XC9271B083QR-G [TOREX]
Switching Regulator,;
| 型号： | XC9271B083QR-G |
| 厂家： | 
Torex Semiconductor |
| 描述： | Switching Regulator, 开关 |
| 文件： | 总29页 (文件大小：1039K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
XC9270/XC9271Series
30V Driver Transistor Built-In Step-Down DC/DC Converters
■GENERAL DESCRIPTION
ETR05048-003
The XC9270/XC9271 series are 30V operation step-down DC/DC converter ICs with an internal driver transistor. The internal Nch driver
transistor is driven by bootstrap to achieve a stable, high-efficiency power supply up to an output current of 2.0A. Low ESR capacitors such as
ceramic capacitors can be used for the load capacitor (CL).
A 0.8V reference voltage source is incorporated in the IC, and the output voltage can be set to a value from 1.2V to 12.0V using external
resistors (RFB1, RFB2).
300kHz or 500kHz can be selected for the switching frequency. The generation of unneeded noise can be suppressed by synchronizing to an
external CLK in a range of ±25% of the free running frequency using the SYNC pin. In automatic PWM/PFM control, the IC operates by PFM
control when the load is light to achieve high efficiency over the full load range from light to heavy.
The soft start time can be set as desired by adding an external capacitance to the SS pin.
With the built-in UVLO function, the driver transistor is forced OFF when input voltage becomes 4.5V or lower.
Internal protection circuits include over current protection, integral latch protection, short-circuit protection, and thermal shutdown circuits to
enable safe use.
■FEATURES
Input Voltage
■APPLICATIONS
:
:
:
:
:
7～30V
●Car navigation systems
●Car audios
0.8V (±2％)
300kHz, 500kHz
FB Voltage
●Industrial equipment
Oscillation Frequency
Maximum Output Current
Control Method
2.0A
PWM (XC9270)
PWM/PFM (XC9271)
External Capacitor
:
:
Soft-start
(set by external capacitor C)
Over Current Protection 3.2A (TYP.)
Protection Circuit
Integral Latch Method (XC9270 / XC9271A)
Automatic Recovery (XC9270 / XC9271B)
Thermal Shutdown
Low ESR Ceramic Capacitor
:
:
:
:
Ceramic Capacitor
-40℃ ~ +105℃
Operating Ambient Temperature
Package
SOP-8FD
Environmentally Friendly
EU RoHS Compliant, Pb Free
*Performance depends on external components and wiring on the PCB.
■TYPICAL PERFORMANCE
■TYPICAL APPLICATION CIRCUIT
CHARACTERISTICS
XC9270x085/XC9271x085
(VIN=12V , VOUT=5V)
L=15 H(CLF12555-150M), C =10 F(GRM32ER71H106KA12L),
μ
μ
IN1
SBD=CMS15, C =22 F×2(GRM32ER71E226KE15L)
μ
L
100
90
80
70
60
50
40
30
20
10
0
XC9271
XC9270
1
10
100
1000
10000
Output Current :IOUT[mA]
1/29
XC9270/XC9271 Series
■BLOCK DIAGRAM
1) XC9270 Series, Type A
* Diodes inside the circuit are ESD protection diodes and parasitic diodes.
2) XC9270 Series, Type B
* Diodes inside the circuit are ESD protection diodes and parasitic diodes.
2/29
XC9270/XC9271
Series
■BLOCK DIAGRAM (Continued)
3) XC9271 Series, Type A
* Diodes inside the circuit are ESD protection diodes and parasitic diodes.
4) XC9271 Series, Type B
* Diodes inside the circuit are ESD protection diodes and parasitic diodes.
3/29
XC9270/XC9271 Series
■PRODUCT CLASSIFICATION
●Ordering Information
XC9270①②③④⑤⑥-⑦ PWM
XC9271①②③④⑤⑥-⑦ PWM/PFM Auto
DESIGNATOR
ITEM
SYMBOL
DESCRIPTION
Refer to Selection Guide
A
B
①
②③
④
Functional selection
Adjustable Output Voltage
Oscillation Frequency
08
3
Output voltage can be adjusted in 1.2V to 12V
300kHz
500kHz
5
(*1)
⑤⑥-⑦
Package (Order Unit)
QR-G
SOP-8FD (1,000pcs/Reel)
(*1) The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.
●Selection Guide
CURRENT
LIMITTER
LATCH
TYPE
CHIP ENABLE
UVLO
PROTECTION
A
B
YES
YES
YES (*1)
NO
YES
YES
YES
YES
THERMAL
SYNCHRONIZED with
EXTERNAL CLOCK
TYPE
SOFT-START
SHUTDOWN
A
B
YES
YES
YES
YES
YES
YES
(*1) The over-current protection latch is an integral latch type.
■PIN CONFIGURATION
* The dissipation pad for this IC should be solder-plated for mounting strength and heat
dissipation. Please refer to the reference mount pattern and metal masking. The dissipation pad
should be connected to the GND (No. 6) pin.
4/29
XC9270/XC9271
Series
■PIN ASSIGNMENT
PIN NUMBER
PIN NAME
SOP-8FD
FUNCTIONS
1
2
3
4
5
6
7
8
VIN
CE
Power Input
Chip Enable
SYNC
FB
External CLK Sync Pin
Output Voltage Sense
Soft-start Adjustment
Ground
SS
GND
BST
Lx
Bootstrap
Switching Output
■FUNCTION
PIN NAME
SIGNAL
STATUS
L
H
Stand-by
Active
CE
OPEN
L
Undefined State (*1)
Operates with internal clock frequency
H
SYNC
CLK
Synchronizes with External Clock Signal
Undefined State (*1)
OPEN
(*1) Please do not leave the CE and SYNC pin open.
■ABSOLUTE MAXIMUM RATINGS
Ta=25℃
PARAMETER
VIN Pin Voltage
BST Pin Voltage
FB Pin Voltage
SYNC Pin Voltage
CE Pin Voltage
SS Pin Voltage
Lx Pin Voltage
Lx Pin Current
SYMBOL
RATINGS
-0.3 ～ +36
UNITS
VIN
V
V
V
V
V
V
V
A
VBST
VFB
-0.3 or VLX-0.3 (*1) ～ VLX+6.5 or +36 (*2)
-0.3 ～ +6.5
VSYNC
VCE
-0.3 ～ +6.5
-0.3 ～ +36
VCSS
VLx
-0.3 ～ +6.5
-0.3 ～ VIN+0.3 or +36 (*3)
ILx
4.2
300
Power Dissipation
Pd
mW
1500 (PCB mounted)
46 (*4)
Surge Voltage
VSURGE
Topr
V
Operating Ambient Temperature
Storage Temperature
-40 ～ +105
℃
℃
Tstg
-55 ～ +125
* All voltages are described based on the GND pin.
(*1) The minimum value should be either -0.3 or VLX-0.3 in the highest.
(*2) The maximum value should be either VLX+6.5 or +36 in the lowest.
(*3) The maximum value should be either VIN+0.3 or +36 in the lowest.
(*4) Applied Time≦400ms
5/29
XC9270/XC9271 Series
■ELECTRICAL CHARACTERISTICS
●XC9270A/B083
Ta=25℃
PARAMETER
FB Voltage
SYMBOL
VFB1
CONDITIONS
MIN.
TYP.
0.8
MAX.
