XC9272A06B4R-G [TOREX]

IC REG BUCK 0.65V 50MA SYNC 6USP;


型号：	XC9272A06B4R-G
厂家：	Torex Semiconductor
描述：	IC REG BUCK 0.65V 50MA SYNC 6USP
文件：	总25页 (文件大小：1921K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

XC9272 Series

ETR05057-003

Ultra Low Quiescent Current Synchronous Step-Down PFM DC/DC Converter for Low Output Voltage

☆GreenOperation compatible

■GENERAL DESCRIPTION

XC9272 series are Ultra Low Quiescent Current synchronous-rectification for Low Output Voltage type PFM step down

DC/DC converters with a built-in 0.4Ω (TYP.) Pch driver and 0.4Ω (TYP.) Nch synchronous switching transistor, designed to

allow the use of ceramic capacitor.

PFM control enables a low quiescent current, making these products ideal for battery operated devices that require high

efficiency and long battery life.

Only inductor, C^INand C capacitors are needed as external parts to make a step down DC/DC circuit.

Operation voltage range is from 2.0V to 6.0V. This product has fixed output voltage from 0.6V to 0.95V(accuracy: ±20mV) in

increments of 0.05V.

During stand-by, all circuits are shutdown to reduce consumption to as low as 0.1μA(TYP.) or less.

With the built-in UVLO (Under Voltage Lock Out) function, the internal P-channel MOS driver transistor is forced OFF when

input voltage gets lower than UVLO detection voltage. Besides, XC9272 series has UVLO release voltage of 1.8V (Typ.).

The product with C

discharge function, XC9272B type, can discharge C capacitor during stand-by mode due to the internal

resistance by turning on the internal switch between V_OUT-GND. This enables output voltage restored to GND level fast.

■APPLICATIONS

■FEATURES

Input Voltage Range

2.0V~6.0V

●

Electric devices with GPS

Output Voltage Setting

Output Current

0.6V~0.95V (±20mV, 0.05V step increments)

50mA

Wearable devices

Energy Harvest devices

Backup power supply circuits

Devices with 1 Lithium cell

Driver Transistor

0.4Ω (Pch Driver Tr)

0.4Ω (Nch Synchronous rectifier Switch Tr)

0.50μA @ VOUT(T)=0.7V (TYP.)

PFM control

Supply Current

Control Method

High Speed Transient

PFM Switching Current

50mV (VIN=3.6V, VOUT=0.7V, IOUT=10μA→50mA)

180mA

Function

Short Protection function

CL Discharge(XC9272B type)

UVLO function

Ceramic Capacitor Compatible

-40～+85℃

Operation Ambient Temperature

Package

SOT-25, USP-6EL

Environmentally Friendly

EU RoHS compliant, Pb Free

■TYPICAL PERFORMANCE

CHARACTERISTICS

●Efficiency vs. Output Current

■TYPICAL APPLICATION CIRCUIT

XC9272A071xR-G(V_OUT=0.7V)

L=10μH(VLF302512M-100M),C_IN=10μF(LMK107BJ106MA),

C_L=22μF(JMK107BJ226MA)

100

VIN=2.0V

V_IN

V_OUT

V_IN

L_X

C_IN

(Ceramic)

C_L

(Ceramic)

V_OUT

VIN=3.6V

GND

0.01

0.1

100

Output Current : I_OUT(mA)

1/24

XC9272 Series

■ BLOCK DIAGRAM

XC9272A Type

PFM Comparator Unit

V_OUT

C_FBR_FB1

Short

protection

Current

Sense

PFM

R_FB2

Comparator

PFM

Controller

Synch

Buffer

Driver

L_X

CE Controller Logic

V_REF

V_DD

GND

UVLO

V_INstart up

Controller

V_IN

* Diodes inside the circuit are an ESD protection diode and a parasitic diode.

XC9272B Type

PFM Comparator Unit

C_FBR_FB1

V_OUT

Short

protection

Current

Sense

C_L

Discharge

PFM

R_FB2

Comparator

PFM

Controller

Synch

Buffer

Driver

L_X

CE Controller Logic

V_REF

V_DD

GND

UVLO

_INstart up

V_IN

Controller

* Diodes inside the circuit are an ESD protection diode and a parasitic diode.

