TC9WMB1FK(TE85L,F) [TOSHIBA]

TC9WMB1FK(TE85L,F);
TC9WMB1FK(TE85L,F)
型号: TC9WMB1FK(TE85L,F)
厂家: TOSHIBA    TOSHIBA
描述:

TC9WMB1FK(TE85L,F)

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中文:  中文翻译
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TC9WMB1FK,TC9WMB2FK  
TOSHIBA CMOS Digital Integrated Circuits Silicon Monolithic  
TC9WMB1FK,TC9WMB2FK  
TC9WMB1FK: 1024-Bit (128 × 8 Bit) 2-Wire Serial EEPROM  
TC9WMB2FK: 2048-Bit (256 × 8 Bit) 2-Wire Serial EEPROM  
The TC9WMB1FK and TC9WMB2FK are electrically  
erasable/programmable nonvolatile memory (EEPROM).  
Features  
2-wire serial interface (I2C BUS)  
Single power supply  
Read: V  
= 1.8 to 5.5 V  
= 2.3 to 5.5 V  
CC  
Weight: 0.01 g (typ.)  
Write: V  
CC  
Low power consumption: 5 μA (in standby state)  
: 0.5 mA (in read state)  
Operating frequency: 400 kHz (V  
= 2.3 to 5.5 V)  
CC  
Byte write and page (8-byte) write  
Write protection  
Sequential read  
Write time: 10 ms (V  
= 3.0 to 5.5 V)  
CC  
CC  
12 ms (V  
= 2.3 to 2.7 V)  
Write endurance: 105 times  
Data retention: 10 years  
Wide operating temperature range: 40 to 85°C  
Package: US8  
Product Marking  
Pin Assignment (top view)  
V
WP SCL SDA  
CC  
8
7
6
5
US8  
Part number  
B1orB2  
9WM  
Pin 1 index  
1
2
3
4
NC NC NC GND  
1
2007-10-19  
TC9WMB1FK,TC9WMB2FK  
Block Diagram  
Serial clock input  
SCL  
Timing  
Control  
circuit  
Power supply  
V
Power supply  
CC  
generator  
(booster circuit)  
Serial input/output  
SDA  
Write protection input  
WP  
Command  
register  
Memory cell  
GND Ground  
Address  
decoder  
Address  
register  
Input/Output  
circuit  
Data register  
Pin Function  
Pin Name  
Input/Output  
Input  
Description  
Serial clock input  
SCL  
Data is fetched on a rising edge of SCL. Data is output on a falling edge of SCL.  
Serial input/output  
SDA  
Input/output  
This pin must be pulled up with a resistor because it is configured as an N-ch  
open-drain pin for output.  
Write protection input  
WP  
NC  
Input  
A high on this input disables writing. A low on this input enables writing.  
No connection (not connected internally)  
1.8 to 5.5 V (for reading)  
2.3 to 5.5 V (for writing)  
V
CC  
Power supply  
GND  
0 V (GND)  
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2007-10-19  
TC9WMB1FK,TC9WMB2FK  
Functional Description  
1. Start and Stop Conditions  
When SCL is high, pulling SDA low produces a start condition and pulling SDA high produces a stop  
condition. Every instruction is started when a start condition occurs and terminated when a stop condition  
occurs.  
During a read, a stop condition causes the read to terminate and the chip to enter the standby state.  
During a write, a stop condition causes the fetching of write data to terminate, after which writing starts  
automatically. Upon the completion of writing, the chip enters the standby state.  
Start conditions of five times or more cannot be generated from stop condition to the next stop condition.  
t
t
t
SU.STO  
SU.STA HD.STA  
SCL  
SDA  
Start condition  
Stop condition  
Figure 1  
2. Modifying Data  
Data on the SDA input can be modified while SCL is low. When SCL is high, modifying the SDA input  
means a start or stop condition.  
t
t
HD.DAT  
SU.DAT  
SCL  
SDA  
Modify data  
Modify data  
Figure 2  
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3. Acknowledge  
Data is transmitted and received in 8-bit units. The receiver sends an acknowledge signal by outputting a  
low on SDA in the 9th clock cycle, indicating that it has received data normally. The transmitter releases  
the bus in the 9th clock cycle to receive an acknowledge signal.  
During a write, the chip is always the receiver so that it outputs an acknowledge signal each time it has  
received eight bits of data.  
