TLP285-4(GB,F_技术文档

TLP285-4

TOSHIBA PHOTOCOUPLER GaAs IRED & PHOTO-TRANSISTOR

TLP285-4

Programmable Controllers

Unit in mm

Power Supplies

Hybrid ICs

TLP285-4

The Toshiba TLP285-4 consists of photo transistor, optically coupled to a

gallium arsenide infrared emitting diode. TLP285-4 is housed in the SOP16

package, very small and thin coupler.

Since TLP285-4 are guaranteed wide operating temperature (Ta=-55 to 110

˚C) and high isolation voltage (3750Vrms), it’s suitable for high-density

surface mounting applications such as programmable controllers and hybrid

ICs.

z Collector-Emitter Voltage : 80 V (min)

z Current Transfer Ratio

: 50% (min)

Rank GB

: 100% (min)

z Isolation Voltage

: 3750 Vrms (min)

TOSHIBA

11-10F1

z Guaranteed performance over -55 to 110 ˚C

Weight: 0.19 g (typ.)

z UL Recognized

: UL1577 , File No. E67349

cUL Recognized

: CSA Component Acceptance Service No.5A

z BSI (under application)

: BS EN 60065: 2002,

: BS EN 60950-1: 2006

Pin Configuration

z Option (V4)

TLP285-4

16

VDE approved

Maximum operating insulation voltage : 707 Vpk

Highest permissible over voltage : 6000 Vpk

: EN60747-5-2

1

2

3

4

5

6

7

8

( Note ) When a EN60747-5-2 approved type is needed,

please designate the “Option(V4)”

15

14

13

12

11

Construction Mechanical Rating

Creepage Distance

Clearance

Insulation Thickness

5.0 mm (min)

0.4 mm (min)

10

9

1,3,5,7

2,4,6,8

:ANODE

:CATHODE

9,11,13,15 :EMITTER

10,12,14,16 :COLLECTOR

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TLP285-4

Current Transfer Ratio

Current Transfer Ratio (%)

(I / I )

C

F

Classification

TYPE

Marking of Classification

I

= 5 mA, V = 5 V, Ta = 25℃

CE

(Note1)

F

Min

50

Max

600

Blank

Blank , GB

GB

TLP285-4

Rank GB

100

Note1: ex. Rank GB: TLP285 (GB)

Application type name for certification test, please use standard product type name, i.e.

TLP285−4 (GB): TLP285-4

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TLP285-4

Absolute Maximum Ratings (Ta = 25℃)

RATING

CHARACTERISTIC

Forward Current

SYMBOL

UNIT

I

50

mA

F(RMS)

Forward Current Derating

Pulse Forward Current

Reverse Voltage

∆I /°C

−0.67 (Ta≥50°C)

mA /°C

F

(Note2)

I

1

5

A

V

FP

V

R

Junction Temperature

Collector-Emitter Voltage

Emitter-Collector Voltage

Collector Current

T

125

80

7

°C

V

j

V

CEO

ECO

V

I

50

mA

C

Collector Power Dissipation

(1 Circuit)

P

100

mW

C

Collector Power Dissipation

∆P /°C

−1.0

mW /°C

C

Derating(Ta≥25°C)

(1 Circuit)

Junction Temperature

T

125

°C

j

Operating Temperature Range

Storage Temperature Range

T

opr

−55 to 110

−55 to 125

260 (10s)

T

stg

sol

Lead Soldering Temperature

T

Total Package Power Dissipation

P

170

mW

T

(1 Circuit)

Total Package Power Dissipation

∆P /°C

−1.7

mW /°C

Vrms

T

Derating (Ta≥25°C)

(1 Circuit)

(Note3)

Isolation Voltage

BV

3750

S

Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the

significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even

if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum

ratings.

Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook

(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test

report and estimated failure rate, etc).

Note2: Pulse width ≤ 100μs, frequency 100Hz

Note3: AC, 1 minute, R.H.≤60%, Device considered a two terminal device : LED side pins shorted together and

DETECTOR side pins shorted together.

