change without notice.  
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor  
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical  
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of  
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of  
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.  
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as  
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and  
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability  
Handbook” etc.  
The TOSHIBA products listed in this document are intended for usage in general electronics applications  
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,  
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires  
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or  
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or  
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,  
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his  
document shall be made at the customer’s own risk.  
The products described in this document shall not be used or embedded to any downstream products of which  
manufacture, use and/or sale are prohibited under any applicable laws and regulations.  
Please contact your sales representative for product-by-product details in this document regarding RoHS  
compatibility. Please use these products in this document in compliance with all applicable laws and regulations  
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses  
occurring as a result of noncompliance with applicable laws and regulations.  
4
2007-06-22  

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