TC9WMB2FK(TE85L,F) [TOSHIBA]
TC9WMB2FK(TE85L,F);型号: | TC9WMB2FK(TE85L,F) |
厂家: | TOSHIBA |
描述: | TC9WMB2FK(TE85L,F) |
文件: | 总15页 (文件大小:263K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TC9WMB1FK,TC9WMB2FK
TOSHIBA CMOS Digital Integrated Circuits Silicon Monolithic
TC9WMB1FK,TC9WMB2FK
TC9WMB1FK: 1024-Bit (128 × 8 Bit) 2-Wire Serial EEPROM
TC9WMB2FK: 2048-Bit (256 × 8 Bit) 2-Wire Serial EEPROM
The TC9WMB1FK and TC9WMB2FK are electrically
erasable/programmable nonvolatile memory (EEPROM).
Features
•
•
2-wire serial interface (I2C BUS)
Single power supply
Read: V
= 1.8 to 5.5 V
= 2.3 to 5.5 V
CC
Weight: 0.01 g (typ.)
Write: V
CC
•
Low power consumption: 5 μA (in standby state)
: 0.5 mA (in read state)
•
•
•
•
•
Operating frequency: 400 kHz (V
= 2.3 to 5.5 V)
CC
Byte write and page (8-byte) write
Write protection
Sequential read
Write time: 10 ms (V
= 3.0 to 5.5 V)
CC
CC
12 ms (V
= 2.3 to 2.7 V)
•
•
•
•
Write endurance: 105 times
Data retention: 10 years
Wide operating temperature range: −40 to 85°C
Package: US8
Product Marking
Pin Assignment (top view)
V
WP SCL SDA
CC
8
7
6
5
US8
Part number
B1orB2
9WM
Pin 1 index
1
2
3
4
NC NC NC GND
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TC9WMB1FK,TC9WMB2FK
Block Diagram
Serial clock input
SCL
Timing
Control
circuit
Power supply
V
Power supply
CC
generator
(booster circuit)
Serial input/output
SDA
Write protection input
WP
Command
register
Memory cell
GND Ground
Address
decoder
Address
register
Input/Output
circuit
Data register
Pin Function
Pin Name
Input/Output
Input
Description
Serial clock input
SCL
Data is fetched on a rising edge of SCL. Data is output on a falling edge of SCL.
Serial input/output
SDA
Input/output
This pin must be pulled up with a resistor because it is configured as an N-ch
open-drain pin for output.
Write protection input
WP
NC
Input
A high on this input disables writing. A low on this input enables writing.
⎯
No connection (not connected internally)
1.8 to 5.5 V (for reading)
2.3 to 5.5 V (for writing)
V
CC
Power supply
GND
0 V (GND)
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TC9WMB1FK,TC9WMB2FK
Functional Description
1. Start and Stop Conditions
When SCL is high, pulling SDA low produces a start condition and pulling SDA high produces a stop
condition. Every instruction is started when a start condition occurs and terminated when a stop condition
occurs.
During a read, a stop condition causes the read to terminate and the chip to enter the standby state.
During a write, a stop condition causes the fetching of write data to terminate, after which writing starts
automatically. Upon the completion of writing, the chip enters the standby state.
Start conditions of five times or more cannot be generated from stop condition to the next stop condition.
t
t
t
SU.STO
SU.STA HD.STA
SCL
SDA
Start condition
Stop condition
Figure 1
2. Modifying Data
Data on the SDA input can be modified while SCL is low. When SCL is high, modifying the SDA input
means a start or stop condition.
t
t
HD.DAT
SU.DAT
SCL
SDA
Modify data
Modify data
Figure 2
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3. Acknowledge
Data is transmitted and received in 8-bit units. The receiver sends an acknowledge signal by outputting a
low on SDA in the 9th clock cycle, indicating that it has received data normally. The transmitter releases
the bus in the 9th clock cycle to receive an acknowledge signal.
During a write, the chip is always the receiver so that it outputs an acknowledge signal each time it has
received eight bits of data.