Individual Electrical Characteristics (Ta = 25℃)

CHARACTERISTIC

Forward Voltage

SYMBOL

TEST CONDITION

= 10 mA

F

MIN

1.0

TYP.

MAX

UNIT

V

I

1.15

—

1.3

10

—

V

μA

pF

V

F

Reverse Current

V = 5 V

R

—

80

7

R

Capacitance

C

V = 0, f = 1 MHz

30

—

T

Collector-Emitter Breakdown Voltage

Emitter-Collector Breakdown Voltage

V

I

= 0.5 mA

= 0.1 mA

—

(BR) CEO

(BR) ECO

C

E

V

—

V

= 48 V,

CE

0.01

(2)

0.1

(10)

Ambient Light Below

(100 ℓx)

V

Ambient Light Below

(100 ℓx)

μA

—

Collector Dark Current

(Note5)

(Note4)

I

CEO

= 48 V, Ta = 85°C

CE

2

(4)

50

(50)

μA

—

Capacitance

(Collector to Emitter)

C

CE

V = 0, f = 1 MHz

10

—

pF

Note.4 : Irradiation to marking side using standard light bulb.

Note 5: Because of the construction,leak current might be increased by ambient light.

Please use photocoupler with less ambient light.

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TLP285-4

Coupled Electrical Characteristics (Ta = 25℃)

CHARACTERISTIC

SYMBOL

TEST CONDITION

MIN

TYP.

MAX

UNIT

%

I

= 5 mA, V = 5 V

50

100

—

600

—

60

F

CE

Current Transfer Ratio

I / I

C F

Rank GB

= 1 mA, V = 0.4 V

CE

—

Saturated CTR

I

/ I

F (sat)

%

C

30

—

I

= 2.4 mA, I = 8 mA

F

0.4

—

C

Collector-Emitter Saturation Voltage

Off-State Collector Current

V

= 0.2 mA, I = 1 mA

F

0.2

—

CE (sat)

Rank GB

0.4

10

—

I

V

= 0.7 V, V = 48 V

CE

μA

—

C (off)

F

Isolation Characteristics (Ta = 25℃)

CHARACTERISTIC

Capacitance

SYMBOL

TEST CONDITION

= 0 V, f = 1 MHz

MIN

—

TYP.

0.8

MAX

—

UNIT

C

R

V

pF

S

(Input to Output)

12

14

Isolation Resistance

= 500 V, R.H.≤60%

1×10

3750

—

10

Ω

—

AC , 1 minute

—

Vrms

Vdc

Isolation Voltage

BV

S

AC , 1 second, in OIL

DC , 1 minute, in OIL

10000

—

Switching Characteristics (Ta = 25℃)

CHARACTERISTIC

Rise Time

SYMBOL

TEST CONDITION

MIN

TYP.

MAX

UNIT

—

t

r

2

3

—

Fall Time

t

f

V

= 10 V, I = 2 mA

CC C

R = 100Ω

μs

L

Turn-On Time

Turn-Off Time

Turn-On Time

Storage Time

Turn-Off Time

t

3

on

t

3

off

t

2

ON

R = 1.9 kΩ

(Fig.1)

L

CC

μs

t

25

40

s

V

= 5 V, I = 16 mA

F

t

OFF

(Fig.1) Switchin Time Test Circuit

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TLP285-4

I

- Ta

P

- Ta

F

C

100

80

60

40

20

0

200

180

160

140

120

100

80

60

40

20

0

-20

0

20

40

60

80 100 120

-20

0

20

40

60

80 100 120

Ambient temperature Ta (˚C)

I

- D

I

- V

F

F P

R

F

3000

1000

100

パルス幅≦100μs

Ta=25˚C

500

300

10

1

100˚C

75˚C

50˚C

25˚C

0˚C

-25˚C

-50˚C

100

50

30

0.1

10

10⁰

10^-1

10^-2

10^-3

0.6

0.8

1

1.2

1.4

1.6

Duty cycle ratio

D

Forward voltage

V

(V)

R

F

∆ V / ∆ Ta - I

I

–

V

F

F P

1000

100

10

-3.2

-2.8

-2.4

-2

-1.6

-1.2

-0.8

-0.4

Pulse width≦10μs

Repetitive

Frequency=100Hz

Ta=25℃

1

0.6

1

1.4

1.8

2.2

2.6

3

50

0.1

0.5

1

5

10

Forward current

I

(mA)

Pulse forward voltage V_FP(V)

F

*The above graphs show typical characteristic.