0.816
UNITS
V
CIRCUIT
V
FB=0.816V→0.784V, VSS=6V,
0.784
③
③
VFB Voltage when Lx pin oscillates
FB Voltage
Temperature Characteristics
Output Voltage
∆VFB
(∆Topr
/
-40℃≦Topr≦105℃
-
±50
-
ppm/℃
・
VFB)
VOUTSET
VIN
-
1.2 (*1)
7
-
-
12
30
V
V
-
-
Setting Range
Operating Voltage Range
-
VIN=4.9V→4.3V, VFB=0.65V, VSS=6V
VIN Voltage when Lx pin voltage changes from "H"
level to "L" level
UVLO detect voltage
UVLO release voltage
VUVLO1
4.3
4.7
4.6
5.0
4.9
5.3
V
V
③
③
VIN=4.7V→5.3V, VFB=0.65V, VSS=6V
VIN Voltage when Lx pin voltage changes from "L"
level to "H" level
VUVLO2
Quiescent Current
Stand-by Current
Iq
VIN=VCE=30V, VFB=0.95V
-
-
200
0.01
300
310
0.1
μA
μA
④
④
①
ISTB
fOSC
VIN=30V, VCE=0V, VSS=0V, VSYNC=0V
Connected to external components, IOUT=300mA
Oscillation Frequency
276
324
kHz
External Clock Signal
SYNCOSC
DSYNC
Connected to external components, IOUT=0mA
Connected to external components, IOUT=0mA
fOSCx0.75
25
fOSC
fOSCx1.25
75
kHz
%
②
②
Synchronized Frequency
External Clock Signal
Duty Cycle
-
Maximum Duty Cycle
Minimum Duty Cycle
Lx SW On Resistance
Current Limit (*2)
DMAX
DMIN
RLx
VFB=0.65V
83
-
85
-
88
0
-
%
%
Ω
A
③
③
③
③
VFB=0.95V
VFB=0.65V, VSS=6V
-
0.3
3.2
ILIM
VFB=0.65V, VSS=6V
2.4
-
XC9270A series only
Latch Time
tLAT
0.8
1.3
1.8
ms
⑤
Connected to external components, VFB=0.65V, VSS=6V
XC9270B series only, Connected to external components,
VFB=0.45V→0.35V, VSS=6V
VFB Voltage when Oscillation Frequency is decreased
Short Detect Voltage
VSHORT
0.35
0.40
0.45
V
⑤
V
CE=0→12V, VSS=6V, VFB=VFB1×0.9V
Internal Soft-start Time
External Soft-start Time
tSS1
tSS2
0.8
9
1.3
15
2.0
24
ms
ms
③
③
Time until Lx pin oscillates
VCE=0→12V, VSS=6V, VFB=VFB1×0.9V, CSS=0.01
Time until Lx pin oscillates
μF
Efficiency (*3)
SYNC ‘H’ Voltage
SYNC ‘L’ Voltage
SYNC ‘H’ Current
SYNC ‘L’ Current
FB ‘H’ Current
EFFI
VSYNCH
VSYNCL
ISYNCH
ISYNCL
IFBH
Connected to external components, IOUT=1A
Connected to external components, IOUT=0mA
Connected to external components, IOUT=0mA
VIN=VCE=30V, VSYNC=6V, VFB=0.95V
VIN=VCE=30V, VSYNC=0V, VFB=0.95V
VIN=VCE=30V, VFB=6V, VSS=6V
-
91
-
-
%
V
①
②
②
④
④
④
④
1.5
-
6
-
0.4
0.1
0.1
0.1
0.1
V
-0.1
-0.1
-0.1
-0.1
0
0
0
0
μA
μA
μA
μA
FB ‘L’ Current
IFBL
VIN=VCE=30V, VFB=0V, VSS=6V
V
CE=1.0V→2.8V, VFB=0.65V, VSS=6V
CE ‘H’ Voltage
CE ‘L’ Voltage
VCEH
VCEL
2.8
-
-
-
30
1
V
V
③
③
VCE Voltage when Lx pin voltage changes from "L" level to "H"
V
CE=2.8V→1.0V, VFB=0.65V, VSS=6V
VCE Voltage when Lx pin voltage changes from "H" level to "L"
VIN=VCE=30V, VFB=0.95V
CE ‘H’ Current
CE ‘L’ Current
ICEH
ICEL
-0.1
0
0
0.1
0.1
-
μA
μA
℃
④
④
-
VIN=30V, VCE=0V, VFB=0.95V
Junction Temperature
-0.1
Thermal Shutdown Temperature
Hysteresis Width
TTSD
THYS
-
-
150
25
Junction Temperature
-
℃
-
NOTE:
Unless otherwise stated, VIN=VCE=12V, VSYNC=2V, VSS=2V
External Components: Unless otherwise stated, L=22μH, CIN=10μF, CL=47μF, CBST=1μF, RFB1=2kΩ, RFB2=390Ω, CFB=10nF
(*1) Limited by a minimum ON time of 0.22μs (TYP.).
(*2) Current limit denotes the level of detection at peak of coil current.
(*3) EFFI=[(output voltage × output current)÷(inputvoltage × input current)]×100
6/29
XC9270/XC9271
Series
■ELECTRICAL CHARACTERISTICS (Continued)
●XC9271A/B083
Ta=25℃
PARAMETER
FB Voltage
SYMBOL
VFB1
CONDITIONS
MIN.
TYP.
0.8
MAX.
0.816
UNITS
CIRCUIT
V
FB=0.816V→0.784V, VSS=6V
0.784
V
③
VFB Voltage when Lx pin oscillates
FB Voltage
∆VFB
(∆Topr
/
-40℃≦Topr≦105℃
-
±50
-
ppm/
℃
③
Temperature Characteristics
Output Voltage
・
VFB)
VIN-3 or
12 (*2)
30
VOUTSET
VIN
-
1.2 (*1)
7
-
-
V
V
-
-
Setting Range
Operating Voltage Range
-
VIN=4.9V→4.3V, VFB=0.65V, VSS=6V
VIN Voltage when Lx pin voltage changes from "H"
level to "L" level
UVLO detect voltage
UVLO release voltage
VUVLO1
4.3
4.7
4.6
5.0
4.9
5.3
V
V
③
③
VIN=4.7V→5.3V, VFB=0.65V, VSS=6V
VIN Voltage when Lx pin voltage changes from "L"
level to "H" level
VUVLO2
Quiescent Current
Stand-by Current
Iq
VIN=VCE=30V, VFB=0.95V
-
-
200
0.01
300
310
0.1
μA
μA
④
④
①
ISTB
fOSC
VIN=30V, VCE=0V, VSS=0V, VSYNC=0V
Connected to external components, IOUT=300mA
Oscillation Frequency
External Clock Signal
Synchronized Frequency
External Clock Signal
Duty Cycle
276
324
kHz
SYNCOSC
Connected to external components, IOUT=0mA
Connected to external components, IOUT=0mA
fOSCx0.75
fOSC
-
fOSCx1.25
kHz
%
②
②
DSYNC
25
75
Maximum Duty Cycle
Minimum Duty Cycle
Lx SW On Resistance
PFM Switch Current
Current Limit (*3)
DMAX
DMIN
RLx
VFB=0.65V
83
-
85
-
88
%
%
③
③
③
①
③
VFB=0.95V
0
VFB=0.65V, VSS=6V
-
0.3
160
3.2
-
240
-
Ω
IPFM
ILIM
Connected to external components, IOUT=0mA
VFB=0.65V, VSS=6V
80
2.4
mA
A
XC9271A series only, Connected to external components,
VFB=0.65V, VSS=6V
Latch Time
tLAT
0.8
1.3
1.8
ms
⑤
XC9271B series only, Connected to external components,
VFB=0.45V→0.35V, VSS=6V
VFB Voltage when Oscillation Frequency is decreased
