TLP285(V4-Y,F_技术文档

TLP285

TOSHIBA PHOTOCOUPLER IRED & PHOTO-TRANSISTOR

TLP285

Power Supplies

Unit: mm

Programmable Controllers

Hybrid ICs

The Toshiba TLP285 consists of photo transistor, optically coupled to an

infrared emitting diode. TLP285 is housed in the SOP4 package, very small

and thin coupler.

Since TLP285 is guaranteed wide operating temperature (Ta = -55 to 110 ˚C)

and high isolation voltage (3750 Vrms), it’s suitable for high-density surface

mounting applications such as small switching power supplies and

programmable controllers.

 Collector-Emitter Voltage : 80 V (min)

 Current Transfer Ratio

: 50% (min)

Rank GB

: 100% (min)

 Isolation Voltage

: 3750 Vrms (min)

 Guaranteed performance over -55 to 110 ˚C

TOSHIBA

11-3A1

 UL-recognized

 cUL-recognized

: UL 1577, File No.E67349

Weight: 0.05 g (typ.)

: CSA Component Acceptance Service No.5A

File No.E67349

 VDE-approved

: EN 60747-5-5 (Note 1)

Pin Configuration (top view)

1

2

4

3

Note 1: When a VDE approved type is needed,

please designate the Option(V4).

Construction Mechanical Rating

1: ANODE

2: CATHODE

3: EMITTER

4: COLLECTOR

Creepage Distance

Clearance

Insulation Thickness

5.0 mm (min)

0.4 mm (min)

Start of commercial production

2008-01

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TLP285

Current Transfer Ratio

Current Transfer Ratio (%)

(I /I )

C F

Classification

TYPE

Marking of Classification

I = 5 mA, V = 5 V, Ta = 25°C

F

CE

(Note1)

Min

50

Max

600

■

Blank

Blank,Y , YE, G, G , GR, B, BL, GB

Rank Y

50

150

300

600

150

200

300

400

YE, Y^■

Rank GR

Rank BL

100

200

100

75

GR, G, G^■

BL, B

GB, GR, G, G^■, BL, B

TLP285

Rank GB

■

Rank YH

Rank GRL

Rank GRH

Rank BLL

Y

100

150

200

G

■

G

B

Note1: Ex. rank GB: TLP285 (GB)

Note: Application type name for certification test, please use standard product type name, i.e.

TLP285 (GB): TLP285

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TLP285

Absolute Maximum Ratings (Ta = 25°C)

RATING

CHARACTERISTIC

SYMBOL

UNIT

Forward Current

I

50

-1.0

1

mA

mA/°C

A

F(RMS)

Forward Current Derating (Ta ≥ 75°C)

∆I /°C

F

Pulse Forward Current

Reverse Voltage

(Note 1)

I

FP

V

P

5

V

R

D

100

mW

mW/°C

Diode power dissipation

∆P /°C

Diode power dissipation derating (Ta ≥ 75°C)

Junction Temperature

-2.0

125

D

T

°C

V

j

Collector-Emitter Voltage

Emitter-Collector Voltage

Collector Current

V

80

CEO

ECO

7

V

I

50

mA

C

Collector Power Dissipation

P

150

mW

mW/°C

°C

C

∆P /°C

-1.5

125

Collector Power Dissipation Derating (Ta ≥ 25°C)

Junction Temperature

C

T

j

Operating Temperature Range

T

-55 to 110

-55 to 125

260

°C

opr

Storage Temperature Range

T

°C

stg

sol

Lead Soldering Temperature (10 s)

Total Package Power Dissipation

T

°C

P

200

mW

mW/°C

Vrms

T

∆P /°C

-2.0

3750

Total Package Power Dissipation Derating (Ta ≥ 25°C)

T

Isolation Voltage

(Note 2)

BV

S

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Note 1: Pulse width ≤ 100 μs, frequency 100 Hz

Note 2: AC, 60 s, R.H.≤60 %

Device considered a two terminal device : LED side pins shorted together and DETECTOR side pins shorted

together.

Electrical Characteristics (Ta = 25°C)

CHARACTERISTIC

Forward Voltage

SYMBOL

TEST CONDITION

= 10 mA

F

MIN

TYP.