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TLP285-4

I

- V

C

I

- V

C

P

C E

C

C E

30

25

20

15

10

5

50

40

30

20

10

0

Ta=25˚C

( m a x )

Ta=25˚C

5 0

3 0

2 0

1 5

1 0

1 5

1 0

5

I

= 2 m A

F

I

= 5 m A

F

0

0.5

1

0

5

10

Collector-emitter voltage

V_CE(V)

Collector-emitter voltage V_CE(V)

I

- I

F

ICEO-Ta

C

10¹

10⁰

100

10

1

S A M P L E

A

10^-1

10^-2

10^-3

V

=48V

CE

S A M P L E

B

24V

10V

5V

V

=10V

CE

=5V

CE

V

=0.4V

CE

10^-4

0.1

0

20

40

60

80

100

120

0.1

1

10

(mA)

100

Forward current

I

F

Ambient temperature Ta (℃)

I

- I

C /

F

1000

100

10

V

=10V

=5V

CE

V

CE

V

=0.4V

CE

S A M P L E

A

S A M P L E

B

0.1

1

10

(mA)

100

Forward current

I

F

*The above graphs show typical characteristic.

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TLP285-4

V

- Ta

I

- Ta

C E ( s a t )

C

100

10

0.28

0.24

0.2

25

10

5

0.16

0.12

0.08

0.04

0

1

I =0.5mA

F

0.1

0.01

I

=8mA, I =2.4mA

C

F

=1mA, I =0.2mA

F

C

V

=5V

CE

-40 -20

0

20 40 60 80 100 120

-40 -20

0

20

40

60

80 100 120

Ambient temperature Ta (℃)

Switching time - R

L

Switching time - Ta

100

1000

100

10

Ta=25˚C

I

=16mA

F

t

OFF

V

=5V

CC

t

OFF

t

s

10

t

s

t

ON

1

I

=16mA

F

V

=5V

CC

R =1.9kꢀ

L

t

ON

0.1

1

-60 -40 -20

0

20

40

60

80 100 120

1

10

100

Ambient temperature Ta (℃)

Load resistance

R

L

(kΩ)

*The above graphs show typical characteristic.

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TLP285-4

Soldering and Storage

1. Soldering

1.1 Soldering

When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as

much as possible by observing the following conditions.

1) Using solder reflow

·Temperature profile example of lead (Pb) solder

(°C)

240

This profile is based on the device’s

maximum heat resistance guaranteed

value.

210

Set the preheat temperature/heating

temperature to the optimum temperature

corresponding to the solder paste

type used by the customer within the

described profile.

160

140

less than 30s

60 to 120s

Time

(s)

·Temperature profile example of using lead (Pb)-free solder

(°C)

This profile is based on the device’s

maximum heat resistance guaranteed

value.

Set the preheat temperature/heating

temperature to the optimum temperature

corresponding to the solder paste

type used by the customer within the

described profile.

260

230

190

180

60 to 120s

30 to 50s

Time

(s)

2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder)

・Please preheat it at 150°C between 60 and 120 seconds.

・Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once.

3) Using a soldering iron

Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin may

be heated at most once.

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TLP285-4

2. Storage

1) Avoid storage locations where devices may be exposed to moisture or direct sunlight.

2) Follow the precautions printed on the packing label of the device for transportation and storage.

3) Keep the storage location temperature and humidity within a range of 5°C to 35°C and 45% to 75%,

respectively.

4) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty

conditions.

5) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during

storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the

solderability of the leads.

6) When restoring devices after removal from their packing, use anti-static containers.

7) Do not allow loads to be applied directly to devices while they are in storage.

8) If devices have been stored for more than two years under normal storage conditions, it is recommended

that you check the leads for ease of soldering prior to use.

