TLP2066(V4-TPR,F) [TOSHIBA]
Optocoupler - IC Output, 1 CHANNEL LOGIC OUTPUT OPTOCOUPLER, 20 Mbps, ROHS COMPLIANT, 11-4C2, MINIFLAT, MFSOP-5/6;
| 型号： | TLP2066(V4-TPR,F) |
| 厂家： | 
TOSHIBA |
| 描述： | Optocoupler - IC Output, 1 CHANNEL LOGIC OUTPUT OPTOCOUPLER, 20 Mbps, ROHS COMPLIANT, 11-4C2, MINIFLAT, MFSOP-5/6 输出元件 光电 |
| 文件： | 总16页 (文件大小：313K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TLP2066
TOSHIBA PHOTOCOUPLER GaAℓAs IRED & PHOTO-IC
TLP2066
FA (Factory Automation)
Unit in mm
High Speed Interface
3.3V Supply Voltage
The Toshiba TLP2066 consists of a GaAℓAs light-emitting diode and an
integrated high-gain, high-speed photodetector. TLP2066 operates with 3.3 V
supply voltage. Toshiba offers TLP116 for supply voltage 5V type.
z
z
z
z
z
z
Inverter logic (totem pole output)
Package type : MFSOP6
Guaranteed performance over temperature : -40 to 100°C
Power supply voltage : 3.0 to 3.6V
Input threshold current: I
=5mA (Max.)
/t ): 60ns (Max.)
FHL
Propagation delay time (t
pHL pLH
z
z
z
Switching speed : 20MBd (Typ.) (NRZ)
JEDEC
Common mode transient immunity : 15 kV/μs
JEITA
Isolation voltage : 3750 V
rms
TOSHIBA
11-4C2
Weight: 0.09 g(Typ.)
z
z
UL Recognized : UL1577, File No. E67349
cUL Recognized : CSA Component Acceptance Service No.5A
Pin Configuration (top view)
z
Option (V4)
1
6
5
4
1: ANODE
3: CATHODE
4: GND
V
VDE approved
Maximum operating insulation voltage : 565 Vpk
Highest permissible over voltage : 6000 Vpk
: EN60747-5-2
CC
( Note ) When a EN60747-5-2 approved type is needed,
please designate the “Option(V4)”
5: V
6: V
O
GND
3
CC
SHIELD
Construction Mechanical Rating
Schematic
I
CC
V
CC
Truth Table
6
I
F
Tr1
Tr2
1+
Input
H
LED
ON
Tr1
Tr2
Output
I
O
5
V
3-
F
V
O
OFF ON
ON OFF
L
OFF
H
L
GND
SHIELD
4
A 0.1μF bypass capacitor must be
connected between pins 6 and 4.
1
2010-06-17
TLP2066
Absolute Maximum Ratings (Ta=25°C)
Characteristic
Forward current
Symbol
Rating
Unit
mA
mA/°C
A
I
25
F
Forward current derating (Ta≥85°C)
Peak transient forward current
Reverse voltage
ΔI /ΔTa
F
-0.63
(Note 1)
(Note 2)
I
1
FPT
V
5
V
R
O
Output current
I
10
mA
V
Output voltage
V
6
6
O
Supply voltage
V
V
CC
Output power dissipation
Operating temperature range
Storage temperature range
Lead solder temperature (10s)
Isolation voltage (AC,1min.,R.H.≤60%,Ta=25°C)
P
40
mW
°C
O
T
opr
-40 to 100
-55 to 125
260
T
stg
T
sol
°C
°C
(Note 3)
BV
3750
V
rms
s
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in reliability significantly even if the
operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: Pulse width PW≤1us, 300pps.
Note 2: Derate 0.25 mA/˚C above 85˚C.
Note 3: This device is regarded as a two-terminal device: pins 1 and 3 are shorted together, as are pins 4, 5 and 6.
Recommended Operating Conditions
Characteristic
Input current , ON
Symbol
Min
8
Typ.
