XC9223D82DL_技术文档

XC9223/XC9224Series

ETR0509_007

1A Driver Transistor Built-In Step-Down DC/DC Converters

☆GreenOperation-Compatible

■GENERAL DESCRIPTION

The XC9223/XC9224 series are synchronous step-down DC/DC converters with a 0.21Ω (TYP.) P-channel driver transistor and a

synchronous 0.23Ω (TYP.) N-channel switching transistor built-in. A highly efficient and stable current can be supplied up to 1.0A by

reducing ON resistance of the built-in transistor. With a high switching frequency of 1.0MHz or 2.0MHz, a small inductor is selectable;

therefore, the XC9223/XC9224 series are ideally suited to applications with height limitation such as HDD or space-saving

applications. Current limit value can be chosen either 1.2A (MIN.) when the LIM pin is high level, or 0.6A (MIN.) when the LIM pin is

low level for using the power supply which current limit value differs such as USB or AC adapter. With the MODE/SYNC pin, the

XC9223/XC9224 series provide mode selection of the fixed PWM control or automatically switching current limit PFM/PWM control.

As for preventing unwanted switching noise, the XC9223/XC9224 series can be synchronized with an external clock signal within the

range of ± 25% toward an internal clock signal via the MODE/SYNC pin. For protection against heat damage of the ICs, the

XC9223/XC9224 series build in three protection functions: integral latch protection, thermal shutdown, and short-circuit protection.

With the built-in U.V.L.O. (Under Voltage Lock Out) function, the internal P-channel driver transistor is forced OFF when input voltage

becomes 1.8V or lower. The XC9223B/XC9224B series’ detector function monitors the discretional voltage by external resistors.

■APPLICATIONS

●HDD

■FEATURES

Input Voltage Range

: 2.5V ~ 6.0V

Output Voltage Range : 0.9V ~ VIN (set by FB pin)

Oscillation Frequency : 1MHz, 2MHz (+15% accuracy)

●Notebook computers

Output Current

Maximum Current

Limit

: 1.0A

●CD-R / RW, DVD

: 0.6A (MIN.) ~ 0.9A (MAX)

with LIM pin=’L’

: 1.2A (MIN.) ~ 2.0A (MAX.)

with LIM pin=’H’

: PWM/PFM or PWM by MODE pin

: Thermal shutdown

Integral latch method

●PDAs, Portable communication modems

●Digital cameras, Video recorders

●Various general-purpose power supplies

Controls

Protection Circuits

Short-circuit protection

: 1ms (TYP.) internally set

: B type (with VD function)

D type (without VD function)

: 0.21Ω

Soft-Start Time

Voltage Detector

Built-in P-channel

MOSFET

Built-in Synchronous

N-channel MOSFET

High Efficiency

: 0.23Ω

(No Schottky Barrier Diode Required)

: 95% (V_IN=5.0V, V_OUT=3.3V)

Synchronized with an External Clock Signal

Ceramic Capacitor Compatible

Packages

: MSOP-10, USP-10B, SOP-8

* SOP-8 package is available for the XC9223D type only.

■TYPICAL PERFORMANCE

CHARACTERISTICS

●Efficiency vs. Output Current

■TYPICAL APPLICATION CIRCUIT

XC9223B081Ax

VIN=5V, FOSC=1MHz, L=4.7uH(CDRH4D28C),

L=4.7μH (CDRH4D28C), CIN=10μF (ceramic), CL=10μF (ceramic)

CIN=10uF(ceramic), CL=10uF(ceramic)

VIN=5V, FOSC=1MHz,

100

90

80

70

60

50

40

30

20

10

0

VOUT=3.3V

VOUT=1.5V

(*1) A capacitor of 2200pF～0.1μF is recommended to place at the C_DDbetween the AGND

pin and the V_INpin.

PWM/PFM

PWM

Please refer to the page showing INSTRUCTION ON PATTERN LAYOUT for more detail.

1

10

100

1000

Output Current: IOUT (mA)

1/25

XC9223/XC9224 Series

■PIN CONFIGURATION

1

2

3

VIN

AGND

FB

8 PGND

VIN 1

VDIN 2

AGND 3

VDOUT 4

FB 5

10 PGND

9 LX

LX

7

6

8 CE

7 MODE/SYNC

CE

6 LIM

5 MODE/SYNC

LIM 4

MSOP-10

(TOP VIEW)

SOP-8

(TOP VIEW)

LIM

5

4

3

6

7

8

FB

VDOUT

AGND

MODE/SYNC

CE

9

VDIN

VIN

2

1

LX

10 PGND

USP-10B

(BOTTOM VIEW)

■PIN ASSIGNMENT

PIN NUMBER

PIN NAME

FUNCTION

MSOP-10 * USP-10B *

SOP-8 **

1

2

1

2

1

-

VIN

VDIN

Input

Voltage Detector Input

Analog Ground

3

2

-

AGND

VDOUT

FB

4

VD Output

5

3

4

5

6

7

8

Output Voltage Monitor

Over Current Limit Setting

6

LIM

7

MODE/SYNC

CE

Mode Switch / External Clock Input

Chip Enable

8

9

Lx

Output of Internal Power Switch

Power Ground

10

PGND

* For MSOP-10 and USP-10B packages, please short the GND pins (pin #3 and 10)

** For SOP-8 package, please short the GND pins (pin# 2 and 8)

■FUNCTION CHART

1. CE Pin Function

CE PIN

OPERATIONAL STATE

H

L

ON

OFF *1

*1: Except for a voltage detector block in the XC9224 series.

