TLP290(GB-TP,E) [TOSHIBA]

Optocoupler AC-IN 1-CH Transistor DC-OUT 4-Pin SO T/R;
TLP290(GB-TP,E)
型号: TLP290(GB-TP,E)
厂家: TOSHIBA    TOSHIBA
描述:

Optocoupler AC-IN 1-CH Transistor DC-OUT 4-Pin SO T/R

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TLP290  
TOSHIBA Photocoupler GaAs Ired & Photo-Transistor  
TLP290  
Programmable Controllers  
Unit: mm  
AC/DC-Input Module  
Hybrid ICs  
TLP290 consist of photo transistor, optically coupled to two gallium arsenide  
infrared emitting diodes connected inverse parallel, and can operate directly  
by AC input current  
Since TLP290 is guaranteed wide operating temperature (Ta=-55 to 110 ˚C)  
and high isolation voltage (3750Vrms), it’s suitable for high-density surface  
mounting applications such as programmable controllers and hybrid ICs.  
Collector-Emitter voltage : 80 V (min)  
Current transfer ratio  
Rank GB  
: 50% (min)  
: 100% (min)  
Isolation voltage  
: 3750 Vrms (min)  
TOSHIBA  
11-3C1  
Guaranteed performance over -55 to 110 ˚C  
Weight: 0.05 g (typ.)  
UL recognized  
cUL approved  
: UL1577, File No. E67349  
: CSA Component Acceptance Service No.5A,  
File No. 67349  
Pin Configuration  
TLP290  
SEMKO approved  
:
EN 60065: 2002, Approved no. 1200315  
EN 60950-1: 2001, EN 60335-1: 2002,  
Approved no. 1200315  
1
2
4
3
BSI approved  
Option (V4)  
: BS EN 60065: 2002, Approved no. 9036  
: BS EN 60950-1: 2006, Approved no. 9037  
1: Anode  
Cathode  
2: Cathode  
Anode  
3: Emitter  
4: Collector  
VDE approved: EN 60747-5-5 Certificate, No. 40009347  
Maximum operating insulation voltage: 707 Vpk  
Highest permissible over-voltage: 6000 Vpk  
(Note) When an EN 60747-5-5 approved type is needed,  
please designate the “Option(V4)”  
Construction Mechanical Rating  
Creepage distance  
Clearance  
: 5.0 mm (min)  
: 5.0 mm (min)  
: 0.4 mm (min)  
Insulation thickness  
Start of commercial production  
2012/02  
1
2014-09-08  
TLP290  
Current Transfer Ratio (Unless otherwise specified, Ta = 25°C)  
Current Transfer Ration (%)  
(I / I )  
C
F
Classification  
(Note1)  
TYPE  
Marking of Classification  
I
= 5 mA, V = 5 V, Ta = 25°C  
CE  
F
Min  
50  
Max  
400  
150  
300  
400  
400  
Blank  
Blank, YE, GR, B, GB  
Rank Y  
50  
YE  
GR  
B
TLP290  
Rank GR  
Rank BLL  
Rank GB  
100  
200  
100  
GB  
Note1: Specify both the part number and a rank in this format when ordering  
(e.g.) rank GB: TLP290(GB,E  
Note: For safety standard certification, however, specify the part number alone.  
(e.g.) TLP290(GB,E: TLP290  
Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25°C)  
Note  
Rating  
Characteristic  
R.M.S. forward current  
Symbol  
Unit  
mA  
I
±50  
-1.5  
F(RMS)  
Input forward current derating (Ta 90°C)  
Input forward current (pulsed)  
Input power dissipation  
I /Ta  
F
mA /°C  
A
I
(Note 2)  
±1  
FP  
P
100  
mW  
mW/°C  
°C  
D
Input power dissipation derating (Ta 90°C)  
Junction temperature  
P /Ta  
-3.0  
D
T
125  
j
Collector-emitter voltage  
V
V
80  
V
CEO  
ECO  
Emitter-collector voltage  
7
V
Collector current  
I
50  
mA  
C
Collector power dissipation  
P
150  
mW  
mW /°C  
°C  
C
Collector power dissipation derating (Ta 25°C)  
Junction temperature  
P /Ta  
-1.5  
C
T
125  
j
Operating temperature range  
Storage temperature range  
T
-55 to 110  
-55 to 125  
260 (10s)  
200  
°C  
opr  
T
°C  
stg  
sol  
Lead soldering temperature  
Total package power dissipation  
Total package power dissipation derating (Ta 25°C)  
Isolation voltage  
T
°C  
P
mW  
mW /°C  
Vrms  
T
P /Ta  
-2.0  
T
BV  
(Note3)  
3750  
S
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if  
the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Note2: Pulse width 100μs, frequency 100Hz  
Note3: AC, 1minute, R.H.60%, Device considered a two terminal device: LED side pins shorted together and  
detector side pins shorted together.  