During a read, the chip outputs an acknowledge signal after it receives an address following a start  
condition. Then, it outputs read data and releases the bus to wait for an acknowledge signal from the  
master. When it detects an acknowledge signal, it outputs data at the next address if it does not detect a  
stop condition. If the chip does not detect an acknowledge signal, it stops read operation, and enters the  
standby state when a stop condition occurs subsequently.  
If the chip does not detect an acknowledge signal nor a stop condition, it keeps the bus released.  
SCL  
1
8
9
SDA  
(input)  
SDA  
(output)  
t
t
DH  
AA  
Start condition  
Acknowledge output  
Figure 3  
4. Device Addressing  
After a start condition occurs, a 7-bit device address and a 1-bit read/write instruction code are input to  
the chip.  
The upper four bits are called device code, which must always be “1010”. The next three bits are used to  
select a device on the bus. These three bits are not specified for this IC and can be set to any value.  
The least significant bit ( R/W : READ/WRITE ) indicates a read instruction when set to 1 and a write  
instruction when set to 0.  
An instruction is not executed if the device address does not match the specified value.  
Read/write instruction  
Device address  
Device code  
code  
1
0
1
0
×
×
×
R/ W  
MSD  
×: Don’t care  
LSB  
Figure 4  
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5. Write Operation  
(1) Byte write  
A byte write writes data to a specified address. After a start condition, input a device address,  
R/W (= 0), a word address, and write data.  
When a stop condition is entered subsequently, write operation starts automatically, rewriting the  
data at the specified address with the input data. A next instruction cannot be accepted while write  
operation is in progress. Therefore, no acknowledge signal is returned. After writing the data, the chip  
automatically enters the standby state.  
S
T
A
R
T
W
R
I
T
E
S
T
O
P
DEVICE  
ADDRESS  
WORD  
ADDRESS  
WRITE  
DATA  
*
WWWWWWWW D D D D D D D D  
7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0  
SDA LINE  
1 0 1 0 × × × 0  
M
L R A M  
S / C S  
K B  
L A  
S C  
B K  
A
C
K
S
B
B
W
Address  
increment  
: Don’t care for the TC9WMB1FK  
Figure 5  
(2) Page write  
A page write writes up to eight bytes of data collectively to a specified page. After a start condition,  
input a device address, R/W (= 0), a word address (n), and write data (n), in the same way as for a  
byte write. Then, input write data (n + 1) immediately without entering a stop condition, while  
checking that an acknowledge signal is asserted (0).  
The upper four bits (W3 to W6) of the word address are fixed and the lower three bits (W0 to W2)  
are automatically incremented so that up to eight bytes of data can be input.  
When the last address within the page is reached, the lower three bits (W0 to W2) of the word  
address are rolled over to the first address of the page. If more than eight bytes of write data are  
input, the last eight bytes are valid.  
When a stop condition is entered subsequently, write operation starts automatically, rewriting the  
data at the specified addresses with the input data.  
S
T
A
R
T
W
R
I
T
E
S
T
O
P
DEVICE  
ADDRESS  
WORD  
ADDRESS (n)  
WRITE  
DATA (n)  
WRITE  
DATA (n + 1)  
WRITE  
DATA (n + m)  
*
WWWWWWWW D D D D D D D D D D D D D D D D  
7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0  
D D D D D D  
5 4 3 2 1 0  
SDA LINE  
1 0 1 0 × × × 0  
M
S
B
L R A  
S / C  
W
A
C
K
A
C
K
A
C
K
A
C
K
B
K
Address  
increment  
Address  
increment  
Address  
increment  
*: Don’t care for the TC9WMB1FK  
Figure 6  
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2007-10-19  
TC9WMB1FK,TC9WMB2FK  
(3) Acknowledge polling  
Acknowledge polling is a feature for determining whether rewrite operation is in progress. During  
rewrite operation, input a start condition, a device address, and R/W (= 0 or 1). The acknowledge  
feature does not output an acknowledge signal while rewrite operation is in progress. It outputs a low  
acknowledge signal if rewriting has already completed.  
If the next instruction is a write, input a word address and write data subsequently. If the next  
instruction is a read, supply a stop condition and then start read operation.  