—
Max
18
Unit
mA
V
I
F(ON)
—
Input voltage , OFF
Supply voltage(*)
V
0
0.8
3.6
F(OFF)
(Note 4)
3.0
3.3
V
V
CC
(*) This item denotes operating ranges, and does not imply recommended operating conditions.
Note: Recommended operating conditions are given as a design guideline to obtain the expected
performance of the device. In addition, each item is an independent guideline.
In developing designs using this product, please confirm the specified characteristics shown in this
document.
Note 4: The detector of this product requires a power supply voltage (V ) of 3.0 V or higher for stable operation.
CC
If V
CC
is lower than this value, I may increase, or the output may become unstable.
CCH
Be sure to check the supply current, and the on/off operation of the power supply before using the product.
Note 5: A ceramic capacitor(0.1 μF) should be connected from pin 6 to pin 4 to stabilize the operation of the
high gain linear amplifier. Failure to do so may impair the switching property.
The total lead length between the capacitor and the photocoupler should not exceed 1 cm.
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2010-06-17
TLP2066
Electrical Characteristics
(Unless otherwise specified, Ta=-40 to 100°C, V =3.0 to 3.6 V)
CC
Test
Circuit
Characteristic
Symbol
Conditions
Min.
1.45
—
Typ.
1.6
Max.
1.85
Unit
V
—
Input forward voltage
V
I
I
= 10 mA ,Ta = 25°C
F
F
F
Temperature coefficient
of forward voltage
—
—
ΔV /ΔTa
= 10 mA
-1.2
—
mV/°C
μA
F
—
—
Input reverse current
I
V
= 6 V, Ta = 25 °C
R
10
R
—
1
—
—
2.0
—
—
3.0
60
—
—
—
—
—
Input capacitance
C
V = 0, f = 1 MHz, Ta = 25°C
—
0.6
—
pF
V
T
Logic low output voltage
Logic high output voltage
Logic low supply current
Logic high supply current
Supply voltage
V
I
I
I
= 1.6 mA, I = 12 mA
OL F
OL
V
2
=-0.02mA, V =1.05V (Note 6)
V
OH
OH
F
I
3
= 12 mA, V = 3.3 V
CC
5.0
5.0
3.6
mA
mA
V
CCL
F
I
4
V
= 0 V, V = 3.3 V (Note 4)
CC
CCH
F
V
—
—
CC
Input current logic low
output
—
—
I
I
I
= 1.6 mA, V < 0.6V
—
—
—
5
mA
V
FHL
O
O
Input voltage logic high
output
—
V
= -0.02 mA, V > 2.0V
0.8
FLH
O
O
*All typical values are at Ta=25°C, VCC=3.3V, I (ON) =12mA unless otherwise specified.
F
Note 6: V
=V
–V [V]
CC
OH
O
Isolation Characteristics (Ta = 25°C)
Characteristic
Symbol
Test Conditions
= 0, f = 1MHz
s
Min.
Typ.
0.8
14
Max.
Unit
Capacitance input to output
Isolation resistance
C
R
V
(Note 3)
―
―
―
pF
S
S
12
1×10
(Note 3)
10
Ω
R.H. ≤ 60%,V = 500V
S
AC,1 minute
3750
―
―
―
―
―
V
rms
Isolation voltage
BV
S
AC,1 second,in oil
DC,1 minute,in oil
10000
10000
―
V
dc
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2010-06-17
TLP2066
Switching Characteristics
(Unless otherwise specified, Ta=-40 to 100°C, VCC=3.3V)
Test
Circuit
Characteristic
Symbol
Conditions
Min.
Typ.
Max.