2. MODE Pin Function

MODE PIN

FUNCTION

PWM Control

H

L

PWM/PFM Automatic Control

3. LIM Pin Function

LIM PIN

FUNCTION

H

L

Maximum Output Current: 1.0A

Maximum Output Current: 0.4A

2/25

XC9223/XC9224

Series

■PRODUCT CLASSIFICATION

●Selection Guide

●Ordering Information

XC9223①②③④⑤⑥ <The common CE pin in the DC/DC block and the voltage detector block.>

XC9224B②③④⑤⑥ <No CE pin in the voltage detector block. (Constant operating of the voltage detector block) >

DESIGNATOR

DESCRIPTION

SYMBOL

B

DESCRIPTION

: With VD function

Transistor built-in,

Output voltage freely set (FB voltage),

Current Limit: 0.6A/1.2A

①

D

: Without VD function

0

8

: Fixed reference voltage

②③

④

Reference Voltage

①=0, ②=8

1

: 1.0MHz

DC/DC Oscillation Frequency

2

: 2.0MHz

A

D

: MSOP-10

: USP-10B

⑤

⑥

Package

S

R

L

: SOP-8 (for the XC9223D type)

: Embossed tape, standard feed

: Embossed tape, reverse feed

Device Orientation

3/25

XC9223/XC9224 Series

■BLOCK DIAGRAM

●XC9223B/XC9224B Series

VIN

LIM

Current Limit

PFM

Error Amp.

Comparator

PWM

FB

Buffer

Driver

Logic

Current

Feedback

LX

Vref with

Soft-Start,

CE

PGND

AGND

Ramp Wave

Generator,

OSC

Thermal

Shutdown

MODE/

SYNC

PMW/PFM

VD

VDOUT

VDIN

●XC9223D Series

VIN

LIM

Current Limit

PFM

Error Amp.

Comparator

PWM

FB

Buffer

Driver

Logic

Current

Feedback

LX

Vref with

Soft-Start,

CE

PGND

AGND

Ramp Wave

Generator,

OSC

Thermal

Shutdown

MODE/

SYNC

PMW/PFM

4/25

XC9223/XC9224

Series

■ABSOLUTE MAXIMUM RATINGS

Ta=25^OC

PARAMETER

VIN Pin Voltage

SYMBOL

VIN

RATINGS

- 0.3 ~ 6.5

10

UNITS

V

VDIN Pin Voltage

VDOUT Pin Voltage

VDOUT Pin Current

FB Pin Voltage

VDIN

VDOUT

IDOUT

VFB

V

mA

V

- 0.3 ~ 6.5

- 0.3 ~ VDD + 0.3

2000

LIM Pin Voltage

MODE/SYNC Pin Voltage

CE Pin Voltage

VLIM

V

VMODE/SYNC

VCE

V

Lx Pin Voltage

VLx

V

Lx Pin Current

ILx

mA

MSOP-10

350 (*1)

Power Dissipation

Pd

mW

USP-10B

SOP-8

150

300

Operating Temperature Range

Topr

Tstg

- 40 ~ + 85

- 55 ~ +125

℃

Storage Temperature Range

*1: When implemented on a PCB.

5/25

XC9223/XC9224 Series

■ELECTRICAL CHARACTERISTICS

XC9223/XC9224 Series

Topr=25℃

PARAMETER

SYMBOL

CONDITIONS

MIN.

TYP.

MAX.

UNIT CIRCUIT

Input Voltage

FB Voltage

VIN

VFB

2.5

0.784

0.9

-

0.800

-

6.0

0.816

VIN

V

-

①

③

Output Voltage Setting Range

VOUTSET

Maximum Output Current 1 (*1)

Maximum Output Current 2 (*1)

IOUTMAX1

IOUTMAX2

0.4

1.0

-

A

③

FB=VFB x 0.9, VIN Voltage which Lx pin

voltage holding ‘L’ level (*8)

U.V.L.O. Voltage

Supply Current 1

Supply Current 2

Stand-by Current

Oscillation Frequency

VUVLO

IDD1

1.55

1.80

2.00

V

①

②

③

FB=VFB x 0.9, MODE/SYNC=0V

D1-1 (*2)

D1-2 (*2)

D1-6 (*2)

D1-3 (*2)

μA

MHz

FB=VFB x 1.1 (Oscillation stops),

MODE/SYNC=0V

IDD2

ISTB

CE=0V

Connected to external components,

IOUT=10mA

FOSC

Connected to external components,

IOUT=10mA, apply an external clock signal

to the MODE/SYNC

External Clock Signal

Synchronized Frequency

SYNCOSC

D1-4 (*2)

MHz

④

External Clock Signal Cycle

Maximum Duty Cycle

Minimum Duty Cycle

SYNCDTY

MAXDTY

MINDTY

25

100

-

75

-

%

④

①

FB=VFB x 0.9

FB=VFB x 1.1

0

Connected to external components,

MODE/SYNC=0V, IOUT=10mA

PFM Switch Current

IPFM

-

200

250

mA

③

Connected to external components,

VIN=5.0V, VOUT=3.3V, IOUT=200mA

Efficiency (*3)

EFFI

RLxH

-

95

-

%

③

①

Lx SW ‘H’ On Resistance (*4)

FB=VFB x 0.9, ILx=VIN-0.05V

0.21

0.3 (*7)

Ω

Lx SW ‘L’ On Resistance

Current Limit 1

RLxL

ILIM1

ILIM2

-

0.23

0.3 (*7)

0.9

Ω

A

-

LIM=0V

LIM=VIN

0.6

1.2

-

①

Current Limit 2

2.0

Integral Latch Time (*5)

Short Detect Voltage

Soft-Start Time

TLAT

VSHORT

TSS

FB=VFB x 0.9, Short Lx by 1Ω resistance

FB Voltage which Lx becomes ‘L’ (*8)

CE=0V→VIN, IOUT=1mA

D1-5 (*2)

0.4

ms

V

①

-

0.3

0.5

-

0.5

2.0

-

1.0

ms

^OC

Thermal Shutdown Temperature

Hysteresis Width

TTSD

150

THYS

-

20

-

FB=VFB x 0.9, Voltage which Lx becomes

‘H’ after CE voltage changed from 0.4V to

1.2V (*8)