(4) Write protection  
Driving the write protection (WR) pin high causes the TC9WMB1FK to protect the entire memory  
area from being written and the TC9WMB2FK to protect the bottom half (80h to FFh) of the memory  
area from being written. Rewriting is allowed when the write protection pin is low. While a write is in  
progress, driving the WP pin high does not stop write operation.  
Reading is always enabled regardless of whether the WP pin is high or low.  
6. Read Operation  
Read operation is performed in one of three modes: current address read, random read, and sequential  
read.  
For reading, enter a device address and R/W (= 1) after a start condition. After read data is output,  
terminate read operation by inputting a high acknowledge signal (or releasing the bus without supplying an  
acknowledge signal) and then supplying a stop condition.  
(1) Current address read  
The internal address counter maintains the address that is next to the last accessed (read or  
written) word address (n). In current address read mode, data is read from address n + 1, as indicated  
by the address counter.  
In current address read mode, entering a device address and R/W (= 1) after a start condition  
causes the chip to output a low acknowledge signal and then data at the address indicated by the  
internal address counter.  
The address counter is incremented on a falling edge of the SCL pulse where the eighth bit is  
output. If the previous operation was reading data from the last address, the current address is rolled  
over to address 0. If the previous operation was writing data to the last address of the page, the  
address is rolled over to the first address of the page.  
The current address is maintained in an internal register so that it is lost when the power is turned  
off. For the first read after power-up, specify an address by performing a random read.  
S
T
A
R
T
R
E
A
D
S
T
O
P
DEVICE  
ADDRESS  
D D D D D D D D  
7 6 5 4 3 2 1 0  
SDA LINE  
1 0 1 0 × × × 1  
M
S
B
L R A  
S / C  
W
N
O
READ  
DATA  
B
K
A
C
K
Address  
increment  
Figure 7  
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2007-10-19  
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(2) Random read  
A random read reads data at a specified address. A dummy write is necessary to specify an address.  
In random read mode, enter a device address, R/W (= 0), and a word address after a start condition.  
Unlike a byte or page write, where write data is entered immediately, a dummy write only specifies a  
word address. Then, supply a start condition and enter a device address and R/W (= 1) in the same  
way as for a current address read, to read data from the specified address.  
S
T
A
R
T
W
R
I
T
E
S
T
A
R
T
R
E
A
D
S
T
O
P
DEVICE  
ADDRESS  
WORD  
ADDRESS (n)  
DEVICE  
ADDRESS  
*
WWWWWWWW  
7 6 5 4 3 2 1 0  
D D D D D D D D  
7 6 5 4 3 2 1 0  
SDA LINE  
1 0 1 0 × × × 0  
1 0 1 0 × × × 1  
M
S
B
L R A M  
S / C S  
K B  
L A  
S C  
B K  
M
S
B
L
S
B
A
C
K
N
O
DATA (n)  
READ  
DATA (n)  
B
W
A
C
K
DUMMY WRITE  
Address  
increment  
*: Don’t care for the TC9WMB1FK  
Figure 8  
(3) Sequential read  
A sequential read reads data sequentially from successive word addresses.  
For either current address read or random read, upon receiving a start condition, a device address  
and R/W (= 1), an acknowledge (low) is placed on the SDA line, followed by the data at the address  
pointed to by the internal address counter. When an acknowledge (low) is then received, the word  
address is automatically incremented so that the next data is driven out.  
After the last address is reached, the word address is rolled over to address 0.  
R
E
A
D
S
T
O
P
A
C
K
A
C
K
A
C
K
DEVICE  
ADDRESS  
D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D  
7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0  
SDA LINE  
1
R A  
/ C  
W
N
O
DATA (n)  
DATA (n + 1)  
DATA (n + 2)  
DATA (n + m)  
READ  
DATA (n)  
READ  
DATA (n + 1)  
READ  
DATA (n + 2)  
READ  
DATA (n + m)  
K
A
C
K
Address  
increment  
Address  
increment  
Address  
increment  
Address  
increment  
Figure 9  
7
2007-10-19  
TC9WMB1FK,TC9WMB2FK  
7. Notes on Use  
(1) Powering up the chip  
This IC contains a power-on clear circuit, which initializes the internal circuit of the IC when the  
power is turned on. If initialization fails, the chip may malfunction. When powering up the chip,  
observe the following precautions to assure that the clear circuit will operate normally:  
(a) Pull SCL and SDA high.  