60
Unit
ns
Propagation delay time
to logic high output
R
=100Ω
I
I
= 0→12mA
= 12→0mA
—
—
t
IN
F
F
pHL
C =15pF
L
5
Propagation delay time
to logic low output
(Note 7)
—
—
—
—
—
—
—
—
t
60
60
60
30
ns
ns
ns
ns
pLH
Propagation delay time
to logic high output
V
= 0→3.3V
IN
(I = 0→8mA)
R
C
=220Ω
IN
t
t
pHL
pLH
F
47pF
=
IN
6
5
C =15pF
L
(Note 7)
Propagation delay time
to logic low output
V
= 3.3→0V
IN
(I = 8→0mA)
F
Switching time dispersion
between ON and OFF
|t
-
I
= 12 mA, R =100Ω,
F IN
= 15 pF (Note 7)
L
pHL
C
t
|
pLH
R
C
= 100Ω
IN
= 15pF
I
= 0→12 mA
= 12→0 mA
—
—
—
—
Output fall time (90-10%)
Output rise time (10-90%)
t
f
4
5
ns
ns
F
L
I
t
(Note 7)
F
r
Common mode transient
immunity at high Level
output
V
V
= 1000Vp-p, I =0mA,
F
CM
—
—
—
—
CM
15000
V/μs
V/μs
H
(Min) = 2V, Ta = 25°C
O
7
Common mode transient
immunity at low level
output
V
V
= 1000 Vp-p, I = 12 mA,
F
CM
CM
-15000
L
(Max) = 0.8V, Ta=25°C
O
*All typical values are at Ta=25°C
Note 7: C is approximately 15pF which includes probe and jig/stray wiring capacitance.
L
TEST CIRCUIT 1: V
TEST CIRCUIT 2: V
OL
OH
I
→
F
6
1
V
CC
6
5
4
1
V
0.1uF
V
CC
V
I
O
OH
5
4
↑
V
↑
V
CC
V
CC
I
OL
OL
3
GND
0.1uF
↑
V
3
SHIELD
GND
SHIELD
V
=V
–V [V]
CC
OH
O
TEST CIRCUIT 3: I
TEST CIRCUIT 4: I
CCL
CCH
I
→
I
F
1
I
CCL
6
CCH
1
6
5
4
A
V
CC
V
A
CC
0.1uF
5
0.1uF
V
CC
V
↑
CC
3
4
GND
3
GND
SHIELD
SHIELD
4
2010-06-17
TLP2066
TEST CIRCUIT 5: t
, t
pHL pLH
I =12mA (P.G)
F
(f=5MHz, duty=50%
t
=t =5ns)
f
50%
r
V
CC
V
I
o
F
MONITORING
NODE
0.1uF
INPUT
MONITORING
NODE
t
f
t
r
V
O
V
90% OH
V
CC
GND
C
=15pF
L
SHIELD
=100Ω
C
=15pF
1.5V
L
R
10%
IN
V
O
t
t
pLH
pHL
C
is capacitance of the probe and jig.
L
(P.G): Pulse Generator
TEST CIRCUIT 6: t
, t
pHL pLH
V
=3.3V (P.G)
IN
INPUT MONITORING NODE
(f=5MHz, duty=50%
t
= t =5ns)
r
f
50%
V
CC
V
V
IN
o
0.1uF
MONITORING
NODE
C =15pF
L
t
t
f
r
V
O
V
90% OH
V
CC
GND
C
=15pF
L
SHIELD
1.5V
C
=47pF
10%
IN
R
=220Ω
IN
V
O
t
t
pLH
pHL
C
is capacitance of the probe and jig.