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TLP285-4

Option:Specification for Embossed-Tape Packing

(TP) for Mini-Flat Coupler

1. Applicable Package

Package Name

SOP16

Product Type

Mini-Flat Coupler

2. Product Naming System

Type of package used for shipment is denoted by a symbol suffix after a product number. The method of

classification is as below.

（Example）

ＴＬＰ２８５－４（ＧＢ－ＴＰ，Ｆ

[[G]]/RoHS COMPATIBLE (Note6)

Tape type

CTR rank

Device name

3. Tape Dimensions

3.1 Orientation of Device in Relation to Direction of Tape Movement

Device orientation in the recesses is as shown in Figure 1.

Tape feed

Figure１ Device Orientation

3.2 Tape Packing Quantity：2500 devices per reel

3.3 Empty Device Recesses are as Shown in Table 1.

Table１ Empty Device Recesses

Standard

Remarks

Occurrences of 2 or more

successive empty device

recesses

Within any given 40-mm section of

tape, not including leader and trailer

0

Single empty device

recesses

6 device (max) per reel

Not including leader and trailer

3.4 Start and End of Tape

The start of the tape has 50 or more empty holes. The end of tape has 50 or more empty holes and two

empty turns only for a cover tape.

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TLP285-4

3.5 Tape Specification

(1) Tape material: Plastic (protection against electrostatics)

(2) Dimensions: The tape dimensions are as shown in Figure 2 and table 2.

2.0 ± 0.1

0.3 ± 0.05

+0.1

−0

F

G

φ1.5

K

0

A

φ1.5 ± 0.1

2.4 ± 0.2

Figure2 Tape Forms

Table2 Tape Dimensions

Unit: mm

Unless otherwise specified: ±0.1

Symbol

Dimension

Remark

A

B

D

E

F

7.5

10.5

7.5

―

Center line of indented square hole and sprocket hole

1.75

12.0

4.0

Distance between tape edge and hole center

+0.1

Cumulative error

Internal space

(max) per 10 feed holes

-0.3

+0.1

-0.3

G

K

2.2

0

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TLP285-4

3.6 Reel

(1) Material: Plastic

(2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 3.

Table 3 Reel Dimensions

Unit: mm

Symbol

Dimension

A

B

φ330 ± 2

φ80 ± 1

U

E

C

φ13 ± 0.5

2.0 ± 0.5

4.0 ± 0.5

17.5 ± 0.5

21.5 ± 1.0

E

U

W1

W2

W1

W2

Figure 3 Reel Forms

4. Packing

Either one reel or five reels of photocouplers are packed in a shipping carton.

5. Label Indication

The carton bears a label indicating the product number, the symbol representing classification of

standard, the quantity, the lot number and the Toshiba company name.

6. Ordering Method

When placing an order, please specify the product number, the CTR rank, the tape type and the quantity

as shown in the following example.

（Example）

TLP285-4(GB-TP,F) 2500 Pcs

Quantity (must be a multiple of 2500)

[[G]]/RoHS COMPATIBLE (Note6)

Tape type

CTR rank

Device name

Note6:Please contact your TOSHIBA sales representative for details as to environmental matters such as the

RoHS compatibility of Product.

The RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003

on the restriction of the use of certain hazardous substances in electrical and electronics equipment.

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TLP285-4

TOSHIBA Photocoupler

Option:(V4)

Attachment

Types

: Specifications for EN60747-5-2 option: (V4)

: TLP285-4

Type designations for “option: (V4)”, which are tested under EN60747 requirements.

Ex.: TLP285-4 (V4GB-TP,F

V4 : EN60747 option

GB: CTR rank type

TP : Standard tape & reel type

F

: [[G]]/RoHS COMPATIBLE (Note6)

Note: Use TOSHIBA standard type number for safety standard application.