Short Detect Voltage
VSHORT
0.35
0.40
0.45
V
⑤
V
CE=0→12V, VSS=6V, VFB=VFB1×0.9V
Internal Soft-start Time
External Soft-start Time
tSS1
tSS2
0.8
9
1.3
15
2.0
24
ms
ms
③
③
Time until Lx pin oscillates
VCE=0→12V, VSS=6V, VFB=VFB1×0.9V, CSS=0.01
Time until Lx pin oscillates
μF
Efficiency (*4)
SYNC ‘H’ Voltage
SYNC ‘L’ Voltage
SYNC ‘H’ Current
SYNC ‘L’ Current
FB ‘H’ Current
EFFI
VSYNCH
VSYNCL
ISYNCH
ISYNCL
IFBH
Connected to external components, IOUT=1A
Connected to external components, IOUT=0mA
Connected to external components, IOUT=0mA
VIN=VCE=30V, VSYNC=6V, VFB=0.95V
VIN=VCE=30V, VSYNC=0V, VFB=0.95V
VIN=VCE=30V, VFB=6V, VSS=6V
-
91
-
-
%
V
①
②
②
④
④
④
④
1.5
-
6
-
0.4
0.1
0.1
0.1
0.1
V
-0.1
-0.1
-0.1
-0.1
0
0
0
0
μA
μA
μA
μA
FB ‘L’ Current
IFBL
VIN=VCE=30V, VFB=0V, VSS=6V
V
CE=1.0V→2.8V, VFB=0.65V, VSS=6V
CE ‘H’ Voltage
CE ‘L’ Voltage
VCEH
VCEL
2.8
-
-
-
30
1
V
V
③
③
VCE Voltage when Lx pin voltage changes from "L" level to "H"
V
CE=2.8V→1.0V, VFB=0.65V, VSS=6V
VCE Voltage when Lx pin voltage changes from "H" level to "L"
VIN=VCE=30V, VFB=0.95V
CE ‘H’ Current
CE ‘L’ Current
ICEH
ICEL
-0.1
0
0
0.1
0.1
-
μA
μA
℃
④
④
-
VIN=30V, VCE=0V, VFB=0.95V
Junction Temperature
-0.1
Thermal Shutdown Temperature
Hysteresis Width
TTSD
THYS
-
-
150
25
Junction Temperature
-
℃
-
NOTE:
Unless otherwise stated, VIN=VCE=12V, VSYNC=2V, VSS=2V
External Components: Unless otherwise stated, L=22μH, CIN=10μF, CL=47μF, CBST=1μF, RFB1=2kΩ, RFB2=390Ω, CFB=10nF
(*1) Limited by a minimum ON time of 0.22μs (TYP.).
(*2)
V -3 or 12, whichever is lower.
IN
(*3) Current limit denotes the level of detection at peak of coil current.
(*4) EFFI=[(output voltage × output current)÷(inputvoltage × input current)]×100
7/29
XC9270/XC9271 Series
■ELECTRICAL CHARACTERISTICS (Continued)
●XC9270A/B085
Ta=25℃
PARAMETER
FB Voltage
SYMBOL
VFB1
CONDITIONS
MIN.
TYP.
0.8
MAX.
0.816
UNITS
CIRCUIT
V
FB=0.816V→0.784V, VSS=6V
0.784
V
③
③
VFB Voltage when Lx pin oscillates
FB Voltage
∆VFB
(∆Topr
/
-40℃≦Topr≦105℃
-
±50
-
ppm/℃
Temperature Characteristics
・
VFB)
Output Voltage
Setting Range
VOUTSET
VIN
1.2 (*1)
7
-
-
12
30
V
V
-
-
Operating Voltage Range
VIN=4.9V→4.3V, VFB=0.65V, VSS=6V
VIN Voltage when Lx pin voltage changes from "H"
level to "L" level
UVLO detect voltage
UVLO release voltage
VUVLO1
4.3
4.7
4.6
5.0
4.9
5.3
V
V
③
③
VIN=4.7V→5.3V, VFB=0.65V, VSS=6V
VIN Voltage when Lx pin voltage changes from "L"
level to "H" level
VUVLO2
Quiescent Current
Stand-by Current
Iq
VIN=VCE=30V, VFB=0.95V
-
-
250
0.01
500
360
0.1
μA
μA
④
④
①
ISTB
fOSC
VIN=30V, VCE=0V, VSS=0V, VSYNC=0V
Connected to external components, IOUT=300mA
Oscillation Frequency
External Clock Signal
Synchronized Frequency
External Clock Signal
Duty Cycle
460
540
kHz
SYNCOSC Connected to external components, IOUT=0mA
fOSCx0.75
fOSC
-
fOSCx1.25
kHz
%
②
②
DSYNC
Connected to external components, IOUT=0mA
25
75
Maximum Duty Cycle
Minimum Duty Cycle
Lx SW On Resistance
DMAX
DMIN
RLx
VFB=0.65V
83
-
85
-
88
0
-
%
%
Ω
A
③
③
③
③
VFB=0.95V
VFB=0.65V, VSS=6V
-
0.3
3.2
(*2)
Current Limit
ILIM
VFB=0.65V, VSS=6V
2.4
-
XC9270A series only, Connected to external components,
VFB=0.65V, VSS=6V
Latch Time
tLAT
0.4
0.7
1.0
ms
⑤
XC9270B series only, Connected to external components,
VFB=0.45V→0.35V, VSS=6V
VFB Voltage when Oscillation Frequency is decreased
Short Detect Voltage
VSHORT
0.35
0.40
0.45
V
⑤
V
CE=0→12V, VSS=6V, VFB=VFB1×0.9V
Internal Soft-start Time
External Soft-start Time
tSS1
tSS2
0.4
5
0.7
9
1.2
15
ms
ms
③
③
Time until Lx pin oscillates
VCE=0→12V, VSS=6V, VFB=VFB1×0.9V, CSS=0.01
Time until Lx pin oscillates
μF
(*3)
Efficiency
EFFI
VSYNCH
VSYNCL
ISYNCH
ISYNCL
IFBH
Connected to external components, IOUT=1A
Connected to external components, IOUT=0mA
Connected to external components, IOUT=0mA
VIN=VCE=30V, VSYNC=6V, VFB=0.95V
VIN=VCE=30V, VSYNC=0V, VFB=0.95V
VIN=VCE=30V, VFB=6V, VSS=6V
-
91
-
-
%
V
①
②
②
④
④
④
④
SYNC ‘H’ Voltage
SYNC ‘L’ Voltage
SYNC ‘H’ Current
SYNC ‘L’ Current
FB ‘H’ Current
1.5
-
6
-
0.4
0.1
0.1
0.1
0.1
V
-0.1
-0.1
-0.1
-0.1
0
0
0
0
μA
μA
μA
μA
FB ‘L’ Current
IFBL
VIN=VCE=30V, VFB=0V, VSS=6V
V
CE=1.0V→2.8V, VFB=0.65V, VSS=6V
CE ‘H’ Voltage
CE ‘L’ Voltage
VCEH
VCEL
2.8
-
-
-
30
1
V
V
③
③
VCE Voltage when Lx pin voltage changes from "L" level to "H"
V
CE=2.8V→1.0V, VFB=0.65V, VSS=6V
VCE Voltage when Lx pin voltage changes from "H" level to "L"
VIN=VCE=30V, VFB=0.95V
CE ‘H’ Current
CE ‘L’ Current
ICEH
ICEL
-0.1
0
0
0.1
0.1
-
μA
μA
℃
④
④
-
VIN=30V, VCE=0V, VFB=0.95V
Junction Temperature
-0.1
Thermal Shutdown Temperature
Hysteresis Width
TTSD
THYS
-
-
150
25
Junction Temperature
-
℃
-
NOTE:
Unless otherwise stated, VIN=VCE=12V, VSYNC=2V, VSS=2V
External Components: Unless otherwise stated, L=22μH, CIN=10μF, CL=47μF, CBST=1μF, RFB1=2kΩ, RFB2=390Ω, CFB=10nF
(*1) Limited by a minimum ON time of 0.15μs (TYP.).