FB=VFB x 0.9, Voltage which Lx becomes

‘L’ after CE voltage changed from 1.2V to

0.4V (*8)

CE ‘H’ Voltage

CE ‘L’ Voltage

VCEH

VCEL

1.2

-

V

①

0.4

MODE/SYNC ‘H’ Voltage

MODE/SYNC ‘L’ Voltage

LIM ‘H’ Voltage

VMODE/SYNCH

VMODE/SYNCL

VLIMH

1.2

-

0.4

-

V

③

①

1.2

IOUT=ILIM1 x 1.1, Check LIM voltage which

Lx oscillated after CE voltage changed

from 1.2V to 0.4V

LIM ‘L’ Voltage

VLIML

-

0.4

V

①

CE ‘H’ Current

CE ‘L’ Current

ICEH

ICEL

VIN=CE=6.0V

-

- 0.1

-

0.1

-

A

⑤

⑥

VIN=6.0V, CE=0V

VIN=6.0V

μA

MODE/SYNC ‘H’ Current

MODE/SYNC ‘L’ Current

LIM ‘H’ Current

IMODE/SYNCH

IMODE/SYNCL

ILIMH

0.1

-

VIN=6.0V, MODE/SYNC=0V

VIN=LIM=6.0V

- 0.1

-

0.1

-

LIM ‘L’ Current

ILIML

VIN=6.0V, LIM=0V

VIN=FB=6.0V

- 0.1

-

FB ‘H’ Current

IFBH

0.1

-

FB ‘L’ Current

IFBL

VIN=6.0V, FB=0V

VIN=Lx=6.0V, CE=0V

VIN=6.0V, Lx=CE=0V

- 0.1

-

Lx SW ‘H’ Leak Current

Lx SW ‘L’ Leak Current (*6)

ILeakH

1.0

-

ILeakL

- 3.0

6/25

XC9223/XC9224

Series

■ELECTRICAL CHARACTERISTICS (Continued)

XC9223/XC9224 Series (Continued), Voltage Detector Block (*9)

Topr=25℃

PARAMETER

Detect Voltage

Release Voltage

SYMBOL

VDF

CONDITIONS

MIN.

0.676

0.716

TYP.

0.712

0.752

MAX.

0.744

0.784

UNIT CIRCUIT

VDIN Voltage which VDOUT becomes

‘H’ to ‘L’, Pull-up resistor 200kΩ

VDIN Voltage which VDOUT becomes

‘L’ to ‘H’, Pull-up resistor 200kΩ

V

⑦

VDR

Hysteresis Width

Output Current

VHYS

IDOUT

VHYS=(VDR-VDF) / VDF x 100

-

5

-

%

-

VDIN=VDF x 0.9, apply 0.25V to VDOUT

2.5

4.0

mA

⑦

Time until VDOUT becomes ‘L’ to ‘H’ after

VDIN changed from 0V to 1.0V

Delay Time

TDLY

0.5

2.0

8.0

ms

⑦

VDIN ‘H’ Current

VDIN ‘L’ Current

VDOUT ‘H’ Current

VDOUT ‘L’ Current

IVDINH

IVDINL

VIN=VDIN=6.0V

-

0.1

-

μA

⑤

VIN=6.0V, VDIN=0V

- 0.1

-

IVDOUTH

IVDOUTL

VIN=VDIN=VDOUT=6.0V

VIN=VDIN=6.0V, VDOUT=0V

1.0

-

- 1.0

Test Condition: Unless otherwise stated, VIN=3.6V, CE=VIN, MODE/SYNC=VIN

NOTE:

*1: When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.

If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.

*2: Refer to the chart below.

*3: EFFI = { ( output voltage x output current ) / ( input voltage x input current) } x 100

*4: On resistance (Ω)= (VIN- Lx pin measurement voltage) / 100mA

*5: Time until it short-circuits Lx with GND through 1Ω of resistance from a state of operation and is set to Lx=Low from current limit pulse

generating.

*6: When temperature is high, a current of approximately 100μA may leak.

*7: Designed value.

*8: Whether the Lx pin is high level or low level is judged at the condition of “H”>VIN-0.1V and “L”<0.05V.

*9: There is no voltage detector function available in the XC9223D series.

●Electrical Characteristics Standard Values

1MHz

TYP.

380

2MHz

TYP.

440

45

No.

PARAMETER

SYMBOL

MIN.

MAX.

700

60

MIN.

MAX.

800

80

D1-1

D1-2

D1-3

Supply Current 1

Supply Current 2

IDD1

IDD2

-

30

Oscillation Frequency

External Clock

FOSC

0.85

1.00

1.15

1.7

2.0

2.3

D1-4

D1-5

SYNCOSC

TLAT

0.75

-

1.25

15.0

1.5

-

2.5

Synchronous Oscillation

Integral Latch Time

6.0

3.0

15.0

XC9223 SERIES

XC9224 SERIES

No.

PARAMETER

SYMBOL

ISTB

MIN.

-

TYP.

0.1

MAX.

2.0

MIN.

-

TYP.

7.0

MAX.

D1-6

Stand-by Current

15.0

7/25

XC9223/XC9224 Series

■TYPICAL APPLICATION CIRCUIT

(*1) A capacitor of 2200pF～0.1μF is recommended to place at the C_DDbetween the AGND pin and the V_INpin.

Please refer to the page showing INSTRUCTION ON PATTERN LAYOUT for more detail.

Output voltage can be set by adding external split resistors. Output voltage is determined by the following equation,

based on the values of RFB1 and RFB2. The sum of RFB1 and RFB2 should normally be 1MΩ or less.

VOUT = 0.8 x (RFB1 + RFB2) / RFB2

The value of CFB, speed-up capacitor for phase compensation, should be fzfb = 1 / (2 x π x CFB1 x RFB1) which is equal to

20kHz. Adjustments are required from 1kHz to 50kHz depending on the application, value of inductance (L), and value of

load capacity (CL).