2/24

XC9140 (Design Target)

XC9272

Series

■PRODUCT CLASSIFICATION

●Ordering information

XC9272①②③④⑤⑥-⑦

DESIGNATOR

ITEM

SYMBOL

DESCRIPTION

Without C_LDischarge

With C_LDischarge

①

Product Type

Output Voltage : e.g. V_OUT=0.7V⇒②=0, ③=7

Output Voltage Range: 0.6V～0.95V (0.05V step)

②③

④

Output Voltage

Output Voltage Type

Packages (Order Unit)

06 ～ 09

Output Voltage {x.x0V} (the 2nd decimal place is “0”)

Output Voltage {x.x5V} (the 2nd decimal place is “5”)

USP-6EL (3,000pcs/Reel)

4R-G

MR-G

(*1)

⑤⑥-⑦

SOT-25 (3,000pcs/Reel)

(*1)

The “-G” suffix denotes Halogen and Antimony free as well as being fully EU RoHS compliant.

3/24

XC9272 Series

■PIN CONFIGURATION

L_X

V_OUT

L_X

V_IN

GND

3 V_OUT

V_IN

GND

USP-6EL

(BOTTOM VIEW)

SOT-25

(TOP VIEW)

* The dissipation pad for the USP-6EL package should be solder-plated in reference

mount pattern and metal masking so as to enhance mounting strength and heat release.

The mount pattern should be connected to GND pin (No.2).

■PIN ASSIGNMENT

PIN NUMBER

PIN NAME

FUNCTIONS

USP-6EL SOT-25

L_X

GND

V_OUT

Switching

Ground

Output Voltage

Chip Enable

No Connection

Power Input

V_IN

■ CE PIN FUNCTION

PIN NAME

SIGNAL

STATUS

Operation (All Series)

Standby (All Series)

* Please do not leave the CE pin open.

■ABSOLUTE MAXIMUM RATINGS

Ta=25˚C

UNITS

PARAMETER

V_INPin Voltage

L_XPin Voltage

V_OUTPin Voltage

CE Pin Voltage

SYMBOL

V_IN

RATINGS

-0.3 ~ +7.0

-0.3 ~ V_IN+0.3 or +7.0 ^(*1)

-0.3 ~ +7.0

V_LX

V_OUT

V_CE

L_XPin Current

I_LX

1000

250

SOT-25

600 (40mm x 40mm Standard board) ^(*2)

Power Dissipation

120

750 (40mm x 40mm Standard board) ^(*2)

-40 ~ +85

USP-6EL

(DAF)

Operating Ambient Temperature

Storage Temperature

Topr

Tstg

˚C

-55 ~ +125

* All voltages are described based on the GND.

^(*1)The maximum value is the lower of either VIN + 0.3 or +7.0.

^(*2)The power dissipation figure shown is PCB mounted and is for reference only.

The mounting condition is please refer to PACKAGING INFORMATION.

4/24

XC9140 (Design Target)

XC9272

Series

■ELECTRICAL CHARACTERISTICS

●XC9272A Type, without C_Ldischarge function

Ta=25˚C

PARAMETER

SYMBOL

CONDITIONS

MIN.

2.0

TYP.

MAX.

6.0

UNITS

CIRCUIT

Input Voltage

V_IN

①

Resistor connected with L_Xpin.

(*2)

Output Voltage

V_OUT(E)

Voltage which L_Xpin changes “L” to “H” level

while V_OUTis decreasing.

1.8

②

③

V_CE=V_IN, V_OUT=0V. Resistor connected with L_Xpin.

Voltage which L_Xpin changes “L” to “H” level

while V_INis increasing.

UVLO Release Voltage

V_UVLO(E)

V_HYS(E)

1.65

0.1

1.95

0.23

0.8

V_CE=V_IN, V_OUT=0V. Resistor connected with L_Xpin.

UVLO Hysteresis

Voltage

_UVLO(E)- Voltage which L_Xpin changes “H” to “L”

0.15

0.5

level while V_INis decreasing.

Supply Current

V_IN=V_CE=2.0V, V_OUT=V_OUT(T)+0.5V ^(*1), L_X=Open.

