2SK3845(F) [TOSHIBA]

2SK3845(F);
2SK3845(F)
型号: 2SK3845(F)
厂家: TOSHIBA    TOSHIBA
描述:

2SK3845(F)

晶体 转换器 稳压器 开关 晶体管 功率场效应晶体管 脉冲 电机 驱动
文件: 总6页 (文件大小:231K)
中文:  中文翻译
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2SK3845  
TOSHIBA Field Effect Transistor Silicon N Channel MOS Type (U-MOSIII)  
2SK3845  
Switching Regulator, DC-DC Converter Applications and  
Motor Drive Applications  
Unit: mm  
Low drain-source ON resistance: R  
= 4.7 m(typ.)  
DS (ON)  
High forward transfer admittance: |Y | = 88 S (typ.)  
fs  
Low leakage current: I  
= 100 μA (max) (V  
= 60 V)  
DSS  
DS  
Enhancement model: V = 2.0 to 4.0 V (V  
= 10 V, I = 1 mA)  
D
th  
DS  
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Drain-source voltage  
Symbol  
Rating  
Unit  
V
60  
60  
V
V
V
DSS  
Drain-gate voltage (R  
Gate-source voltage  
= 20 kΩ)  
V
GS  
DGR  
V
±20  
70  
GSS  
1. GATE  
2. DRAIN (HEAT SINK)  
3. SOURCE  
DC (Note 1)  
Pulse (Note 1)  
I
D
Drain current  
A
I
280  
125  
DP  
Drain power dissipation (Tc = 25°C)  
P
W
D
AS  
AR  
Single pulse avalanche energy  
JEDEC  
JEITA  
E
328  
mJ  
(Note 2)  
Avalanche current  
I
70  
12.5  
A
Repetitive avalanche energy (Note 3)  
Channel temperature  
E
mJ  
°C  
°C  
AR  
TOSHIBA  
2-16C1B  
T
150  
ch  
Weight: 4.6 g (typ.)  
Storage temperature range  
T
stg  
55 to150  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in  
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e.  
operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate  
reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and  
Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).  
Thermal Characteristics  
2
Characteristics  
Symbol  
Max  
Unit  
Thermal resistance, channel to case  
Thermal resistance, channel to ambient  
R
1.0  
50  
°C/W  
°C/W  
th (ch-c)  
R
th (ch-a)  
Note 1: Ensure that the channel temperature does not exceed 150.  
Note 2: = 25 V, T = 25°C (initial), L = 91 μH, R = 25 Ω, I = 70 A  
1
V
DD  
ch  
G
AR  
Note 3: Repetitive rating: pulse width limited by maximum channel temperature  
This transistor is an electrostatic-sensitive device. Please handle with caution.  
3
1
2006-11-17  
2SK3845  
Electrical Characteristics (Ta = 25°C)  
Characteristics  
Gate leakage current  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
I
V
V
= ±16 V, V  
= 0 V  
60  
35  
2.0  
44  
±10  
100  
μA  
μA  
GSS  
GS  
DS  
DS  
= 60V, V = 0 V  
GS  
Drain cut-OFF current  
I
DSS  
V
V
I
I
= 10mA, V  
= 10mA, V  
= 0 V  
(BR) DSS  
(BR) DSX  
D
D
GS  
GS  
Drain-source breakdown voltage  
V
= −20 V  
Gate threshold voltage  
V
V
V
V
= 10 V, I = 1 mA  
4.0  
5.8  
V
mΩ  
S
th  
DS  
GS  
DS  
D
Drain-source ON resistance  
R
= 10 V, I = 35 A  
4.7  
88  
DS (ON)  
D
Y ⎪  
fs  
= 10 V, I = 35 A  
Forward transfer admittance  
Input capacitance  
D
C
C
12400  
700  
1100  
iss  
V
= 10 V, V  
= 0 V, f = 1 MHz  
GS  
pF  
Reverse transfer capacitance  
DS  
rss  
C
oss  
Output capacitance  
Rise time  
10 V  
GS  
I = 35 A  
D
t
17  
44  
r
V
V
OUT  
0 V  
Turn-ON time  
Switching time  
t
on  
R
L
= 0.86 Ω  
ns  
Fall time  
t
f
35  
V
30 V  
DD  
<
Turn-OFF time  
t
200  
196  
Duty 1%, t = 10 μs  
off  
=
w
Total gate charge  
(gate-source plus gate-drain)  
Q
g
V
48 V, V  
= 10 V, I = 70 A  
GS D  
nC  
DD  
Q
Gate-source charge  
148  
48  
gs  
Q
gd  
Gate-drain (“miller”) charge  
Source-Drain Ratings and Characteristics (Ta = 25°C)  
Characteristics  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
Continuous drain reverse current (Note 1)  
I
70  
77  
70  
280  
1.5  
A
A
DR  
Pulse drain reverse current  
Forward voltage (diode)  
Reverse recovery time  
Reverse recovery charge  
(Note 1)  
I
DRP  
V
I
I
= 70 A, V  
= 70 A, V  
= 0 V  
V
DSF  
DR  
DR  
GS  
t
= 0 V,  
ns  
nC  
rr  
GS  
dI /dt = 50 A/μs  
Q
DR  
rr  
Marking  
TOSHIBA  
K3845  
Part No. (or abbreviation code)  
Lot No.  
A line indicates  
lead (Pb)-free package or  
lead (Pb)-free finish.  
2
2006-11-17  
2SK3845  
I
– V  
I – V  
D DS  
D
DS  
6
100  
80  
60  
40  
20  
0
200  
160  
120  
80  
6
Common source  
Tc = 25°C  
Pulse test  
10  
Common source  
Tc = 25°C  
Pulse test  
10  
5
5.2  
8
4.5  
4.3  
5
8
4.8  
4.5  
V
= 4 V  
GS  
4.3  
40  
V
= 4 V  
GS  
0
0
0.2  
0.4  
0.6  
0.8  
1.0  
0
0
1
1
2
3
4
5
Drainsource voltage  
V
(V)  
Drainsource voltage  
V
(V)  
DS  
DS  
I
D
– V  
V
– V  
DS GS  
GS  
160  
120  
1.0  
0.8  
0.6  
0.4  
0.2  
0
Common source  
Tc = 25°C  
Pulse test  
Common source  