[Example of calculation]

When RFB1=470kΩ, RFB2=150kΩ,

VOUT1 = 0.8 x (470k + 150k) / 150k =3.3V

[Typical example]

VOUT (V)

1.0

CFB (pF)

110

51

VOUT (V)

2.5

CFB (pF)

15

RFB1 (kΩ)

75

RFB2 (kΩ)

300

RFB1 (kΩ)

510

RFB2 (kΩ)

240

1.2

150

300

3.0

330

120

24

1.5

130

150

62

3.3

470

150

18

1.8

300

240

27

5.0

430

82

18

* When fzfb = 20kHz

[External components]

1MHz:

L: 4.7μH (CDRH4D28C, SUMIDA)

CL: 10μF (ceramic)

CIN: 10μF (ceramic)

2MHz:

L: 2.2μH (CDRH4D28, SUMIDA)

2.2μH (VLCF4020T-2R2N1R7, TDK)

CL: 10μF (ceramic)

CIN: 10μF (ceramic)

* As for CIN and CL, use output capacitors of 10μF or more. (Ceramic capacitor compatible)

* High ESR (Equivalent Series Resistance) that comes by using a tantalum or an electrolytic capacitor causes high ripple voltage.

Furthermore, it can cause an unstable operation. Use the IC after you fully confirm with an actual device.

8/25

XC9223/XC9224

Series

■OPERATIONAL EXPLANATION

Each unit of the XC9223/XC9224 series consists of a reference voltage source, a ramp wave circuit, error amplifier, PWM

comparator, phase compensation circuit, output voltage adjustment resistors, P-channel MOS driver transistor, N-channel

MOS synchronous rectification switching transistor, current limiter circuit, U.V.L.O. circuit and others. The series

compares, using the error amplifier, the internal reference voltage to the VOUT pin with the voltage feedback via resistors

RFB1 and RFB2. Phase compensation is performed on the resulting error amplifier output, to input a signal to the PWM

comparator to determine the turn-on time during PWM operation. The PWM comparator compares, in terms of voltage

level, the signal from the error amplifier with the ramp wave from the ramp wave circuit, and delivers the resulting output to

the buffer driver circuit to cause the Lx pin to output a switching duty cycle. This process is continuously performed to

ensure stable output voltage. The current feedback circuit monitors the P-channel MOS driver transistor current for each

switching operation, and modulates the error amplifier output signal to provide multiple feedback signals. This enables a

stable feedback loop even when a low ESR capacitor, such as a ceramic capacitor, is used, ensuring stable output voltage.

The reference voltage source provides the reference voltage to ensure stable output voltage of the DC/DC converter.

The ramp wave circuit determines switching frequency. The frequency is fixed internally and can be selected from 1.0MHz

and 2.0MHz. Clock pulses generated in this circuit are used to produce ramp waveforms needed for PWM operation, and

to synchronize all the internal circuits.

The error amplifier is designed to monitor output voltage. The amplifier compares the reference voltage with the feedback

voltage divided by the internal resistors (RFB1 and RFB2). When a voltage lower than the reference voltage is fed back, the

output voltage of the error amplifier increases. The gain and frequency characteristics of the error amplifier output are

fixed internally to deliver an optimized signal to the mixer.

The current limiter circuit of the XC9223/XC9224 series monitors the current flowing through the P-channel MOS driver

transistor connected to the Lx pin, and features a combination of the constant-current type current limit mode and the

operation suspension mode. For the current limit values, please select the values either from 1.2A (MIN.) when the LIM

pin is high level or 0.6A (MIN.) when the LIM pin is low level.

1When the driver current is greater than a specific level, the constant-current type current limit function operates to turn

off the pulses from the Lx pin at any given time.

2When the driver transistor is turned off, the limiter circuit is then released from the current limit detection state.

3At the next pulse, the driver transistor is turned on. However, the transistor is immediately turned off in the case of an

over current state.

4 When the over current state is eliminated, the IC resumes its normal operation.

The IC waits for the over current state to end by repeating the steps 1 through 3. If an over current state continues for

several msec and the above three steps are repeatedly performed, the IC performs the function of latching the OFF state of

the driver transistor, and goes into operation suspension mode. After being put into suspension mode, the IC can resume

operation by turning itself off once and then starting it up using the CE pin, or by restoring power to the VIN pin. Integral

latch time may be released from a current limit detection state because of the noise. Depending on the state of a substrate,

it may result in the case where the latch time may become longer or the operation may not be latched. Please locate an

input capacitor as close as possible.

ms

Limit < # mS

ms

Limit > # mS

Current Limit LEVEL

IOUT

VOUT

LX

0mA

VSS

CE

Restart

VIN

9/25

XC9223/XC9224 Series

■OPERATIONAL EXPLANATION (Continued)

For protection against heat damage of the ICs, thermal shutdown function monitors chip temperature. The thermal

shutdown circuit starts operating and the driver transistor will be turned off when the chip’s temperature reaches 150^OC.

When the temperature drops to 130^OC or less after shutting of the current flow, the IC performs the soft start function to

initiate output startup operation.

<Short-Circuit Protection>

The short-circuit protection circuit monitors FB voltage. In case where output is accidentally shorted to the Ground and

when the FB voltage decreases less than half of the FB voltage, the short-circuit protection operates to turn off and to

latch the driver transistor. In latch mode, the operation can be resumed by either turning the IC off and on via the CE pin,

or by restoring power supply to the VIN pin.

The detector block of the XC9223/9224 series detects a signal inputted from the VDIN pin by the VDOUT pin (N-ch

open-drain).