2
2014-09-08  
TLP290  
Electrical Characteristics (Unless otherwise specified, Ta = 25°C)  
Characteristic  
Symbol  
Test Condition  
= ±10 mA  
F
Min  
Typ.  
Max  
Unit  
Input forward voltage  
V
C
I
1.1  
1.25  
60  
-
1.4  
V
pF  
V
F
Input capacitance  
V = 0 V, f = 1 MHz  
-
80  
7
-
-
T
Collector-emitter breakdown voltage  
Emitter-collector breakdown voltage  
V
V
I
I
= 0.5 mA  
= 0.1 mA  
-
-
(BR) CEO  
(BR) ECO  
C
E
-
V
V
V
= 48 V  
0.01  
2
0.08  
50  
-
μA  
μA  
pF  
CE  
CE  
Dark current  
I
CEO  
= 48 V, Ta = 85°C  
-
Collector-emitter capacitance  
C
V = 0 V, f = 1 MHz  
-
10  
CE  
Coupled Electrical Characteristics (Unless otherwise specified, Ta = 25°C)  
Characteristic  
Symbol  
Test Condition  
MIn  
Typ.  
Max  
Unit  
%
50  
100  
-
-
-
400  
I
= ±5 mA, V  
= 5 V  
F
CE  
Current transfer ratio  
I / I  
C F  
400  
Rank GB  
Rank GB  
60  
-
-
-
IF = ±1 mA, V  
= 0.4 V  
CE  
Saturated CTR  
I
/ I  
F (sat)  
%
V
C
30  
I
I
= 2.4 mA, I = ±8 mA  
F
-
-
-
0.3  
-
C
C
Collector-emitter  
saturation voltage  
0.2  
V
= 0.2 mA, I = ±1 mA  
F
CE (sat)  
-
-
-
-
0.3  
10  
Rank GB  
Off-state collector current  
I
V
= ± 0.7 V, V = 48 V  
CE  
μA  
C(off)  
F
I
(I = -5 mA) / I (I = 5 mA)  
C
F
C
F
Collector current ratio  
I
0.33  
-
3
-
C (ratio)  
(Fig.1)  
Fig.1: Collector current ratio test circuit  
IC1  
IF1  
IF2  
VCE  
I
(I = I ,V  
(I = I ,V  
C1 F F1 CE  
= 5V)  
= 5V)  
C2 F F2 CE  
IC2  
I
=
C(ratio)  
I
3
2014-09-08  
TLP290  
Isolation Characteristics (Unless otherwise specified, Ta = 25°C)  
Characteristic  
Symbol  
Test Condition  
= 0V, f = 1 MHz  
Min  
-
Typ.  