During a read, the chip outputs an acknowledge signal after it receives an address following a start
condition. Then, it outputs read data and releases the bus to wait for an acknowledge signal from the
master. When it detects an acknowledge signal, it outputs data at the next address if it does not detect a
stop condition. If the chip does not detect an acknowledge signal, it stops read operation, and enters the
standby state when a stop condition occurs subsequently.
If the chip does not detect an acknowledge signal nor a stop condition, it keeps the bus released.
SCL
1
8
9
SDA
(input)
SDA
(output)
t
t
DH
AA
Start condition
Acknowledge output
Figure 3
4. Device Addressing
After a start condition occurs, a 7-bit device address and a 1-bit read/write instruction code are input to
the chip.
The upper four bits are called device code, which must always be “1010”. The next three bits are used to
select a device on the bus. These three bits are not specified for this IC and can be set to any value.
The least significant bit ( R/W : READ/WRITE ) indicates a read instruction when set to 1 and a write
instruction when set to 0.
An instruction is not executed if the device address does not match the specified value.
Read/write instruction
Device address
Device code
code
1
0
1
0
×
×
×
R/ W
MSD
×: Don’t care
LSB
Figure 4
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TC9WMB1FK,TC9WMB2FK
5. Write Operation
(1) Byte write
A byte write writes data to a specified address. After a start condition, input a device address,
R/W (= 0), a word address, and write data.
When a stop condition is entered subsequently, write operation starts automatically, rewriting the
data at the specified address with the input data. A next instruction cannot be accepted while write
operation is in progress. Therefore, no acknowledge signal is returned. After writing the data, the chip
automatically enters the standby state.
S
T
A
R
T
W
R
I
T
E
S
T
O
P
DEVICE
ADDRESS
WORD
ADDRESS
WRITE
DATA
*
WWWWWWWW D D D D D D D D
7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0
SDA LINE
1 0 1 0 × × × 0
M
L R A M
S / C S
K B
L A
S C
B K
A
C
K
S
B
B
W
Address
increment
∗: Don’t care for the TC9WMB1FK
Figure 5
(2) Page write
A page write writes up to eight bytes of data collectively to a specified page. After a start condition,
input a device address, R/W (= 0), a word address (n), and write data (n), in the same way as for a
byte write. Then, input write data (n + 1) immediately without entering a stop condition, while
checking that an acknowledge signal is asserted (0).
The upper four bits (W3 to W6) of the word address are fixed and the lower three bits (W0 to W2)
are automatically incremented so that up to eight bytes of data can be input.
When the last address within the page is reached, the lower three bits (W0 to W2) of the word
address are rolled over to the first address of the page. If more than eight bytes of write data are
input, the last eight bytes are valid.
When a stop condition is entered subsequently, write operation starts automatically, rewriting the
data at the specified addresses with the input data.
S
T
A
R
T
W
R
I
T
E
S
T
O
P
DEVICE
ADDRESS
WORD
ADDRESS (n)
WRITE
DATA (n)
WRITE
DATA (n + 1)
WRITE
DATA (n + m)
*
WWWWWWWW D D D D D D D D D D D D D D D D
7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0
D D D D D D
5 4 3 2 1 0
SDA LINE
1 0 1 0 × × × 0
M
S
B
L R A
S / C
W
A
C
K
A
C
K
A
C
K
A
C
K
B
K
Address
increment
Address
increment
Address
increment
*: Don’t care for the TC9WMB1FK
Figure 6
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TC9WMB1FK,TC9WMB2FK
(3) Acknowledge polling
Acknowledge polling is a feature for determining whether rewrite operation is in progress. During
rewrite operation, input a start condition, a device address, and R/W (= 0 or 1). The acknowledge
feature does not output an acknowledge signal while rewrite operation is in progress. It outputs a low
acknowledge signal if rewriting has already completed.
If the next instruction is a write, input a word address and write data subsequently. If the next
instruction is a read, supply a stop condition and then start read operation.