L
(P.G): Pulse Generator
TEST CIRCUIT 7: Common-Mode Transient Immunity Test Circuit
90%
10%
1000V
6
I
1
3
F
SW
→
V
CC
t
r
t
f
A
0.1uF
B
5
4
V
O
V
・SW B: I =0mA
CC
F
CM
H
GND
2V
SHIELD
0.8V
・SW A: I =12mA
CM
F
L
V
CM
800(V)
800(V)
CM
=
CM =
H
L
(μs)
(μs)
t
f
t
r
5
2010-06-17
TLP2066
I
- V
∆V /∆Ta-I
F
F
F
F
100
10
1
-3
-2.5
-2
25°C
100°C
-40°C
-1.5
-1
-0.5
0
0.1
0.1
1
10
100
1
1.2
1.4
1.6
1.8
2
Forward Voltage V (V)
F
Forward Current I (mA)
F
V
-Ta
V
-Ta
OH
OL
6
1
0.8
0.6
0.4
0.2
0
I
=1.6mA , I =12mA,
F
OL
V
=3.3V
CC
5
4
3
2
1
0
I
=-0.02mA , V =1.05V
OH
F
V
=3.3V
CC
-40 -20
0
20 40 60 80 100
-40 -20
0
20 40 60 80 100
Ambient Temperature Ta(℃)
Ambient Temperature Ta(℃)
I
-Ta
I
-Ta
CCH
CCL
10
8
10
I
=12mA
V
V
=0V
F
F
V
=3.3V
CC
=3.3V
CC
8
6
4
2
0
6
4
2
0
-40 -20
0
20 40 60 80 100
-40 -20
0
20 40 60 80 100
Ambient Temperature Ta(℃)
Ambient Temperature Ta(℃)
*: The above graphs show typical characteristics.
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TLP2066
t
,t
pHL pLH
-Ta
t
,t
pHL pLH
-Ta
60
50
40
30
20
10
0
60
50
40
30
20
10
0
tpLH
tpHL
tpLH
tpHL
Test Circuit 6
Test Circuit 5
V
=3.3V,R =220Ω
I
=12mA,R =100Ω,
IN
IN
F
IN
C
=47pF,C =15pF,V =3.3V
C
=15pF,V =3.3V
IN CC
L
L
CC
-40 -20
0
20 40 60 80 100
-40 -20
0
20 40 60 80 100
Ambient Temperature Ta(℃)
Ambient Temperature Ta(℃)
t
,t
pHL pLH
-I
t
,t
-V
F
pHL pLH CC
60
50
40
30
20
10
60
50
40
30
20
10
0
tpLH
tpLH
tpHL
tpHL
Test Circuit 5
=12mA , RIN=100Ω
Test Circuit 5
I
F
R
IN=100Ω , C =15pF
L
C
=15pF , Ta=25°C
L
V
=3.3V , Ta=25°C
CC
3
3.3
3.6
0
5
10
15
20
25
Forward Current I (mA)
F
Supply Voltage V
(V)
CC
|t
-t
pHL pLH
|-Ta
I
-Ta
FHL
5
4
3
2
1
0
30
25
20
15
10
5
I
=1.6mA
<0.6V
Test Circuit 5
Test Circuit 6
O
V
O
0
-40 -20
0
20 40 60 80 100
-40 -20
0
20 40 60 80 100
Ambient Temperature Ta(℃)
Ambient Temperature Ta(℃)
*: The above graphs show typical characteristics.
7
2010-06-17
TLP2066
Soldering and Storage
1. Soldering
1.1 Soldering
When using a soldering iron or medium infrared ray/hot air reflow, avoid a rise in device temperature as
much as possible by observing the following conditions.
1) Using solder reflow
·Temperature profile example of lead (Pb) solder
(°C)
240
This profile is based on the device’s maximum
heat resistance guaranteed value.
210
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste type used
by the customer within the described profile.
160
140
less than 30s
60 to 120s
Time
(s)
·Temperature profile example of using lead (Pb)-free solder
(°C)
260
This profile is based on the device’s maximum
heat resistance guaranteed value.
230
Set the preheat temperature/heating
temperature to the optimum temperature
corresponding to the solder paste type used
by the customer within the described profile.
190
180
60 to 120s
30 to 50s
Time
(s)
Reflow soldering must be performed once or twice.
The mounting should be completed with the interval from the first to the last mountings being 2
weeks.
2) Using solder flow (for lead (Pb) solder, or lead (Pb)-free solder)
・Please preheat it at 150°C between 60 and 120 seconds.
・Complete soldering within 10 seconds below 260°C. Each pin may be heated at most once.