0.8  
Max  
Unit  
Total capacitance (input to output)  
Isolation resistance  
C
R
V
V
-
-
-
-
-
pF  
S
S
S
12  
14  
= 500 V, R.H.60%  
1×10  
10  
S
AC, 1 minute  
3750  
-
V
rms  
Isolation voltage  
BV  
AC, 1 second, in oil  
DC, 1 minute, in oil  
-
-
10000  
10000  
S
V
dc  
Switching Characteristics (Unless otherwise specified, Ta = 25°C)  
Characteristic  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
Rise time  
t
-
-
-
-
-
-
-
4
7
-
-
-
-
-
-
-
r
Fall time  
t
f
V
R
= 10 V, I = 2 mA  
C
= 100 Ω  
CC  
L
μs  
Turn-on time  
Turn-off time  
Turn-on time  
Storage time  
Turn-off time  
t
t
t
7
on  
off  
on  
7
2
R
= 1.9 kΩ  
= 5 V, I = ±16 mA  
F
(Fig.2)  
L
t
30  
60  
μs  
s
V
CC  
t
off  
(Fig. 2): Switching time test circuit  
IF  
IF  
VCC  
VCE  
tS  
RL  
VCC  
4.5V  
0.5V  
VCE  
toff  
ton  
4
2014-09-08  
TLP290  
I
- Ta  
P
- Ta  
C
F
160  
140  
120  
100  
80  
100  
80  
60  
40  
20  
0
60  
(Note) This curve shows  
the maximum limit to the  
input forward current.  
40  
(Note) This curve shows the  
maximum limit to the collector  
power dissipation.  
20  
0
-20  
0
20  
40  
60  
80 100 120  
-20  
0
20  
40  
60  
80  
100  
120  
Ambient temperature Ta (˚C)  
Ambient temperature  
Ta (˚C)  
I
- D  
I
- V  
F F  
F P  
R
100  
3000  
Pules width 100μs  
Ta=25˚C  
1000  
10  
1
500  
300  
110˚C  
85˚C  
50˚C  
25˚C  
0˚C  
100  
-25˚C  
-55˚C  
50  
30  
(Note) This curve shows the  
maximum limit to the input  
forward current (pulsed).  
0.1  
10  
100  
10-1  
10-2  
10-3  
0.6 0.8  
1
1.2 1.4 1.6 1.8  
(V)  
2
Duty cycle ratio  
D
Input forward voltage  
V
F
R
V / Ta - I  
I
- V  
F
F
F P  
F P  
1000  
100  
10  
-3.2  
-2.8  
-2.4  
-2  
-1.6  
-1.2  
-0.8  
-0.4  
Pulse width 10μs  
Repeative frequency=100Hz  
Ta=25°C  
1
0.1  
1
10  
100  
0.6  
1
1.4  
1.8  
2.2  
2.6  
3
3.4  
Input forward current  
I
(mA)  
Input forward voltage (pulsed) VFP (V)  
F
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,  
unless otherwise noted.  
5
2014-09-08  
TLP290  
I
- V  
I
- V  
C C E  
C
C E  
30  
25  
20  
15  
10  
5
50  
40  
30  
20  
10  
0
Ta=25˚C  
Ta=25˚C  
P
( m a x )  
C
5 0  
3 0  
2 0  
5 0  
3 0  
2 0  
1 5  
1 5  
1 0  
1 0  
5
I
= 2 m A  
F
I
= 5 m A  
F
0
0
0.2  
0.4  
0.6  
0.8  
1
0
2
4
6
8
10  
Collector-emitter voltage VCE (V)  
Collector-emitter voltage VCE (V)  
I
- I  
I
-Ta  
C E O  
C
F
10  
100  
10  
1
Ta=25˚C  
1
0.1  
V =48V  
CE  
24V  
10V  
5V  
0.01  
0.001  
0.0001  
V
=10V  
=5V  
CE  
V
CE  
V
=0.4V  
CE  
0.1  
0
20  
40  
60  
80  
100  
120  
0.1  
1
10  
100  
Input forward voltage  
I
F
(mA)  
Ambient temperature Ta (°C)  
I
I
- I  
F
C /  
F
1000  
100  
10  
V
=10V  
CE  
V
=5V  
CE  
V
=0.4V  
CE  
0.1  
1
10  
F
100  
Input forward current  
I
(mA)  
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,  
unless otherwise noted.  