MAX

UNIT

V

I

1.0

—

80

7

1.15

—

1.3

10

—

V

μA

pF

V

F

Reverse Current

I

V = 5 V

R

Capacitance

C

T

V = 0 V, f = 1 MHz

30

Collector-Emitter Breakdown Voltage

Emitter-Collector Breakdown Voltage

V

I

= 0.5 mA

= 0.1 mA

(BR)CEO

(BR)ECO

C

E

—

V

= 48 V,

CE

0.01

(2)

0.1

(10)

Ambient Light Below

(100 ℓx)

V

Ambient Light Below

(100 ℓx)

μA

—

Collector Dark Current

(Note 2)

(Note 1)

I

CEO

= 48 V, Ta = 85 °C

CE

2

(4)

50

(50)

μA

—

Capacitance

(Collector to Emitter)

C

CE

V = 0 V, f = 1 MHz

10

—

pF

Note 1: Irradiation to marking side using standard light bulb.

Note 2: Because of the construction, leak current might be increased by ambient light.

Please use photocoupler with less ambient light.

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TLP285

Coupled Electrical Characteristics (Ta = 25°C)

CHARACTERISTIC

SYMBOL

TEST CONDITION

MIN

TYP.

MAX

UNIT

%

50

100

—

600

—

60

I

= 5 mA, V = 5 V

F

CE

Current Transfer Ratio

I /I

C F

Rank GB

—

= 1 mA, V = 0.4 V

CE

Saturated CTR

I /I

C F(sat)

%

30

—

I

= 2.4 mA, I = 8 mA

0.4

—

C

F

Collector-Emitter

V

0.2

V

CE(sat)

—

= 0.2 mA, I = 1 mA

F

Saturation Voltage

Rank GB

0.4

10

—

OFF-State Collector Current

I

V

= 0.7 V, V = 48 V

μA

C(off)

F

CE

—

Isolation Characteristics (Ta = 25°C)

CHARACTERISTIC

Capacitance

SYMBOL

TEST CONDITION

= 0 V, f = 1 MHz

MIN

—

TYP.

0.8

MAX

UNIT

C

R

V

pF

Ω

S

—

(Input to Output)

12

14

Isolation Resistance

= 500 V, R.H.≤60 %

1×10

3750

10

S

Isolation Voltage

BV

AC, 60 s

—

Vrms

S

Switching Characteristics (Ta = 25°C)

CHARACTERISTIC

Rise Time

SYMBOL

TEST CONDITION

MIN

TYP.

MAX

UNIT

—

t

2

3

r

—

Fall Time

t

f

V

= 10 V, I = 2 mA

C

R = 100 Ω

CC

L

μs

Turn-On Time

Turn-Off Time

Turn-On Time

Storage Time

Turn-Off Time

t

3

on

off

3

t

2

ON

R = 1.9 kΩ

(Fig.1)

L

CC

t

25

40

μs

s

V

= 5 V, I = 16 mA

F

t

OFF

Fig.1: Switching Time Test Circuit

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TLP285

I

- Ta

P

- Ta

C

F

100

80

60

40

20

0

200

180

160

140

120

100

80

60

40

20

0

-20

0

20

40

60

80

100 120

-20

0

20

40

60

80

100 120

Ambient temperature Ta (˚C)

I

- D

I

- V

F

F P

R

F

3000

100

Pulse Width

≤100μs

Ta=25˚C

1000

500

300

10

1

100˚C

75˚C

50˚C

25˚C

0˚C

-25˚C

-50˚C

100

50

30

0.1

10

10⁰

10^-1

R

10^-2

10^-3

0.6

0.8

1

1.2

1.4

1.6

Duty cycle ratio

D

Forward voltage

V

(V)

F

∆ V

∆ Ta - I

I

– V

F /

F

F P

-3.2

1000

100

10

-2.8

-2.4

-2

-1.6

-1.2

-0.8

-0.4

Pulse width≤10μs

Repetitive

Frequency=100Hz

Ta=25°C

1

0.6

1

1.4

1.8

2.2

FP

2.6

3

50

0.1

1

10

0.5

5

Forward current

I

(mA)

Pulse forward voltage

V

(V)

F

NOTE: The above characteristics curves are presented for reference only and not guaranteed by production test,

unless otherwise noted.