3) Using a soldering iron
Complete soldering within 10 seconds below 260°C, or within 3 seconds at 350°C. Each pin may
be heated at most once.
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TLP2066
2. Storage
1) Avoid storage locations where devices may be exposed to moisture or direct sunlight.
2) Follow the precautions printed on the packing label of the device for transportation and storage.
3) Keep the storage location temperature and humidity within a range of 5°C to 35°C and 45% to 75%
respectively.
4) Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty
conditions.
5) Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during
storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the
solderability of the leads.
6) When restoring devices after removal from their packing, use anti-static containers.
7) Do not allow loads to be applied directly to devices while they are in storage.
8) If devices have been stored for more than two years under normal storage conditions, it is recommended
that you check the leads for ease of soldering prior to use.
9
2010-06-17
TLP2066
Specification for Embossed–Tape Packing
(TPL)(TPR) for Mini-flat Coupler
1. Applicable Package
Package
MFSOP
Product Type
Mini-flat coupler
2. Product Naming System
Type of package used for shipment is denoted by a symbol suffix after a product number. The method of
classification is as below.
(Example) TLP2066 (TPL, F)
[[G]]/RoHS COMPATIBLE (Note8)
Tape type
Device name
3. Tape Dimensions
3.1 Specification Classification are as shown in Table 1
Table 1 Tape Type Classification
Quantity
(pcs / reel)
Tape type
Classification
TPL
TPR
L direction
R direction
3000
3000
3.2 Orientation of Device in Relation to Direction of Tape Movement
Device orientation in the recesses is as shown in Figure 1.
Direction of Tape
L direction
R direction
Figure 1 Device Orientation
10
2010-06-17
TLP2066
3.3 Empty Device Recesses are as shown in Table 2.
Table 2 Empty Device Recesses
Standard
0
Remarks
Occurrences of 2 or
more successive
Within any given 40-mm section
of tape, not including leader
and trailer
empty
device
recesses
Single empty device
recesses
6 devices (max) per
reel
Not including leader and trailer
3.4 Start and End of Tape
The start of the tape has 50 or more empty holes. The end of tape has 50 or more empty holes and two empty
turns only for a cover tape.
3.5 Tape Specification
(1) Tape material: Plastic (protection against electrostatics)
(2) Dimensions: The tape dimensions are as shown in Figure 2 and Table 3.
0.3 ± 0.05
+0.1
−0
φ1.5
G
A
K
0
F
φ1.6 ± 0.1
3.15 ± 0.2
Figure 2 Tape Forms
Table 3 Tape Dimensions
Unit: mm
Unless otherwise specified: ±0.1
Symbol
Dimension
Remark
A
B
D
E
F
4.2
7.6
5.5
1.75
8.0
4.0
2.8
―
―
Centre line of indented square hole and sprocket hole
Distance between tape edge and hole center
+0.1
Cumulative error
Cumulative error
Internal space
(max) per 10 feed holes
(max) per 10 feed holes
-0.3
+0.1
-0.3
G
K
0
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2010-06-17
TLP2066
3.6 Reel
(1) Material: Plastic
(2) Dimensions: The reel dimensions are as shown in Figure 3 and Table 4.
Table 4 Reel Dimensions
Unit: mm
Symbol
A
Dimension
Φ380±2
Φ80±1
B
C
Φ13±0.5
2.0±0.5
4.0±0.5
13.5±0.5
17.5±1.0
U
E
E
U
W1
W2
W1
Figure 3 Reel Form
W2
4. Packing
Either one reel or five reels of photocouplers are packed in a shipping carton.
5. Label Indication
The carton bears a label indicating the product number, the symbol representing classification of standard,
the quantity, the lot number and the Toshiba company name.
6. Ordering Method
When placing an order, please specify the product number, the tape type and the quantity as shown in the
following example.
(Example)
(Example) TLP2066 (TPL, F) 3000 pcs
Quantity (must be a multiple of 3000)
[[G]]/RoHS COMPATIBLE (Note 8)
Tape type
Device name
Note 8 :Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS
compatibility of Product.