(*2) Current limit denotes the level of detection at peak of coil current.
(*3) EFFI=[(output voltage × output current)÷(inputvoltage × input current)]×100
8/29
XC9270/XC9271
Series
■ELECTRICAL CHARACTERISTICS (Continued)
●XC9271A/B085
Ta=25℃
PARAMETER
FB Voltage
SYMBOL
VFB1
CONDITIONS
MIN.
TYP.
0.8
MAX.
0.816
UNITS
CIRCUIT
VFB=0.816V→0.784V, VSS=6V
0.784
V
③
V
FB Voltage when Lx pin oscillates
FB Voltage
∆VFB
(∆Topr
/
-40℃≦Topr≦105℃
-
±50
-
ppm/
℃
③
Temperature Characteristics
・
VFB)
VIN-3
or
Output Voltage
Setting Range
VOUTSET
VIN
1.2 (*1)
7
-
-
V
V
V
-
-
12 (*2)
Operating Voltage Range
30
VIN=4.9V→4.3V, VFB=0.65V, VSS=6V
UVLO detect voltage
VUVLO1
V
IN Voltage when Lx pin voltage changes from "H"
4.3
4.6
4.9
5.3
③
level to "L" level
VIN=4.7V→5.3V, VFB=0.65V, VSS=6V
UVLO release voltage
VUVLO2
V
IN Voltage when Lx pin voltage changes from "L"
4.7
5.0
V
③
level to "H" level
Quiescent Current
Stand-by Current
Iq
VIN=VCE=30V, VFB=0.95V
-
-
250
0.01
500
360
0.1
μA
μA
④
④
①
ISTB
fOSC
VIN=30V, VCE=0V, VSS=0V, VSYNC=0V
Connected to external components, IOUT=300mA
Oscillation Frequency
460
540
kHz
External Clock Signal
SYNCOSC
Connected to external components, IOUT=0mA
Connected to external components, IOUT=0mA
fOSCx0.75
fOSC
-
fOSCx1.25
kHz
%
②
②
Synchronized Frequency
External Clock Signal
Duty Cycle
DSYNC
25
75
Maximum Duty Cycle
Minimum Duty Cycle
Lx SW On Resistance
PFM Switch Current
Current Limit (*3)
DMAX
DMIN
RLx
VFB=0.65V
83
-
85
-
88
%
%
③
③
③
①
③
VFB=0.95V
0
VFB=0.65V, VSS=6V
-
0.3
160
3.2
-
240
-
Ω
IPFM
ILIM
Connected to external components, IOUT=0mA
VFB=0.65V, VSS=6V
80
2.4
mA
A
XC9271A series only, Connected to external components,
VFB=0.65V, VSS=6V
Latch Time
tLAT
0.4
0.7
1.0
ms
⑤
XC9271B series only, Connected to external components,
VFB=0.45V→0.35V, VSS=6V
VFB Voltage when Oscillation Frequency is decreased
VCE=0→12V, VSS=6V, VFB=VFB1×0.9V
Time until Lx pin oscillates
Short Detect Voltage
VSHORT
0.35
0.40
0.45
V
⑤
Internal Soft-Start Time
External Soft-Start Time
tSS1
tSS2
0.4
5
0.7
9
1.2
15
ms
ms
③
③
VCE=0→12V, VSS=6V, VFB=VFB1×0.9V, CSS=0.01μF
Time until Lx pin oscillates
Efficiency (*4)
SYNC ‘H’ Voltage
SYNC ‘L’ Voltage
SYNC ‘H’ Current
SYNC ‘L’ Current
FB ‘H’ Current
EFFI
VSYNCH
VSYNCL
ISYNCH
ISYNCL
IFBH
Connected to external components, IOUT=1A
Connected to external components, IOUT=0mA
Connected to external components, IOUT=0mA
VIN=VCE=30V, VSYNC=6V, VFB=0.95V
-
91
-
-
%
V
①
②
②
④
④
④
④
1.5
-
6
-
0.4
0.1
0.1
0.1
0.1
V
-0.1
-0.1
-0.1
-0.1
0
0
0
0
μA
μA
μA
μA
VIN=VCE=30V, VSYNC=0V, VFB=0.95V
VIN=VCE=30V, VFB=6V, VSS=6V
FB ‘L’ Current
IFBL
VIN=VCE=30V, VFB=0V, VSS=6V
VCE=0.8V→2.8V, VFB=0.65V, VSS=6V
VCE Voltage when Lx pin voltage changes from "L" level to "H"
VCE=2.8V→0.8V, VFB=0.65V, VSS=6V
VCE Voltage when Lx pin voltage changes from "H" level to "L"
VIN=VCE=30V, VFB=0.95V
CE ‘H’ Voltage
CE ‘L’ Voltage
VCEH
VCEL
2.8
-
-
-
30
1
V
V
③
③
CE ‘H’ Current
CE ‘L’ Current
ICEH
ICEL
-0.1
0
0
0.1
0.1
-
μA
μA
℃
④
④
-
VIN=30V, VCE=0V, VFB=0.95V
-0.1
Thermal Shutdown Temperature
Hysteresis Width
TTSD
THYS
Junction Temperature
-
-
150
25
Junction Temperature
-
℃
-
NOTE:
Unless otherwise stated, VIN=VCE=12V, VSYNC=2V, VSS=2V
External Components: Unless otherwise stated, L=22μH, CIN=10μF, CL=47μF, CBST=1μF, RFB1=2kΩ, RFB2=390Ω, CFB=10nF
(*1) Limited by a minimum ON time of 0.15μs (TYP.).
(*2)
V -3 or 12, whichever is lower.
IN
(*3) Current limit denotes the level of detection at peak of coil current.
(*4) EFFI=[(output voltage × output current)÷(inputvoltage × input current)]×100
9/29
XC9270/XC9271 Series
■TEST CIRCUITS
Circuit①
A
VIN
Probe
22μH
CE
BST
Lx
1μF
V
SS
A
10μF
CFB
RFB1
SYNC
FB
V
RFB2
47μF
SBD
GND
Circuit②
Circuit③
A
Probe
VIN
CE
SS
BST
6V
V
Lx
V
10μF
SYNC
FB
V
0.01μF
GND
V
10/29
XC9270/XC9271
Series
■TEST CIRCUITS (Continued)
Circuit④
Circuit⑤
11/29
XC9270/XC9271 Series
■TYPICAL APPLICATION CIRCUIT
【Typical Examples】
MANUFACTURER PRODUCT NUMBER
VALUE
15μH
22μH
33μH
CLF12555-150M
TDK
CLF12555-220M
CLF12555-330M
L
Toho Zinc
Murata
TCM-0840-200
GRM32ER71H106K
GRM21BB31H105K
GRM32ER71A476K
GRM32ER71E226K
25SVPD47M
20μH
10μF/50V
CIN1
CIN2
Murata
1μF/50V
47μF/10V
Murata
CL
22μF/25V 2parallel
47μF/25V, ESR=30mΩ
VF=0.51V (3A)
VF=0.58V (3A)
VF=0.69V (5A)
0.01μF/10V (*1)
1000pF/10V (*2)
1μF/10V
Panasonic
TOREX
XBS304S19R-G
CMS15
SBD
TOSHIBA
VISHAY
SS5P5
CSS
CSYNC
CBST
(*1) Can also be used without CSS (SS pin OPEN). When used without CSS, the IC starts at the soft start time set internally.