μA

Standby Current

I_STB

I_LEAKH

I_LEAKL

I_PFM

V_IN=5.0V, V_CE=V_OUT=0V, L_X=Open.

V_IN=5.0V, V_CE=V_OUT=0V, V_LX=0V.

V_IN=5.0V, V_CE=V_OUT=0V, V_LX=5.0V.

V_IN=V_CE=V_OUT(T)+2.0V ^(*1), I_OUT=10mA.

V_IN=V_CE=3.6V,

0.1

180

1.0

250

μA

③

①

L_XSW “H” Leak Current

L_XSW “L” Leak Current

PFM Switching Current

115

Efficiency ^(*3)

EFFI

R_LXP

R_LXN

0.4

0.65

①

④

_OUT(T)=0.7V ^(*1), I_OUT=30mA.

LX SW “Pch”

ON Resistance ^(*4)

LX SW “Nch”

V_IN=V_CE=5.0V, V_OUT=0V, I_LX=50mA.

V_IN=V_CE=5.0V.

0.4 ^(*5)

ON Resistance

Output Voltage

Temperature

ΔV_OUT

-40℃≦Topr≦85℃.

±100

ppm/℃

②

⑤

(V_OUT・ΔTopr)

Characteristics

V_OUT=0V. Resistor connected with L_Xpin.

Voltage which L_Xpin changes “L” to “H” level while

V_CE=0.2→1.5V.

CE “High” Voltage

CE “Low” Voltage

V_CEH

1.2

6.0

0.3

V_OUT=0V. Resistor connected with L_Xpin.

Voltage which L_Xpin changes “H” to “L” level while

V_CE=1.5→0.2V.

V_CEL

GND

CE “High” Current

CE “Low” Current

I_CEH

I_CEL

V_IN=V_CE=5.0V, V_OUT=0V, L_X=Open.

V_IN=5.0V, V_CE=V_OUT=0V, L_X=Open.

Resistor connected with L_Xpin.

-0.1

0.1

μA

⑤

Short Protection

V_SHORT

Voltage which L_Xpin changes “H” to “L” level while

0.14

0.3

0.48

②

Threshold Voltage

_OUT= V_OUT(T)+0.1V→0V^(*1)

Unless otherwise stated, VIN=VCE=5.0V

^(*1)VOUT(T)=Nominal Output Voltage

^(*2)VOUT(E)=Effective Output Voltage

The actual output voltage value V^OUT(E)is the PFM comparator threshold voltage in the IC.

Therefore, the DC/DC circuit output voltage, including the peripheral components, is boosted by the ripple voltage average value.

Please refer to the characteristic example.

^(*3)EFFI=[{ (Output Voltage)×(Output Current)] / [(Input Voltage)×(Input Current)}]×100

^(*4)LX SW “Pch” ON resistance = (V_IN– VLX pin measurement voltage) / 50mA

^{(*5) )}Designed value

5/24

XC9272 Series

■ELECTRICAL CHARACTERISTICS (Continued)

●XC9272B Type, with C_Ldischarge function

PARAMETER

SYMBOL

CONDITIONS

MIN.

2.0

TYP.

MAX.

6.0

UNITS

CIRCUIT

Input Voltage

V_IN

①

Resistor connected with L_Xpin.

(*2)

Output Voltage

V_OUT(E)

Voltage which L_Xpin changes “L” to “H” level

while V_OUTis decreasing.

1.8

②

③

V_CE=V_IN, V_OUT=0V. Resistor connected with L_Xpin.

Voltage which L_Xpin changes “L” to “H” level

while V_INis increasing.

UVLO Release Voltage

V_UVLO(E)

V_HYS(E)

1.65

0.1

1.95

0.23

0.8

V_CE=V_IN, V_OUT=0V. Resistor connected with L_Xpin.

UVLO Hysteresis

Voltage

_UVLO(E)- Voltage which L_Xpin changes “H” to “L”

0.15

0.5

level while V_INis decreasing.

Supply Current

V_IN=V_CE=2.0V, V_OUT=V_OUT(T)+0.5V ^(*1), L_X=Open.

μA

Standby Current

I_STB

I_LEAKH

I_LEAKL

I_PFM

V_IN=5.0V, V_CE=V_OUT=0V, L_X=Open.