RoHS is the Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on
the restriction of the use of certain hazardous substances in electrical and electronics equipment.
12
2010-06-17
TLP2066
TOSHIBA Photocoupler
Option:(V4)
Attachment
Types
: Specifications for EN60747-5-2 option: (V4)
: TLP2066(F)
Type designations for “option: (V4)”, which are tested under EN60747 requirements.
Ex.: TLP2066 (V4-TPL,F)
V4 : EN60747 option
TPL
F : [[G]]/RoHS COMPATIBLE (Note 8)
:
Standard tape & reel type
Note: Use TOSHIBA standard type number for safety standard application.
Ex.: TLP2066 (V4-TPL,F)
→
TLP2066
EN60747 Isolation Characteristics
Description
Symbol
Rating
Unit
Application classification
for rated mains voltage ≤ 150Vrms
for rated mains voltage ≤ 300Vrms
I-IV
I-III
―
Climatic classification
Pollution degree
40 / 100 / 21
2
―
―
Maximum operating insulation voltage
V
565
850
Vpk
Vpk
IORM
Input to output test voltage, Method A
Vpr=1.5 × V
, type and sample test
V
pr
V
pr
IORM
tp=10s, partial discharge<5pC
Input to output test voltage, Method B
Vpr=1.875 × V
, 100% production test
1060
6000
Vpk
Vpk
IORM
tp=1s, partial discharge<5pC
Highest permissible overvoltage
V
TR
(transient overvoltage, tpr=60s）
Safety limiting values (max. permissible ratings in case of fault,
also refer to thermal derating curve)
current (input current I , Psi=0)
F
power (output or total power dissipation)
temperature
I
P
T
250
400
150
mA
mW
℃
si
si
si
Insulation resistance
9
>
R
si
10
Ω
V =500V, Ta=T
IO si
13
2010-06-17
TLP2066
Insulation Related Specifications
Minimum creepage distance
Minimum clearance
Cr
Cl
4.4mm
4.4mm
0.4mm
175
Minimum insulation thickness
Comparative tracking index
ti
CTl
1. If a printed circuit is incorporated, the creepage distance and clearance may be reduced below this value.
(e.g. at a standard distance between soldering eye centers of 3.5mm).
If this is not permissible, the user shall take suitable measures.
2. This photocoupler is suitable for ‘safe electrical isolation’ only within the safety limit data.
Maintenance of the safety data shall be ensured by means of protective circuit.
TÜV test sign：Marking on product
for EN60747
Ｖ
Marking Example： TLP2066
Lot No.
Type name without “TLP”
1pin indication
v
Mark for option(V4)
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2010-06-17
TLP2066
1
Partial discharge measurement procedure according to EN60747
Destructive test for qualification and sampling tests.
Figure
Method A
V
(6kV)
INITIAL
V
(for type and sampling tests,
destructive tests)
V
(850V)
V
pr
t1, 2
t
= 1 to 10 s
= 1 s
(565V)
t
IORM
t3, 4
t
tp(Measuring time for
partial discharge)
= 10 s
= 12 s
= 60 s
0
t
t
t
3
P
4
tb
tini
t
t
t
b
t
1
ini
2
Figure
2
Partial discharge measurement procedure according to EN60747
Non-destructive test for100% inspection.
Method B
V
(1060V)
pr
V
(for sample test,non-
destructive test)
V
(565V)
IORM
= 0.1 s
t3, t4
tp(Measuring time for
partial discharge)
tb
= 1 s
= 1.2 s
t
t
P
t
t
3
b
t
4
Figure
3
Dependency of maximum safety ratings on ambient temperature
500
500
400
300
Psi
(mW)
Isi
(mA)
400
300
200
100
0
200
100
→ Psi
Isi ←
0
0
25
50
75
100
Ta (°C)
125
150
175
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TLP2066
RESTRICTIONS ON PRODUCT USE
•
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relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for
Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for
the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product
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