(b) The power rising time (tR) must be 10 ms or less.  
(c) After turning off the power, wait at least 100 ms (tOFF) before attempting to power up the chip  
again.  
(d) The supply voltage must rise from a voltage lower than 0.1 V.  
(e) After turning on the power, wait at least 10 ms before attempting to send an instruction to the  
chip.  
V
CC  
V
CC  
0.1 V max  
0 V  
t
R
t
OFF  
10 ms  
Figure 10  
(2) Pulling up the SDA and SCL pins  
This IC requires the SDA and SCL pins to be pulled up with an external resistor. The recommended  
pull-up resistance range is 1 kΩ to 10 kΩ.  
(3) Noise elimination time for the SDA and SCL pins  
This IC contains a low-pass filter for eliminating noise on the SDA and SCL pins. Its guaranteed  
value corresponds to the noise suppression time Ti, given in the AC characteristics table.  
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TC9WMB1FK,TC9WMB2FK  
Absolute Maximum Ratings (Note) (GND = 0 V)  
Characteristics  
Supply voltage  
Symbol  
Rating  
Units  
V
0.3~7.0  
V
V
CC  
Input voltage  
V
0.3~V  
+ 0.3  
IN  
CC  
CC  
Output voltage  
V
OUT  
0.3~V  
+ 0.3  
V
Power dissipation  
Storage temperature  
Operating temperature  
P
200 (25°C)  
55~125  
40~85  
mW  
°C  
°C  
D
T
stg  
opr  
T
Note: Exceeding any of the absolute maximum ratings, even briefly, lead to deterioration in IC performance or even  
destruction.  
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings and the operating ranges.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Operating Ranges (Note) (GND = 0 V, T  
= −40 to 85°C)  
opr  
Characteristics  
Symbol  
Test Condition  
Min  
Max  
Unit  
Supply voltage (for reading)  
Supply voltage (for writing)  
V
V
1.8  
2.3  
5.5  
5.5  
V
V
CC  
CC  
0.7 ×  
CC  
2.3 V V  
1.8 V V  
2.3 V V  
1.8 V V  
5.5 V  
< 2.3 V  
5.5 V  
< 2.3 V  
V
V
CC  
CC  
CC  
CC  
CC  
CC  
V
High-level input voltage  
V
V
IH  
0.8 ×  
V
CC  
0
0.3 ×  
V
CC  
Low-level input voltage  
Operating frequency  
V
V
IL  
0.2 ×  
V
0
CC  
2.3 V V  
1.8 V V  
5.5 V  
< 2.3 V  
0
0
400  
100  
CC  
CC  
f
kHz  
SCL  
Note: The operating ranges must be maintained to ensure the normal operation of the device.  
Unused inputs must be tied to either VCC or GND.  
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Electrical Characteristics  
DC Characteristics (GND = 0 V, T  
= −40 to 85°C)  
opr  
1.8 V  
Min  
< 2.3 V 2.3 V  
3.6 V 4.5 V  
CC  
5.5 V  
Max  
±1  
Test  
CC  
CC  
Characteristics  
Symbol  
Unit  
Condition  
Max  
±1  
Min  
Max  
±1  
Min  
Input current  
I
LI  
μA  
μA  
Output leakage current  
Low-level output voltage  
I
±1  
±1  
±1  
LO  
I
I
= 3.2 mA  
= 1.5 mA  
0.4  
0.4  
OL  
V
V
OL  
0.5  
5
OL  
Quiescent supply current  
Supply current during read  
Supply current during write  
I
I
I
5
5
μA  
mA  
mA  
CC1  
CC2  
CC3  
f = 400 kHz  
f = 400 kHz  
0.2*  
0.3  
1.5  
0.5  
2.0  
*: f = 100 kHz  
AC Characteristics (GND = 0 V, T  
= −40 to 85°C)  
opr  
Test Conditions  
V
CC  
Input pulse voltage  
Input rise/fall time  
Input/output testing voltage  
Output load  
0.1 × V ~0.9 × V  
CC  
CC  
R
= 1 kΩ  
L
20 ns  
SDA  
0.5 × V  
CC  
C
L
= 100 pF  
100 pF + 1 kΩ pull-up resistor  
1.8 V  
< 2.3 V 2.3 V  
3.6 V 4.5 V  
5.5 V  
Max  
400  
CC  
CC  
CC  
Characteristics  
Symbol  
Unit  
Min  
Max  
100  
Min  
0
Max  
400  
Min  
0
SCL clock frequency  
SCL clock “low” time  
SCL clock “high” time  
Noise suppression time  
SDA output delay  
f
0
kHz  
μs  
μs  
ns  
μs  
μs  
μs  
μs  
ns  
ns  
μs  
μs  
μs  
ns  
SCL  
t
4.7  
4.0  
1.2  
0.6  
1.2  
0.6  
LOW  
t
HIGH  
t
100  
4.5  
50  
0.9  
50  
I
t
0.1  
4.7  
4.0  
4.7  
0
0.1  
1.2  
0.6  
0.6  
0
0.1  
1.2  
0.6  
0.6  
0
0.9  
AA  
Bus free time  
t
BUF  
Start condition hold time  
Start condition setup time  
Data input hold time  
Data input setup time  
SCL, SDA input rise time  
SCL, SDA input fall time  
Stop condition setup time  
SDA output hold time  
t
HD.STA  
t
SU.STA  
HD.DAT  
t
t
250  
200  
200  
SU.DAT  
t
R
1.0  
0.3  
0.3  
0.3  
0.3  
0.3  
t
F
t
4.7  
100  
0.6  
50  
0.6  
50  
SU.STO  
t
DH  
10  
2007-10-19  
TC9WMB1FK,TC9WMB2FK  
EEPROM Characteristics (GND = 0 V, 2.3 V V 2.7 V, T  
= −40 to 85°C)  
CC  
opr  
Characteristics  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