Ex.: TLP285-4 (V4GB-TP,F

→

TLP285-4

EN60747 Isolation Characteristics

Description

Symbol

Rating

Unit

Application classification

―

for rated mains voltage ≤ 150Vrms

for rated mains voltage ≤ 300Vrms

I-IV

I-III

Climatic classification

Pollution degree

55 / 110 / 21

2

―

Maximum operating insulation voltage

V

707

Vpk

IORM

Input to output test voltage, Method A

Vpr=1.5 × V

, type and sample test

V

1060

IORM

pr

tp=10s, partial discharge<5pC

Input to output test voltage, Method B

Vpr=1.875 × V

, 100% production test

1325

6000

Vpk

IORM

pr

tp=1s, partial discharge<5pC

Highest permissible overvoltage

V

TR

(transient overvoltage, tpr=60s）

Safety limiting values (max. permissible ratings in case of fault,

also refer to thermal derating curve)

current (input current I , Psi=0)

F

power (output or total power dissipation)

temperature

I

P

T

250

400

150

mA

mW

℃

si

Insulation resistance

V =500V, Ta=T

IO

R

si

≥10⁹

ꢀ

si

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TLP285-4

Insulation Related Specifications

Minimum creepage distance

Minimum clearance

Cr

Cl

5.0mm

0.4mm

175

Minimum insulation thickness

Comparative tracking index

ti

CTl

1. If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value.

(e.g. at a standard distance between soldering eye centers of 3.5mm).

If this is not permissible, the user shall take suitable measures.

2. This photocoupler is suitable for ‘safe electrical isolation’ only within the safety limit data.

Maintenance of the safety data shall be ensured by means of protective circuit.

VDE test sign：Marking on product

for EN60747

Ｖ

：Marking on packing

for EN60747

DE

V

Marking Example：TLP285-4(F)

Lot No.

Type name

TLP285－4

CTR Rank Marking

V

1pin indication

Mark for option (V4))

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TLP285-4

1

Partial discharge measurement procedure according to EN60747

Destructive test for qualification and sampling tests.

Figure

Method A

V

(6kV)

INITIAL

V

(for type and sampling tests,

destructive tests)

V

(1060V)

pr

t_{1, 2}

t

= 1 to 10 s

= 1 s

V

(707V)

t

IORM

t_{3, 4}

t

t_p(Measuring time for

partial discharge)

= 10 s

= 12 s

= 60 s

0

t

3

P

4

t_b

t_ini

t

b

t

1

ini

2

Figure

2

Partial discharge measurement procedure according to EN60747

Non-destructive test for100% inspection.

Method B

V

(1325V )

pr

V

(for sample test,non-

destructive test)

V

(707V )

IORM

= 0.1 s

t₃, t₄

t_p(Measuring time for

partial discharge)

t_b

= 1 s

= 1.2 s

t

P

t

3

b

t

4

3

Dependency of maximum safety ratings on ambient temperature

Figure

500

400

300

Psi

(mW)

Isi

(mA)

400

300

200

100

0

200

100

→

Psi

Isi ←

0

25

50

75

100

Ta (°C)

125

150

175

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TLP285-4

RESTRICTIONS ON PRODUCT USE

•

Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information

in this document, and related hardware, software and systems (collectively “Product”) without notice.

This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with

TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.

Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are

responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and

systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily

injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must

also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,

the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA

Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are

solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the

appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any

information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other

referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO

LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.

•

Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring

equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.

Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or

reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious

public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used

in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling

equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric

power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this

document.

•

Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.

Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any

applicable laws or regulations.

•

The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any

infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to

any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.

ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE

FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY

WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR

LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND

LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO

SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS

FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.

•

GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or

vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.

Do not use or otherwise make available Product or related software or technology for any military purposes, including without

limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile

technology products (mass destruction weapons). Product and related software and technology may be controlled under the

Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product

or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.

•

Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.

Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,

including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of

noncompliance with applicable laws and regulations.

16

2009-05-27


型号：	TLP285-4(GB,F
厂家：	TOSHIBA
描述：	Transistor Output Optocoupler, 4-Element, 3750V Isolation 晶体光电二极管晶体管光电晶体管输出元件
文件：	总16页 (文件大小：326K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

TLP285-4(GB,F [TOSHIBA]

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