(*2)
Can be used without CSYNC if the external CLK synchronization function is not used. In this case, connect the SYNC pin to GND in close
proximity to the IC.
<Output voltage setting>
The output voltage can be set by adding an external dividing resistor. The output voltage is determined by the equation below based on the
values of RFB1 and RFB2
.
V
OUT=0.8 × (RFB1+RFB2)/RFB2
with RFB2≦15kΩ
Adjust the value of the phase compensation speed-up capacitor. Adjust the CFB value so that fzfb = 1/(2×π×CFB×RFB1) is about 10kHz.
【Setting Example】
When RFB1=68kΩ, RFB2=13kΩ, VOUT=0.8×(68kΩ+13kΩ) / 13kΩ≒4.98V
When fzfb is set to a target of 10.64kHz using the above equation, CFB=1/(2×π×10.64kHz×68kΩ)≒220pF
If the dropout voltage is too large and the minimum Lx ON time is not attained, pulse skipping will occur and the output voltage will not be stable.
Use with an Lx ON time longer than the minimum. The minimum ON time is 0.22μs (TYP.) at a set frequency of 300kHz, or 0.15μs (TYP.) at a set
frequency of 500kHz.
12/29
XC9270/XC9271
Series
■TYPICAL APPLICATION CIRCUIT (Continued)
<Inductance value setting>
In the XC9270 and XC9271 series, it is optimum to set an inductance value within the range below based on the set frequency and setting output
voltage.
f
OSCSET: Set frequency
OUTSET: Setting output voltage
V
ｆOSCSET
1.2V≦VOUTSET≦6V
6V＜VOUTSET≦12V
33μH
20μH
22μH
300kHz
500kHz
20μH
22μH
15μH
<Soft-start function>
The soft start time of the XC9270 and XC9271 series can be adjusted externally (SS pin). The soft start time is the time from the start of VCE until
the output voltage reaches 90% of the set voltage. The soft start time depends on the external capacitance CSS, and is determined by the
equation below.
t
SS2 = 1.08 × CSS / ISS [ms]
SS: External capacitance [nF]
C
I
f
SS: When fOSCSET=300kHz, 0.72 [μA (TYP.)]
When fOSCSET=500kHz, 1.2 [μA(TYP.)]
OSCSET: Set frequency [kHz]
* Note that the value of the soft start time tSS2 varies depending on the effective capacitance value of the delay capacitance CSS
.
【Calculation Example】
When fOSCSET=300kHz and CSS=10nF, tss2=1.08×10/0.72=15ms
When fOSCSET=500kHz and CSS=10nF, tss2=1.08×10/1.2=9ms
The minimum value tSS2 of the soft-start time is set internally. The internal soft-start time tSS1 is determined by the equation below.
When fOSCSET=300kHz, tss1=1.3ms （TYP.）
When fOSCSET=500kHz, tss1=0.7ms （TYP.）
13/29
XC9270/XC9271 Series
■OPERATIONAL EXPLANATION
The XC9270/XC9271 series consists internally of a reference voltage supply, ramp wave circuit, error amp, PWM comparator, phase
compensation circuit, N-ch MOS driver transistor, current limiting circuit, under-voltage lockout (UVLO) circuit, internal power supply (VL) circuit,
thermal shutdown (TSD) circuit, oscillator (OSC) circuit, soft-start circuit, control block and other elements.
The voltage feed back from the FB pin is compared to the internal reference voltage by the error amp, the output from the error amp is phase
compensated, and the signal is input to the PWM comparator to determine the ON time of switching during PWM operation. The output signal
from the error amp is compared to the ramp wave by the PWM comparator, and the output is sent to the buffer drive circuit and output from the Lx
pin as the duty width of switching. This operation is performed continuously to stabilize the output voltage.
The driver transistor current is monitored at each switching by the output signal from the error amp is modulated as a multi-feedback signal. This
allows a stable feedback system to be obtained even when a low ESR capacitor such as a ceramic capacitor is used, and this stabilizes the
output voltage.
Because the IC uses an N-ch MOS transistor for the Hi side driver, a voltage higher than the VIN voltage is required to turn on the driver. To
generate a voltage higher than the VIN voltage, the bootstrap method is used.
XC9271 Series, Type B
<Reference voltage source>
The reference voltage source provides the reference voltage to ensure stable output voltage of the DC/DC converter.
<Oscillator circuit>
The ramp wave circuit determines switching frequency. The frequency is fixed internally and can be selected from 300kHz, 500 kHz. Clock
pulses generated in this circuit are used to produce ramp waveforms needed for PWM operation.
<Error amplifier>
The error amplifier is designed to monitor output voltage. The amplifier compares the reference voltage with the feedback voltage divided by
the internal split resistors, RFB1 and RFB2. When a voltage is lower than the reference voltage, then the voltage is fed back, the output voltage of
the error amplifier increases. The error amplifier output is fixed internally to deliver an optimized signal to the mixer which is a part of a PWM
comparator.
<Chip enable>
The XC9270/XC9271 series can be put in the standby state by inputting L level into the CE pin. In the standby state, the quiescent current of the
IC is 0.01μA (TYP.). When H level is input into CE pin, operation starts. The input of the CE pin is CMOS input and the sink current is 0μA (TYP.).
14/29
XC9270/XC9271
Series
■OPERATIONAL EXPLANATION (Continued)
<Current limiting, short-circuit protection>
The current limiting circuits of type B combine both current limiting and short-circuit protection.
(1) The current in the N-ch MOS driver transistor connected to the Lx pin is monitored, and when the load current attains the limiting current, the
current limiting circuit activates and the output voltage drops.
(2) As the current limiting state continues, the switching frequency drops to prevent coil current (IL) overlay. When the current limiting state is
released, the switching frequency returns to the set frequency.
(3) If the output voltage drops further from states (2), the output current is limited, the switching frequency is lowered further, and the short-circuit
state is entered. When the load becomes lighter than the short-circuit state, restart takes place automatically. To prevent overshoot during
restart, restart takes place by soft-start.
② If the current limiting
state continues, the
switching frequency is
lowered
①
③ If VOUT drops to 50% (TYP.) or less of the regular level in
the state of ① or ②, the output current is reduced, the
switching frequency is further lowered, and the IC enters
the short-circuit state
Current limiting
operates
<Integral latch protection>
When the current limiting state continues for a certain time, the correct limiting circuit of type A latches and stops the Lx pin in the "H" level state
(turning off the driver Tr). To restart operation by soft-start once in the latch stop state, "L" level must be input into the CE pin followed by "H" level,
or briefly lowering the VIN voltage below the UVLO detection voltage must be performed.
①
Current limiting ② When the state of ① continues for 1.3ms
③ Operation restarts by soft
start when CE=“L”→“H”
operates
(TYP. fOSCSET=300kHz) or 0.7ms (TYP., fOSCSET=500kHz),
the Lx pin is latched to “L” level and operation stops
<Thermal shutdown>
The thermal shutdown (TSD) as an over current limit is built in the XC9270/XC9271 series.
When the junction temperature reaches the detection temperature, the driver transistor is forcibly turned off. When the junction temperature falls
to the release temperature while in the output stop state, restart takes place by soft-start.