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TLP285

I

- V

I

- V

C E

C

C E

C

50

40

30

20

10

0

30

25

20

15

10

5

Ta=25˚C

P _C( m a x )

5 0

3 0

2 0

5 0

3 0

2 0

1 5

1 0

1 5

5

1 0

I

= 2 m A

F

I

= 5 m A

F

0

0.5

Collector-emitter voltage

1

0

5

10

V

(V)

CE

Collector-emitter voltage

V

(V)

CE

I

- I

I

-Ta

CEO

C

F

10¹

10⁰

100

10

1

10^-1

10^-2

10^-3

S A M P L E

A

V

=48V

CE

S A M P L E

B

24V

10V

5V

V

CE

=10V

V =5V

CE

V =0.4V

CE

10^-4

0.1

0

20

40

60

80

100

120

0.1

1

10

(mA)

100

Forward current

I

F

Ambient temperature Ta (°C)

I

- I

F

C /

F

1000

100

10

V

=10V

=5V

CE

V

CE

V

=0.4V

CE

S A M P L E

A

S A M P L E

B

0.1

1

10

(mA)

100

Forward current

I

F

NOTE: The above characteristics curves are presented for reference only and not guaranteed by production test,

unless otherwise noted.

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TLP285

V

- Ta

I

- Ta

C

C E ( s a t )

100

10

0.28

0.24

0.2

25

10

5

0.16

0.12

0.08

0.04

0

1

I =0.5mA

F

0.1

0.01

I

=8mA, I =2.4mA

C

F

=1mA, I =0.2mA

C

V =5V

CE

-40 -20

0

20 40 60 80 100 120

-40 -20

0

20

40

60

80 100 120

Ambient temperature Ta (°C)

Switching time - Ta

Switching time - R

L

1000

100

Ta=25˚C

I

=16mA

F

t

V =5V

CC

OFF

t

OFF

t

s

100

10

1

10

t

s

t

ON

1

I

=16mA

F

V

=5V

CC

R =1.9kΩ

L

t

ON

0.1

-60 -40 -20

0

20

40

60

80 100 120

1

10

100

Ambient temperature Ta (°C)

Load resistance

R

L

(kΩ)

NOTE: The above characteristics curves are presented for reference only and not guaranteed by production test,

unless otherwise noted.

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TLP285

Soldering and Storage

1. Soldering

Soldering

When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as

much as possible by observing the following conditions.

1) Using solder reflow

∙Temperature profile example of lead (Pb) solder

(°C)

240

This profile is based on the device’s

maximum heat resistance guaranteed

value.

210

Set the preheat temperature/heating

temperature to the optimum temperature

corresponding to the solder paste

type used by the customer within the

described profile.

160

140

less than 30s

60 to 120s

Time

(s)

∙Temperature profile example of using lead (Pb)-free solder

(°C)

This profile is based on the device’s

maximum heat resistance guaranteed

value.

Set the preheat temperature/heating

temperature to the optimum temperature

corresponding to the solder paste

type used by the customer within the

described profile.

260

230

190

180

60 to 120s

30 to 50s

Time

(s)

Reflow soldering must be performed once or twice.

The mounting should be completed with the interval from the first to the last mountings being 2 weeks.

2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder)

・Please preheat it at 150°C between 60 and 120 seconds.

・Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once.

3) Using a soldering iron

Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin may

be heated at most once.

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TLP285

2. Storage

1) Avoid storage locations where devices may be exposed to moisture or direct sunlight.

2) Follow the precautions printed on the packing label of the device for transportation and storage.

3) Keep the storage location temperature and humidity within a range of 5°C to 35°C and 45% to 75%,

respectively.

4) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty

conditions.

5) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during

storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the

solderability of the leads.

6) When restoring devices after removal from their packing, use anti-static containers.

7) Do not allow loads to be applied directly to devices while they are in storage.

8) If devices have been stored for more than two years under normal storage conditions, it is recommended

that you check the leads for ease of soldering prior to use.

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TLP285

Embossed-Tape Packing (TP) Specification for Mini-Flat Couplers

1. Applicable Package

Package

SOP4

Product Type

Mini-Flat Coupler

2. Product Naming System

Type of package used for shipment is denoted by a symbol suffix after a product number. The method of

classification is as below.

(Example)

TLP285(GB-TP, F)

[[G]]/RoHS COMPATIBLE (Note 1)

Tape type

CTR rank

Device name

Note 1: Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS

compatibility of Product.

The RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on

the restriction of the use of certain hazardous substances in electrical and electronic equipment.

3. Tape Dimensions

3.1 Orientation of Device in Relation to Direction of Tape Movement

Device orientation in the recesses is as shown in Figure 2.

Tape feed

Figure 2 Device Orientation

3.2 Tape Packing Quantity: 2500 devices per reel

3.3 Empty Device Recesses Are as Shown in Table 1.

Table 1 Empty Device Recesses

Standard

0 device

Remarks

Occurrences of 2 or more

successive empty device

recesses

Within any given 40-mm section of

tape, not including leader and trailer

Single empty device

recesses

6 device (max.) per reel

Not including leader and trailer

3.4 Start and End of Tape

The start of the tape has 50 or more empty holes. The end of tape has 50 or more empty holes and two empty

turns only for a cover tape.

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TLP285

3.5 Tape Specification

(1) Tape material: Plastic (protection against electrostatics)

(2) Dimensions: The tape dimensions are as shown in Figure 3 and table 2.

Unit: mm

2.0 ± 0.1

0.3 ± 0.05

+0.1

−0

F

G

φ1.5

K

0

A

φ1.6 ± 0.1

2.5 ± 0.2

Figure 3 Tape Forms

Table 2 Tape Dimensions

Unit: mm

Unless otherwise specified: ±0.1

Symbol

Dimension

Remark

A

B

D

E

F

3.1

7.5

5.5

1.75

8.0

4.0

2.3

―

Center line of indented square hole and sprocket hole

Distance between tape edge and hole center

+0.1

Cumulative error

Internal space

(max) per 10 feed holes

-0.3

+0.1

-0.3

G

K

0

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TLP285

3.6 Reel

(1) Material: Plastic

(2) Dimensions: The reel dimensions are as shown in Figure 4 and Table 3.

Table 3 Reel Dimensions

Unit: mm

Symbol

Dimension

U

A

B

Φ330 ±2

Φ80 ±1

E

C

Φ13 ±0.5

2.0 ±0.5

4.0 ±0.5

13.5 ±0.5

17.5 ±1.0

E

U

W1

W2

W1

W2

Figure 4 Reel Form

4. Packing

Packed in a shipping carton.

5. Label Indication

The carton bears a label indicating the product number, the symbol representing classification of standard, the

quantity, the lot number and the Toshiba company name.

6. Ordering Method

When placing an order, please specify the product number, the CTR rank, the tape type and the quantity as

shown in the following example.

(Example)

TLP285(GB-TP,F) 2500 pcs

Quantity (must be a multiple of 2500)

[[G]]/RoHS COMPATIBLE (Note 1)

Tape type

CTR rank

Device name

Note 1 : Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS

compatibility of Product.

The RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on

the restriction of the use of certain hazardous substances in electrical and electronic equipment.

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TLP285

EN 60747-5-5 Option (V4) Specification

Types

: TLP285 (Note 1)

Type designations for “option: (V4)”, which are tested under EN 60747 requirements.

Ex.: TLP285 (V4-GB-TP,F)

V4 : EN 60747 option

GB: CTR rank type

TP : Standard tape & reel type

F

: [[G]]/RoHS COMPATIBLE (Note 2)

Note 1: Use TOSHIBA standard type number for safety standard application.

Ex.: TLP285 (V4-GB-TP,F) TLP285

→

Note 2: Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS

compatibility of Product.

The RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on

the restriction of the use of certain hazardous substances in electrical and electronic equipment.

EN 60747 Isolation Characteristics

Description

Symbol

Rating

Unit

Application classification

―

for rated mains voltage ≤ 150Vrms

for rated mains voltage ≤ 300Vrms

I-IV

I-III

Climatic classification

Pollution degree

55 / 110 / 21

2

―

Maximum operating insulation voltage

V

707

Vpk

IORM

Input to output test voltage, Method A

Vpr=1.6 × V , type and sample test

IORM

V

pr

V

pr

1131

tp=10s, partial discharge<5pC

Input to output test voltage, Method B

Vpr=1.875 × V , 100% production test

IORM

1325

6000

Vpk

tp=1s, partial discharge<5pC

Highest permissible overvoltage

(transient overvoltage, tpr=60s)

V

TR

Safety limiting values (max. permissible ratings in case of fault,

also refer to thermal derating curve)

current (input current I , Psi=0)

F

power (output or total power dissipation)

temperature

I

P

T

250

400

150

mA

mW

°C

si

9

>

Insulation resistance

V =500V, Ta=Tsi

IO

R

si

10

Ω

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TLP285

Insulation Related Specifications

Minimum creepage distance

Minimum clearance

Cr

Cl

5.0 mm

0.4 mm

175

Minimum insulation thickness

Comparative tracking index

ti

CTl

Note: If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value.

