SSM3K7002BFU [TOSHIBA]

High-Speed Switching Applications Analog Switch Applications; 高速开关应用模拟开关应用
SSM3K7002BFU
型号: SSM3K7002BFU
厂家: TOSHIBA    TOSHIBA
描述:

High-Speed Switching Applications Analog Switch Applications
高速开关应用模拟开关应用

开关
文件: 总5页 (文件大小:220K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SSM3K7002BFU  
TOSHIBA Field-Effect Transistor Silicon N Channel MOS Type (U-MOS)  
SSM3K7002BFU  
High-Speed Switching Applications  
Analog Switch Applications  
Unit: mm  
Small package  
Low ON-resistance : R  
= 3.3 Ω (max) (@V  
= 2.6 Ω (max) (@V  
= 2.1 Ω (max) (@V  
= 4.5 V)  
= 5 V)  
DS(ON)  
DS(ON)  
DS(ON)  
GS  
GS  
GS  
: R  
: R  
= 10 V)  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Drain-source voltage  
Symbol  
Rating  
Unit  
V
V
V
60  
DSS  
Gate-source voltage  
± 20  
200  
800  
150  
150  
V
GSS  
DC  
I
D
Drain current  
mA  
Pulse  
I
DP  
Drain power dissipation (Ta = 25°C)  
Channel temperature  
P
(Note 1)  
mW  
°C  
D
T
ch  
Storage temperature range  
T
stg  
55 to 150  
°C  
Note: Using continuously under heavy loads (e.g. the application of high  
temperature/current/voltage and the significant change in  
temperature, etc.) may cause this product to decrease in the  
reliability significantly even if the operating conditions (i.e.  
operating temperature/current/voltage, etc.) are within the  
absolute maximum ratings.  
JEDEC  
JEITA  
SC-70  
2-2E1E  
TOSHIBA  
Weight: 6.0 mg (typ.)  
Please design the appropriate reliability upon reviewing the  
Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and  
individual reliability data (i.e. reliability test report and estimated failure rate, etc).  
Note 1: mounted on FR4 board  
(25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 0.6mm2 × 3)  
0.6 mm  
1.0 mm  
Marking  
Equivalent Circuit (top view)  
3
3
NM  
1
2
1
2
1
2009-11-26  
SSM3K7002BFU  
Electrical Characteristics (Ta = 25°C)  
Characteristics  
Gate leakage current  
Symbol  
Test Condition  
= ± 20 V, V = 0 V  
Min  
Typ  
Max  
Unit  
I
V
60  
45  
± 10  
μA  
GSS  
GS  
DS  
= 0 V  
V
V
I
I
= 10 mA, V  
(BR) DSS  
(BR) DSX  
D
D
GS  
Drain-source breakdown voltage  
V
= 10 mA, V  
= -10 V  
GS  
= 60 V, V = 0 V  
GS  
Drain cutoff current  
I
V
V
V
1
μA  
V
DSS  
DS  
DS  
DS  
Gate threshold voltage  
Forward transfer admittance  
V
= 10 V, I = 0.25 mA  
1.5  
225  
3.1  
th  
D
Y ⎪  
fs  
= 10 V, I = 200 mA  
(Note 2)  
(Note 2)  
(Note 2)  
(Note 2)  
mS  
D
I
I
I
= 500 mA, V  
= 10 V  
= 5 V  
1.62  
1.90  
2.10  
17.0  
1.9  
3.6  
3.3  
14.5  
-0.84  
2.1  
2.6  
3.3  
D
D
D
GS  
GS  
GS  
Drain-source ON-resistance  
R
Ω
= 100 mA, V  
= 100 mA, V  
DS (ON)  
= 4.5 V  
Input capacitance  
C
C
iss  
V
= 25 V, V  
= 0 V, f = 1 MHz  
GS  
pF  
Reverse transfer capacitance  
Output capacitance  
DS  
rss  
oss  
C
td  
td  
Turn-on delay time  
Turn-off delay time  
6.6  
40  
-1.2  
(on)  
(off)  
DSF  
V
V
= 30 V , I = 200 mA ,  
DD  
GS  
D
Switching time  
ns  
V
= 0 to 10 V  
Drain-source forward voltage  
Note2: Pulse test  
V
I
= -200 mA, V  
= 0 V  
GS  
(Note 2)  
D
Switching Time Test Circuit  
10 V  
90 %  
(a) Test circuit  
(b) V  
(c) V  
IN  
OUT  
10 V  
10 %  
IN  
0 V  
DD  
0
R
L
V
10 %  
OUT  
10 μs  
V
DD  
V
= 30 V  
DD  
90 %  
Duty 1%  
V
DS (ON)  
t
t
r
f
V
: t , t < 2 ns  
IN  
(Z  
r f  
= 50 Ω)  
out  
td  
(on)  
Common Source  
td  
(off)  
Ta = 25 °C  
Precaution  
Let V be the voltage applied between gate and source that causes the drain current (I ) to be low (0.25 mA for the  
th  
D
SSM3K7002BFU). Then, for normal switching operation, V  
must be higher than V and V  
must be lower  
GS(off)  
GS(on)  
th,  
than V This relationship can be expressed as: V  
th.  
< V < V  
th GS(on).  
GS(off)  
Take this into consideration when using the device  
Handling Precaution  
When handling individual devices that are not yet mounted on a circuit board, make sure that the environment is  
protected against electrostatic discharge. Operators should wear antistatic clothing, and containers and other objects that  
come into direct contact with devices should be made of antistatic materials.  
2
2009-11-26  
SSM3K7002BFU  
I
– V  
I – V  
D GS  
D
DS  
1000  
1000  
100  
Common Source  
Ta = 25 °C  
Common Source  
V = 10 V  
DS  
10 V 7.0 V  
800  
600  
400  
5.0 V  
4.5 V  
10  
1
Ta = 100 °C  
25 °C  
4.0 V  
-25 °C  
200  
0
0.1  
3.5 V  
V
= 3.3 V  
GS  
0.01  
0
1.0  
2.0  
0.4  
0.8  
1.2  
1.6  
2.0  
0
5.0  
3.0  
4.0  
Drain–source voltage  
V
(V)  
DS  