V_IN=5.0V, V_CE=V_OUT=0V, V_LX=0V.

V_IN=5.0V, V_CE=V_OUT=0V, V_LX=5.0V.

V_IN=V_CE=V_OUT(T)+2.0V ^(*1), I_OUT=10mA.

V_IN=V_CE=3.6V,

0.1

180

1.0

250

μA

③

①

L_XSW “H” Leak Current

L_XSW “L” Leak Current

PFM Switching Current

115

Efficiency ^(*3)

EFFI

R_LXP

R_LXN

0.4

0.65

①

④

_OUT(T)=0.7V ^(*1), I_OUT=30mA.

LX SW “Pch”

ON Resistance ^(*4)

LX SW “Nch”

V_IN=V_CE=5.0V, V_OUT=0V, I_LX=50mA.

V_IN=V_CE=5.0V.

0.4 ^(*5)

ON Resistance

Output Voltage

Temperature

ΔV_OUT

-40℃≦Topr≦85℃.

±100

ppm/℃

②

⑤

(V_OUT・ΔTopr)

Characteristics

V_OUT=0V. Resistor connected with L_Xpin.

Voltage which L_Xpin changes “L” to “H” level while

V_CE=0.2→1.5V.

CE “High” Voltage

CE “Low” Voltage

V_CEH

1.2

6.0

0.3

V_OUT=0V. Resistor connected with L_Xpin.

Voltage which L_Xpin changes “H” to “L” level while

V_CE=1.5→0.2V.

V_CEL

GND

CE “High” Current

CE “Low” Current

I_CEH

I_CEL

V_IN=V_CE=5.0V, V_OUT=0V, L_X=Open.

V_IN=5.0V, V_CE=V_OUT=0V, L_X=Open.

Resistor connected with L_Xpin.

-0.1

0.1

μA

⑤

Short Protection

V_SHORT

Voltage which L_Xpin changes “H” to “L” level while

0.14

0.3

0.48

105

②

③

Threshold Voltage

_OUT= V_OUT(T)+0.1V→0V^(*1)

V_IN=V_OUT=5.0V, V_CE=0V, L_X=Open.

C_LDischarge

R_DCHG

Unless otherwise stated, VIN=VCE=5.0V

^(*1)VOUT(T)=Nominal Output Voltage

^(*2)VOUT(E)=Effective Output Voltage

The actual output voltage value V^OUT(E)is the PFM comparator threshold voltage in the IC.

Therefore, the DC/DC circuit output voltage, including the peripheral components, is boosted by the ripple voltage average value.

Please refer to the characteristic example.

^(*3)EFFI=[{ (Output Voltage)×(Output Current)] / [(Input Voltage)×(Input Current)}]×100

^(*4)LX SW “Pch” ON resistance = (V_IN– VLX pin measurement voltage) / 50mA

^(*5)Designed value

6/24

XC9140 (Design Target)

XC9272

Series

■ELECTRICAL CHARACTERISTICS (Continued)

XC9272 series voltage specification chart

SYMBOL

PARAMETER

UNITS: V

Output Voltage

UNITS: V

OUTPUT

MIN.

MAX.

VOLTAGE

0.60

0.65

0.70

0.75

0.80

0.85

0.90

0.95

0.58

0.63

0.68

0.73

0.78

0.83

0.88

0.93

0.62

0.67

0.72

0.77

0.82

0.87

0.92

0.97

7/24

XC9272 Series

■TEST CIRCUITS

< Test Circuit No.1 >

< Test Circuit No.2 >

Wave Form Measure Point

I_OUT

V_IN

L_X

V_IN

L_X

C_IN

Rpulldown

C_L

V_OUT

GND

※ꢀExternal Components

ꢀꢀ L : 10uH

ꢀꢀ C_IN: 10uF (ceramic)

ꢀꢀ C_L: 22uF (ceramic)

