TLP290(BLL-TPE(T [TOSHIBA]
Transistor Output Optocoupler;
| 型号： | TLP290(BLL-TPE(T |
| 厂家： | 
TOSHIBA |
| 描述： | Transistor Output Optocoupler |
| 文件： | 总10页 (文件大小：275K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TLP290
TOSHIBA Photocoupler GaAs Ired & Photo−Transistor
TLP290
Programmable Controllers
Unit: mm
AC/DC−Input Module
Hybrid ICs
TLP290 consist of photo transistor, optically coupled to two gallium arsenide
infrared emitting diode connected inverse parallel, and can operate directly
by AC input current
Since TLP290 are guaranteed wide operating temperature (Ta=-55 to 110 ˚C)
and high isolation voltage (3750Vrms), it’s suitable for high-density surface
mounting applications such as programmable controllers and hybrid ICs.
•
•
Collector-Emitter voltage : 80 V (min)
Current transfer ratio
Rank GB
: 50% (min)
: 100% (min)
•
•
Isolation voltage
: 3750 Vrms (min)
TOSHIBA
11-3C1
Guaranteed performance over -55 to 110 ˚C
Weight: 0.05 g (typ.)
Pin Configuration
•
•
•
UL(Under application):
cUL(Under application):
UL1577
CSA Component Acceptance Service No.5A
TLP290
SEMKO(Under application):EN 60065: 2002,
EN 60950-1: 2001, EN 60335-1: 2002
BS EN 60065: 2002,
BS EN 60950-1: 2006
1
2
4
3
•
•
BSI (Under application):
Option (V4)
VDE (Under application): EN60747-5-2
1: Anode
Cathode
2: Cathode
Anode
3: Emitter
4: Collector
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2012-02-16
TLP290
Current Transfer Ratio (Unless otherwise specified, Ta = 25°C)
Current Transfer Ration (%)
(I / I )
C
F
Classification
(Note1)
TYPE
Marking of Classification
I
= 5 mA, V = 5 V, Ta = 25°C
CE
F
Min
50
Max
400
150
300
400
400
Blank
Blank, YE, GR, B, GB
Rank Y
50
YE
GR
B
TLP290
Rank GR
Rank BLL
Rank GB
100
200
100
GB
Note1: Ex. rank GB: TLP290(GB,E
Note
Application type name for certification test, please use standard product type name, i.e.
TLP290(GB,E: TLP290
Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25°C)
Note
Rating
Characteristic
Symbol
Unit
R.M.S. forward current
I
±50
-1.5
mA
F(RMS)
Input forward current derating (Ta ≥ 90°C)
Input forward current (pulsed)
Input power dissipation
ΔI /ΔTa
mA /°C
A
F
I
(Note 2)
±1
FP
P
100
mW
mW/°C
°C
D
Input power dissipation derating (Ta ≥ 90°C)
Junction temperature
ΔP /ΔTa
-3.0
D
T
j
125
Collector−emitter voltage
V
V
80
V
CEO
ECO
Emitter−collector voltage
7
V
Collector current
I
50
mA
C
Collector power dissipation
P
150
mW
mW /°C
°C
C
Collector power dissipation derating (Ta ≥ 25°C)
Junction temperature
ΔP /ΔTa
−1.5
125
C
T
j
Operating temperature range
Storage temperature range
T
−55 to 110
−55 to 125
260 (10s)
200
°C
opr
T
°C
stg
Lead soldering temperature
T
°C
sol
Total package power dissipation
Total package power dissipation derating (Ta ≥ 25°C)
Isolation voltage
P
mW
mW /°C
Vrms
T
ΔP /ΔTa
−2.0
3750
T
BV
(Note3)
S
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note2: Pulse width ≤ 100μs, frequency 100Hz
Note3: AC, 1min., R.H.≤ 60%, Device considered a two terminal device: LED side pins shorted together and
detector side pins shorted together.
