2SK3843 [TOSHIBA]

Silicon N-Channel MOS Type Switching Regulator, DC/DC Converter and Motor Drive Applications; 硅N沟道MOS型开关稳压器, DC / DC转换器和电机驱动应用
2SK3843
型号: 2SK3843
厂家: TOSHIBA    TOSHIBA
描述:

Silicon N-Channel MOS Type Switching Regulator, DC/DC Converter and Motor Drive Applications
硅N沟道MOS型开关稳压器, DC / DC转换器和电机驱动应用

晶体 转换器 稳压器 开关 晶体管 功率场效应晶体管 脉冲 光电二极管 电机
文件: 总6页 (文件大小:180K)
中文:  中文翻译
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2SK3843  
TOSHIBA Field Effect Transistor Silicon N-Channel MOS Type (UMOSIII)  
2SK3843  
Switching Regulator, DC/DC Converter and Motor Drive  
Applications  
Unit: mm  
z Low drainsource ON resistance  
z High forward transfer admittance  
: R  
= 2.7 m(typ.)  
DS (ON)  
: |Y | = 120 S (typ.)  
fs  
z Low leakage current : I  
= 10 μA (max) (V  
= 40 V)  
DSS  
DS  
z Enhancement mode : V = 1.5~3.0 V (V  
= 10 V, I = 1 mA)  
DS D  
th  
Maximum Ratings (Ta = 25°C)  
Characteristic  
Drain–source voltage  
Symbol  
Rating  
Unit  
V
40  
40  
V
V
DSS  
Drain–gate voltage (R  
Gate–source voltage  
= 20 k)  
V
GS  
DGR  
V
±20  
75  
V
GSS  
DC (Note 1)  
Pulse (Note 1)  
I
A
D
Drain current  
I
300  
125  
A
DP  
Drain power dissipation (Tc = 25°C)  
P
W
D
JEDEC  
JEITA  
Single-pulse avalanche energy  
E
I
542  
mJ  
AS  
SC-97  
2-9F1B  
(Note 2)  
Avalanche current  
75  
12.5  
A
AR  
TOSHIBA  
Repetitive avalanche energy (Note 3)  
Channel temperature  
E
mJ  
°C  
°C  
AR  
Weight: 0.74 g (typ.)  
T
150  
ch  
Storage temperature range  
T
55~150  
stg  
Thermal Characteristics  
4
Characteristic  
Symbol  
Max  
Unit  
1
Thermal resistance, channel to case  
R
1.0  
°C/W  
th (ch–c)  
Note 1: Ensure that the channel temperature does not exceed 150°C.  
Note 2: V = 25 V, T = 25°C (initial), L = 100 µH, I = 75 A, R = 25  
DD  
ch  
AR  
G
3
Note 3: Repetitive rating: pulse width limited by maximum channel temperature.  
This transistor is an electrostatic-sensitive device. Handle with care.  
1
2006-09-27  
2SK3843  
Electrical Characteristics (Ta = 25°C)  
Characteristic  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
Gate leakage current  
Drain cutoff current  
I
V
V
= ±16 V, V = 0 V  
DS  
40  
15  
1.5  
60  
±10  
10  
μA  
μA  
GSS  
GS  
DS  
I
= 40 V, V  
= 0 V  
DSS  
GS  
GS  
GS  
V
V
I
I
= 10 mA, V  
= 10 mA, V  
= 0 V  
(BR) DSS  
(BR) DSX  
D
D
Drain–source breakdown voltage  
Gate threshold voltage  
V
V
= 20 V  
V
V
V
V
V
= 10 V, I = 1 mA  
3.0  
8.0  
3.5  
th  
DS  
GS  
GS  
DS  
D
= 4.5 V, I = 38 A  
4.3  
D
Drain–source ON resistance  
R
mΩ  
S
DS (ON)  
= 10 V, I = 38 A  
2.7  
D
Forward transfer admittance  
Input capacitance  
|Y |  
fs  
= 10 V, I = 38 A  
120  
11200  
800  
1350  
D
C
C
iss  
V
= 10 V, V  
= 0 V, f = 1 MHz  
GS  
pF  
Reverse transfer capacitance  
Output capacitance  
DS  
rss  
C
oss  
Rise time  
t
12  
40  
65  
r
I
= 38 A  
D
10 V  
V
GS  
V
OUT  
0 V  
Turn–on time  
Switching time  
t
on  
ns  
Fall time  
t
f
V
20 V  
DD  
Turn–off time  
t
260  
210  
<
off  
Duty 1%, t = 10 μs  
=
w
Total gate charge  
Q
g
(gate–source plus gate–drain)  
V
32 V, V  
= 10 V, I = 75 A  
nC  
DD  
GS  
D
Gate–source charge  
Q
150  
60  
gs  
Gate–drain (“Miller”) Charge  
Q
gd  
Source–Drain Ratings and Characteristics (Ta = 25°C)  
Characteristics  
Symbol  
Test Condition  
Min  
Typ.  
Max  
75  
Unit  
A
Continuous drain reverse current  
(Note 1)  
I
DR  
Pulse drain reverse current  
(Note 1)  
I
300  
A
DRP  
Forward voltage (diode)  
Reverse recovery time  
Reverse recovery charge  
V
I
I
= 75 A, V  
= 0 V  
1.5  
V
DSF  
DR1 GS  
= 75 A, V = 0 V  
GS  
t
100  
120  
ns  
nC  
rr  
DR  
dI /dt = 30 A/μs  
DR  
Q
rr  
Marking  
Part No. (or abbreviation code)  
Lot No.  
K3843  
A line indicates  
lead (Pb)-free package or  
lead (Pb)-free finish.  
2
2006-09-27  
2SK3843  
I
– V  
I – V  
D DS  
D
DS  
100  
80  
60  
40  
20  
0
200  
160  
120  
80  
5
4.75  
4.5  
5
4.75  
6
10  
10  
6
Common source  
Tc = 25°C  
Pulse test  
Common source  
Tc = 25°C  
Pulse test  
8
8
4.5  
4.25  
4
4.25  
3.75  
4
3.5  
3.75  
3.5  
40  
V
= 3.25 V  
GS  
V
= 3.25 V  
GS  
4
0
0
0.1  
0.2  
0.3  
0.4  
0.5  
0
0
1
1
2
3
5
Drainsource voltage  
V
(V)  
Drainsource voltage  
V
(V)  
DS  
DS  
I
D
– V  
V
– V  
DS GS  
GS  
200  
160  
120  
80  
1.0  
0.8  
0.6  
0.4  
0.2  
0
Common source  
= 10 V  
Common source  
Tc = 25°C  
Pulse test  