(4) Write protection
Driving the write protection (WR) pin high causes the TC9WMB1FK to protect the entire memory
area from being written and the TC9WMB2FK to protect the bottom half (80h to FFh) of the memory
area from being written. Rewriting is allowed when the write protection pin is low. While a write is in
progress, driving the WP pin high does not stop write operation.
Reading is always enabled regardless of whether the WP pin is high or low.
6. Read Operation
Read operation is performed in one of three modes: current address read, random read, and sequential
read.
For reading, enter a device address and R/W (= 1) after a start condition. After read data is output,
terminate read operation by inputting a high acknowledge signal (or releasing the bus without supplying an
acknowledge signal) and then supplying a stop condition.
(1) Current address read
The internal address counter maintains the address that is next to the last accessed (read or
written) word address (n). In current address read mode, data is read from address n + 1, as indicated
by the address counter.
In current address read mode, entering a device address and R/W (= 1) after a start condition
causes the chip to output a low acknowledge signal and then data at the address indicated by the
internal address counter.
The address counter is incremented on a falling edge of the SCL pulse where the eighth bit is
output. If the previous operation was reading data from the last address, the current address is rolled
over to address 0. If the previous operation was writing data to the last address of the page, the
address is rolled over to the first address of the page.
The current address is maintained in an internal register so that it is lost when the power is turned
off. For the first read after power-up, specify an address by performing a random read.
S
T
A
R
T
R
E
A
D
S
T
O
P
DEVICE
ADDRESS
D D D D D D D D
7 6 5 4 3 2 1 0
SDA LINE
1 0 1 0 × × × 1
M
S
B
L R A
S / C
W
N
O
READ
DATA
B
K
A
C
K
Address
increment
Figure 7
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TC9WMB1FK,TC9WMB2FK
(2) Random read
A random read reads data at a specified address. A dummy write is necessary to specify an address.
In random read mode, enter a device address, R/W (= 0), and a word address after a start condition.
Unlike a byte or page write, where write data is entered immediately, a dummy write only specifies a
word address. Then, supply a start condition and enter a device address and R/W (= 1) in the same
way as for a current address read, to read data from the specified address.
S
T
A
R
T
W
R
I
T
E
S
T
A
R
T
R
E
A
D
S
T
O
P
DEVICE
ADDRESS
WORD
ADDRESS (n)
DEVICE
ADDRESS
*
WWWWWWWW
7 6 5 4 3 2 1 0
D D D D D D D D
7 6 5 4 3 2 1 0
SDA LINE
1 0 1 0 × × × 0
1 0 1 0 × × × 1
M
S
B
L R A M
S / C S
K B
L A
S C
B K
M
S
B
L
S
B
A
C
K
N
O
DATA (n)
READ
DATA (n)
B
W
A
C
K
DUMMY WRITE
Address
increment
*: Don’t care for the TC9WMB1FK
Figure 8
(3) Sequential read
A sequential read reads data sequentially from successive word addresses.
For either current address read or random read, upon receiving a start condition, a device address
and R/W (= 1), an acknowledge (low) is placed on the SDA line, followed by the data at the address
pointed to by the internal address counter. When an acknowledge (low) is then received, the word
address is automatically incremented so that the next data is driven out.
After the last address is reached, the word address is rolled over to address 0.
R
E
A
D
S
T
O
P
A
C
K
A
C
K
A
C
K
DEVICE
ADDRESS
D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D D
7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0
SDA LINE
1
R A
/ C
W
N
O
DATA (n)
DATA (n + 1)
DATA (n + 2)
DATA (n + m)
READ
DATA (n)
READ
DATA (n + 1)
READ
DATA (n + 2)
READ
DATA (n + m)
K
A
C
K
Address
increment
Address
increment
Address
increment
Address
increment
Figure 9
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TC9WMB1FK,TC9WMB2FK
7. Notes on Use
(1) Powering up the chip
This IC contains a power-on clear circuit, which initializes the internal circuit of the IC when the
power is turned on. If initialization fails, the chip may malfunction. When powering up the chip,
observe the following precautions to assure that the clear circuit will operate normally:
(a) Pull SCL and SDA high.