<UVLO>
When the VIN pin voltage falls below 4.6V (TYP.), EXTB becomes "H" level and forcibly stops output to prevent false pulse output due to instable
operation of the internal circuits. When the VIN pin voltage rises above 5.0V (TYP.), the UVLO function is released, the soft-start function activates,
and output start operation begins. Stopping by UVLO is not shutdown; only pulse output is stopped and the internal circuits continue to operate.
15/29
XC9270/XC9271 Series
■OPERATIONAL EXPLANATION (Continued)
<SYNC function>
When an external CLK (±25% of free running frequency, on duty 25% to 75%) is input into the SYNC pin, operation is synchronized to the
falling edge of the external CLK (external CLK synchronization function). When synchronized to the external CLK, the control mode is
automatically PWM control. When the external CLK is fixed at "H" voltage or "L" voltage for about 3 cycles of the free running frequency, external
CLK synchronization stops and operation at the free running frequency takes place.
(1) Switching from free running frequency ⇒ external CLK synchronization
Operation at free running frequency
Synchronized to external CLK
Cycles at falling edge of external CLK
Free running frequency
→ external CLK synchronization switching delay (about 5 cycles)
(2) Switching from external CLK synchronization ⇒ free running frequency
Synchronized to external CLK
Synchronized to external CLK
When there is no pulse for about 3 cycles,
switches to free running frequency
16/29
XC9270/XC9271
Series
■NOTE ON USE
1. For the phenomenon of temporal and transitional voltage decrease or voltage increase, the IC may be damaged or deteriorated if IC is used
beyond the absolute MAX. specifications.
2. Make sure that the absolute maximum ratings of the external components and of this IC are not exceeded.
3. The DC/DC converter characteristics depend greatly on the externally connected components as well as on the characteristics of this IC, so
refer to the specifications and standard circuit examples of each component when carefully considering which components to select. Be
especially careful of the capacitor characteristics and use B characteristics (JIS standard) or X7R, X5R (EIA standard) ceramic capacitors.
4. The DC/DC converter of this IC uses a current-limiting circuit to monitor the coil peak current. If the potential dropout voltage is large or the load
current is large, the peak current will increase, which makes it easier for current limitation to be applied which in turn could cause the operation
to become unstable. When the peak current becomes large, adjust the coil inductance and sufficiently check the operation. The following
formula is used to show the peak current.
Peak Current: Ipk = ( VIN – VOUT ) × OnDuty / ( 2 × L × fOSC ) + IOUT
L: Coil Inductance [H]
fOSC: Oscillation Frequency [Hz]
IOUT: Load Current [A]
5. If the difference between input voltage and output voltage is large, when the current limit circuit activates, the switching current might overlap
and exceed the current limit spec. due to the circuit delay time.
6. The ripple voltage could be increased when switching from discontinuous conduction mode to Continuous conduction mode. Please apply the
ICs only after careful examination by the customer.
7. In some cases, ripple voltage may increase in the XC9271 series when the load is light. This is for the purpose of charging the CBST, and is
normal operation.
8. The IC enters test mode when a 6V external power supply is applied to the SS pin. Do not apply an external power supply to the SS pin during use.
9. The operation of the IC becomes unstable below the minimum operating voltage.
10. The effects of ambient noise and the state of the circuit board may cause release from the current limiting state, and the latch time may
lengthen or latch operation may not take place. Test sufficiently using the actual equipment.
11. When operation changes from free running frequency to external CLK synchronization, the output voltage may fluctuate. Please apply the ICs
only after careful examination by the customer.
12. Instructions of pattern layouts
The operation may become unstable due to noise and/or phase lag from the output current when the wire impedance is high, please place the
input capacitor(CIN1, CIN2) and the output capacitor (CL) as close to the IC as possible.
(1) In order to stabilize VIN voltage level, we recommend that a by-pass capacitor (CIN1) be connected as close as possible to the VIN pin.
(2) In order to stabilize GND voltage level, we recommend that a by-pass capacitor (CIN2) be connected as close as possible to the GND pin.
(3) Please mount each external component as close to the IC as possible.
(4) Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit impedance.
(5) Make sure that the GND traces are as thick as possible, as variations in ground potential caused by high ground currents at the time of
switching may result in instability of the IC.
(6) Because this product contains an internal driver, heat is generated due to the IOUT current and ON resistance of the N-ch MOS driver transistor.
<Reference Pattern Layout>
Front
Back
17/29
XC9270/XC9271 Series
■NOTE ON USE (Continued)
13. In general, semiconductor components have a possibility to have variation of electrical specifications due to the (cosmic) radiation exposure.
Therefore this product has the same possibility. Please inform us in advance if your system might have a possibility to be exposed to the
(cosmic) radiation in the production process (assembly, test, etc.).
14. Torex places an importance on improving our products and their reliability.
We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products in their systems.
18/29
XC9270/XC9271
Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) Efficiency vs. Output current
XC9270x083/XC9271x083
(VIN=12V, VOUT=1.8V)
XC9270x083/XC9271x083
(VIN=12V, VOUT=5V)
L=22μH(CLF12555-220M), CIN 1=10μF(GRM32ER71H106KA12L),
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
L=22μH(CLF12555-220M), CIN 1=10μF(GRM32ER71H106KA12L),
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
XC9271
XC9270
XC9271
XC9270
1
10
100
1000
10000
1
10
100
1000
10000
Output Current :IOUT[mA]
Output Current :IOUT[mA]
XC9270x083/XC9271x083
(VIN=24V , VOUT=5V)
XC9270x083/XC9271x083
(VIN=24V , VOUT=12V)
L=22μH(CLF12555-220M), CIN 1=10μF(GRM32ER71H106KA12L),
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
L=30μH(CLF12555-300M), CIN 1=10μF(GRM32ER71H106KA12L),
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
XC9271
XC9270
XC9271
XC9270
1
10
100
1000
10000
1
10
100
1000
10000
Output Current :IOUT[mA]