<U.V.L.O. Circuit>

When the VIN pin voltage becomes 1.8V (TYP.) or lower, the driver transistor is forced OFF to prevent false pulse output

caused by unstable operation of the internal circuitry. When the VIN pin voltage becomes 2.0V (TYP.) or higher, switching

operation takes place. By releasing the U.V.L.O. function, the IC performs the soft-start function to initiate output startup

operation. The U.V.L.O. function operates even when the VIN pin voltage falls below the U.V.L.O. operating voltage for

tens of ns.

A MODE/SYNC pin has two functions, a MODE switch and an input of external clock signal. The MODE/SYNC pin

operates as the PWM mode when applying high level of direct current and the PFM/PWM automatic switching mode by

applying low level of direct current, which is the same function as the normal MODE pin. By applying the external clock

signal (±25% of the internal clock signal, ON duty 25% to 75%), the MODE/SYNC pin switches to the internal clock signal.

Also the circuit will synchronize with the falling edge of external clock signal. While synchronizing with the external clock

signal, the MODE/SYNC pin becomes the PWM mode automatically. If the MODE/SYNC pin holds high or low level of the

external clock signal for several μs, the MODE/SYNC pin stops synchronizing with the external clock and switches to the

internal clock operation. (Refer to the chart below.)

・External Clock Synchronization Function

VOUT

50mV/div

Synchronous with the

Operates by the

external clock

internal clock

1.2MHz

1MHz

Lx

2V/div

External Clock Signal

1.2MHz Duty50%

MODE/SYNC

2V/div

Delay time to the external clock synchronization

1.0ꢀs/div

* When an input of MODE/SYNC is changed from “L” voltage into a clock signal of 1.2MHz and 50% duty.

10/25

XC9223/XC9224

Series

■OPERATIONAL EXPLANATION (Continued)

In PFM control operation, until coil current reaches to a specified level (IPFM), the IC keeps the P-ch MOSFET on. In this case,

time that the P-ch MOSFET is kept on (TON) can be given by the following formula.

TON= L×IPFM (VIN－VOUT)

→IPFM①

In PFM control operation, the maximum duty cycle (MAXPFM) is set to 50% (TYP.). Therefore, under the condition that the

duty increases (e.g. the condition that the step-down ratio is small), it’s possible for P-ch MOSFET to be turned off even when

coil current doesn’t reach to IPFM.

→IPFM②

IPFM②

IPFM①

Ton

FOSC

Maxumum IPFMCurrent

Lx

IPFM

0mA

IPFM

0mA

I Lx

11/25

XC9223/XC9224 Series

■NOTES ON USE

1. The XC9223/XC9224 series is designed for use with ceramic output capacitors. If, however, the potential difference

between dropout voltage, a ceramic capacitor may fail to absorb the resulting high switching energy and oscillation could

occur on the output. In this case, use a larger capacitor etc. to compensate for insufficient capacitance.

2. Spike noise and ripple voltage arise in a switching regulator as with a DC/DC converter. These are greatly influenced by

external component selection, such as the coil inductance, capacitance values, and board layout of external components.

Once the design has been completed, verification with actual components should be done.

3. In PWM control, very narrow pulses will be outputted, and there is the possibility that some cycles may be skipped

completely. This may happens while synchronizing with an external clock.

4. When the difference between VIN and VOUT is small, and the load current is heavy, very wide pulses will be outputted and

there is the possibility that some cycles may be skipped completely.

5. With the IC, the peak current of the coil is controlled by the current limit circuit. Since the peak current increases when

dropout voltage or load current is high, current limit starts operating, and this can lead to instability. When peak current

becomes high, please adjust the coil inductance value and fully check the circuit operation. In addition, please calculate

the peak current according to the following formula:

Ipk = (VIN - VOUT) x OnDuty / (2 x L x FOSC) + IDOUT

L: Coil Inductance Value

FOSC: Oscillation Frequency

6. When the peak current, which exceeds limit current, flows within the specified time, the built-in P-ch driver transistor is

turned off (an integral latch circuit). During the time until it detects limit current and before the built-in transistor can be

turned off, the current for limit current flows; therefore, care must be taken when selecting the rating for the coil.

7. The voltage drops because of ON resistance of a driver transistor or in-series resistance of a coil. For this, the current

limit may not be attained to the limit current value, when input voltage is low.

8. Malfunction may occur in the U.V.L.O. circuit because of the noise when pulling current at the minimum operation voltage.

9. This IC and the external components should be used within the stated absolute maximum ratings in order to prevent

damage to the device.

10. Depending on the state of the PC Board, latch time may become longer and latch operation may not work. The board

should be laid out so that capacitors are placed as close to the chip as possible.

11. In heavy load, the noise of DC/DC may influence and the delay time of the voltage detector may be prolonged.

12. Output voltage may become unstable when synchronizing high internal frequency with the external clock.

In such a case, please use a larger output capacitor etc. to compensate for insufficient capacitance.

13. When a voltage lower than minimum operating voltage is applied, the output voltage may fall before reaching the over

current limit.

14. When the IC is used in high temperature, output voltage may increase up to input voltage level at light load (less than 100

μA) because of the leak current of the driver transistor.

15. The current limit is set to LIM=H: 2000mA (MAX.). However, the current of 2000mA or more may flow. In case that the

current limit functions while the VOUT pin is shorted to the GND pin, when P-ch MOSFET is ON, the potential difference

for input voltage will occur at both ends of a coil. For this, the time rate of coil current becomes large. By contrast,

when N-ch MOSFET is ON, there is almost no potential difference at both ends of the coil since the VOUT pin is shorted to

the GND pin. Consequently, the time rate of coil current becomes quite small. According to the repetition of this

operation, and the delay time of the circuit, coil current will be converged on a certain current value, exceeding the

amount of current, which is supposed to be limited originally. The short protection does not operate during the soft-start

time. The short protection starts to operate and the circuit will be disabled after the soft-start time. Current larger than

over current limit may flow because of a delay time of the IC when step-down ratio is large. A coil should be used within

the stated absolute maximum rating in order to prevent damage to the device.