6
2014-09-08  
TLP290  
V
-
Ta  
I
- Ta  
C
C E ( s a t )  
100  
10  
1
0.28  
0.24  
0.20  
0.16  
0.12  
0.08  
0.04  
0.00  
25  
10  
5
1
I =0.5mA  
F
I
I
=8mA, I =2.4mA  
C
F
=1mA, I =0.2mA  
F
C
V
=5V  
CE  
0.1  
-60 -40 -20  
0
20 40 60 80 100 120  
-60 -40 -20  
0
20 40 60 80 100 120  
Ambient temperature Ta (°C)  
Ambient temperature Ta (°C)  
Switching time - R  
L
Switching time - Ta  
10000  
1000  
100  
10  
1000  
Ta=25˚C  
I
=16mA  
F
V
=5V  
CC  
t
off  
100  
10  
1
t
off  
t
s
t
s
t
on  
I
=16mA  
F
t
V
=5V  
CC  
on  
R =1.9kΩ  
L
0.1  
1
-60 -40 -20  
0
20 40 60 80 100 120  
1
10  
Load resistance  
100  
Ambient temperature Ta (°C)  
R
L
(k)  
Note: The above characteristics curves are presented for reference only and not guaranteed by production test,  
unless otherwise noted.  
7
2014-09-08  
TLP290  
Soldering and Storage  
1. Soldering  
1.1 Soldering  
When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as  
much as possible by observing the following conditions.  
1) Using solder reflow  
·Temperature profile example of lead (Pb) solder  
(°C)  
240  
This profile is based on the device’s  
maximum heat resistance guaranteed  
value.  
210  
Set the preheat temperature/heating  
temperature to the optimum temperature  
corresponding to the solder paste type  
used by the customer within the  
described profile.  
160  
140  
less than 30s  
60 to 120s  
Time  
(s)  
·Temperature profile example of using lead (Pb)-free solder  
(°C)  
260  
This profile is based on the device’s  
maximum heat resistance guaranteed  
value.  
230  
Set the preheat temperature/heating  
temperature to the optimum temperature  
corresponding to the solder paste type  
used by the customer within the  
described profile.  
190  
180  
60 to 120s  
30 to 50s  
Time  
(s)  
Reflow soldering must be performed once or twice.  
The mounting should be completed with the interval from the first to the last mountings being 2 weeks.  
2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder)  
Please preheat it at 150°C between 60 and 120 seconds.  
Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once.  
3) Using a soldering iron  
Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin may be heated  
at most once.  
8
2014-09-08  
TLP290  
2. Storage  
1) Avoid storage locations where devices may be exposed to moisture or direct sunlight.  
2) Follow the precautions printed on the packing label of the device for transportation and storage.  
3) Keep the storage location temperature and humidity within a range of 5°C to 35°C and 45% to 75%, respectively.  
4) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty  
conditions.  
5) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during  
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the  
solderability of the leads.  
6) When restoring devices after removal from their packing, use anti-static containers.  
7) Do not allow loads to be applied directly to devices while they are in storage.  
8) If devices have been stored for more than two years under normal storage conditions, it is recommendedthat you check  
the leads for ease of soldering prior to use.  
9
2014-09-08  
TLP290  
EN 60747-5-5 Option: (V4)  
Types  
: TLP290  
Type designations for “option: (V4)”, which are tested under EN 60747 requirements.  
Ex.: TLP290 (V4GB-TP,E  
V4 : EN 60747 option  
GB: CTR rank type  
TP : Standard tape & reel type  
E
: [[G]]/RoHS COMPATIBLE (Note 4 )  
Note: Use TOSHIBA standard type number for safety standard application.  
e.g.: TLP290(V4GB-TP,E TLP290  
Note4: Please contact your Toshiba sales representative for details on environmental information such  
as the product’s RoHS compatibility.  
RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011  
on the restriction of the use of certain hazardous substances in electrical and electronics  
equipment.  