Write time  
t
1 × 10  
10  
12  
ms  
WR  
5
Rewrite endurance  
Data retention time  
N
Times  
Years  
EW  
t
RET  
EEPROM Characteristics (GND = 0 V, 2.7 V < V 5.5 V, T  
= −40 to 85°C)  
CC  
opr  
Characteristics  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
Write time  
t
1 × 10  
10  
10  
ms  
WR  
5
Rewrite endurance  
Data retention time  
N
Times  
Years  
EW  
t
RET  
Capacitance Characteristics (Ta = 25°C)  
Characteristics  
Symbol  
Test Condition  
Typ.  
Unit  
V
(V)  
CC  
5
Input capacitance  
Output capacitance  
C
IN  
4
3
pF  
pF  
C
O
5
11  
2007-10-19  
TC9WMB1FK,TC9WMB2FK  
AC Characteristics Timing Charts  
t
F
t
t
t
R
HIGH  
LOW  
SCL  
t
SU.STO  
t
t
t
t
SU.DAT  
SU.STA  
HD.STA  
HD.DAT  
SDA  
(Input)  
t
t
t
BUF  
AA  
DH  
SDA  
(Output)  
Figure 11 Bus Timing  
SCL  
SDA  
(Input)  
D
O
t
WR  
Write data Acknowledge  
input output  
Stop  
condition  
Start  
condition  
Figure 12 Write Cycle Timing  
12  
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TC9WMB1FK,TC9WMB2FK  
Input/Output Circuits of Pins  
Pin  
Type  
Input/Output Circuit  
Remarks  
WP  
Input  
SCL  
SDA  
Input  
Input/output  
Open-drain output  
13  
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TC9WMB1FK,TC9WMB2FK  
Package Dimensions  
Weight: 0.01 g (typ.)  
14  
2007-10-19  
TC9WMB1FK,TC9WMB2FK  
RESTRICTIONS ON PRODUCT USE  
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information  
in this document, and related hardware, software and systems (collectively “Product”) without notice.  
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with  
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.  
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are  
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and  
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily  
injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must  
also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,  
the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA  
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are  
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the  
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any  
information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other  
referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO  
LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.  
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring  
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.  
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or  
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious  
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used  
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling  
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric  
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this  
document.  
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.  
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any  
applicable laws or regulations.  
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any  
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to  
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.  
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE  
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY  
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR  
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND  
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO  
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS  
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.  
Do not use or otherwise make available Product or related software or technology for any military purposes, including without  
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile  
technology products (mass destruction weapons). Product and related software and technology may be controlled under the  
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product  
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.  
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.  
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,  
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of  
noncompliance with applicable laws and regulations.  
15  
2007-10-19  

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