Gate–source voltage  
V
(V)  
GS  
R
– V  
GS  
R
– I  
D
DS (ON)  
DS (ON)  
5
5
4
3
Common Source  
Ta = 25°C  
I
= 100 mA  
D
Common Source  
Ta = 25°C  
4
3
Ta = 100 °C  
25 °C  
4.5 V  
5.0 V  
2
1
0
2
1
V
= 10 V  
GS  
-25 °C  
0
10  
0
10  
20  
30  
100  
300  
1000  
Gate–source voltage  
V
(V)  
GS  
Drain current  
I
(mA)  
D
R
Ta  
V
Ta  
th  
DS (ON)  
5
3.0  
2.0  
Common Source  
Common Source  
= 10 V  
V
DS  
= 0.25 mA  
I
D
4
3
2
100 mA / 4.5 V  
1.0  
I
= 500 mA / V  
GS  
= 10 V  
D
1
100 mA / 5.0V  
0
50  
0
50  
0
50  
100  
150  
0
50  
100  
150  
Ambient temperature Ta (°C)  
Ambient temperature Ta (°C)  
3
2009-11-26  
SSM3K7002BFU  
I
– V  
DR  
DS  
|Y | – I  
fs  
D
1
1000  
800  
Common Source  
= 0 V  
Ta = 25°C  
Common Source  
= 10 V  
V
GS  
V
DS  
Ta = 25°C  
0.3  
0.1  
D
I
G
DR  
600  
S
0.03  
0.01  
400  
200  
0
0.003  
0.001  
100  
10  
1000  
0
-0.2  
-0.4  
-0.6  
-0.8  
-1.0  
-1.2  
1
Drain current  
I
(mA)  
Drain–source voltage  
V
(V)  
D
DS  
t – I  
D
C – V  
DS  
100  
1000  
Common Source  
t
f
V
V
= 30 V  
= 0 to 10 V  
DD  
GS  
50  
30  
Ta = 25 °C  
t
d(off)  
100  
10  
1
C
iss  
10  
5
3
C
C
oss  
Common Source  
Ta = 25°C  
f = 1 MHz  
t
d(on)  
rss  
t
r
V
= 0 V  
GS  
1
0.1  
1
10  
100  
1
10  
100  
1000  
Drain–source voltage  
V
(V)  
DS  
Drain current  
I
(mA)  
D
P
Ta  
D
250  
Mounted on FR4 board.  
(25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 0.6 mm × 3)  
2
200  
150  
100  
50  
0
0
40  
80  
120  
160  
Ambient temperature Ta (°C)  
4
2009-11-26  
SSM3K7002BFU  
RESTRICTIONS ON PRODUCT USE  
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information  
in this document, and related hardware, software and systems (collectively “Product”) without notice.  
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with  
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.  
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are  
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and  
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily  
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the  
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of  
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes  
for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the  
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their  
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such  
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,  
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating  
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR  
APPLICATIONS.  
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring  
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.  
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or  
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious  
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used  
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling  
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric  
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this  
document.  
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.  
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any  
applicable laws or regulations.  
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any  
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to  
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.  
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE  
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY  
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR  
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND  
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO  
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS  
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.  
Do not use or otherwise make available Product or related software or technology for any military purposes, including without  
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile  
technology products (mass destruction weapons). Product and related software and technology may be controlled under the  
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product  
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.  
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.  
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,  
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of  
noncompliance with applicable laws and regulations.  
5
2009-11-26  

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