SSM3J56MFV [TOSHIBA]
Load Switching Applications; 负载开关应用![SSM3J56MFV](http://pdffile.icpdf.com/pdf1/p00191/img/icpdf/SSM3J5_1081301_icpdf.jpg)
型号: | SSM3J56MFV |
厂家: | ![]() |
描述: | Load Switching Applications |
文件: | 总6页 (文件大小:196K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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SSM3J56MFV
TOSHIBA Field-Effect Transistor Silicon P-Channel MOS Type (U-MOSⅥ)
SSM3J56MFV
○Load Switching Applications
•
•
1.2 V drive
Low ON-resistance:R
Unit: mm
= 390 mΩ (max) (@V
= 480 mΩ (max) (@V
= 660 mΩ (max) (@V
= 900 mΩ (max) (@V
= -4.5 V)
= -2.5 V)
= -1.8 V)
= -1.5 V)
DS(ON)
DS(ON)
DS(ON)
DS(ON)
DS(ON)
GS
GS
GS
GS
R
R
R
R
= 4000 mΩ (max) (@V
= -1.2 V)
GS
Absolute Maximum Ratings (Ta = 25°C)
Characteristic
Drain-Source voltage
Symbol
Rating
Unit
V
V
V
-20
DSS
Gate-Source voltage
± 8
V
GSS
DC
I
I
(Note 1)
(Note 1)
(Note 2)
(Note 3)
t < 5s
-800
-1600
150
D
Drain current
mA
Pulse
DP
P
P
D
D
1.Gate
Power dissipation
mW
500
2.Source
3.Drain
800
Channel temperature
T
150
°C
°C
ch
VESM
JEDEC
JEITA
Storage temperature range
T
stg
−55 to 150
―
―
Note: Using continuously under heavy loads (e.g. the application of high
temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the
absolute maximum ratings.
TOSHIBA
2-1L1B
Weight: 1.5mg (typ.)
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: The channel temperature should not exceed 150°C during use.
Note 2: Mounted on a FR4 board.
(25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 0.585 mm2)
Note 3: Mounted on a FR4 board.
(25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 645 mm2)
Marking
Equivalent Circuit (top view)
3
3
PW
1
2
1
2
Handling Precaution
When handling individual devices that are not yet mounted on a circuit board, make sure that the environment is
protected against electrostatic discharge. Operators should wear antistatic clothing, and containers and other objects that
come into direct contact with devices should be made of antistatic materials.
Thermal resistance R
and Power dissipation P vary depending on board material, board area, board thickness
D
th (ch-a)
and pad area. When using this device, please take heat dissipation into consideration.
1
2011-05-09
SSM3J56MFV
Electrical Characteristics (Ta = 25°C)
Characteristic
Symbol
Test Conditions
Min
Typ.
Max
Unit
V
V
I
I
= -1 mA, V
= -1 mA, V
= 0 V
= 5 V
-20
-15
⎯
⎯
⎯
⎯
⎯
V
V
(BR) DSS
(BR) DSX
D
D
GS
GS
Drain-source breakdown voltage
.(Note 5)
Drain cut-off current
I
V
V
V
V
= -20 V, V = 0 V
GS
⎯
-1
μA
μA
V
DSS
DS
GS
DS
DS
Gate leakage current
Gate threshold voltage
Forward transfer admittance
I
= ±8 V, V = 0 V
⎯
⎯
±1
GSS
DS
V
= -3 V, I = -1 mA
-0.3
0.5
⎯
⎯
-1.0
⎯
th
D
⏐Y ⏐
= -3 V, I = -100 mA
(Note 4)
(Note 4)
(Note 4)
(Note 4)
(Note 4)
(Note 4)
1.0
310
380
470
560
770
100
16
S
fs
D
I
I
I
I
I
= -800 mA, V
= -500 mA, V
= -200 mA, V
= -100 mA, V
= -4.5 V
= -2.5 V
= -1.8 V
= -1.5 V
390
480
660
900
4000
⎯
D
D
D
D
D
GS
GS
GS
GS
⎯
Drain–source ON-resistance
R
mΩ
⎯
DS (ON)
⎯
= -10 mA, V
= -1.2 V
⎯
GS
Input capacitance
C
⎯
iss
V
= -10 V, V
GS
= 0 V
DS
pF
ns
Output capacitance
C
⎯
⎯
oss
f = 1 MHz
Reverse transfer capacitance
C
⎯
10
⎯
rss
Turn-on time
Switching time
t
t
V
V
= -10 V, I = -200 mA
D
⎯
8
⎯
on
DD
GS
= 0 to -2.5 V, R = 50 Ω
Turn-off time
⎯
26
⎯
G
off
Total gate charge
Q
⎯
1.6
0.2
0.4
0.9
⎯
g
V
V
= -10 V, I = -800 mA,
D
DD
GS
nC
V
Gate-source charge
Gate-drain charge
Q
gs1
⎯
⎯
= -4.5 V
Q
gd
⎯
⎯
Drain-source forward voltage
V
I
= 800 mA, V = 0 V
GS
(Note 4)
⎯
1.2
DSF
D
Note 4: Pulse test
Note 5: If a forward bias is applied between gate and source, this device enters V(BR)DSX mode.
Note that the drain-source breakdown voltage is lowered in this mode.