※ꢀExternal Components

ꢀꢀC_IN: 10uF

ꢀꢀRpulldown : 100Ω

< Test Circuit No.3 >

< Test Circuit No.4 >

V_IN

L_X

V_IN

L_X

C_IN

V_OUT

GND

※ꢀExternal Components

ꢀꢀC_IN: 10uF

※ꢀExternal Components

ꢀꢀC_IN: 10uF

< Test Circuit No.5 >

Wave Form Measure Point

V_IN

L_X

C_IN

ICEH

Rpulldown

V_OUT

ICEL

GND

※ꢀExternal Components

ꢀꢀC_IN: 10uF

ꢀꢀRpulldown : 100Ω

8/24

XC9140 (Design Target)

XC9272

Series

■TYPICAL APPLICATION CIRCUIT

【Typical Examples】

MANUFACTURE

PRODUCT NUMBER

VALUE

TDK

VLF302512M-100M

LPS3015-103MRB

DFE201610E-100M

LMK107BJ106MA

JMK107BJ226MA

10μH

Coilcraft

Murata

10μH

C_IN

C_L

TAIYO YUDEN

10μF/10V

22μF/6.3V

* Take capacitance loss, withstand voltage, and other conditions into consideration when selecting components.

* Characteristics are dependent on deviations in the coil inductance value. Test fully using the actual device.

* A value of 10μH is recommended for the coil inductance.

* If a tantalum or electrolytic capacitor is used for the load capacitance C_L, ripple voltage will increase, and there is a possibility that operation will

become unstable. Test fully using the actual device.

9/24

XC9272 Series

■OPERATIONAL EXPLANATION

The XC9272 series consists of a reference voltage supply, PFM comparator, Pch driver Tr, Nch synchronous rectification switch

Tr, current sensing circuit, PFM control circuit, CE control circuit, and others. (Refer to the block diagram below.)

PFM Comparator Unit

C_FBR_FB1

PFM Comparator Unit

C_FBR_FB1

V_OUT

Short

protection

Current

Sense

Short

protection

Current

Sense

C_L

Discharge

PFM

Comparator

PFM

Comparator

R_FB2

PFM

Controller

PFM

Controller

Synch

Buffer

Driver

Synch

Buffer

Driver

L_X

CE Controller Logic

V_REF

CE Controller Logic

V_REF

V_DD

GND

UVLO

V_INstart up

Controller

UVLO

V_INstart up

Controller

V_IN

XC9272A Type

XC9272B Type

An ultra-low quiescent current circuit and synchronous rectification enable a significant reduction of dissipation in the IC, and the

IC operates with high efficiency at both light loads and heavy loads. Current limit PFM is used for the control method, and even

when switching current superposition occurs, increases of output voltage ripple are suppressed, allowing use over a wide voltage

and current range. The IC is compatible with low-capacitance ceramic capacitors, and a small, high-performance step-down DC-

DC converter can be created.

The actual output voltage V_OUT(E)in the electrical characteristics is the threshold voltage of the PFM comparator in the block

diagram. Therefore the average output voltage of the step-down circuit, including peripheral components, depends on the ripple

voltage. Before use, test fully using the actual device

Reference voltage for stabilization of the output voltage of the IC.

(1) The feedback voltage (FB voltage) is the voltage that results from dividing the output voltage with the IC internal dividing

resistors R_FB1and R_FB2. The PFM comparator compares this FB voltage to V_REF. When the FB voltage is lower than V_REF, the PFM

comparator sends a signal to the buffer driver through the PFM control circuit to turn on the Pch driver Tr. When the FB voltage is

higher than V_REF, the PFM comparator sends a signal to prevent the Pch driver Tr from turning on.

(2) When the Pch driver Tr is on, the current sense circuit monitors the current that flows through the Pch driver Tr connected to the

Lx pin. When the current reaches the set PFM switching current (I_PFM), the current sense circuit sends a signal to the buffer driver

through the PFM control circuit. This signal turns off the Pch driver Tr and turns on the Nch synchronous rectification switch Tr.

(3) The on time of the Nch synchronous rectification switch Tr is dynamically optimized inside the IC. After the off time elapses

and the PFM comparator detects that the V_OUTvoltage is higher than the set voltage, the PFM comparator sends a signal to the

PFM control circuit that prevents the Pch driver Tr from turning on. However, if the V_OUTvoltage is lower than the set voltage, the

PFM comparator starts Pch driver Tr on.