①Current flows into P-ch MOSFET to reach the current limit (ILIM).

②The current of ILIM (2000mA, MAX.) or more flows since the delay time of the circuit occurs during from the detection of

the current limit to OFF of P-ch MOSFET.

③Because of no potential difference at both ends of the coil, the time rate of coil current becomes quite small.

④Lx oscillates very narrow pulses by the current limit for several msec.

⑤The short protection operates, stopping its operation.

②

③

①

④ #ms

⑤

Delay

VLX

Overcurrent

Limit Value

ILX

（Coil Current）

12/25

XC9223/XC9224

Series

■INSTRUCTION ON PATTERN LAYOUT

1. In order to stabilize VIN’s voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as

possible to the VIN & VSS pins.

2. Please mount each external component, especially CIN, as close to the IC as possible.

3. Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit

impedance.

4. Make sure that the PCB GND traces are as thick as possible, as variations in ground potential caused by high

ground currents at the time of switching may result in instability of the IC.

5. Unstable operation may occur at the heavy load because of a spike noise. 2200pF ~0.1μF of a capacitor, CDD, is

recommended to use between the AGND pin and the VIN pin for reducing noise.

・TOP VIEW

Inductor

L

0

R

C

Jumper Chip

Resistor

・BOTTOM VIEW

Ceramic Capaticor

13/25

XC9223/XC9224 Series

■TEST CIRCUITS

Circuit ②

Circuit ①

Waveform Measurement Point

A

VIN

CE

LX

FB

ILx

LX

A

VIN

CE

MODE/

SYNC

ILIM

1uF

MODE/

SYNC

ILIM

FB

1uF

V

VDIN

VDOUT

AGND

VDIN

VDOUT

AGND

PGND

Circuit ③

Waveform Measurement Point

L

IOUT

LX

VIN

CE

A

RFB1

RFB2

V

CFB

CL

V

MODE/

SYNC

ILIM

FB

CIN

VDOUT

AGND

VDIN

V

PGND

* External Components

L (1MHz) : 4.7ꢀH (CDRH4D28C, SUMIDA)

L (2MHz) : 2.2ꢀH (VLCF4020T-2R2N1R7, TDK)

ꢁꢁCIN : 10ꢀF (ceramic)

ꢁꢁCL : 10ꢀF (ceramic)

ꢁꢁRFB1 : 130kΩ

ꢁꢁRFB2 : 150kΩ

ꢁꢁCFB : 62pF (ceramic)

Circuit ④

Waveform Measurement Point

L

IOUT

VIN

CE

LX

RFB1

RFB2

CFB

MODE/

SYNC

ILIM

FB

CL

～

CIN

VDIN

VDOUT

AGND

PULSE

PGND

* External Components

L (1MHz) : 4.7ꢀH (CDRH4D28C, SUMIDA)

L (2MHz) : 2.2ꢀH (VLCF4020T-2R2N1R7, TDK)

ꢁꢁCIN : 10ꢀF (ceramic)

ꢁꢁCL : 10ꢀF (ceramic)

ꢁꢁRFB1 : 130kΩ

ꢁꢁRFB2 : 150kΩ

ꢁꢁCFB : 62pF (ceramic)

14/25

XC9223/XC9224

Series

■TEST CIRCUITS (Continued)

Circuit ⑤

LX

FB

VIN

CE

A

MODE/

SYNC

ILIM

A

1ꢀF

A

VDOUT

AGND

VDIN

PGND

Circuit ⑥

LX

FB

VIN

CE

A

MODE/

SYNC

ILIM

1ꢀF

VDOUT

VDIN

AGND

PGND

Circuit ⑦

LX

FB

VIN

CE

MODE/

SYNC

1ꢀF

200kΩ

ILIM

A

VDIN

VDOUT

PGND

AGND

Waveform Measurement Point

15/25

XC9223/XC9224 Series

■TYPICAL PERFORMANCE CHARACTERISTICS

(1) Efficiency vs. Output Current

XC9223B082Ax

XC9223B081Ax

VIN=5V, FOSC=2MHz, L=2.2uH(CDRH4D28),

V_IN=5V, F_OSC=2MHz, L=2.2μH (CDRH4D28),

V

=5V, F =1MHz, L=4.7μH (CDRH4D28C),

VIN=5V, FOSC=1MHz, L=4.7uH(CDRH4D28C),

IN

OSC

CIN=10uF(ceramic), CL=10uF(ceramic)

C

=10μF (ceramic), CL=10μF (ceramic)

CIN=10uF(ceramic), CL=10uF(ceramic)

C_IN=10μF (ceramic), CL=10μF (ceramic)

IN

100

90

80

70

60

50

40

30

20

10

0

100

90

80

70

60

50

40

30

20

10

0

VOUT=3.3V

VOUT=1.5V

VOUT=3.3V

VOUT=1.5V

PWM/PFM

PWM

PWM/PFM

PWM

1

10

100

1000

1

10

100

1000

Output Current: IOUT (mA)

XC9223B081Ax

XC9223B0821Ax

VIN=3.3V,FOSC=2MHz

V_IN=3.3V, F_OSC=2MHz, L=2.2μH (CDRH4D28),

V_IN=3.3V, F_OSC=1MHz, L=4.7μH (CDRH4D28C),

VIN=3.3V,FOSC=1MHz

C_IN=10μF (ceramic), CL=10μF (ceramic)

L=4.7uH(CDRH4D28C),CIN=10uF(ceramic),CL=10uF(ceramic)

L=2.2uH(CDRH4D28),CIN=10uF(ceramic),CL=10uF(ceramic)

C_IN=10μF (ceramic), CL=10μF (ceramic)

100

90

80

70

60

90

80

70

60

VOUT=2.5V

VOUT=1.5V

VOUT=2.5V

VOUT=1.5V

50

40

30

20

10

0

50

40

30

20

10

0

PWM/PFM

PWM

PWM/PFM

PWM

1

10

100

1000

1

10

100

1000

Out^Op^uu^tpt^uC^{t C}u^ur^rrr^eeⁿn^{t :}t:^IOI^UO^TU^(mT^A)(mA)