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2012-02-16
TLP290
Electrical Characteristics (Unless otherwise specified, Ta = 25°C)
Characteristic
Symbol
Test Condition
= ±10 mA
F
Min
Typ
Max
Unit
Input forward voltage
V
I
1.1
―
80
7
1.25
60
1.4
—
V
pF
V
F
Input capacitance
C
V = 0, f = 1 MHz
T
Collector−emitter breakdown voltage
Emitter−collector breakdown voltage
V
V
I
I
= 0.5 mA
= 0.1 mA
―
—
(BR) CEO
(BR) ECO
C
E
―
—
V
V
V
= 48 V,
―
―
―
0.01
2
0.08
50
μA
μA
pF
CE
CE
Dark current
I
CEO
= 48 V, Ta = 85°C
Collector-emitter capacitance
C
V = 0, f = 1 MHz
10
―
CE
Coupled Electrical Characteristics (Unless otherwise specified, Ta = 25°C)
Characteristic
Symbol
Test Condition
MIn
Typ.
Max
Unit
%
50
100
—
—
—
60
—
—
0.2
—
—
400
400
—
I
= ±5 mA, V
= 5 V
F
CE
Current transfer ratio
I / I
C F
Rank GB
Rank GB
IF = ±1 mA, V
= 0.4 V
CE
Saturated CTR
I
/ I
F (sat)
%
V
C
V
30
—
—
I
I
= 2.4 mA, I = ±8 mA
0.3
—
C
C
F
Collector−emitter
saturation voltage
—
CE (sat)
= 0.2 mA, I = ±1 mA
F
Rank GB
—
0.3
10
Off−state collector current
I
V
= ± 0.7 V, V = 48 V
CE
—
μA
C(off)
F
I
(I = −5 mA) / I (I = 5 mA)
C
F
C
F
Collector current ratio
I
0.33
—
3
—
C (ratio)
(Fig.1)
Fig.1: Collector current ratio test circuit
IC1
IF1
IF2
VCE
I
(I = I ,V
(I = I ,V
C1 F F1 CE
= 5V)
= 5V)
C2 F F2 CE
IC2
I
=
C(ratio)
I
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2012-02-16
TLP290
Isolation Characteristics (Unless otherwise specified, Ta = 25°C)
Characteristic
Symbol
Test Condition
= 0V, f = 1 MHz
Min
—
Typ.
0.8
Max
Unit
Total capacitance (input to output)
Isolation resistance
C
R
V
V
—
—
—
—
—
pF
S
S
S
12
14
= 500 V, R.H.≤ 60%
1×10
3750
—
10
Ω
S
AC, 1 minute
—
V
rms
Isolation voltage
BV
S
AC, 1 second, in oil
DC, 1 minute, in oil
10000
10000
—
V
dc
Switching Characteristics (Unless otherwise specified, Ta = 25°C)
Characteristic
Symbol
Test Condition
Min
Typ.
Max
Unit
Rise time
t
—
—
—
—
—
—
—
4
7
—
—
—
—
—
—
—
r
Fall time
t
f
V
R
= 10 V, I = 2 mA
C
= 100 Ω
CC
L
μs
Turn−on time
Turn−off time
Turn−on time
Storage time
Turn−off time
t
t
t
7
on
off
on
7
2
R
V
= 1.9 kΩ
= 5 V, I = ±16 mA
F
(Fig.2)
L
CC
μs
t
30
60
s
t
off
(Fig. 2): Switching time test circuit
IF
IF
VCC
VCE
tS
RL
VCC
4.5V
0.5V
VCE
toff
ton
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2012-02-16
TLP290
I
- Ta
P
- Ta
F
C
160
140
120
100
80
100
80
60
40
20
0
60
(Note) This curve shows
the maximum limit to the
input forward current.
40
(Note) This curve shows the
maximum limit to the collector
power dissipation.
20
0
-20
0
20
40
60
80 100 120
-20
0
20
40
60
80
100
120
Ambient temperature Ta (˚C)
Ambient temperature
Ta (˚C)
I
- D
I
- V
F F
F P
R
3000
100
Pules width ≤100μs
Ta=25˚C
1000
500
300
10
1
110˚C
85˚C
50˚C
25˚C
0˚C
100
-25˚C
-55˚C
50
30
(Note) This curve shows the
maximum limit to the input
forward current (pulsed).