By continuously adjusting the interval of the linked operation of (1), (2) and (3) above in response to the load current, the output

voltage is stabilized with high efficiency from light loads to heavy loads.

10/24

XC9140 (Design Target)

XC9272

Series

■OPERATIONAL EXPLANATION (Continued)

The PFM switching current monitors the current that flows through the Pch driver Tr, and is a value that limits the Pch driver Tr current.

The Pch driver Tr remains on until the coil current reaches the PFM switching current (I_PFM). An approximate value for this on-time

_ONcan be calculated using the following equation:

t_ON= L × I_PFM/ (V_IN– V_OUT

)

To avoid excessive ripple voltage in the event that the coil current does not reach the PFM switching current within a certain

interval even though the Pch driver Tr has turned on and the FB voltage is above V_REF, the Pch driver Tr can be turned off at any

timing using the maximum on-time function of the PFM control circuit. If the Pch driver Tr turns off by the maximum on-time function

instead of the current sense circuit, the Nch synchronous rectification switch Tr will not turn on and the coil current will flow to the

V_OUTpin by means of the parasite diode of the Nch synchronous rectification switch Tr.

<V_INstart mode>

When the V_INvoltage rises, V_INstart mode stops the short-circuit protection function during the interval until the FB voltage

approaches V_REF. After the V_INvoltage rises and the FB voltage approaches V_REFby step-down operation, V_INstart mode is

released. In order to prevent an excessive rush current while V_INstart mode is activated, Nch synchronous rectification switch Tr

will not turn on and the coil current flows to the V_OUTpin by means of the parasitic diode of the Nch synchronous rectification Tr.

In V_INstart mode as well, the coil current is limited by the PFM switching current.

<Short-circuit protection function>

The short-circuit protection function monitors the V_OUTvoltage. In the event that the V_OUTpin is accidentally shorted to GND or an

excessive load current causes the V_OUTvoltage to drop below the set short-circuit protection voltage, the short-circuit protection

function activates, and turns off and latches the Pch driver Tr at any selected timing. Once in the latched state, the IC is turned off

and then restarted from the CE pin, or operation is started by re-applying the V_INvoltage.

When the V_INpin voltage drops below the UVLO detection voltage, the IC stops switching operation at any selected timing, turns

off the Pch driver Tr and Nch synchronous rectification switch Tr (UVLO mode). When the V_INpin voltage recovers and rises above

the UVLO release voltage, the IC restarts operation.

<C_Ldischarge function>

On the XC9272 series, a C_Ldischarge function is available as an option (XC9272B type). This function enables quick discharging

of the C_Lload capacitance when “L” voltage is input into the CE pin by the Nch Tr connected between the V_OUT-GND pins, or in

UVLO mode. This prevents malfunctioning of the application in the event that a charge remains on C_Lwhen the IC is stopped.

The discharge time is determined by C_Land the C_Ldischarge resistance R_DCHG, including the Nch Tr (refer to the diagram below).

Using this time constant τ= C_L×R_DCHG, the discharge time of the output voltage is calculated by means of the equation below.

V = V_OUT× e ^{- t /}^τ, or in terms of t, t = τIn(V_OUT/ V)

V: Output voltage after discharge

V_OUT: Set output voltage

ｔ: Discharge time

V_OUT

C_L: Value of load capacitance (C_L)

R_DCHG: Value of C_Ldischarge resistance Varies by power supply voltage.

τ: C_L× R_DCHG

R_DCHG= R + R_ON

CE / UVLO

Signal

R_ON

The C_Ldischarge function is not available on the XC9272A type.

11/24

XC9272 Series

■NOTE ON USE

1. Be careful not to exceed the absolute maximum ratings for externally connected components and this IC.

2. The DC/DC converter characteristics greatly depend not only on the characteristics of this IC but also on those of externally

connected components, so refer to the specifications of each component and be careful when selecting the components. Be

especially careful of the characteristics of the capacitor used for the load capacity C_Land use a capacitor with B characteristics

(JIS Standard) or an X7R/X5R (EIA Standard) ceramic capacitor.

3. Use a ground wire of sufficient strength. Ground potential fluctuation caused by the ground current during switching could cause

the IC operation to become unstable, so reinforce the area around the GND pin of the IC in particular.