Output Current : IOUT (mA)

Output Current: IOUT (mA)

(2) Output Voltage vs. Output Current

XC9223B081Ax

XC9223B082Ax

V_IN=5.0V, Topr=25℃, L=4.7μH (CDRH4D28C),

VIN=5.0V,Topr=25 C, L:4.7uH(CDRH4D28C),

VIN=5.0V, Topr=25^oC, L:4.7uH(CDRH4D28C),

o

V_IN=5.0V, Topr=25℃, L=4.7μH (CDRH4D28C),

C_IN=10μF (ceramic), CL=10μF (ceramic)

CIN=10uF(ceramic),CL=10uF(ceramic)

C

IN=10uF(ceramic),CL=10uF(ceramic)

C_IN=10μF (ceramic), CL=10μF (ceramic)

1.6

1.55

1.5

3.6

3.5

3.4

3.3

3.2

3.1

3

PWM Control

1.45

1.4

PWM/PFM Automatic Switching Control

1

10

100

1000

1

10

100

1000

Output Current: IOUT (mA)

16/25

XC9223/XC9224

Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(2) Output Voltage vs. Output Current (Continued)

XC9223B082Ax

XC9223B081Ax

VIN=3.3V,Topr=25^oC, L:4.7uH(CDRH4D28C),

V_IN=3.3V, Topr=25^o℃, L=4.7μH (CDRH4D28C),

V_IN=3.3V, Topr=25℃, L=4.7μH (CDRH4D28C),

VIN=3.3V,Topr=25 C, L:4.7uH(CDRH4D28C),

CIN=10uF(ceramic), CL=10uF(ceramic)

C_IN=10μF (ceramic), CL=10μF (ceramic)

CIN=10uF(ceramic),CL=10uF(ceramic)

2.8

2.7

2.6

2.5

2.4

2.3

2.2

1.6

1.55

1.5

PWM Control

PWM/PFM Automatic Switching Control

1.45

1.4

PWM/PFM Automatic Switching Control

1

10

100

1000

1

10

100

1000

Output Current: IOUT (mA)

(3) Oscillation Frequency vs. Ambient Temperature

(4) U.V.L.O. Voltage vs. Ambient Temperature

XC9223/24 Series

XC9223/XC9224 Series

1.40

2.8

2.6

2.4

2.2

2.0

1.8

1.6

1.4

UVLO2

1MHz

1.20

2.4

2

1.00

2MHz

0.80

1.6

UVLO

-25

0.60

1.2

-50

-25

0

25

50

75

100

-50

0

25

50

75

100

Ambient Temperature : Ta (^oC)

(5) Supply Current 2 vs. Input Voltage

XC9223/24 Series (2MHz)

XC9223/XC9224 Series (2MHz)

XC9223/XC9224 Series (1MHz)

XC9223/9424 Series (1MHz)

CE=FB=VIN, MODE=0V

100

80

60

40

20

0

100

80

60

40

20

0

2

3

4

5

6

7

2

3

4

5

6

7

Input Voltage: VIN (V)

17/25

XC9223/XC9224 Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(6) Soft Start Time

XC9223/24 Series

XC9223/XC9224 Series

XC9223/24 Series

ꢁ

VIN=5.0V,VOUT=3.3V,CE=0 5V

→

VIN=5.0V,VOUT=1.5V,CE=0 5V

→

IOUT=1mA,MODE=VIN

IOUT=1mA,MODE=0V

CE : 5V/div

VOUT : 1V/div

500usec/div

500μs / div

500usec/div

(7) FB Voltage vs. Supply Voltage

XC9223/9424 Series

XC9223/XC9224 Series

IOUT=0.1mA,Topr=25^oC

0.816

0.808

0.800

0.792

0.784

2.0

3.0

4.0

5.0

6.0

7.0

Input Voltage: VIN (V)

18/25

XC9223/XC9224

Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(8) Load Transient Response

XC9223B081Ax <1MHz>

VIN=5.0V, VOUT=3.3V, MODE/SYNC=VIN (PWM control)

L=4.7μH (CDRH4D28C), CIN=10μF (ceramic), CL=10μF (ceramic), Topr=25^OC

VOUT:200mV/div

IOUT=200mA

IOUT=1mA

50usec/div

500usec/div

500μs / div

50μs / div

VOUT:200mV/div

IOUT=800mA

IOUT=200mA

50usec/div

500usec/div

50μs / div

500μs / div

VIN=5.0V, VOUT=3.3V, MODE/SYNC=0V (PWM/PFM automatic switching control)

L=4.7μH (CDRH4D28C), CIN=10μF (ceramic), CL=10μF (ceramic), Topr=25^OC

VOUT:200mV/div

IOUT=200mA

IOUT=1mA

50usec/div

50μs / div

500usec/div

500μs / div

19/25

XC9223/XC9224 Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(8) Load Transient Response (Continued)

XC9223B081Ax <1MHz> (Continued)

VIN=5.0V, VOUT=1.5V, MODE/SYNC=VIN (PWM control)

L=4.7μH (CDRH4D28C), CIN=10μF (ceramic), CL=10μF (ceramic), Topr=25^OC

VOUT:200mV/div

IOUT=200mA

IOUT=1mA

50usec/div

200usec/div

200μs / div

50μs / div

VOUT:200mV/div

IOUT=800mA

IOUT=200mA

50usec/div

50μs / div

200usec/div

200μs / div

VIN=5.0V, VOUT=1.5V, MODE/SYNC=0V (PWM/PFM automatic switching control)

L=4.7μH (CDRH4D28C), CIN=10μF (ceramic), CL=10μF (ceramic), Topr=25^OC

VOUT:200mV/div

IOUT=200mA

IOUT=1mA

50μs / div

50usec/div

200μs / div

200usec/div

20/25

XC9223/XC9224

Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(8) Load Transient Response (Continued)