Output Current :IOUT[mA]
XC9270x085/XC9271x085
(VIN=12V, VOUT=1.8V)
XC9270x085/XC9271x085
(VIN=12V, VOUT=5V)
L=15μH(CLF12555-150M), CIN 1=10μF(GRM32ER71H106KA12L),
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
L=15μH(CLF12555-150M), CIN 1=10μF(GRM32ER71H106KA12L),
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
XC9271
XC9270
XC9271
XC9270
1
10
100
1000
10000
1
10
100
1000
10000
Output Current :IOUT[mA]
Output Current :IOUT[mA]
XC9270x085/XC9271x085
(VIN=24V , VOUT=5V)
XC9270x085/XC9271x085
(VIN=24V , VOUT=12V)
L=22μH(CLF12555-220M), CIN 1=10μF(GRM32ER71H106KA12L),
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
L=15μH(CLF12555-150M), CIN 1=10μF(GRM32ER71H106KA12L),
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
XC9271
XC9270
XC9271
XC9270
1
10
100
1000
10000
1
10
100
1000
10000
Output Current :IOUT[mA]
Output Current :IOUT[mA]
19/29
XC9270/XC9271 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(2) Output Voltage vs. Output Currnt
XC9270x083/XC9271x083
(VIN=12V, VOUT=1.8V)
XC9270x083/XC9271x083
(VIN=12V, VOUT=5V)
L=22μH(CLF12555-220M), CIN1=10μF(GRM32ER71H106KA12L),
L=22μH(CLF12555-220M), CIN 1=10μF(GRM32ER71H106KA12L),
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
5.60
2.20
XC9271
XC9270
XC9271
2.10
2.00
5.40
XC9270
5.20
5.00
4.80
4.60
4.40
1.90
1.80
1.70
1.60
1.50
1.40
1
10
100
1000
10000
1
10
100
1000
10000
Output Current :IOUT[mA]
Output Current :IOUT[mA]
XC9270x083/XC9271x083
(VIN=24V , VOUT=5V)
XC9270x083/XC9271x083
(VIN=24V, VOUT=12V)
L=30μH(CLF12555-300M), CIN1=10μF(GRM32ER71H106KA12L),
L=22μH(CLF12555-220M), CIN 1=10μF(GRM32ER71H106KA12L),
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
13.00
5.60
12.80
12.60
12.40
12.20
12.00
11.80
11.60
11.40
11.20
11.00
XC9271
XC9270
XC9271
XC9270
5.40
5.20
5.00
4.80
4.60
4.40
1
10
100
1000
10000
1
10
100
1000
10000
Output Current :IOUT[mA]
Output Current :IOUT[mA]
XC9270x085/XC9271x085
(VIN=12V, VOUT=1.8V)
XC9270x085/XC971x085
(VIN=12V , VOUT=5V)
L=15μH(CLF12555-150M), CIN 1=10μF(GRM32ER71H106KA12L),
L=15μH(CLF12555-150M), CIN1=10μF(GRM32ER71H106KA12L),
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
5.60
2.20
XC9271
XC9271
XC9270
2.10
2.00
5.40
XC9270
5.20
5.00
4.80
4.60
4.40
1.90
1.80
1.70
1.60
1.50
1.40
1
10
100
1000
10000
1
10
100
1000
10000
Output Current :IOUT[mA]
Output Current :IOUT[mA]
XC9270x085/XC9271x085
(VIN=24V , VOUT=5V)
XC9270x085/XC9271x085
(VIN=24V, VOUT=12V)
L=22μH(CLF12555-220M), CIN1=10μF(GRM32ER71H106KA12L),
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
13.00
L=15μH(CLF12555-150M), CIN 1=10μF(GRM32ER71H106KA12L),
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
6.00
5.80
5.60
5.40
5.20
5.00
4.80
4.60
4.40
4.20
4.00
XC9271
XC9270
12.80
12.60
12.40
12.20
12.00
11.80
11.60
11.40
11.20
11.00
XC9271
XC9270
1
10
100
1000
10000
1
10
100
1000
10000
Output Current :IOUT[mA]
Output Current :IOUT[mA]
20/29
XC9270/XC9271
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(3) Ripple Voltage vs. Output Current
XC9270x083/XC9271x083
(VIN=12V , VOUT=5V)
XC9270x085/XC9271x085
(VIN=12V , VOUT=5V)
L=15μH(CLF12555-150M), CIN1=10μF(GRM32ER71H106KA12L),
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
L=22μH(CLF12555-220M), CIN1=10μF(GRM32ER71H106KA12L),
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
50
50
45
40
35
30
25
20
15
10
5
XC9271
XC9270
XC9271
XC9270
45
40
35
30
25
20
15
10
5
0
0
0.1
1
10
100
1000
10000
0.1
1
10
100
1000
10000
Output Current :IOUT[mA]
Output Current :IOUT[mA]
(4) FB Voltage vs. Ambient Temperature
(5) UVLO Voltage vs. Ambient Temperature
XC9270/XC9271
XC9270/XC9271
VIN=12V
5.6
5.4
5.2
5.0
4.8
4.6
4.4
4.2
0.812
0.810
0.808
0.806
0.804
0.802
0.800
0.798
0.796
0.794
0.792
0.790
0.788
Detection
Release
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Ambient Temperature :Ta[℃]
Ambient Temperature :Ta[℃]
(6) Oscillation Frequency vs. Ambient Temperature
XC9270x083/XC9271x083
XC9270x085/XC9271x085
VIN=12V
VIN=12V
350
550
540
530
520
510
500
490
480
470
460
450
340
330
320
310
300
290
280
270
260
250
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Ambient Temperature :Ta[℃]
Ambient Temperature :Ta[℃]
(7) SupplyCurrent vs. Ambient Temperature
XC9270x083/XC9271x083
XC9270x085/XC9271x085
VIN=30V
VIN=30V
600
600
500
400
300
200
100
0
500
400
300
200
100
0
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Ambient Temperature :Ta[℃]
Ambient Temperature :Ta[℃]
21/29
XC9270/XC9271 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(8) Stand-byCurrent vs. Ambient Temperature
(9) LxSW ON Resistance vs. Ambient Temperature
XC9270/XC9271
XC9270/XC9271
VIN=30V
5
0.70
0.60
0.50
0.40
0.30
0.20
0.10
0.00
4
3
2
1
0
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
125
125
Ambient Temperature :Ta[℃]
Ambient Temperature :Ta[℃]
(10) MaxDuty vs. Ambient Temperature
(11) PFMSwitch Current vs. Ambient Temperature
XC9270/XC9271
XC9271
VIN=12V
92.0
90.0
88.0
86.0
84.0
82.0
80.0
78.0
350
300
250
200
150
100
50
0
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
Ambient Temperature :Ta[℃]
Ambient Temperature :Ta[℃]
(12) CE "H" Voltage vs. Ambient Temperature
(13) CE "L" Voltage vs. Ambient Temperature
XC9270/XC9271
XC9270/XC9271
3.0
3.0
VIN=30V
VIN=12V
VIN=7V
VIN=30V
VIN=12V
VIN=7V
2.5
2.0
1.5
1.0
0.5
2.5
2.0
1.5
1.0
0.5
-50
-25
0
25
50
75
100
-50
-25
0
25
50
75
100
125
Ambient Temperature :Ta[℃]
Ambient Temperature :Ta[℃]
(14)Internal Soft-Start Time vs. Ambient Temperature
XC9270x083/XC9271x083
XC9270x085/XC9271x085
VIN=12V
VIN=12V
3.0
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
2.5
2.0
1.5
1.0
0.5
0.0
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Ambient Temperature :Ta[℃]
Ambient Temperature :Ta[℃]
22/29
XC9270/XC9271
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(15) External Soft-Start Time vs. Ambient Temperature
XC9270x083/XC9271x083
XC9270x085/XC9271x085
VIN=12V
VIN=12V
35
20
18
16
14
12
10
8
30
25
20
15
10
5
6
4
2
0
0
-50
-25
0
25
50
75
100
125
-50
-25
0
25
50
75
100
125
Ambient Temperature :Ta[℃]
Ambient Temperature :Ta[℃]
23/29
XC9270/XC9271 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(16) Load Transient Response
XC9270x083/XC9271x083
XC9270x083/XC9271x083
VIN =12V, VOUT=5V, IOUT=300mA 1A
VIN=12V, VOUT=5V, IOUT=1A 300mA
→
→
L=22μH(CLF12555-220M), CIN 1=10μF(GRM32ER71H106KA12L),
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
L=22μH(CLF12555-220M), CIN1=10μF(GRM32ER71H106KA12L),
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
1ms/div
1ms/div
VOUT : 500mV/div
VOUT : 500mV/div
IOUT =300mA→1A
IOUT =1A→300mA
XC9270x083/XC9271x083
XC9270x083/XC9271x083
VIN =12V, VOUT=5V, IOUT=1A 2A
VIN=12V, VOUT=5V, IOUT=2A 1A
→
→
L=22μH(CLF12555-220M), CIN 1=10μF(GRM32ER71H106KA12L),