(b) The power rising time (tR) must be 10 ms or less.
(c) After turning off the power, wait at least 100 ms (tOFF) before attempting to power up the chip
again.
(d) The supply voltage must rise from a voltage lower than 0.1 V.
(e) After turning on the power, wait at least 10 ms before attempting to send an instruction to the
chip.
V
CC
V
CC
0.1 V max
0 V
t
R
t
OFF
10 ms
Figure 10
(2) Pulling up the SDA and SCL pins
This IC requires the SDA and SCL pins to be pulled up with an external resistor. The recommended
pull-up resistance range is 1 kΩ to 10 kΩ.
(3) Noise elimination time for the SDA and SCL pins
This IC contains a low-pass filter for eliminating noise on the SDA and SCL pins. Its guaranteed
value corresponds to the noise suppression time Ti, given in the AC characteristics table.
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Absolute Maximum Ratings (Note) (GND = 0 V)
Characteristics
Supply voltage
Symbol
Rating
Units
V
−0.3~7.0
V
V
CC
Input voltage
V
−0.3~V
+ 0.3
IN
CC
CC
Output voltage
V
OUT
−0.3~V
+ 0.3
V
Power dissipation
Storage temperature
Operating temperature
P
200 (25°C)
−55~125
−40~85
mW
°C
°C
D
T
stg
opr
T
Note: Exceeding any of the absolute maximum ratings, even briefly, lead to deterioration in IC performance or even
destruction.
Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings and the operating ranges.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Operating Ranges (Note) (GND = 0 V, T
= −40 to 85°C)
opr
Characteristics
Symbol
Test Condition
Min
Max
Unit
Supply voltage (for reading)
Supply voltage (for writing)
V
V
⎯
⎯
1.8
2.3
5.5
5.5
V
V
CC
CC
0.7 ×
CC
2.3 V ≤ V
1.8 V ≤ V
2.3 V ≤ V
1.8 V ≤ V
≤ 5.5 V
< 2.3 V
≤ 5.5 V
< 2.3 V
V
V
CC
CC
CC
CC
CC
CC
V
High-level input voltage
V
V
IH
0.8 ×
V
CC
0
0.3 ×
V
CC
Low-level input voltage
Operating frequency
V
V
IL
0.2 ×
V
0
CC
2.3 V ≤ V
1.8 V ≤ V
≤ 5.5 V
< 2.3 V
0
0
400
100
CC
CC
f
kHz
SCL
Note: The operating ranges must be maintained to ensure the normal operation of the device.
Unused inputs must be tied to either VCC or GND.
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Electrical Characteristics
DC Characteristics (GND = 0 V, T
= −40 to 85°C)
opr
1.8 ≤ V
Min
⎯
< 2.3 V 2.3 ≤ V
≤ 3.6 V 4.5 ≤ V
CC
≤ 5.5 V
Max
±1
Test
CC
CC
Characteristics
Symbol
Unit
Condition
Max
±1
Min
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Max
±1
Min
⎯
⎯
⎯
⎯
⎯
⎯
⎯
Input current
I
LI
⎯
⎯
μA
μA
Output leakage current
Low-level output voltage
I
⎯
±1
±1
±1
LO
I
I
= 3.2 mA
= 1.5 mA
⎯
⎯
⎯
0.4
⎯
0.4
⎯
OL
V
V
OL
⎯
0.5
5
OL
Quiescent supply current
Supply current during read
Supply current during write
I
I
I
⎯
5
5
μA
mA
mA
CC1
CC2
CC3
f = 400 kHz
f = 400 kHz
⎯
0.2*
⎯
0.3
1.5
0.5
2.0
⎯
*: f = 100 kHz
AC Characteristics (GND = 0 V, T
= −40 to 85°C)
opr
Test Conditions
V
CC
Input pulse voltage
Input rise/fall time
Input/output testing voltage
Output load
0.1 × V ~0.9 × V
CC
CC
R
= 1 kΩ
L
20 ns
SDA
0.5 × V
CC
C
L
= 100 pF
100 pF + 1 kΩ pull-up resistor
1.8 ≤ V
< 2.3 V 2.3 ≤ V