0.1
10
100
10-1
10-2
10-3
0.6 0.8
1
1.2 1.4 1.6 1.8
(V)
2
Duty cycle ratio
D
Input forward voltage
V
F
R
∆ V / ∆ Ta - I
I
– V
F
F
F P
F P
1000
100
10
-3.2
-2.8
-2.4
-2
-1.6
-1.2
-0.8
-0.4
Pulse width ≤10μs
Repeative frequency=100Hz
Ta=25°C
1
0.1
1
10
100
0.6
1
1.4
1.8
2.2
2.6
3
3.4
Input forward current
I
(mA)
Input forward voltage (pulsed) VFP (V)
F
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
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2012-02-16
TLP290
I
- V
I
- V
C
C E
C
C E
50
40
30
20
10
0
30
25
20
15
10
5
Ta=25˚C
Ta=25˚C
P
( m a x )
C
5 0
3 0
2 0
5 0
3 0
1 5
2 0
1 5
1 0
1 0
5
I
= 2 m A
F
I
= 5 m A
F
0
0
2
4
6
8
10
0
0.2
0.4
0.6
0.8
1
Collector-emitter voltage VCE (V)
Collector-emitter voltage VCE (V)
I
- I
I
-Ta
C E O
C
F
10
100
10
1
Ta=25˚C
1
0.1
V
=48V
CE
24V
10V
5V
0.01
0.001
0.0001
V
=10V
=5V
CE
V
CE
V
=0.4V
CE
0.1
0
20
40
60
80
100
120
0.1
1
10
100
Input forward voltage
I
F
(mA)
Ambient temperature Ta (°C)
I
I
- I
C /
F
F
1000
100
10
V
=10V
CE
V
=5V
CE
V
=0.4V
CE
0.1
1
10
F
100
Input forward current
I
(mA)
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
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2012-02-16
TLP290
V
-
Ta
I
– Ta
C E ( s a t )
C
0.28
0.24
0.20
0.16
0.12
0.08
0.04
0.00
100
10
1
25
10
5
1
I =0.5mA
F
I
I
=8mA, I =2.4mA
C
F
=1mA, I =0.2mA
F
C
V
=5V
CE
0.1
-60 -40 -20
0
20 40 60 80 100 120
-60 -40 -20
0
20 40 60 80 100 120
Ambient temperature Ta (°C)
Ambient temperature Ta (°C)
Switching time - R
L
Switching time – Ta
1000
10000
1000
100
10
Ta=25˚C
I
=16mA
F
V
=5V
CC
t
off
100
10
1
t
off
t
s
t
s
t
on
I
=16mA
F
V
=5V
CC
t
on
R =1.9kΩ
L
0.1
1
-60 -40 -20
0
20 40 60 80 100 120
1
10
Load resistance
100
Ambient temperature Ta (°C)
R
L
(kΩ)
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,
unless otherwise noted.
7
2012-02-16
TLP290
Soldering and Storage
1. Soldering
1.1 Soldering
When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as
much as possible by observing the following conditions.
1) Using solder reflow
·Temperature profile example of lead (Pb) solder
(°C)
240
This profile is based on the device’s
maximum heat resistance guaranteed
value.
210
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste
type used by the customer within the
described profile.
160
140
less than 30s
60 to 120s
Time
(s)
·Temperature profile example of using lead (Pb)-free solder
(°C)
This profile is based on the device’s
maximum heat resistance guaranteed
value.
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste
type used by the customer within the
described profile.
260
230
190
180
60 to 120s
30 to 50s
Time
(s)
2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder)
･Please preheat it at 150°C between 60 and 120 seconds.
･Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once.
3) Using a soldering iron
Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin may
be heated at most once.
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2012-02-16
TLP290
2. Storage
1) Avoid storage locations where devices may be exposed to moisture or direct sunlight.
2) Follow the precautions printed on the packing label of the device for transportation and storage.
3) Keep the storage location temperature and humidity within a range of 5°C to 35°C and 45% to 75%,
respectively.
4) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
5) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
6) When restoring devices after removal from their packing, use anti-static containers.
7) Do not allow loads to be applied directly to devices while they are in storage.
8) If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
9
2012-02-16
TLP290
RESTRICTIONS ON PRODUCT USE
•
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•
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR
APPLICATIONS.
•
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
•
•
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
•
•
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
•
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GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or
vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
•
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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2012-02-16
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