V
DS  
Pulse test  
100  
Tc = −55°C  
25  
I
= 75 A  
D
40  
38  
19  
0
0
2
4
6
8
10  
4
8
12  
16  
20  
Gatesource voltage  
V
(V)  
Gatesource voltage  
V
(V)  
GS  
GS  
R
I  
D
DS (ON)  
Y ⎪ − I  
fs  
D
100  
10  
1
1000  
100  
10  
Common source  
Tc = 25°C  
Common source  
= 10 V  
V
DS  
Pulse test  
Pulse test  
Tc = −55°C  
100  
25  
V
= 4.5 V  
GS  
10  
1
1
10  
100  
1000  
10  
100  
1000  
Drain current  
I
(A)  
Drain current  
I
(A)  
D
D
3
2006-09-27  
2SK3843  
R
Tc  
I
V  
DR DS  
DS (ON)  
10  
8
1000  
100  
10  
Common source  
Pulse test  
Common source  
Tc = 25°C  
Pulse test  
10  
38  
6
5
19  
V
= 4.5 V  
= 10 V  
GS  
3
4
1
I
= 75, 38, 19 A  
D
V
GS  
V
= 0, 1 V  
GS  
2
0
80  
1
40  
0
40  
80  
120  
160  
0
0.4  
0.8  
1.2  
1.6  
2.0  
Case temperature Tc (°C)  
Drainsource voltage  
V
(V)  
DS  
C V  
V
Tc  
th  
DS  
100000  
10000  
5
4
3
2
1
0
Common source  
= 10 V  
V
I
DS  
= 1 mA  
D
Pulse test  
C
iss  
1000  
100  
C
oss  
C
rss  
Common source  
V
= 0 V  
GS  
f = 1 MHz  
Tc = 25°C  
0.1  
1
10  
100  
80  
40  
0
40  
80  
120  
160  
Case temperature Tc (°C)  
Drainsource voltage  
V
(V)  
DS  
Dynamic input/output  
characteristics  
P
Tc  
D
150  
120  
90  
60  
30  
0
40  
16  
Common source  
= 75 A  
Tc = 25°C  
I
D
V
Pulse test  
DS  
8
30  
20  
10  
12  
8
V
= 32 V  
DD  
16  
4
0
V
GS  
0
0
0
40  
80  
120  
160  
100  
200  
300  
400  
500  
Case temperature Tc (°C)  
Total gate charge  
Q
g
(nC)  
4
2006-09-27  
2SK3843  
r
th  
t  
w
10  
1
Duty = 0.5  
0.2  
0.1  
P
DM  
Single Pulse  
0.1  
0.05  
t
0.02  
T
0.01  
Duty = t/T  
R
= 1.0°C/W  
th (ch-c)  
0.01  
10 μ  
100 μ  
1 m  
10 m  
100 m  
1
10  
Pulse width  
t
(S)  
w
Safe operating area  
E
– T  
AS  
ch  
1000  
100  
10  
1000  
800  
600  
400  
200  
0
I
max (Pulse) *  
D
1 ms *  
10 ms *  
I
max (Continuous)  
D
DC operation  
Tc = 25°C  
25  
50  
75  
100  
125  
ch  
150  
1
*
Single nonrepetitive pulse  
Channel temperature (initial)  
T
(°C)  
Tc = 25°C  
Curves must be derated  
linearly with increase in  
temperature.  
B
VDSS  
15 V  
V
max  
DSS  
0.1  
0.1  
I
AR  
0 V  
1
10  
100  
V
V
DD  
DS  
B
Drainsource voltage  
V
(V)  
DS  
Test circuit  
Wave form  
1
2
2
R
V
= 25 Ω  
VDSS  
G
=
LI ⋅  
Ε
AS  
V
DD  
= 25 V, L = 100 μH  
B
VDSS  
DD  
5
2006-09-27  
2SK3843  
RESTRICTIONS ON PRODUCT USE  
20070701-EN  
The information contained herein is subject to change without notice.  
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor  
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical  
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of  
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of  
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.  
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as  
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and  
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability  
Handbook” etc.  
The TOSHIBA products listed in this document are intended for usage in general electronics applications  
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,  
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires  
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or  
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or  
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,  
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his  
document shall be made at the customer’s own risk.  
The products described in this document shall not be used or embedded to any downstream products of which  
manufacture, use and/or sale are prohibited under any applicable laws and regulations.  
The information contained herein is presented only as a guide for the applications of our products. No  
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which  
may result from its use. No license is granted by implication or otherwise under any patents or other rights of  
TOSHIBA or the third parties.  
Please contact your sales representative for product-by-product details in this document regarding RoHS  
compatibility. Please use these products in this document in compliance with all applicable laws and regulations  
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses  
occurring as a result of noncompliance with applicable laws and regulations.  
6
2006-09-27  

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