≤ 3.6 V 4.5 ≤ V
≤ 5.5 V
Max
400
⎯
CC
CC
CC
Characteristics
Symbol
Unit
Min
Max
100
⎯
Min
0
Max
400
⎯
Min
0
SCL clock frequency
SCL clock “low” time
SCL clock “high” time
Noise suppression time
SDA output delay
f
0
kHz
μs
μs
ns
μs
μs
μs
μs
ns
ns
μs
μs
μs
ns
SCL
t
4.7
4.0
⎯
1.2
0.6
⎯
1.2
0.6
⎯
LOW
t
⎯
⎯
⎯
HIGH
t
100
4.5
⎯
50
0.9
⎯
50
I
t
0.1
4.7
4.0
4.7
0
0.1
1.2
0.6
0.6
0
0.1
1.2
0.6
0.6
0
0.9
⎯
AA
Bus free time
t
BUF
Start condition hold time
Start condition setup time
Data input hold time
Data input setup time
SCL, SDA input rise time
SCL, SDA input fall time
Stop condition setup time
SDA output hold time
t
⎯
⎯
⎯
HD.STA
t
⎯
⎯
⎯
SU.STA
HD.DAT
t
⎯
⎯
⎯
t
250
⎯
⎯
200
⎯
⎯
200
⎯
⎯
SU.DAT
t
R
1.0
0.3
⎯
0.3
0.3
⎯
0.3
0.3
⎯
t
F
⎯
⎯
⎯
t
4.7
100
0.6
50
0.6
50
SU.STO
t
⎯
⎯
⎯
DH
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TC9WMB1FK,TC9WMB2FK
EEPROM Characteristics (GND = 0 V, 2.3 V ≤ V ≤ 2.7 V, T
= −40 to 85°C)
CC
opr
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
Write time
t
⎯
⎯
⎯
⎯
1 × 10
10
⎯
⎯
⎯
12
⎯
⎯
ms
WR
5
Rewrite endurance
Data retention time
N
Times
Years
EW
t
RET
EEPROM Characteristics (GND = 0 V, 2.7 V < V ≤ 5.5 V, T
= −40 to 85°C)
CC
opr
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
Write time
t
⎯
⎯
⎯
⎯
1 × 10
10
⎯
⎯
⎯
10
⎯
⎯
ms
WR
5
Rewrite endurance
Data retention time
N
Times
Years
EW
t
RET
Capacitance Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
Typ.
Unit
V
(V)
CC
5
Input capacitance
Output capacitance
C
IN
⎯
⎯
4
3
pF
pF
C
O
5
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TC9WMB1FK,TC9WMB2FK
AC Characteristics Timing Charts
t
F
t
t
t
R
HIGH
LOW
SCL
t
SU.STO
t
t
t
t
SU.DAT
SU.STA
HD.STA
HD.DAT
SDA
(Input)
t
t
t
BUF
AA
DH
SDA
(Output)
Figure 11 Bus Timing
SCL
SDA
(Input)
D
O
t
WR
Write data Acknowledge
input output
Stop
condition
Start
condition
Figure 12 Write Cycle Timing
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TC9WMB1FK,TC9WMB2FK
Input/Output Circuits of Pins
Pin
Type
Input/Output Circuit
Remarks
WP
Input
⎯
SCL
SDA
Input
⎯
Input/output
Open-drain output
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Package Dimensions
Weight: 0.01 g (typ.)
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RESTRICTIONS ON PRODUCT USE
•
•
•
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must
also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,
the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any
information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other
referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO
LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
•
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
•
•
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
•
•
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
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Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
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2007-10-19
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