If this is not permissible, the user shall take suitable measures.

Note: This photocoupler is suitable for ‘safe electrical isolation’ only within the safety limit data.

Maintenance of the safety data shall be ensured by means of protective circuit.

VDE test sign:

V

Marking on packing

VDE

Marking Example

CTR Rank Marking

Mark for option(V4)

v

P285

Type name

1pin indication

Lot No.

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TLP285

1

Partial discharge measurement procedure according to EN 60747

Destructive test for qualification and sampling tests.

Figure

Method A

V

(6kV)

INITIAL

V

(for type and sampling tests,

destructive tests)

V (1131V)

pr

t₁

t₃

t

= 1 to 10 s

= 1 s

,

2

4

V

(707V)

t

IORM

,

t_p(Measuring time for

partial discharge)

= 10 s

= 12 s

= 60 s

0

t

3

t

4

P

t_b

t_ini

t

b

t

1

ini

2

Figure

2

Partial discharge measurement procedure according to EN 60747

Non-destructive test for100% inspection.

Method B

V (1325V )

pr

V

(for sample test, non-

destructive test)

V

(707V )

IORM

= 0.1 s

t₃, t₄

t_p(Measuring time for

partial discharge)

t_b

= 1 s

= 1.2 s

t

P

t

3

t

b

t

4

Figure

3

Dependency of maximum safety ratings on ambient temperature

500

400

300

Psi

(mW)

Isi

(mA)

400

300

200

100

0

200

100

→

Psi

Isi

←

0

25

50

75

100

Ta (°C)

125

150

175

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TLP285

RESTRICTIONS ON PRODUCT USE

Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as “TOSHIBA”.

Hardware, software and systems described in this document are collectively referred to as “Product”.

• TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.

• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with

TOSHIBA's written permission, reproduction is permissible only if reproduction is without alteration/omission.

• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are

responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and

systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily

injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the

Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of

all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes

for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the

instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their

own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such

design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,

diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating

parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR

APPLICATIONS.

• PRODUCT IS NEITHER INTENDED NOR WARRANTED FOR USE IN EQUIPMENTS OR SYSTEMS THAT REQUIRE

EXTRAORDINARILY HIGH LEVELS OF QUALITY AND/OR RELIABILITY, AND/OR A MALFUNCTION OR FAILURE OF WHICH

MAY CAUSE LOSS OF HUMAN LIFE, BODILY INJURY, SERIOUS PROPERTY DAMAGE AND/OR SERIOUS PUBLIC IMPACT

("UNINTENDED USE"). Except for specific applications as expressly stated in this document, Unintended Use includes, without

limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, lifesaving and/or life supporting medical

equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to

control combustions or explosions, safety devices, elevators and escalators, and devices related to power plant. IF YOU USE

PRODUCT FOR UNINTENDED USE, TOSHIBA ASSUMES NO LIABILITY FOR PRODUCT. For details, please contact your

TOSHIBA sales representative or contact us via our website.

• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.

• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any

applicable laws or regulations.

• The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any

infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to

any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY

WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR

LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND

LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO

SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS

FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or

vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.

• Do not use or otherwise make available Product or related software or technology for any military purposes, including without

limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile

technology products (mass destruction weapons). Product and related software and technology may be controlled under the

applicable export laws and regulations including, without limitation, the Japanese Foreign Exchange and Foreign Trade Law and the

U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited

except in compliance with all applicable export laws and regulations.

• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of

Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled

substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES

OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.

https://toshiba.semicon-storage.com/

16

2019-06-17

Toshiba Electronic Devices & Storage Corporation


型号：	TLP285(V4-Y,F
厂家：	TOSHIBA
描述：	Transistor Output Optocoupler, 1-Element, 3750V Isolation 输出元件光电
文件：	总16页 (文件大小：590K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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