4. Mount the externally connected components in the vicinity of the IC. Also use short, thick wires to reduce the wire impedance.

5. When the voltage difference between V_INand V_OUTis small, switching energy increases and there is a possibility that the ripple

voltage will be too large. Before use, test fully using the actual device.

6. The CE pin does not have an internal pull-up or pull-down, etc. Apply the prescribed voltage to the CE pin.

7. If other than the inductance and capacitance values listed in the “Typical example” are used, excessive ripple voltage or a drop

in efficiency may result.

8. If other than the inductance and capacitance values listed in the “Typical example” are used, a drop of output voltage at load

transient may cause the short-circuit protection function to activate. Before use, test fully using the actual device.

9. At high temperature, excessive ripple voltage may occur and cause a drop in output voltage and efficiency. Before using at high

temperature, test fully using the actual device

10. At light loads or when IC operation is stopped, leakage current from the Pch driver Tr may cause the output voltage to rise.

11. The average output voltage may vary due to the effects of output voltage ripple caused by the load current. Before use, test

fully using the actual device.

12. If V_INvoltage is high or the C_Lcapacitance or load current is large, the output voltage rise time will lengthen when the IC is

started, and coil current overlay may occur during the interval until the output voltage reaches the set voltage (refer to the

diagram below).

13. When the IC is started, the short-circuit protection function does not operate during the interval until the V_OUT

voltage reaches a value near the set voltage.

14. If the load current is excessively large when the IC is started, it is possible that the V_OUTvoltage will not rise to the set voltage.

Before use, test fully using the actual device.

12/24

XC9140 (Design Target)

XC9272

Series

■NOTE ON USE (Continued)

15. In actual operation, the maximum on-time depends on the peripheral components, input voltage, and load current. Before use,

test fully using the actual device.

16. When the V_INvoltage is turned on and off continuously, excessive rush current may occur while the voltage is on. Before use,

test fully using the actual device.

17. When the V_INvoltage is high, the Pch driver may change from on to off before the coil current reaches the PFM switching

current (I_PFM), or before the maximum on-time elapses. Before use, test fully using the actual device.

18. For temporary, transitional voltage drop or voltage rising phenomenon, the IC is liable to malfunction should the ratings be

exceeded.

19. Torex places an importance on improving our products and their reliability.

We request that users incorporate fail-safe designs and post-aging protection treatment when using Torex products in their

systems.

13/24

XC9272 Series

■NOTE ON USE (Continued)

●Instructions of pattern layouts

1. To suppress fluctuations in the V_INpotential, connect a bypass capacitor (C_IN) in the shortest path between the V_INpin and

ground pin.

2. Please mount each external component as close to the IC as possible.

3. Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit impedance.

4. Make sure that the ground traces are as thick as possible, as variations in ground potential caused by high ground currents at

the time of switching may result in instability of the IC.

5. Internal driver transistors bring on heat because of the transistor current and ON resistance of the driver transistors.

●Reference Pattern Layout (USP-6EL)

Top view

●Reference Pattern Layout (SOT-25)

Bottom view

14/24

XC9140 (Design Target)

XC9272

Series

Top view

Bottom view

15/24

XC9272 Series

■TYPICAL PERFORMANCE CHARACTERISTICS

(1) Efficiency vs. Output Current

(2) Output Voltage vs. Output Current

16/24

XC9140 (Design Target)

XC9272

Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(2) Output Voltage vs. Output Current

(3) Ripple Voltage vs. Output Current

17/24

XC9272 Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(4) Output Voltage vs. Ambient Temperature

(5) Supply Current vs. Ambient Temperature

(6) Standby Current vs. Ambient Temperature

18/24

XC9140 (Design Target)

XC9272

Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(7) UVLO Release Voltage vs. Ambient Temperature

(8) PFM Switching Current vs. Ambient Temperature

(9) Maximum Frequency vs. Ambient Temperature

19/24

XC9272 Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(10) Pch Driver ON Resistance vs. Ambient Temperature

(11) Nch Driver ON Resistance vs. Ambient Temperature

(12) Lx SW "H" Leakage Current vs. Ambient Temperature

(13) Lx SW "L" Leakage Current vs. Ambient Temperature

(14) CE "High" Voltage vs. Ambient Temperature

(15) CE "Low" Voltage vs. Ambient Temperature

20/24

XC9140 (Design Target)