XC9223B082Ax <2MHz>

VIN=5.0V, VOUT=3.3V, MODE/SYNC=VIN (PWM control)

L=2.2μH (CDRH4D28), CIN=10μF (ceramic), CL=10μF (ceramic), Topr=25^OC

VOUT:200mV/div

IOUT=200mA

IOUT=1mA

50usec/div

500usec/div

50μs / div

500μs / div

VOUT:200mV/div

IOUT=800mA

IOUT=200mA

500usec/div

50usec/div

50μs / div

500μs / div

VIN=5.0V, VOUT=3.3V, MODE/SYNC=0V (PWM/PFM automatic switching control)

L=2.2μH (CDRH4D28C), CIN=10μF (ceramic), CL=10μF (ceramic), Topr=25^OC

VOUT:200mV/div

IOUT=200mA

IOUT=1mA

50usec/div

50μs / div

500μs / div

500usec/div

21/25

XC9223/XC9224 Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(8) Load Transient Response (Continued)

XC9223B082Ax <2MHz> (Continued)

VIN=5.0V, VOUT=1.5V, MODE/SYNC=VIN (PWM control)

L=2.2μH (CDRH4D28), CIN=10μF (ceramic), CL=10μF (ceramic), Topr=25^OC

VOUT:200mV/div

IOUT=200mA

IOUT=1mA

50usec/div

50μs / div

200usec/div

200μs / div

VOUT:200mV/div

IOUT=800mA

IOUT=200mA

50μs / div

50usec/div

200μs / div

200usec/div

VIN=5.0V, VOUT=1.5V, MODE/SYNC=0V (PWM/PFM automatic switching control)

L=2.2μH (CDRH4D28C), CIN=10μF (ceramic), CL=10μF (ceramic), Topr=25^OC

VOUT:200mV/div

IOUT=200mA

IOUT=1mA

200usec/div

200μs / div

50μs / div

50usec/div

22/25

XC9223/XC9224

Series

■PACKAGE INFORMATION

●USP-10B

●MSOP-10

1

0.15+0.08

2.9+0.15

ꢆꢆꢆ

ꢆꢆꢆꢆ

1

3.00+0.10

0.2+0.05

0.45+0.05

0.2+0.05

0.125

0.15

0.2

0.325 0.3 0.3

+0.1

-0.05

(0.5)

1 0.20

0.65

2.5+0.1

0.5

0.1+0.03

●SOP-8

+ꢃꢂꢃꢅ

-ꢃꢂꢅ

ꢃꢂꢄ

+ꢃꢂ5ꢃ

-ꢃꢂꢄꢃ

5ꢂꢃ

ꢅꢂꢄ7±ꢃꢂꢃ3

ꢃꢂ4±ꢃꢂꢅ

23/25

XC9223/XC9224 Series

■PACKAGING INFORMATION (Continued)

●USP-10B Recommended Pattern Layout

●USP-10B Recommended Metal Mask Design

1.50

1.05

0.80

1.50

1.45

1.10

0.70

1.45

1.10

0.70

0.35

0.45

1.05

0.80

0.20 0.20

0.15

0.20

0.40

0.20

■MARKING RULE

●MSOP-10

①Represents products series

10 9

8

7

6

MARK

0

PRODUCT SERIES

XC9223xxxxAx

A

XC9224xxxxAx

②Represents type of DC/DC converters

① ② ③

④ ⑤ ⑥ ⑦

MARK

B

PRODUCT SERIES

XC9223/9224BxxxAx

③④Represents reference voltage

MARK

PRODUCT SERIES

XC9223/9224x08xAx

③

④

1

2

3

4

5

0

8

MSOP-10

(TOP VIEW)

⑤Represents oscillation frequency

MARK

OSCILLATION FREQUENCY

PRODUCT SERIES

1

2

1.0MHz

2.0MHz

XC9223/9224xxx1Ax

XC9223/9224xxx2Ax

⑥Represents production lot number

01 to 09, 0A to 0Z, 10 to 19, 1A~ in order. (G, I, J, O, Q, W excepted)

Note: No character inversion used.

ex.)

MARKING

PRODUCTION

LOT NUMBER

⑥

0

⑦

3

03

1

A

1A

24/25

XC9223/XC9224

Series

1. The products and product specifications contained herein are subject to change without

notice to improve performance characteristics. Consult us, or our representatives

before use, to confirm that the information in this catalog is up to date.

2. We assume no responsibility for any infringement of patents, patent rights, or other

rights arising from the use of any information and circuitry in this catalog.

3. Please ensure suitable shipping controls (including fail-safe designs and aging

protection) are in force for equipment employing products listed in this catalog.

4. The products in this catalog are not developed, designed, or approved for use with such

equipment whose failure of malfunction can be reasonably expected to directly

endanger the life of, or cause significant injury to, the user.

(e.g. Atomic energy; aerospace; transport; combustion and associated safety

equipment thereof.)

5. Please use the products listed in this catalog within the specified ranges.

Should you wish to use the products under conditions exceeding the specifications,

please consult us or our representatives.

6. We assume no responsibility for damage or loss due to abnormal use.

prior permission of Torex Semiconductor Ltd.

25/25


型号：	XC9223D82DL
厂家：	Torex Semiconductor
描述：	1A Driver Transistor Built-In Step-Down DC/DC Converters 1A驱动三极管内置降压型DC / DC转换器转换器驱动
文件：	总25页 (文件大小：380K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

XC9223D82DL [TOREX]

相关型号：

XC9223D82DR

XC9223D82SL

XC9223D82SR

XC9223_04

XC9224

XC9224081AL

XC9224081AR

XC9224082AR

XC9224B081AL

XC9224B081AR

XC9224B081DL

XC9224B081DR