EN 60747 Isolation Characteristics  
Description  
Symbol  
Rating  
Unit  
Application classification  
for rated mains voltage 150Vrms  
for rated mains voltage 300Vrms  
I-IV  
I-III  
Climatic classification  
Pollution degree  
55 / 110 / 21  
2
Maximum operating insulation voltage  
V
707  
Vpk  
Vpk  
IORM  
Input to output test voltage, Method A  
Vpr=1.5 × V  
, type and sample test  
IORM  
V
pr  
V
pr  
1060  
tp=10s, partial discharge<5pC  
Input to output test voltage, Method B  
Vpr=1.875 × V , 100% production test  
IORM  
1325  
6000  
Vpk  
Vpk  
tp=1s, partial discharge<5pC  
Highest permissible overvoltage  
(transient overvoltage, tpr=60s)  
V
TR  
Safety limiting values (max. permissible ratings in case of fault,  
also refer to thermal derating curve)  
current (input current: I , Psi=0mW)  
F
power (output or total power dissipation)  
temperature  
I
P
T
250  
400  
150  
mA  
mW  
°C  
si  
si  
si  
Insulation resistance  
9
>
R
si  
10  
=
V =500V, Ta=T  
IO si  
10  
2014-09-08  
TLP290  
Insulation Related Specifications  
Minimum creepage distance  
Minimum clearance  
Cr  
Cl  
5.0mm  
5.0mm  
0.4mm  
175  
Minimum insulation thickness  
Comparative tracking index  
ti  
CTl  
1. If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value.  
(e.g. at a standard distance between soldering eye centers of 3.5mm).  
If this is not permissible, the user shall take suitable measures.  
2. This photocoupler is suitable for ‘safe electrical isolation’ only within the safety limit data.  
Maintenance of the safety data shall be ensured by means of protective circuit.  
VDE test sign: Marking on product  
for EN 60747  
V
: Marking on packing  
for EN 60747  
DE  
V
Marking Example: TLP290  
1pin mark  
Lot No.  
Option(V4) mark  
V
P290  
Process lot No.  
Country of origin  
e.g.) J: Japan  
Type  
CTR rank mark  
11  
2014-09-08  
TLP290  
1
Partial discharge measurement procedure according to EN 60747  
Destructive test for qualification and sampling tests.  
Figure  
Method A  
V
(6kV)  
INITIAL  
V
(for type and sampling tests,  
destructive tests)  
V
pr  
(1060V)  
t1, 2  
t
= 1 to 10 s  
= 1 s  
V
IORM  
(707V)  
t
t3, 4  
t
tp(Measuring time for  
partial discharge)  
= 10 s  
= 12 s  
= 60 s  
0
t
t
t
4
3
P
tb  
tini  
t
1
t
ini  
t
b
t
2
Figure  
2
Partial discharge measurement procedure according to EN 60747  
Non-destructive test for 100% inspection.  
Method B  
V
pr  
(1325V)  
V
(for sample test, non-  
destructive test)  
V
(707V)  
IORM  
= 0.1 s  
t3, t4  
tp(Measuring time for  
partial discharge)  
tb  
= 1 s  
= 1.2 s  
t
t
p
t
3
t
b
t
4
Figure  
3 Dependency of maximum safety ratings on ambient temperature  
500  
500  
400  
300  
Psi  
(mW)  
Isi  
(mA)  
400  
300  
200  
100  
0
200  
100  
Psi  
Isi  
0
0
25  
50  
75  
100  
Ta (°C)  
125  
150  
175  
12  
2014-09-08  
TLP290  
RESTRICTIONS ON PRODUCT USE  
Toshiba Corporation, and its subsidiaries and affiliates (collectively "TOSHIBA"), reserve the right to make changes to the information  
in this document, and related hardware, software and systems (collectively "Product") without notice.  
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with  
TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.  
Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are  
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and  
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily  
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product,  
or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all  
relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for  
Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for  
the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product  
design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or  
applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams,  
programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for  
such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.  
PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE  
EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH  
MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT  
("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without  
limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for  
automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions,  
safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. IF YOU USE  
PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your  
TOSHIBA sales representative.  
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.  
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any  
applicable laws or regulations.  
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any  
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to  
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.  
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE  
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY  
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR  
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND  
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO  
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS  
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.  
GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor.  
Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.  
Do not use or otherwise make available Product or related software or technology for any military purposes, including without limitation,  
for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology  
products (mass destruction weapons). Product and related software and technology may be controlled under the applicable export  
laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export  
Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in  
compliance with all applicable export laws and regulations.  
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.  
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,  
including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES  
OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.  
13  
2014-09-08  

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