Switching Time Test Circuit
0 V
(a) Test Circuit
(b) V
90%
IN
OUT
0
IN
10%
−2.5 V
−2.5V
R
L
V
DS (ON)
90%
10%
(c) V
OUT
10 μs
V
DD
V
= -10 V
DD
V
DD
R
G
= 50 Ω
t
t
f
r
<
Duty 1%
: t , t < 5 ns
V
IN
r f
t
t
off
on
Common Source
Ta = 25°C
Notice on Usage
V
th
can be expressed as the voltage between gate and source when the low operating current value is I = -1 mA for
D
this product. For normal switching operation, V
voltage than V (The relationship can be established as follows: V
th.
requires a higher voltage than V and V requires a lower
GS (off)
GS (on)
th
)
GS (on).
< V < V
GS (off)
th
Take this into consideration when using the device.
2
2011-05-09
SSM3J56MFV
I
– V
I
– V
GS
D
DS
D
-2.0
-1.5
-10
-1
-4.5 V
-2.5 V
-1.8 V
-1.5 V
-0.1
-1.0
-0.5
Ta = 100 °C
25 °C
-0.01
V
= -1.2 V
GS
-25 °C
-0.001
Common Source
Ta = 25 °C
Common Source
V
= -3 V
DS
Pulse test
Pulse test
0
-0.0001
0
-0.5
-1.0
-1.5
0
-1.0
-2.0
Drain–source voltage
V
(V)
DS
Gate–source voltage
V
(V)
GS
R
– V
GS
R
– V
GS
DS (ON)
DS (ON)
1.6
1.6
I
= -800 mA
I
= -10 mA
D
D
Common Source
Pulse test
Common Source
Pulse test
1.2
0.8
1.2
0.8
25 °C
25 °C
Ta = 100 °C
-25 °C
Ta = 100 °C
-25 °C
0.4
0
0.4
0
0
-2
-4
-6
-8
0
-2
-4
-6
-8
Gate–source voltage
V
(V)
Gate–source voltage
V
(V)
GS
GS
R
– I
D
R
– Ta
DS (ON)
DS (ON)
1.6
1.6
12
Common Source
Pulse test
-1.2 V
-1.5 V
1.2
-200 mA / -1.8 V
-100 mA / -1.5 V
0.8
0.4
0
0.8
0.4
-10 mA / -1.2 V
-1.8 V
-2.5 V
I
= -800 mA / V
= -4.5 V
GS
Common Source
Ta = 25 °C
D
V
= -4.5 V
-1.0
GS
-500 mA / -2.5 V
Pulse test
0
−50
-0.5
-1.5
-2.0
0
0
50
100
150
Ambient temperature Ta (°C)
Drain current
I
(A)
D
3
2011-05-09
SSM3J56MFV
V
– Ta
th
|Y | – I
fs
D
-1.0
10
Common Source
= -3 V
Common Source
= -3 V
V
V
DS
= -1 mA
DS
I
D
Ta = 25°C
3
1
Pulse test
-0.5
0.3
0.1
0.03
0.01
0
−50
0
50
100
150
-1
-0.1
-0.01
-10
-0.001
Ambient temperature Ta (°C)
Drain current
I
(A)
D
I
– V
DS
DR
C – V
DS
1000
10
1
Common Source
= 0 V
V
GS
Pulse test
300
100
D
I
G
DR
C
iss
-25 °C
25 °C
S
0.1
30
10
Ta =100 °C
C
oss
C
rss
0.01
Common Source
Ta = 25°C
3
1
f = 1 MHz
V
= 0 V
GS
0.001
-0.1
-1
-10
-100
0
0.5
1.0
1.5
Drain–source voltage
V
(V)
DS
Drain–source voltage
V
(V)
DS
Dynamic Input Characteristic
t – I
D
1000
100
10
-8
-6
-4
-2
0
Common Source
Common Source
I = -800 mA
D
Ta = 25°C
V
V
= -10 V
= 0 to -2.5 V
DD
GS
Ta = 25 °C
= 50 Ω
R
G
t
f
off
VDD = - 10 V
t
t
VDD = - 16 V
on
t
r
1
2
0
1
3
4
-0.1
-1
-0.01
-10
Total Gate Charge Qg (nC)
Drain current
I
(A)
D
4
2011-05-09
SSM3J56MFV
R
th
– t
w
P
– Ta
D
600
500
400
300
1000
100
10
a: Mounted on FR4 board
(25.4mm 25.4mm
Cu Pad : 645 mm2)
b: Mounted on FR4 board
(25.4mm 25.4mm
Cu Pad : 0.585 mm2)
×
×
1.6mm,
1.6mm,
b
a
a
×
×
200
100
Single pulse
a: Mounted on FR4 board
b
2
(25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 645 mm )
b: Mounted on FR4 board
2
(25.4 mm × 25.4 mm × 1.6 mm, Cu Pad: 0.585 mm )
0
0
1
50
100
150
0.001
0.01 0.1 10 100 1000
1
Pulse Width
t
(s)
w
Ambient temperature Ta (°C)
5
2011-05-09
SSM3J56MFV
RESTRICTIONS ON PRODUCT USE
•
•
•
Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the
Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of
all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes
for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the
instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their
own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such
design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts,
diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating
parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR
APPLICATIONS.
•
Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
•
•
Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
applicable laws or regulations.
•
•
The information contained herein is presented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any
infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to
any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS
FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
•
•
Do not use or otherwise make available Product or related software or technology for any military purposes, including without
limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile
technology products (mass destruction weapons). Product and related software and technology may be controlled under the
Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product
or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product.
Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
6
2011-05-09
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