XC9272

Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(16) CL Discharge vs. Ambient Temperature

(17) Short Protection Threshold vs. Ambient Temperature

(18) Rising Output Voltage

21/24

XC9272 Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(19) Load Transient Response

22/24

XC9140 (Design Target)

XC9272

Series

■PACKAGING INFORMATION

For the latest package information go to, www.torexsemi.com/technical-support/packages

PACKAGE

SOT-25

OUTLINE / LAND PATTERN

SOT-25 PKG

THERMAL CHARACTERISTICS

Standard Board

SOT-25 Power Dissipation

USP-6EL Power Dissipation

USP-6EL(DAF)

USP-6EL PKG

23/24

XC9272 Series

■MARKING RULE

●SOT-25(Under dot)

SOT-25(Under dot仕様)

①

②

③

④

⑤

Magnified

拡大

●USP-6EL

USP-6EL

① represents product series

MARK

PRODUCT SERIES

XC9272A/B*****-G

※SOT-25 Under dot

② represents output voltage

PRODUCT SERIES

MARK

OUTPUT VOLTAGE

0.6

0.7

0.8

0.9

0.65

0.75

0.85

0.95

XC9272*06***-G

XC9272*07***-G

XC9272*08***-G

XC9272*09***-G

③ represents product type and output voltage type

PRODUCT SERIES

OUTPUT VOLTAGE TYPE

MARK

PRODUCT TYPE

Without C_LDischarge

With C_LDischarge

XC9272A**1**-G

XC9272A**B**-G

XC9272B**1**-G

XC9272B**B**-G

Output Voltage {x.x0V} (the 2nd decimal place is “0”)

Output Voltage {x.x5V} (the 2nd decimal place is “5”)

Output Voltage {x.x0V} (the 2nd decimal place is “0”)

Output Voltage {x.x5V} (the 2nd decimal place is “5”)

④⑤ represents production lot number

01～09、0A～0Z、11～9Z、A1～A9、AA～AZ、B1～ZZ

(G, I, J, O, Q, W excluded)

* No character inversion used.

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XC9140 (Design Target)

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1. The product and product specifications contained herein are subject to change without notice to

improve performance characteristics. Consult us, or our representatives before use, to confirm that

the information in this datasheet is up to date.

2. The information in this datasheet is intended to illustrate the operation and characteristics of our

products. We neither make warranties or representations with respect to the accuracy or completeness

of the information contained in this datasheet nor grant any license to any intellectual property rights

of ours or any third party concerning with the information in this datasheet.

3. Applicable export control laws and regulations should be complied and the procedures required by

such laws and regulations should also be followed, when the product or any information contained in

this datasheet is exported.

4. The product is neither intended nor warranted for use in equipment of systems which require extremely

high levels of quality and/or reliability and/or a malfunction or failure which may cause loss of human

life, bodily injury, serious property damage including but not limited to devices or equipment used in 1)

nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and other

transportation industry and 5) safety devices and safety equipment to control combustions and

explosions. Do not use the product for the above use unless agreed by us in writing in advance.

5. Although we make continuous efforts to improve the quality and reliability of our products; nevertheless

Semiconductors are likely to fail with a certain probability. So in order to prevent personal injury and/or

property damage resulting from such failure, customers are required to incorporate adequate safety

measures in their designs, such as system fail safes, redundancy and fire prevention features.

6. Our products are not designed to be Radiation-resistant.

7. Please use the product listed in this datasheet within the specified ranges.

8. We assume no responsibility for damage or loss due to abnormal use.

Semiconductor Ltd in writing in advance.

TOREX SEMICONDUCTOR LTD.

25/24

XC9272A06B4R-G [TOREX]

相关型号：

XC9272A0714R-G

XC9272A0814R-G

XC9272A08B4R-G

XC9272A0914R-G

XC9272A09B4R-G

XC9272B0614R-G

XC9272B06B4R-G

XC9272B0714R-G

XC9272B0814R-G

XC9272B08B4R-G

XC9272B0914R-G

XC9272B09B4R-G