= 20 V  
V
DS  
Pulse test  
100  
Tc = −55°C  
80  
40  
25  
70  
35  
I
= 18 A  
D
0
0
2
4
6
8
4
8
12  
16  
20  
Gatesource voltage  
V
(V)  
Gatesource voltage  
V
(V)  
GS  
GS  
R
I  
D
Y ⎪ − I  
fs  
DS (ON)  
D
100  
10  
1
1000  
100  
10  
Common source  
Tc = 25°C  
Pulse test  
Common source  
= 20 V  
V
DS  
Pulse test  
Tc = −55°C  
25  
100  
V
= 10, 15 V  
GS  
1
1
1000  
10  
100  
1000  
10  
100  
Drain current  
I
(A)  
Drain current  
I
(A)  
D
D
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2006-11-17  
2SK3845  
R
Tc  
I
V  
DS  
DS (ON)  
DR  
10  
8
1000  
100  
10  
Common source  
= 10 V  
V
GS  
Pulse test  
I
= 70 A  
D
10  
5
3
35  
18  
6
4
1
V
= 0 V  
GS  
2
Common source  
Tc = 25°C  
Pulse test  
0
1
0
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
80  
40  
0
40  
80  
120  
160  
Case temperature Tc (°C)  
Drainsource voltage  
V
(V)  
DS  
Capacitance – V  
DS  
100000  
10000  
1000  
V
Tc  
th  
5
4
3
2
Common source  
= 10 V  
V
DS  
= 1 mA  
I
D
Pulse test  
C
iss  
C
oss  
Common source  
1
0
V
= 0 V  
GS  
C
rss  
f = 1 MHz  
Tc = 25°C  
100  
0.1  
1
10  
100  
80  
40  
0
40  
80  
120  
160  
Case temperature Tc (°C)  
Drainsource voltage  
V
(V)  
DS  
Dynamic input/output characteristics  
P
Tc  
D
25  
50  
150  
V
DS  
20  
15  
40  
30  
120  
90  
V
= 12 V  
DD  
24V  
10  
5
60  
30  
20  
10  
0
Common source  
V
GS  
48V  
I
= 70 A  
D
Tc = 25°C  
Pulse test  
0
320  
0
80  
240  
0
40  
80  
120  
160  
0
160  
Case temperature Tc (°C)  
Total gate charge  
Q
g
(nC)  
4
2006-11-17  
2SK3845  
r
th  
t  
w
10  
1
Duty = 0.5  
0.2  
P
0.1  
DM  
Single Pulse  
0.1  
0.01  
0.05  
t
T
0.02  
Duty = t/T  
0.01  
R
= 1.0°C/W  
th (ch-c)  
10 μ  
100 μ  
1 m  
10 m  
100 m  
1
10  
Pulse width  
t
(S)  
w
Safe operating area  
E
– T  
AS  
ch  
1000  
500  
400  
300  
200  
100  
0
500  
300  
I
max (pulsed) *  
D
100 μs *  
1 ms *  
I
max (continuous)  
D
100  
30  
DC operation  
Tc = 25°C  
10  
5
3
25  
50  
75  
100  
125  
150  
1
Channel temperature (initial) Tch (°C)  
*: Single nonrepetitive pulse  
Tc = 25°C  
0.5  
0.3  
Curves must be derated  
linearly with increase in  
temperature.  
V
max  
DSS  
0.1  
0.1  
B
VDSS  
1
10  
100  
15 V  
0 V  
Drain-source voltage  
V
DS  
(V)  
I
AR  
V
DD  
V
DS  
Test circuit  
Wave form  
1
2
B
VDSS  
2
R
V
= 25 Ω  
G
=
LI ⋅  
Ε
AS  
V
DD  
= 25 V, L = 91 μH  
B
VDSS  
DD  
5
2006-11-17  
2SK3845  
RESTRICTIONS ON PRODUCT USE  
20070701-EN  
The information contained herein is subject to change without notice.  
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor  
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical  
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of  
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of  
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.  
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as  
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and  
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability  
Handbook” etc.  
The TOSHIBA products listed in this document are intended for usage in general electronics applications  
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,  
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires  
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or  
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or  
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,  
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his  
document shall be made at the customer’s own risk.  
The products described in this document shall not be used or embedded to any downstream products of which  
manufacture, use and/or sale are prohibited under any applicable laws and regulations.  
The information contained herein is presented only as a guide for the applications of our products. No  
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which  
may result from its use. No license is granted by implication or otherwise under any patents or other rights of  
TOSHIBA or the third parties.  
Please contact your sales representative for product-by-product details in this document regarding RoHS  
compatibility. Please use these products in this document in compliance with all applicable laws and regulations  
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses  
occurring as a result of noncompliance with applicable laws and regulations.  
6
2006-11-17  

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