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
L=22μH(CLF12555-220M), CIN1=10μF(GRM32ER71H106KA12L),
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
1ms/div
1ms/div
VOUT: 500mV/div
VOUT : 500mV/div
IOUT =1A→2A
IOUT =2A→1A
XC9270x085/XC9271x085
XC9270x085/XC9271x085
VIN =12V, VOUT=5V, IOUT=300mA 1A
VIN=12V, VOUT=5V, IOUT=1A 300mA
→
→
L=15μH(CLF12555-150M), CIN 1=10μF(GRM32ER71H106KA12L),
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
L=15μH(CLF12555-150M), CIN1=10μF(GRM32ER71H106KA12L),
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
1ms/div
1ms/div
V
OUT: 500mV/div
VOUT : 500mV/div
IOUT =300mA→1A
IOUT =1A→300mA
XC9270x085/XC9271x085
XC9270x085/XC9271x085
VIN =12V, VOUT=5V, IOUT=1A 2A
VIN=12V, VOUT=5V, IOUT=2A 1A
→
→
L=15μH(CLF12555-150M), CIN 1=10μF(GRM32ER71H106KA12L),
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
L=15μH(CLF12555-150M), CIN1=10μF(GRM32ER71H106KA12L),
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
1ms/div
1ms/div
VOUT: 500mV/div
VOUT : 500mV/div
IOUT =1A→2A
IOUT =2A→1A
24/29
XC9270/XC9271
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(17) Rising Response Time
XC9270x083/XC9271x083
XC9270x083/XC9271x083
VIN=0 12V, VOUT=5V, IOUT=1mA
→
VIN=0 24V, VOUT=5V, IOUT=1mA
→
L=22μH(CLF12555-220M), CIN1=10μF(GRM32ER71H106KA12L),
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
L=22μH(CLF12555-220M), CIN1=10μF(GRM32ER71H106KA12L),
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
1ms/div
1ms/div
VIN: 0→12V
VIN: 0→24V
V
OUT : 2V/div
VOUT : 2V/div
XC9270x085/XC9271x085
XC9270x085/XC9271x085
VIN=0 12V, VOUT=5V, IOUT=1mA
→
VIN=0 24V, VOUT=5V, IOUT=1mA
→
L=15μH(CLF12555-150M),
C
IN1=10μF(GRM32ER71H106KA12L),
L=15μH(CLF12555-150M), CIN1=10μF(GRM32ER71H106KA12L),
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
VIN: 0→12V
1ms/div
1ms/div
V
IN: 0→24V
VOUT : 2V/div
VOUT: 2V/div
(18) Input Transient Response
XC9270x083/XC9271x083
XC9270x083/XC9271x083
VIN=12V 30V, VOUT=5V, IOUT=1A
→
VIN=30V 12V, VOUT=5V, IOUT=1A
→
L=22μH(CLF12555-220M), CIN1=10μF(GRM32ER71H106KA12L),
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
L=22μH(CLF12555-220M), CIN1=10μF(GRM32ER71H106KA12L),
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
1ms/div
1ms/div
V
OUT : 200mV/div
VOUT : 200mV/div
VIN=12V→30V
V
IN=30V→12V
XC9270x085/XC9271x085
XC9270x085/XC9271x085
VIN=12V 30V, VOUT=5V, IOUT=1A
→
VIN=30V 12V, VOUT=5V, IOUT=1A
→
L=15μH(CLF12555-150M), CIN1=10μF(GRM32ER71H106KA12L),
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
L=15μH(CLF12555-150M), CIN1=10μF(GRM32ER71H106KA12L),
SBD=CMS15, CL=22μF×2(GRM32ER71E226KE15L)
1ms/div
1ms/div
VOUT: 200mV/div
VOUT : 200mV/div
V
IN=12V→30V
V
IN=30V→12V
25/29
XC9270/XC9271 Series
■PACKAGING INFORMATION
●SOP-8FD (unit: mm)
0.22±0.03
4.9±0.1
0.1
(1.27）
0.42±0.09
(3.3)
BOTTOM VIEW
●SOP-8FD Reference Pattern Layout (unit: mm)
●SOP-8FD Reference Metal Mask Design (unit: mm)
0.5
3.0
0.6
3.3
1.27
1.27
26/29
XC9270/XC9271
Series
●ꢀSOP-8FD Power Dissipation
Power dissipation data for the SOP-8FD is shown in this page.
The value of power dissipation varies with the mount board conditions.
Please use this data as the reference data taken in the following condition.
1. Measurement Condition
40.0
28.9
Condition Mount on a board
：
Ambient Natural convection
：
Soldering Lead (Pb) free
：
Board Dimensions 40 x 40 mm
：
(1600 mm2 in one side)
Copper (Cu) traces occupy 50% of the board
area In top and back faces
Package heat-sink is tied to the copper traces
Material Glass Epoxy (FR-4)
：
Thickness 1.6mm
：
Through-hole 4 x 0.8 Diameter
：
2.54
1.4
Evaluation Board (Unit mm)
：
2.Power Dissipation vs. Ambient Temperature
Board Mount (Tj max = 125
)
℃
Ambient Temperature
Power Dissipation Pd mW
Thermal Resistance
66.67
W
(℃/
（℃）
（
）
)
25
1500
300
105
Pd vs Ta
1600
1400
1200
1000
800
600
400
200
0
25
45
65
85
105
125
Ambient Temperature Ta (℃)
27/29
XC9270/XC9271 Series
■MARKING RULE
① represents products series
MARK
PRODUCT SERIES
XC9270******-G
XC9271******-G
SOP-8FD
C
D
8
6
7
5
① ② ③
④ ⑤
② represents products type
MARK
PRODUCT SERIES
XC9270A*****-G
XC9271A*****-G
XC9270B*****-G
XC9271B*****-G
A
B
2
3
4
1
③ represents FB voltage and oscillation frequency
OSCILLATION
FREQUENCY
MARK
VOLTAGE (V)
PRODUCT SERIES
3
5
3
5
300kHz
500kHz
300kHz
500kHz
XC9270*083**-G
XC9270*085**-G
XC9271*083**-G
XC9271*085**-G
0.8
0.8
④⑤ represents production lot number
01～09、0A～0Z、11～9Z、A1～A9、AA～AZ、B1～ZZ in order.
(G, I, J, O, Q, W excluded)
* No character inversion used.
28/29
XC9270/XC9271
Series
1. The product and product specifications contained herein are subject to change without notice to
improve performance characteristics. Consult us, or our representatives before use, to confirm that
the information in this datasheet is up to date.
2. The information in this datasheet is intended to illustrate the operation and characteristics of our
products. We neither make warranties or representations with respect to the accuracy or
completeness of the information contained in this datasheet nor grant any license to any intellectual
property rights of ours or any third party concerning with the information in this datasheet.
3. Applicable export control laws and regulations should be complied and the procedures required by
such laws and regulations should also be followed, when the product or any information contained in
this datasheet is exported.
4. The product is neither intended nor warranted for use in equipment of systems which require
extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss
of human life, bodily injury, serious property damage including but not limited to devices or equipment
used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and
other transportation industry and 5) safety devices and safety equipment to control combustions and
explosions. Do not use the product for the above use unless agreed by us in writing in advance.
5. Although we make continuous efforts to improve the quality and reliability of our products;
nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent
personal injury and/or property damage resulting from such failure, customers are required to
incorporate adequate safety measures in their designs, such as system fail safes, redundancy and
fire prevention features.
6. Our products are not designed to be Radiation-resistant.
7. Please use the product listed in this datasheet within the specified ranges.
8. We assume no responsibility for damage or loss due to abnormal use.
9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex
Semiconductor Ltd in writing in advance.
TOREX SEMICONDUCTOR LTD.
29/29
相关型号：
©2020 ICPDF网 联系我们和版权申明